CN221550440U - Epoxy adhesive adhesion force testing device - Google Patents
Epoxy adhesive adhesion force testing device Download PDFInfo
- Publication number
- CN221550440U CN221550440U CN202420146851.6U CN202420146851U CN221550440U CN 221550440 U CN221550440 U CN 221550440U CN 202420146851 U CN202420146851 U CN 202420146851U CN 221550440 U CN221550440 U CN 221550440U
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- Prior art keywords
- plate
- groove
- mounting seat
- epoxy adhesive
- clamping
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- 229920006332 epoxy adhesive Polymers 0.000 title claims abstract description 24
- 238000012360 testing method Methods 0.000 title claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 238000001514 detection method Methods 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims description 27
- 230000001070 adhesive effect Effects 0.000 claims description 27
- 238000005485 electric heating Methods 0.000 claims description 6
- 229920006335 epoxy glue Polymers 0.000 description 18
- 238000007664 blowing Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The utility model discloses an epoxy adhesive force testing device which comprises a bottom plate, wherein a heating mechanism is arranged above the bottom plate, a support is arranged above the bottom plate, a driving detection mechanism is arranged below the support, an upper mounting seat is connected below the driving detection mechanism, an upper bonding plate is arranged below the upper mounting seat, a clamping mechanism is arranged between the upper mounting seat and the upper bonding plate, a lower bonding plate is arranged below the upper bonding plate, a lower mounting seat is arranged below the lower bonding plate, and a detachable mechanism is arranged between the lower mounting seat and the lower bonding plate.
Description
Technical Field
The utility model relates to the technical field of epoxy adhesives, in particular to an epoxy adhesive force testing device.
Background
Epoxy glue is a common adhesive and is generally formed by mixing epoxy resin and a hardener. It has many excellent properties such as high strength, chemical resistance, good electrical insulation, dimensional stability, durability, etc. In the process of producing the epoxy adhesive, the performance of the epoxy adhesive needs to be tested, wherein the adhesive force of the epoxy adhesive is an important test item.
The existing testing device is used for testing the adhesive force of epoxy glue, a large amount of epoxy glue can be adhered to the surface of the upper bonding plate and the lower bonding plate through long-time use, and the upper bonding plate and the lower bonding plate on the existing testing device are inconvenient to detach and maintain, so that the later test is greatly influenced, the adhesive force test result of the epoxy glue is wrong, and the use of the epoxy glue is influenced.
Disclosure of utility model
The utility model provides an epoxy adhesive force testing device aiming at the problems in the related art, so as to overcome the technical problems in the prior art.
For this purpose, the utility model adopts the following specific technical scheme:
The utility model provides an epoxy adhesive adhesion force testing arrangement, includes the bottom plate, and the bottom plate top is equipped with heating mechanism, and the bottom plate top is equipped with the support, and the support below is equipped with drive detection mechanism, and drive detection mechanism below is connected with the mount pad, goes up the mount pad below and is equipped with the bonding board, goes up and is equipped with clamping mechanism between mount pad and the last bonding board, goes up the bonding board below and is equipped with down the bonding board, and lower bonding board below is equipped with down the mount pad, is equipped with detachable mechanism down between mount pad and the bonding board down.
Further, in order to dismantle the maintenance to lower bonding board, detachable mechanism is including locating the first slider of bonding board below down, the inside spout that is equipped with of mount pad down, first slider and spout assorted, the inside first recess that is equipped with of mount pad down, the inside spring that is equipped with of first recess, spring one end is connected with the draw-in groove, the inside draw-in groove that is equipped with of first slider, draw-in groove and draw-in groove assorted, bonding board both sides are equipped with the mounting panel down, the mounting panel top is equipped with the bolt, be equipped with first screw hole on the mount pad down, the bolt passes mounting hole and first screw hole threaded connection.
Further, in order to conveniently move the position of the clamping column, a mounting hole is formed in the mounting plate and matched with the bolt, an opening is formed in one side of the first groove, the clamping column is connected with the moving block, and one end of the moving block penetrates through the opening and is arranged on the outer side of the lower mounting seat.
Further, in order to conveniently dismantle the upper bonding plate, clamping mechanism is including locating the screw rod of mount pad top, goes up the inside second screw hole that is equipped with of mount pad, and screw rod one end is passed the second screw hole and is connected with the bearing, and the bearing is connected with splint, and the screw rod top is fixed with the swivel plate.
Further, in order to drive the upper bonding plate and remove, detect epoxy adhesive force, drive detection mechanism includes the cylinder, and the cylinder is connected with the piston rod, and the piston rod below is connected with the pulling force detector, and the pulling force detects and is connected with the mount pad.
Further, in order to accelerate the speed of epoxy glue solidification, the heating mechanism is including locating the air-blower of bottom plate one side, and the air-blower air outlet is connected with the connecting pipe, and the connecting pipe is linked together with the heating cabinet, and the heating cabinet is inside to be equipped with the heating wire, and the heating wire outside is equipped with the protection net, protection net and heating cabinet fixed connection.
Further, in order not to heat the epoxy glue, can make the electric heating box keep away from down the bonding board, the heating box below is equipped with the connecting block, and the connecting block is connected with the second slider, and second slider and threaded rod threaded connection, bottom plate bottom are equipped with the second recess, and the threaded rod is located inside the second recess, and threaded rod one end is connected with the rotating electrical machines output, rotating electrical machines and bottom plate fixed connection.
The beneficial effects of the utility model are as follows:
(1) Through setting up detachable mechanism, through separating bolt and first screw hole mutually, the rethread removes the movable block, makes first slider follow the inside roll-off of spout, conveniently dismantles the maintenance to lower bonding board, avoids down the bonding board surface to be stained with the condition of attaching a large amount of epoxy glue and takes place, guarantees the accuracy that this device detected to and when needs are installed down bonding board, make first slider inside the spout slide, arrange the draw-in groove inside through the draw-in groove, conveniently fix a position first slider, make things convenient for the bolt to be connected with first screw hole.
(2) Through setting up clamping mechanism, conveniently through rotating the screw rod, drive splint removal, the convenience is fixed or is dismantled last bonding board, the convenience is cleared up the epoxy glue that is stained with on the bonding board to and through setting up and heating mechanism, through setting up air-blower and heating wire, the convenience carries out even heating to the epoxy glue, speed for its solidification, and accessible start rotating electrical machines when need not using heating mechanism, drive the heating cabinet and keep away from bonding board down, the convenience is dismantled down bonding board and last bonding board.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a front view of an epoxy adhesive force test apparatus according to an embodiment of the present utility model.
Fig. 2 is a structural view of a heating mechanism of an epoxy adhesive force test apparatus according to an embodiment of the present utility model.
Fig. 3 is a structural view of a detachable mechanism of an epoxy adhesive force test apparatus according to an embodiment of the present utility model.
Fig. 4 is a diagram showing the connection of the mounting base on the epoxy adhesive force test device according to the embodiment of the utility model.
In the figure:
1. A bottom plate; 2. a heating mechanism; 201. a blower; 202. a connecting pipe; 203. a heating box; 204. heating wires; 205. a protective net; 3. a bracket; 4. driving a detection mechanism; 401. a cylinder; 402. a piston rod; 403. a tension detector; 5. an upper mounting seat; 6. an upper adhesive plate; 7. a clamping mechanism; 701. a screw; 702. a second threaded hole; 703. a bearing; 704. a clamping plate; 705. a rotating plate; 8. a lower adhesive plate; 9. a lower mounting seat; 10. a detachable mechanism; 1001. a first slider; 1002. a chute; 1003. a first groove; 1004. a spring; 1005. a clamping column; 1006. a clamping groove; 1007. a mounting plate; 1008. a bolt; 1009. a first threaded hole; 11. a mounting hole; 12. an opening; 13. a moving block; 14. a connecting block; 15. a second slider; 16. a threaded rod; 17. a rotating electric machine; 18. and a second groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, an epoxy adhesive force testing device according to an embodiment of the present utility model includes a base plate 1, a heating mechanism 2 disposed above the base plate 1, a support 3 disposed above the base plate 1, and a driving detection mechanism 4 disposed below the support 3 for providing a tensile force to an upper adhesive plate 6 and measuring the tensile force;
An upper mounting seat 5 is connected below the drive detection mechanism 4, an upper bonding plate 6 is arranged below the upper mounting seat 5, and a clamping mechanism 7 is arranged between the upper mounting seat 5 and the upper bonding plate 6 and is used for clamping the upper bonding plate 6, so that the upper bonding plate 6 is convenient to fix and detach;
The lower bonding plate 8 is arranged below the upper bonding plate 6, the lower mounting seat 9 is arranged below the lower bonding plate 8, and the detachable mechanism 10 is arranged between the lower mounting seat 9 and the lower bonding plate 8 and used for detaching the lower bonding plate 8.
Example 1
Referring to fig. 1-3, for a detachable mechanism 10, the detachable mechanism 10 includes a first slider 1001 disposed below a lower adhesive plate 8, a chute 1002 disposed inside a lower mounting seat 9, the first slider 1001 being matched with the chute 1002, a first groove 1003 disposed inside the lower mounting seat 9, a spring 1004 disposed inside the first groove 1003, one end of the spring 1004 being connected with a clamping column 1005, a clamping groove 1006 disposed inside the first slider 1001, the clamping column 1005 being matched with the clamping groove 1006, mounting plates 1007 disposed on two sides of the lower adhesive plate 8, bolts 1008 disposed above the mounting plates 1007, a first threaded hole 1009 disposed on the lower mounting seat 9, the bolts 1008 passing through the mounting holes 11 and being in threaded connection with the first threaded holes 1007, mounting holes 11 disposed on the mounting plates, the mounting holes 11 being matched with the bolts 1008, an opening 12 disposed on one side of the first groove 1003, the clamping column being connected with a moving block 13, one end of the moving block 13 being disposed outside the lower mounting seat 9 through the opening 12.
Through the scheme, when the device is used, the bolt 1008 is separated from the first threaded hole 1009, the moving block 13 is moved, and the clamping column 1005 is far away from the clamping groove 1006, so that the first slider 1001 slides out of the inside of the sliding groove 1002, the lower adhesive plate 8 is convenient to detach and maintain, the condition that a large amount of epoxy glue is adhered to the surface of the lower adhesive plate 8 is avoided, the detection accuracy of the device is ensured, when the lower adhesive plate 8 is required to be installed, the first slider 1001 slides in the sliding groove 1002, the spring 1004 is compressed to drive the clamping column 1005 to be placed in the first groove 1003, and when the clamping groove 1006 moves to the front end of the clamping column 1005, the spring 1004 examines, the clamping column 1005 is placed in the clamping groove 1006, the first slider 1001 is convenient to position, the bolt 1008 is convenient to be connected with the first threaded hole 1009, and the lower adhesive plate 8 is convenient to install.
Example two
Referring to fig. 1-4, for the clamping mechanism 7, the clamping mechanism 7 includes a screw 701 disposed above the upper mounting seat 5, a second threaded hole 702 is disposed inside the upper mounting seat 5, one end of the screw 701 passes through the second threaded hole 702 to be connected with a bearing 703, the bearing 703 is connected with a clamping plate 704, a rotating plate 705 is fixed at the top end of the screw 701, the screw 701 is conveniently rotated by the arrangement of the rotating plate 705, and a driving detection mechanism 4 is disposed above the clamping mechanism 7.
The driving detection mechanism 4 comprises an air cylinder 401, the air cylinder 401 is connected with a piston rod 402, a tension detector 403 is connected below the piston rod 402, and tension detection is connected with the upper mounting seat 5.
Through the scheme of the utility model, when the adhesive force measuring device is used, the screw 701 rotates in the second threaded hole 702 through rotating the screw 701, so that the clamping plate 704 can be driven to move, the upper adhesive plate 6 is conveniently fixed or detached, the attached epoxy adhesive on the upper adhesive plate 6 is conveniently cleaned, the upward tension is conveniently provided for the upper adhesive plate 6 through arranging the air cylinder 401 and the piston rod 402, and the adhesive force is conveniently measured through the tension detector 403.
Example III
Referring to fig. 1-3, for a heating mechanism 2, the heating mechanism 2 includes a blower mechanism 201 disposed at one side of a base plate 1, an air outlet of the blower mechanism 201 is connected with a connecting pipe 202, the connecting pipe 202 is connected with a heating box 203, an electric heating wire 204 is disposed inside the heating box 203, a protection net 205 is disposed outside the electric heating wire 204, the protection net 205 is fixedly connected with the heating box 203, a connecting block 14 is disposed below the heating box 203, the connecting block 14 is connected with a second slider 15, the second slider 15 is in threaded connection with a threaded rod 16, a second groove 18 is disposed at a bottom end of the base plate 1, the threaded rod 16 is disposed inside the second groove 18, one end of the threaded rod 16 is connected with an output end of a rotating motor 17, and the rotating motor 17 is fixedly connected with the base plate 1.
Through the scheme of the utility model, when the epoxy glue curing device is used, the rotating motor 17 is started to drive the threaded rod 16 to rotate and drive the sliding block to move, so that the heating box 203 can be driven to be close to the lower bonding plate 8, the blowing mechanism 201 and the electric heating wire 204 are started to uniformly heat the epoxy glue, the curing speed of the epoxy glue is accelerated, and when the heating mechanism 2 is not needed, the rotating motor 17 is started to drive the heating box 203 to be far away from the lower bonding plate 8, so that the lower bonding plate 8 and the upper bonding plate 6 can be detached and maintained conveniently.
In summary, with the above technical solution of the present utility model, when in use, epoxy glue to be tested is smeared on the lower adhesive plate 8, then the adhesive plate and the lower adhesive plate 8 are adhered by the epoxy glue through the starting cylinder 401, then the heating box 203 can be driven to approach the lower adhesive plate 8 through the starting of the rotating motor 17, then the blowing mechanism 201 and the heating wire 204 are started, the epoxy glue is heated uniformly, the curing speed is accelerated, the piston rod 402 is driven to pull the upper adhesive plate 6 through the starting cylinder 401, the tension force can be detected through the tension force detector 403 above the upper mounting seat 5, and when a large amount of epoxy glue is adhered on the surface of the lower adhesive plate 8, the bolt 1008 is separated from the first threaded hole 1009, then the moving block 13 is moved, and the clamping column 1005 is far away from the clamping groove 1006, so that the first slider 1001 slides out from the inside of the sliding groove 1002, and the lower adhesive plate 8 can be disassembled and maintained.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (7)
1. The utility model provides an epoxy adhesive force testing arrangement, its characterized in that, including bottom plate (1), bottom plate (1) top is equipped with heating mechanism (2), bottom plate (1) top is equipped with support (3), support (3) below is equipped with drive detection mechanism (4), drive detection mechanism (4) below is connected with mount pad (5), it is equipped with bonding board (6) to go up mount pad (5) below, be equipped with clamping mechanism (7) between last mount pad (5) and last bonding board (6), it is equipped with down bonding board (8) to go up bonding board (6) below, be equipped with down mount pad (9) below bonding board (8), be equipped with detachable mechanism (10) between lower mount pad (9) and lower bonding board (8).
2. The epoxy adhesive force testing device according to claim 1, wherein the detachable mechanism (10) comprises a first sliding block (1001) arranged below the lower adhesive plate (8), a sliding groove (1002) is formed in the lower mounting seat (9), the first sliding block (1001) is matched with the sliding groove (1002), a first groove (1003) is formed in the lower mounting seat (9), a spring (1004) is arranged in the first groove (1003), one end of the spring (1004) is connected with a clamping column (1005), a clamping groove (1006) is formed in the first sliding block (1001), the clamping column (1005) is matched with the clamping groove (1006), mounting plates (1007) are arranged on two sides of the lower adhesive plate (8), bolts (1008) are arranged above the mounting plates (1007), first threaded holes (1009) are formed in the lower mounting seat, and the bolts (1008) penetrate through the mounting holes (11) to be in threaded connection with the first threaded holes (1009).
3. The epoxy adhesive force testing device according to claim 2, wherein the mounting plate (1007) is provided with a mounting hole (11), the mounting hole (11) is matched with the bolt (1008), an opening (12) is formed on one side of the first groove (1003), the clamping column (1005) is connected with the moving block (13), and one end of the moving block (13) passes through the opening (12) and is arranged on the outer side of the lower mounting seat (9).
4. The epoxy adhesive force testing device according to claim 1, wherein the clamping mechanism (7) comprises a screw (701) arranged above the upper mounting seat (5), a second threaded hole (702) is formed in the upper mounting seat (5), one end of the screw (701) penetrates through the second threaded hole (702) to be connected with a bearing (703), the bearing (703) is connected with a clamping plate (704), and a rotating plate (705) is fixed at the top end of the screw (701).
5. An epoxy adhesive force testing device according to claim 1, characterized in that the driving detection mechanism (4) comprises a cylinder (401), the cylinder (401) is connected with a piston rod (402), a tension detector (403) is connected below the piston rod (402), and the tension detector is connected with an upper mounting seat (5).
6. The epoxy adhesive force testing device according to claim 1, wherein the heating mechanism (2) comprises a blower (201) arranged on one side of the bottom plate (1), an air outlet of the blower (201) is connected with a connecting pipe (202), the connecting pipe (202) is communicated with a heating box (203), an electric heating wire (204) is arranged in the heating box (203), a protection net (205) is arranged on the outer side of the electric heating wire (204), and the protection net (205) is fixedly connected with the heating box (203).
7. The epoxy adhesive force testing device according to claim 6, wherein a connecting block (14) is arranged below the heating box (203), the connecting block (14) is connected with a second sliding block (15), the second sliding block (15) is in threaded connection with a threaded rod (16), a second groove (18) is formed in the bottom end of the bottom plate (1), the threaded rod (16) is arranged in the second groove (18), one end of the threaded rod (16) is connected with the output end of a rotating motor (17), and the rotating motor (17) is fixedly connected with the bottom plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420146851.6U CN221550440U (en) | 2024-01-22 | 2024-01-22 | Epoxy adhesive adhesion force testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420146851.6U CN221550440U (en) | 2024-01-22 | 2024-01-22 | Epoxy adhesive adhesion force testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221550440U true CN221550440U (en) | 2024-08-16 |
Family
ID=92257143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420146851.6U Active CN221550440U (en) | 2024-01-22 | 2024-01-22 | Epoxy adhesive adhesion force testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221550440U (en) |
-
2024
- 2024-01-22 CN CN202420146851.6U patent/CN221550440U/en active Active
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