CN221598259U - Circuit board surface etching device - Google Patents
Circuit board surface etching device Download PDFInfo
- Publication number
- CN221598259U CN221598259U CN202323522586.1U CN202323522586U CN221598259U CN 221598259 U CN221598259 U CN 221598259U CN 202323522586 U CN202323522586 U CN 202323522586U CN 221598259 U CN221598259 U CN 221598259U
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- China
- Prior art keywords
- etching
- circuit board
- waste collection
- box
- board surface
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- 238000005530 etching Methods 0.000 title claims abstract description 125
- 239000002699 waste material Substances 0.000 claims abstract description 43
- 238000001035 drying Methods 0.000 claims abstract description 39
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 238000005507 spraying Methods 0.000 claims abstract description 11
- 239000007921 spray Substances 0.000 claims description 14
- 238000003860 storage Methods 0.000 claims description 8
- 238000005485 electric heating Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The utility model discloses a circuit board surface etching device, which comprises an etching box, wherein openings are formed at two ends of the etching box, a grid type conveying belt is installed in a supporting frame, one end of the grid type conveying belt is connected with a driving motor installed on the supporting frame, a positioning column is installed on the grid type conveying belt, a circuit board positioning structure is connected on the positioning column, an etching spraying mechanism is installed on one side of the etching box, a waste collection structure communicated with the etching box is arranged on the other side of the etching box, and a drying mechanism is communicated with one end, far away from the driving motor, of the etching box, so that the circuit board surface etching device has the beneficial effects that: the device has simple structure, can collect the used etching liquid and filter residues in the etching liquid, and can directly dry the circuit board body after etching, thereby avoiding the need of subsequent drying treatment, simplifying working procedures and improving the production efficiency.
Description
Technical Field
The utility model relates to the technical field of circuit board production, in particular to a circuit board surface etching device.
Background
Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old; the design is mainly layout design; the main advantages of the adoption of the circuit board are that the errors of wiring and assembly are greatly reduced, the automation level and the production labor rate are improved, the surface of the printed circuit board needs to be etched in the production process, and etching equipment is used for etching the printed circuit board.
However, the etching device does not have the functions of simultaneously cleaning and collecting scraps generated by etching when etching the surface of the printed circuit board, scraps flow along with etching liquid, certain liquid is carried on the etched printed circuit board, the existing device cannot immediately dry the etched printed circuit board, the etching liquid is easy to stay on the circuit board, and further side etching is easily caused by residual medicament on the circuit board.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of utility model
Aiming at the defects existing in the prior art, the utility model aims to provide a circuit board surface etching device.
In order to achieve the above purpose, the utility model is realized by the following technical scheme that the circuit board surface etching device comprises an etching box, openings are formed at two ends of the etching box, a supporting frame penetrating through the openings in the etching box, a grid type conveying belt is installed in the supporting frame, one end of the grid type conveying belt is connected with a driving motor installed on the supporting frame, a positioning column is installed on the grid type conveying belt, a circuit board positioning structure is connected on the positioning column, a circuit board body is clamped on the circuit board positioning structure, an etching spraying mechanism is installed on one side of the etching box, a waste collection structure communicated with the etching box is arranged on the other side of the etching box, and a drying mechanism is communicated with one end, far away from the driving motor, of the etching box.
Preferably, an inclined guide plate is fixedly arranged in the etching box below the opening, and side flow gathering sheets are symmetrically arranged at the lower end of the inclined guide plate.
Preferably, the etching spraying mechanism comprises an etching liquid storage tank, a high-pressure submersible pump is arranged at the bottom in the etching liquid storage tank, a conveying pipeline extending into the etching tank is arranged at the output end of the high-pressure submersible pump, an etching spray nozzle is communicated with the other end of the conveying pipeline, and a plurality of spray holes are formed in the etching spray nozzle.
Preferably, the drying mechanism comprises a drying box body, a suction pump is arranged at the inner top of the drying box body, a filter screen is arranged at the suction end of the suction pump, the other end of the suction pump is communicated with the drying box body through a pipeline, mounting plates are symmetrically arranged in the drying box body, an electric heating network is directly arranged on the mounting plates, and a liquid collecting tank is arranged at the bottom of the drying box body.
Preferably, the waste collection structure comprises a waste collection box, a cover plate is detachably arranged at the top of the waste collection box, a waste liquid collection pipe communicated with the etching box is arranged at one end of the waste collection box, and the waste liquid collection pipe is located on the side flow gathering plate.
Preferably, the inner wall bilateral symmetry of waste collection box is equipped with the supporting shoe, place the filter screen plate on the supporting shoe, just the filter screen plate is inclination and places, waste collection box one end is located the below intercommunication of filter screen plate has the discharge pipe, be equipped with the sealing plug on the discharge pipe.
Preferably, the circuit board positioning structure comprises a U-shaped supporting frame, positioning holes matched with the positioning columns are symmetrically formed in the bottom of the U-shaped supporting frame, fixed side plates are symmetrically connected to two sides of the inner wall of the U-shaped supporting frame, clamping gaps are directly formed in the fixed side plates, and the circuit board body is clamped in the clamping gaps.
The utility model provides a circuit board surface etching device, which has the following beneficial effects:
Through all offer the opening at the both ends of etching the case, pass through whole etching case with the grid conveyer belt cooperation support frame, utilize driving motor drive grid conveyer belt to carry out the work, cooperate the effect of circuit board location structure, install the circuit board body on circuit board location structure, and carry out the work through grid conveyer belt, get into etching incasement, through etching spraying mechanism's effect, carry out etching work to the circuit board body, the waste material that etching work produced can then be collected to the waste collection structure of setting, and carry out corresponding filtration, utilize drying mechanism's effect at last, carry out drying work to the circuit board body that etching was accomplished, the subsequent drying treatment of having avoided, the device of the application is simple in structure, convenient for operation, have the collection work to the etching liquid after using, and carry out filtering work to the residue therein, simultaneously, can directly carry out drying work to the circuit board body after the etching is accomplished, the subsequent drying treatment of avoiding need, the process has been simplified, the efficiency of production has been improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a front view of a circuit board surface etching apparatus according to an embodiment of the present utility model;
fig. 2 is a schematic view showing an internal structure of an etching chamber in a circuit board surface etching apparatus according to an embodiment of the present utility model;
FIG. 3 is a schematic view showing the structure of an etching spray mechanism in a circuit board surface etching device according to an embodiment of the present utility model;
FIG. 4 is a schematic diagram showing a structure of a drying mechanism in a circuit board surface etching device according to an embodiment of the utility model;
FIG. 5 is a schematic view of a waste collection structure in a circuit board surface etching apparatus according to an embodiment of the present utility model;
Fig. 6 is a schematic structural view of a circuit board positioning structure in a circuit board surface etching device according to an embodiment of the utility model.
In the figure:
1. An etching box; 2. an opening; 3. a support frame; 4. a grid type conveyer belt; 5. a driving motor; 6. positioning columns; 7. a circuit board positioning structure; 8. a circuit board body; 9. etching the spraying mechanism; 10. a waste collection structure; 11. a drying mechanism; 12. an inclined deflector; 13. a side gather sheet; 14. an etching liquid storage tank; 15. a high pressure submersible pump; 16. a delivery conduit; 17. etching the spray head; 18. a spray hole; 19. a drying box body; 20. a getter pump; 21. a filter screen; 22. a mounting plate; 23. an electric heating net; 24. a liquid collecting tank; 25. a waste collection box; 26. a waste liquid collecting pipe; 27. a filter screen plate; 28. a support block; 29. a discharge pipe; 30. a U-shaped support frame; 31. positioning holes; 32. fixing the side plates; 33. and (5) clamping the gap.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-6, a circuit board surface etching device according to an embodiment of the utility model comprises an etching box 1, wherein openings 2 are formed at two ends of the etching box 1, a supporting frame 3 penetrating through the openings 2 in the etching box 1, a grid type conveyer belt 4 is installed in the supporting frame 3, one end of the grid type conveyer belt 4 is connected with a driving motor 5 installed on the supporting frame 3, a positioning column 6 is installed on the grid type conveyer belt 4, a circuit board positioning structure 7 is connected on the positioning column 6, a circuit board body 8 is clamped on the circuit board positioning structure 7, the grid type conveyer belt 4 is matched with the supporting frame 3 to penetrate through the whole etching box 1 through the openings 2 formed at two ends of the etching box 1, the grid type conveyer belt 4 is driven by the driving motor 5 to carry out conveying work, and the function of the circuit board positioning structure 7 is matched, the circuit board body 8 is arranged on the circuit board positioning structure 7 and is conveyed by the grid conveyor belt 4 to enter the etching box 1, one side of the etching box 1 is provided with the etching spraying mechanism 9, the other side of the etching box 1 is provided with the waste collecting structure 10 communicated with the etching box 1, one end of the etching box 1 far away from the driving motor 5 is communicated with the drying mechanism 11, the etching spraying mechanism 9 is used for etching the circuit board body 8, the arranged waste collecting structure 10 can collect waste generated by the etching operation and perform corresponding filtration, finally the etched circuit board body 8 is dried by the drying mechanism 11, the subsequent drying treatment is avoided, the device of the utility model has the advantages of simple structure and convenient operation, and has the function of collecting etching liquid after use, and filter the work to the residue wherein, simultaneously, after the etching is accomplished, can directly carry out the dry work to circuit board body 8, avoid needing follow-up drying treatment, retrench the process, improve the efficiency of production.
In an embodiment, referring to fig. 2 of the specification, an inclined deflector 12 is fixedly installed below the opening 2 in the etching chamber 1, and side flow collecting plates 13 are symmetrically installed at the lower end of the inclined deflector 12. The collected etching liquid is caused to flow toward one side by the inclined baffle 12 provided in cooperation with the side collecting plate 13, and finally enters the waste collecting structure 10.
In an embodiment, referring to fig. 3 of the specification, the etching spraying mechanism 9 includes an etching solution storage tank 14, a high-pressure submersible pump 15 is installed at the bottom of the etching solution storage tank 14, a delivery pipe 16 extending into the etching tank 1 is disposed at the output end of the high-pressure submersible pump 15, an etching spray nozzle 17 is connected to the other end of the delivery pipe 16, and a plurality of spray holes 18 are disposed on the etching spray nozzle 17. The etching liquid in the etching liquid storage tank 14 is pumped by the high-pressure submersible pump 15, is sent into the etching spray head 17 through the conveying pipeline 16, and is sprayed out through the spray hole 18, so that the etching work of the circuit board body 8 is realized.
In an embodiment, referring to fig. 4 of the specification, the drying mechanism 11 includes a drying box 19, a suction pump 20 is installed at the top in the drying box 19, a filter screen 21 is installed at the suction end of the suction pump 20, the other end of the suction pump 20 is communicated with the drying box 19 through a pipeline, mounting plates 22 are symmetrically arranged in the drying box 19, an electric heating network 23 is directly installed on the mounting plates 22, and a liquid collecting tank 24 is placed at the bottom of the drying box 19. Outside air is sucked through the suction pump 20, filtered by the filter screen 21, sent into the electric heating net 23 for heating, blown hot air, blown away the liquid on the circuit board body 8, and dried, and the liquid drops into the liquid collecting tank 24.
In an embodiment, please refer to fig. 5 in the specification, the waste collection structure 10 includes a waste collection tank 25, a cover plate is detachably disposed at the top of the waste collection tank 25, a waste collection pipe 26 communicated with the etching tank 1 is disposed at one end of the waste collection tank 25, the waste collection pipe 26 is located on the side collecting plate 13, supporting blocks 28 are symmetrically disposed on two sides of an inner wall of the waste collection tank 25, a filter screen plate 27 is disposed on the supporting blocks 28, the filter screen plate 27 is disposed at an inclined angle, a discharge pipe 29 is communicated with one end of the waste collection tank 25 below the filter screen plate 27, and a sealing plug is disposed on the discharge pipe 29. Through setting up at the direct waste liquid collecting pipe 26 of side flow gathering piece 13 to in sending into waste collecting box 25, can be through being the filtration of inclination's filter screen plate 27 at first after, waste residue can stay on the filter screen plate 27, liquid then falls into the below, discharges through discharge pipe 29, and detachable apron has made things convenient for the clearance work of waste residue on the filter screen plate 27.
In an embodiment, referring to fig. 1 and fig. 6 of the specification, the circuit board positioning structure 7 includes a U-shaped supporting frame 30, positioning holes 31 matched with the positioning posts 6 are symmetrically provided at the bottom of the U-shaped supporting frame 30, two sides of the inner wall of the U-shaped supporting frame 30 are symmetrically connected with fixing side plates 32, the fixing side plates 32 directly form a clamping gap 33, and the circuit board body 8 is clamped in the clamping gap 33 directly. Through setting up the locating hole 31 in U-shaped braced frame 30 bottom, make things convenient for its installation on reference column 6, also make things convenient for its taking off, set up the fixed curb plate 32 on U-shaped braced frame 30, play the spacing joint effect to circuit board body 8.
In practical application, through all offer opening 2 at the both ends of etching case 1, with grid conveyer belt 4 cooperation support frame 3 run through whole etching case 1, utilize driving motor 5 drive grid conveyer belt 4 to carry out the work, cooperate the effect of circuit board location structure 7, install circuit board body 8 on circuit board location structure 7, and carry out the work through grid conveyer belt 4, get into etching case 1, carry out etching work through etching spraying mechanism 9 to circuit board body 8, waste material that etching work produced can be collected to the waste collection structure 10 that sets up, and carry out corresponding filtration, finally utilize drying mechanism 11's effect, carry out drying work to the circuit board body 8 that etching was accomplished, the device of the application has avoided the follow-up drying to handle, and is convenient for operation, have the collection work to the etching liquid after using, and filter work to the residue in that, simultaneously, after the etching is accomplished, can directly carry out drying work to circuit board body 8, the subsequent drying treatment of needs has been avoided, the process has been simplified, production efficiency has been improved.
Although the present disclosure describes embodiments, not every embodiment is described in terms of a single embodiment, and such description is for clarity only, and one skilled in the art will recognize that the embodiments described in the disclosure as a whole may be combined appropriately to form other embodiments that will be apparent to those skilled in the art.
Claims (7)
1. The utility model provides a circuit board surface etching device, its characterized in that, including etching case (1), opening (2) have all been seted up at the both ends of etching case (1), run through in etching case (1) support frame (3) of opening (2), install grid conveyer belt (4) in support frame (3), the one end of grid conveyer belt (4) is connected with and installs driving motor (5) on support frame (3), install reference column (6) on grid conveyer belt (4), be connected with circuit board location structure (7) on reference column (6), joint has circuit board body (8) on circuit board location structure (7), etching spraying mechanism (9) are installed to one side of etching case (1), the opposite side of etching case (1) be equipped with waste collection structure (10) of etching case (1) intercommunication, keep away from on etching case (1) driving motor (5) one end intercommunication has drying mechanism (11).
2. The etching device for the surface of the circuit board according to claim 1, wherein an inclined guide plate (12) is fixedly arranged below the opening (2) in the etching box (1), and side flow collecting plates (13) are symmetrically arranged at the lower end of the inclined guide plate (12).
3. A circuit board surface etching device according to claim 2, characterized in that the etching spraying mechanism (9) comprises an etching liquid storage tank (14), a high-pressure submersible pump (15) is arranged at the inner bottom of the etching liquid storage tank (14), a conveying pipeline (16) extending into the etching tank (1) is arranged at the output end of the high-pressure submersible pump (15), an etching spray head (17) is communicated with the other end of the conveying pipeline (16), and a plurality of spray holes (18) are arranged on the etching spray head (17).
4. A circuit board surface etching device according to claim 3, characterized in that the drying mechanism (11) comprises a drying box body (19), a suction pump (20) is installed at the top in the drying box body (19), a filter screen (21) is installed at the suction end of the suction pump (20), the other end of the suction pump (20) is communicated with the drying box body (19) through a pipeline, mounting plates (22) are symmetrically arranged in the drying box body (19), an electric heating net (23) is directly installed on the mounting plates (22), and a liquid collecting groove (24) is arranged at the bottom of the drying box body (19).
5. A circuit board surface etching device according to claim 4, characterized in that the waste collection structure (10) comprises a waste collection tank (25), a cover plate is detachably arranged on the top of the waste collection tank (25), a waste collection pipe (26) communicated with the etching tank (1) is arranged at one end of the waste collection tank (25), and the waste collection pipe (26) is positioned directly on the side flow collecting plate (13).
6. The etching device for the surface of the circuit board according to claim 5, wherein supporting blocks (28) are symmetrically arranged on two sides of the inner wall of the waste collection box (25), a filter screen plate (27) is arranged on the supporting blocks (28), the filter screen plate (27) is arranged in an inclined angle, a discharge pipe (29) is communicated with one end of the waste collection box (25) below the filter screen plate (27), and a sealing plug is arranged on the discharge pipe (29).
7. The circuit board surface etching device according to claim 6, wherein the circuit board positioning structure (7) comprises a U-shaped supporting frame (30), positioning holes (31) matched with the positioning columns (6) are symmetrically formed in the bottom of the U-shaped supporting frame (30), two sides of the inner wall of the U-shaped supporting frame (30) are symmetrically connected with fixed side plates (32), the fixed side plates (32) directly form a clamping gap (33), and the circuit board body (8) is directly clamped in the clamping gap (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323522586.1U CN221598259U (en) | 2023-12-23 | 2023-12-23 | Circuit board surface etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323522586.1U CN221598259U (en) | 2023-12-23 | 2023-12-23 | Circuit board surface etching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221598259U true CN221598259U (en) | 2024-08-23 |
Family
ID=92411686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323522586.1U Active CN221598259U (en) | 2023-12-23 | 2023-12-23 | Circuit board surface etching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221598259U (en) |
-
2023
- 2023-12-23 CN CN202323522586.1U patent/CN221598259U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |