CN221575686U - Packaged chip power supply device - Google Patents
Packaged chip power supply device Download PDFInfo
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- CN221575686U CN221575686U CN202323038144.XU CN202323038144U CN221575686U CN 221575686 U CN221575686 U CN 221575686U CN 202323038144 U CN202323038144 U CN 202323038144U CN 221575686 U CN221575686 U CN 221575686U
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- circuit board
- power
- printed circuit
- chip
- via hole
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- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 230000008054 signal transmission Effects 0.000 claims abstract description 5
- 230000005611 electricity Effects 0.000 claims abstract description 3
- 239000002184 metal Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 230000007704 transition Effects 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 6
- 238000004891 communication Methods 0.000 abstract description 2
- 238000009434 installation Methods 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to the technical field of communication equipment, in particular to a power supply device of a packaged chip, which comprises: the chip body, the printed circuit board group, power module and power connecting plate, the printed circuit board group has relative first surface and the second surface that sets up, the chip body set up in first surface and with printed circuit board group signal connection, power module passes through the power connecting plate set up in the second surface, and with printed circuit board group electricity is connected, printed circuit board group is equipped with and is used for connecting the chip body with the lead wire of power connecting plate for with power module's signal transmission extremely the chip body, the lead wire is followed first surface extremely the second surface runs through printed circuit board group, the better utilization printed circuit board group back does not have the space of wiring position, has further reduced the occupation to printed circuit board group space, has practiced thrift installation space.
Description
Technical Field
The utility model relates to the technical field of communication equipment, in particular to a power supply device for a packaged chip.
Background
The packaging chip is mainly used for connecting equipment and transmitting data, along with the improvement of the chip transmission rate, the volume and power of the high-speed packaging chip (the rate is more than 50 GBPS) are far more than those of a common chip, on the basis, in order to ensure the normal use of the packaging chip, the power is required to be increased as well as the power corresponding to the packaging chip, a power module for supplying power to the chip occupies a large amount of space resources of a printed circuit board, and a power area is a high-noise area and cannot be commonly used with signals such as a high-speed clock and the like, so that the resource is wasted.
Disclosure of utility model
The utility model provides a power supply device for a packaged chip, which is used for saving the occupation of a power supply module on the space of a printed circuit board on the basis of ensuring the normal power supply of the packaged chip.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
A packaged chip power supply device, comprising: the chip comprises a chip body, a printed circuit board group, a power module and a power connection board;
The printed circuit board group has relative first surface and the second surface that sets up, the chip body set up in the first surface and with printed circuit board group signal connection, power module pass through the power connecting plate set up in the second surface, and with printed circuit board group electricity is connected, printed circuit board group is equipped with and is used for connecting the chip body with the lead wire of power connecting plate for with power module's signal transmission extremely the chip body, the lead wire is followed first surface to the second surface runs through printed circuit board group.
The power module and the chip body are oppositely arranged, namely the chip body is arranged on the first surface of the printed circuit board group, the power module is arranged on the second surface of the printed circuit board group, and the power module is electrically connected with the chip body through the lead wires, so that the power module is arranged on one side of the printed circuit board group, which is far away from the chip body, namely the power module is arranged on one side of the back of the printed circuit board group, which is free of wiring.
In some embodiments, the area of the power connection plate that is connected to the second surface is planar.
In some embodiments, the packaged chip power supply device further comprises a flexible connection board for connecting the power module and the power connection board, and forming an angle α with the second surface of the power module, the angle α satisfying the following range: alpha is more than or equal to 30 degrees and less than or equal to 90 degrees;
In some embodiments, the printed wiring board set further comprises a via, and the lead comprises a metal layer filled inside the via.
In some embodiments, the printed circuit board set includes a power circuit board and a sub-signal circuit board, a side of the sub-signal circuit board facing the chip body is the first surface, a side of the power circuit board facing the power module is the second surface, and through blind holes are formed in the sub-signal circuit board and the power circuit board, and the blind holes are multiple and are used for transmitting signals to the chip body.
In some embodiments, a first via hole is formed in the sub-signal circuit board, a second via hole is formed in the power circuit board, and the first via hole is communicated with the second via hole;
the lead comprises a first via hole section, a second via hole section and a transition section, wherein the first via hole section is a metal layer filled in the first via hole, the second via hole section is a metal layer filled in the second via hole, and the transition section protrudes out of the second via hole and is connected with the metal layer in the second via hole.
In some embodiments, the transition section includes a filter capacitor electrically connected to the power module through the power circuit board.
In some embodiments, the orthographic projection of the first via on the second surface is a first projection, the orthographic projection of the second via on the second surface is a second projection, and the first projection and the second projection coincide.
In some embodiments, the packaged chip power supply device further includes a first connector disposed between the power connection board and the power circuit board for electrically connecting the power connection board and the power circuit board.
In some embodiments, the packaged chip power supply device further includes a second connector disposed on the power module and configured to connect with the flexible connection board.
Drawings
FIG. 1 is a schematic diagram of the whole structure of a power supply device for a packaged chip provided by the utility model;
FIG. 2 is a schematic diagram of an embodiment of an overall structure of a packaged chip power supply device according to the present utility model;
FIG. 3 is a schematic diagram of another embodiment of the whole structure of the power supply device for a packaged chip according to the present utility model;
1-chip body, 2-printed wiring board group, 21-sub signal circuit board, 210-first surface, 211-through hole, 212-blind hole, 22-power circuit board, 220-second surface, 3-flexible connecting plate, 4-power module, 5-power connecting plate, 6-filter capacitor, 7-first connector, 8-second connector.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Wherein, in the description of the embodiments of the present utility model, unless otherwise indicated, "/" means or, for example, a/B may represent a or B; the text "and/or" is merely an association relation describing the associated object, and indicates that three relations may exist, for example, a and/or B may indicate: the three cases where a exists alone, a and B exist together, and B exists alone, and furthermore, in the description of the embodiments of the present utility model, "plural" means two or more than two.
The terms "first," "second," and the like, are used below for descriptive purposes only and are not to be construed as implying or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature, and in the description of embodiments of the application, unless otherwise indicated, the meaning of "a plurality" is two or more.
As shown in fig. 1, an embodiment of the present utility model provides a power supply device for a packaged chip, including: the chip comprises a chip body 1, a printed circuit board group 2, a power module 4 and a power connection board 5;
The printed circuit board set 2 has a first surface 210 and a second surface 220 which are oppositely arranged, the chip body 1 is arranged on the first surface 210 and is in signal connection with the printed circuit board set 2, the power module 4 is arranged on the second surface 220 through a power connection plate and is electrically connected with the printed circuit board set 2, the printed circuit board set 2 is provided with a lead wire for connecting the chip body 1 and the power connection plate, the electric signal of the power module 4 is transmitted to the chip body 1, and the lead wire penetrates through the printed circuit board set 2 along the first surface 210 to the second surface 220.
According to the utility model, the power module 4 and the chip body 1 are oppositely arranged, namely the chip body 1 is arranged on the first surface 210 of the printed circuit board group 2, the power module 4 is arranged on the second surface 220 of the printed circuit board group 2, and the power module 4 is electrically connected with the chip body 1 through the lead wires, so that the power module 4 is arranged on one side of the printed circuit board group 2, which is away from the chip body 1, namely the power module 4 is arranged on one side of the back of the printed circuit board group 2, which is free of wiring, on the basis, the power module 4 firstly does not occupy the position of the signal area of the printed circuit board group 2, the normal transmission of signals is ensured, secondly, the power module 4 better utilizes the space of the back of the printed circuit board group 2, the occupation of the space of the printed circuit board group 2 is further reduced, the installation space is saved, and meanwhile, the shorter wiring also avoids the loss of electric signals in the transmission process.
In addition, the power connection board and the printed circuit board group 2 may be connected by welding, socket connection, or by a connector such as a conductive film, a conductive post, etc., which is not particularly limited in the present application.
In a possible implementation manner, as shown in fig. 1, the area where the power connection board is connected to the second surface 220 is a plane, for this reason, the present application can be understood herein that the connection surface of the power connection board and the second surface 220 is a plane, or the contact surface of the power connection board and the second surface 220 is a plane, on the basis that the power connection board and the second surface 220 are connected by adopting a plane, the form difference is small, and meanwhile, the contact area of the plane connection is larger, which is favorable for large current transmission and power integrity, and meets the power supply requirement of the chip body 1.
In a possible implementation manner, please continue to refer to fig. 1, the packaged chip power supply device further includes a flexible connection board 3, where the flexible connection board 3 is used to connect the power module 4 and the power connection board, and make the power module 4 form an angle α with the second surface 220, where the angle α meets the following range: in the structure, an angle of 30-90 degrees is formed between the power module 4 and the second surface 220 of the printed circuit board group 2 through the flexible connecting plate 3, so that the power module 4 in the structure can better utilize the vertical space of the printed circuit board group 2, the power module 4 does not encroach on the first surface 210 where the chip body 1 is located, the layout of all electronic elements in the first surface 210 is ensured, and the stability of signal transmission is improved.
It should be noted that, the flexible connection board 3 in the present application may be a rigid circuit board, a flexible circuit board, or a rigid-flexible combination board, where the rigid-flexible combination board may be understood as a splice board of a rigid circuit board and a flexible circuit board, for example, a flexible circuit board is used in a space where deformation is required, so that layout of a device and reasonable utilization of space are facilitated, and the present application is not limited specifically.
In a possible implementation manner, please continue to refer to fig. 1, in some embodiments, the printed circuit board set 2 further includes a through hole 211, the lead includes a metal layer filled in the through hole 211, where the axis of the through hole 211 may be parallel to the thickness direction of the printed circuit board set 2, i.e. the normal direction of the first surface 210 or the second surface 220, so that space on the printed circuit board set 2 may be saved, so that the printed circuit board set 2 is more compactly routed, and of course, under the condition that the space of the printed circuit board set 2 allows, the axis of the through hole 211 may also form an acute angle with the thickness direction of the printed circuit board set 2, i.e. the lead is inclined to penetrate the printed circuit board set 2, but the application takes herein that the axis of the through hole 211 is parallel to the thickness direction of the printed circuit board set 2 as an example, on this basis, it can be ensured that the routing distance between the power module 4 and the chip body 1 is shorter, so that the loss of the electrical signal in the transmission process can be effectively reduced, and the lead is suitable for the situation that the through hole 211 can be processed directly on the printed circuit board set 2, and the signal pin of the chip body 1 is matched with the signal pin (such as the standard pin).
In a possible implementation manner, referring to fig. 1-3, a printed circuit board set 2 includes a power circuit board 22 and a sub-signal circuit board 21, a side of the sub-signal circuit board 21 facing the chip body 1 is a first surface 210, a side of the power circuit board 22 facing the power module 4 is a second surface 220, and a plurality of through blind holes 212 are formed in the sub-signal circuit board 21 and the power circuit board 22 for transmitting signals to the chip body 1, in the present application, the printed circuit board set 2 adopts the power circuit board 22 and the sub-signal circuit board 21 which are stacked, and only the blind holes 212 on the sub-signal circuit board 21 are needed for transmitting signals below the area covered by the chip body 1, so that the power circuit board 22 is not affected, and when the power signal is transmitted by the power circuit board 22, the signal of the sub-signal circuit board 21 is not affected, and the transmission efficiency of the signal and the power is improved.
In a possible implementation manner, the printed circuit board set 2 in the present application may be divided into a power supply area and a signal area according to functions in use, where the power supply area and the signal area are both annularly disposed on the first surface 210, the power supply area is disposed at a central position of the first surface 210, the chip body 1 is located inside the power supply area, the area is mainly an area where the power supply module 4 supplies power to the chip body 1, and the signal area is disposed around the power supply area, and is mainly used for transmitting signals between electronic components on the first surface 210.
In a possible implementation manner (not shown in the figure), the sub-signal circuit board 21 is provided with a first via hole, the power circuit board 22 is provided with a second via hole, and the first via hole is communicated with the second via hole;
The lead wire comprises a first via hole section, a second via hole section and a transition section, wherein the first via hole section is a metal layer filled in the first via hole, the second via hole section is a metal layer filled in the second via hole, the transition section stretches out of the second via hole and is connected with the metal layer in the second via hole, in the structure, the lead wire sequentially penetrates through the sub-signal circuit board 21 and the power circuit board 22, the lead wire penetrates through the first via hole in the sub-signal circuit board 21, and penetrates through the second via hole in the power circuit board 22, so that the integrity of the lead wire is ensured, and the normal transmission of an electric signal is ensured.
In a possible implementation manner, referring to fig. 1, the transition section includes a filter capacitor 6, where the filter capacitor 6 is electrically connected to the power module 4 through the power circuit board 22, and the filter capacitor 6 is also located on the second surface 220, so as not to affect the layout of the components on the first surface 210.
In a possible implementation manner, the front projection of the first via hole on the second surface 220 is a first projection, the front projection of the second via hole on the second surface 220 is a second projection, and the first projection and the second projection are overlapped, so that when the first projection and the second projection are overlapped, the first via hole and the second via hole are vertically arranged, namely, the vertical through hole 211, and the purpose of adopting the design is to shorten the routing distance and reduce the loss of electric energy.
In a possible implementation manner, referring to fig. 2, the packaged chip power supply device further includes a first connector 7, where the first connector 7 is disposed between the power connection board and the power circuit board 22 and is used for electrically connecting the power connection board and the power circuit board 22, and in actual use, the internal layout of the packaged chip power supply device of the present application should be changed according to actual needs, where the first connector 7 is only one connection form, and the connection form includes, but is not limited to, a connector, a Socket, soldering, conductive adhesive adhesion, an elastic conductive post, a gold finger connection, and the like.
In a possible implementation manner, referring to fig. 3, the packaged chip power supply device further includes a second connector 8, where the second connector 8 is disposed on the power module 4 and is used for being connected with the flexible connection board 3, and in actual use, the packaged chip power supply device in the present application should change the internal layout manner according to actual needs, where the second connector 8 is only one connection form, and the connection form includes, but is not limited to, a connector, a Socket, welding, conductive adhesive adhesion, an elastic conductive post, and a gold finger connection.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A packaged chip power supply device, comprising: the chip comprises a chip body, a printed circuit board group, a power module and a power connection board;
The printed circuit board group has relative first surface and the second surface that sets up, the chip body set up in the first surface and with printed circuit board group signal connection, power module pass through the power connecting plate set up in the second surface, and with printed circuit board group electricity is connected, printed circuit board group is equipped with and is used for connecting the chip body with the lead wire of power connecting plate for with power module's signal transmission extremely the chip body, the lead wire is followed first surface to the second surface runs through printed circuit board group.
2. The packaged chip power supply device of claim 1, wherein the area of the power connection board that is connected to the second surface is planar.
3. The packaged chip power supply device of claim 1, further comprising a flexible connection board for connecting the power module with the power connection board and forming an angle α with the second surface, the angle α satisfying the following range: alpha is more than or equal to 30 degrees and less than or equal to 90 degrees.
4. The packaged chip power device of claim 1, wherein the printed wiring board set further comprises a via, and the lead comprises a metal layer filled inside the via.
5. The packaged chip power supply device according to claim 3, wherein the printed circuit board group comprises a power circuit board and a sub-signal circuit board, wherein a side of the sub-signal circuit board facing the chip body is the first surface, a side of the power circuit board facing the power module is the second surface, through blind holes are formed in the sub-signal circuit board and the power circuit board, and the blind holes are multiple and are used for transmitting signals to the chip body.
6. The packaged chip power supply device according to claim 5, wherein a first via is formed in the sub-signal circuit board, a second via is formed in the power circuit board, and the first via is communicated with the second via;
the lead comprises a first via hole section, a second via hole section and a transition section, wherein the first via hole section is a metal layer filled in the first via hole, the second via hole section is a metal layer filled in the second via hole, and the transition section protrudes out of the second via hole and is connected with the metal layer in the second via hole.
7. The packaged chip power device of claim 6, wherein the transition section comprises a filter capacitor electrically connected to the power module through the power circuit board.
8. The packaged chip power device of claim 7, wherein an orthographic projection of the first via on the second surface is a first projection, and an orthographic projection of the second via on the second surface is a second projection, the first projection and the second projection being coincident.
9. The packaged chip power supply device of claim 8, further comprising a first connector disposed between the power connection board and the power circuit board for electrically connecting the power connection board and the power circuit board.
10. The packaged chip power device of claim 3, further comprising a second connector disposed on the power module and configured to connect with the flexible connection board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323038144.XU CN221575686U (en) | 2023-11-10 | 2023-11-10 | Packaged chip power supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323038144.XU CN221575686U (en) | 2023-11-10 | 2023-11-10 | Packaged chip power supply device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221575686U true CN221575686U (en) | 2024-08-20 |
Family
ID=92292445
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323038144.XU Active CN221575686U (en) | 2023-11-10 | 2023-11-10 | Packaged chip power supply device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221575686U (en) |
-
2023
- 2023-11-10 CN CN202323038144.XU patent/CN221575686U/en active Active
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| GR01 | Patent grant | ||
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