CN221510142U

CN221510142U - Liquid cooling heat abstractor

Info

Publication number: CN221510142U
Application number: CN202420043465.4U
Authority: CN
Inventors: 江知陶; 陈体俊; 夏露; 王可悦; 方国强; 裘腾威; 刘敏; 黄宽
Original assignee: Ningbo Polytechnic
Current assignee: Ningbo Polytechnic
Priority date: 2024-01-08
Filing date: 2024-01-08
Publication date: 2024-08-09
Anticipated expiration: 2034-01-08

Abstract

The utility model belongs to the field of heat dissipation devices, and provides a liquid cooling heat dissipation device, which comprises: the heat conducting plate is used for being connected with a heat source, the upper end of the heat conducting plate is provided with a mounting groove, and two sides of the mounting groove extend outwards to form a plurality of clamping grooves which are symmetrically distributed and communicated with the mounting groove; the copper plates are placed in the mounting grooves at intervals, and two ends of each copper plate in the length direction are inserted into the clamping grooves so as to limit the copper plates to move relative to the heat conducting plates; each copper plate is internally provided with a plurality of micro-channels for cooling liquid circulation; and the cover plate is covered on the heat conducting plate and the copper plates and is used for sealing and connecting the two adjacent copper plates. Compared with the prior art, the utility model has the advantages that the integral structure is simple, the plurality of copper plates are split-type, so that the copper plates are spliced with the clamping grooves in the heat-conducting plates in a plug-in mode, the stability is good, the processing, the manufacturing, the installation and the disassembly are convenient, and convenience is provided for the later disassembly, the cleaning and the maintenance.

Description

Liquid cooling heat abstractor

Technical Field

The utility model belongs to the field of heat dissipation devices, and particularly relates to a liquid cooling heat dissipation device.

Background

At present, the liquid cooling radiator is widely used in the field of electronic product heat dissipation, and in the heat dissipation process, heat generated by an electronic product is subjected to heat exchange with cooling liquid through a heat sink structure of a cold head of the liquid cooling radiator, and the cooling liquid absorbing the heat flows out of the cold head and then is subjected to heat dissipation through a far-end air cooling radiator, and then enters the cold head again to perform heat exchange.

For example, chinese patent No.: CN201820954017.4, patent name: a copper plate of the liquid cooling heat dissipation device is fixed in a groove in a diffusion welding mode, so that the heat transfer performance of the heat dissipation device is affected, and meanwhile, a micro-channel and the copper plate are integrally formed, so that the micro-channel in the copper plate is low in through hole rate, poor in cooling liquid flow performance, and not only is the heat dissipation performance of the device affected, but also the later disassembly, assembly, cleaning and maintenance are not facilitated.

Disclosure of utility model

Aiming at the defects existing in the prior art, the technical problems to be solved by the utility model are as follows: the split type design of a plurality of copper is provided, so that the split type design of the copper is good in stability, convenient to process, manufacture, install and detach, and provides convenience for later disassembly, cleaning and maintenance.

The technical scheme adopted by the utility model for solving the technical problems is that the utility model provides a liquid cooling heat dissipation device, which comprises: the heat conducting plate is used for being connected with a heat source, the upper end of the heat conducting plate is provided with a mounting groove, and two sides of the mounting groove extend outwards to form a plurality of clamping grooves which are symmetrically distributed and communicated with each other;

The copper plates are placed in the mounting grooves at intervals, and two ends of each copper plate in the length direction are inserted into the clamping grooves so as to limit the copper plates to move relative to the heat conducting plates; a plurality of micro-channels for cooling liquid circulation are formed in each copper plate;

The cover plate is covered on the heat-conducting plate and the copper plates and is used for connecting two adjacent copper plates in a sealing way, a liquid inlet and a liquid outlet which are distributed at two ends of the mounting groove and communicated with the mounting groove are formed in the cover plate, and cooling liquid entering from the liquid inlet can pass through the micro-channel and flow out from the liquid outlet.

In the above liquid cooling heat dissipation device, a heat dissipation cavity communicated with the micro-channel is formed between every two adjacent copper plates.

In the above-mentioned liquid cooling heat dissipation device, two ends of each copper plate extend outwards along the length direction thereof to form a clamping portion, and the clamping portion can be inserted into the clamping groove when the copper plate is placed in the mounting groove.

In the above-mentioned liquid cooling heat dissipation device, the cover plate includes:

The sealing gasket is formed at the bottom of the cooling cavity and is used for covering a plurality of copper plates, so that the cooling cavity is sealed by the sealing groove to prevent cooling liquid from flowing out of the cooling cavity;

The top cover covers the heat-conducting plate and abuts against the sealing gasket, and the liquid inlet and the liquid outlet are formed in the top cover.

In the above-mentioned liquid cooling heat dissipation device, the heat conduction plate is provided with a first connection hole, the top cover is provided with a second connection hole, and the first connection hole is connected with the second connection hole through a fixing piece when aligned, so as to prevent relative displacement between the heat conduction plate and the top cover.

In the above-mentioned liquid cooling heat dissipation device, a mounting plate is further disposed between the top cover and the heat conducting plate, an extension block is formed at the periphery of the mounting plate, and a mounting hole for mounting and fixing the liquid cooling heat dissipation device is formed in the extension block.

In the above liquid cooling heat dissipation device, the plurality of micro channels are arranged linearly and regularly when the plurality of copper plates are placed in the mounting groove.

In the above-mentioned liquid cooling heat dissipation device, the mounting groove both ends have coolant inlet and coolant outlet respectively, the coolant outlet is located the below of inlet and with its UNICOM, the coolant outlet is located the below of liquid outlet and with its UNICOM.

Compared with the prior art, the utility model has the following beneficial effects:

(1) According to the liquid cooling heat dissipation device, the split design of the copper plate is beneficial to accurate machining and manufacturing of micro-channels in the device, the operation is convenient, the manufacturing cost is low, meanwhile, the copper plate and the clamping grooves in the heat conduction plate are accurately spliced together in a plug-in mode, the mounting and dismounting are convenient, meanwhile, the mounting stability between the copper plate and the heat conduction plate is guaranteed, convenience is provided for subsequent dismounting, cleaning and maintenance, and the whole micro-channel heat sink is formed by utilizing the spaced copper plate and the mounting groove, so that the heat dissipation performance of the device is improved, and the smoothness and stability of the heat dissipation device in operation are improved.

(2) The heat dissipation appearance chamber that forms between two adjacent copper can change along with the distance adjustment between two copper, when guaranteeing convenient stability of dismouting, the heat dispersion of this liquid cooling heat abstractor of very big degree increase.

Drawings

FIG. 1 is a perspective view of the present application;

FIG. 2 is a view of the mounting structure of several copper plates within a heat-conducting plate;

FIG. 3 is a structural view of the installation groove and the engagement groove in the heat conductive plate;

fig. 4 is a schematic view showing a state between the sealing gasket and the heat conduction plate when the sealing gasket is covered on the copper plate;

FIG. 5 is a bottom view of FIG. 1;

Fig. 6 is a full cross-sectional view of fig. 1.

In the figure, 1, a heat conducting plate; 10. a mounting groove; 100. a cooling liquid inlet; 101. a cooling liquid outlet; 11. a clamping groove; 12. a first connection hole;

2. Copper plate; 20. a microchannel; 21. a heat dissipation cavity; 22. an engagement portion;

3. A cover plate; 30. a sealing gasket; 300. sealing grooves; 31. a top cover; 310. a liquid inlet; 311. a liquid outlet; 312. a second connection hole;

4. a mounting plate; 40. an extension block; 400. and (5) mounting holes.

Detailed Description

The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.

As shown in fig. 1 to 6, a liquid-cooled heat sink according to the present utility model includes: the heat conducting plate 1 is used for being connected with a heat source, the upper end of the heat conducting plate 1 is provided with a mounting groove 10, and two sides of the mounting groove 10 extend outwards to form a plurality of clamping grooves 11 which are symmetrically distributed and communicated with each other; a plurality of copper plates 2 are placed in the mounting groove 10 at intervals, and two ends of each copper plate 2 in the length direction are inserted in the clamping grooves 11 so as to limit the movement of the copper plate 2 relative to the heat-conducting plate 1; a plurality of micro-channels 20 for cooling liquid circulation are formed in each copper plate 2; the cover plate 3 is covered on the heat conducting plate 1 and the copper plates 2 and is used for sealing and connecting the two adjacent copper plates 2, a liquid inlet 310 and a liquid outlet 311 which are distributed at two ends of the mounting groove 10 and communicated with the mounting groove are formed on the cover plate 3, and cooling liquid entering from the liquid inlet 310 can pass through the micro-channel 20 and flow out from the liquid outlet 311.

In this embodiment, the heat source (not shown in the drawing) is located at the bottom of the heat conducting plate 1 in fig. 6, because the heat conducting plate 1 in this embodiment is made of copper material, copper itself has a better heat conductivity coefficient, so that the heat generated by the heat source is transferred to the copper plate 2 through the heat conducting plate 1, when the cooling liquid flows in from the liquid inlet 310 on the left side in fig. 6, the cooling liquid can flow through the micro-channel 20 in the copper plate 2, and under the condition of realizing heat exchange with the cooling liquid, the cooling liquid finally carries heat to flow out from the liquid outlet 311 on the right side in fig. 6, and the heat of the cooling liquid can be discharged into the environment through the far-end heat dissipation and flows in again from the liquid inlet 310, thus the structure is simple, and the operation is convenient and quick. And for the installation of copper 2 and heat-conducting plate 1, as shown in fig. 2 and 3, this scheme forms a plurality of block groove 11 in heat-conducting plate 1, block groove 11 symmetric distribution and all with mounting groove 10 UNICOM, when copper 2 is placed in the mounting groove 10, copper 2 length direction's both ends can be inserted and establish in block groove 11, and then make copper 2 and heat-conducting plate 1 splice together accurately under the plug mode, compare in welded connection's mode in the tradition, this embodiment is favorable to promoting the stability of installing between copper 2 and the heat-conducting plate 1, also just because the split type design of copper 2 for microchannel 20 processing becomes more convenient, the in-process that the interval was placed in mounting groove 10 has effectually increased the heat dispersion of device, also provide the convenience for later stage dismouting washing and maintenance simultaneously.

Referring to fig. 2 and 3, because the engaging grooves 11 are symmetrically distributed on two sides of the mounting groove 10, when the copper plates 2 are inserted into the engaging grooves 11, a heat dissipation cavity 21 communicating with the micro-channel 20 can be formed between every two adjacent copper plates 2, and it should be noted that, in the manufacturing process of the heat conducting plate 1, the distance between the two adjacent engaging grooves 11 can be adjusted according to the actual use requirement of the customer, and then when the copper plates 2 are inserted into the engaging grooves 11, the adjustment of the size of the heat dissipation cavity 21 is realized (that is, the adjustment of the size of the gap between the two adjacent copper plates 2 is completed), and the heat dissipation cavity 21 is beneficial to effectively increasing the heat dissipation performance of the heat dissipation device through the generated flocculation phenomenon.

Further, with continued reference to fig. 2, two ends of each copper plate 2 extend outwards along the length direction to form a clamping portion 22, so that the overall length of the copper plate 2 is far greater than the width of the mounting groove 10, and when the copper plate 2 is placed in the mounting groove 10, the clamping portions 22 at two ends of the copper plate 2 can be just inserted into the clamping grooves 11, and finally, the connection of the copper plate 2 and the heat conducting plate 1 in a plugging manner is realized, and it is noted that in the scheme, the clamping portions 22 and the clamping grooves 11 can be connected in an interference fit manner, so that displacement of the copper plate 2 relative to the heat conducting plate 1 during operation of the liquid cooling heat dissipation device is avoided, and stability of the heat dissipation device is improved.

The cover plate 3 includes: the sealing gasket 30, the bottom of which is formed with a sealing groove 300, the sealing gasket 30 is used for covering a plurality of copper plates 2, so that the sealing groove 300 seals the heat dissipation cavity 21 to prevent the cooling liquid from flowing out of the heat dissipation cavity 21; the top cover 31 covers the heat conducting plate 1 and abuts against the sealing gasket 30, and the liquid inlet 310 and the liquid outlet 311 are both arranged on the top cover 31.

Referring to fig. 1, fig. 4 and fig. 6, the rubber gasket 30 is adopted in the scheme, when each copper plate 2 is inserted into the corresponding mounting groove 10 and the clamping groove 11, the gasket 30 can be utilized to cover all copper plates 2, as shown in fig. 4, the sealing groove 300 at the bottom of the gasket 30 abuts against the heat dissipation cavity 21, so that cooling liquid is effectively prevented from flowing out of the heat dissipation cavity 21 to the copper plates 2 when flowing through the micro-channels 20, and then the micro-channels 20 in the copper plates 2 and the heat dissipation cavity 21 are communicated, the tightness of the heat dissipation device is improved, and similarly, the sealing groove 300 can also be installed and connected in an interference fit mode when covering the copper plates 2, and the principle and the mode are the same and are not repeated herein.

In addition, in this embodiment, the top cover 31 with the liquid inlet 310 and the liquid outlet 311 is further used to cover the upper part of the heat dissipating device, referring to fig. 2, when the copper plates 2 are inserted into the mounting groove 10, the cooling liquid inlet 100 is formed on the left side of the mounting groove 10, and the cooling liquid outlet 101 is formed on the right side of the mounting groove 10, as shown in fig. 6, because the cooling liquid outlet 101 is located below the liquid inlet 310 and is communicated with the liquid inlet 310, the cooling liquid outlet 101 is located below the liquid outlet 311 and is communicated with the liquid outlet 311, when the cooling liquid flows in from the liquid inlet 310, the micro channels 20 and the heat dissipating cavities 21 which are mutually communicated and completely sealed can flow through from the cooling liquid inlet 100, and finally the cooling liquid carries heat to flow from the cooling liquid outlet 101 to the liquid outlet 311, thus cooling circularly.

Preferably, in the process of covering the gasket 30 by the top cover 31, a limit groove (not shown) may be provided at a position where the top cover 31 contacts the gasket 30, and the top end of the gasket 30 extends out of the limit groove along with the covering of the top cover 31, so as to further limit the movement of the gasket 30, and ensure the stability of the gasket 30 when sealing the heat dissipation chamber 21.

An installation plate 4 is further arranged between the top cover 31 and the heat conducting plate 1, an extension block 40 is formed at the periphery of the installation plate 4, and an installation hole 400 for installing and fixing the liquid cooling heat dissipation device is formed in the extension block 40.

Referring to fig. 1 and 6, the mounting plate 4 is located between the top cover 31 and the heat conducting plate 1, after the top cover 31 and the heat conducting plate 1 are connected, a user can place the liquid cooling heat dissipating device at a designated mounting position, and the whole heat dissipating device is finally fixed at a required position by penetrating through the mounting holes 400 on the extension block 40 by using connecting pieces such as screws, so that the whole heat dissipating device is simple in overall structure and convenient and fast to operate, and convenience is provided for the user.

The heat-conducting plate 1 is provided with a first connecting hole 12, the top cover 31 is provided with a second connecting hole 312, and the first connecting hole 12 and the second connecting hole 312 can be connected through a fixing piece when aligned so as to prevent relative displacement between the heat-conducting plate 1 and the top cover 31.

For the installation of the heat-conducting plate 1 and the top cover 31, referring to fig. 5, when the top cover 31 is covered on the mounting plate 4, the second connecting hole 312 on the top cover 31 is aligned with the first connecting hole 12 on the heat-conducting plate 1, at this time, a worker can connect the first connecting hole 12 with the second connecting hole 312 through a fixing piece, and finally, the connection between the top cover 31 and the heat-conducting plate 1 is completed, as shown in fig. 1, the top cover 31 is far larger than the heat-conducting plate 1, because the periphery of the top cover 31 is covered on the mounting plate 4, when the top cover 31 is connected with the heat-conducting plate 1, the mounting plate 4 at the middle position is also tightly fixed, and the mounting hole 400 for mounting and fixing the liquid cooling heat dissipation device is added, so that the overall stability of the device is further improved.

Preferably, the top cover 31 is abutted against the mounting plate 4 at the periphery, and a sealing ring (not shown in the figure) can be adopted for abutting, and the sealing ring is distributed at the periphery of the mounting groove 10, so that the cooling liquid is effectively prevented from penetrating out from the gap between the top cover 31 and the mounting plate 4 when passing through the cooling liquid inlet 100 or the cooling liquid outlet 101, and the tightness of the liquid cooling heat dissipation device is improved.

Referring to fig. 2, when a plurality of copper plates 2 are placed in the mounting groove 10, the micro-channels 20 are arranged linearly and regularly, that is, the micro-channels 20 in each copper plate 2 are on the same axis under the condition of communication, and then the heat dissipation capacity cavity formed between the adjacent copper plates 2 is combined, so that the heat dissipation performance of the device is increased by effectively utilizing the flocculation phenomenon. Further, because the split type processing mode is adopted to a plurality of copper 2 in this scheme, therefore when processing microchannel 20 in this embodiment, usable digit control machine tool adopts the little drill bit direct quick stable processing that the diameter is less than 1mm, and aperture and porosity all can be according to actual demand and adjust control, when reducing the processing degree of difficulty, also reduced manufacturing cost.

It should be noted that, the cooling liquid in this scheme adopts the pure water, is favorable to environmental protection on the one hand, reduces the cooling liquid cost on the other hand.

It should be noted that, the fixing member described herein may be any other fixing member such as a screw, a bolt, or the like.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.

Furthermore, descriptions such as those referred to herein as "first," "second," "a," and the like are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless specifically stated and limited otherwise, the terms "connected," "affixed," and the like are to be construed broadly, and for example, "affixed" may be a fixed connection, a removable connection, or an integral body; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the technical solutions of the embodiments of the present utility model may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present utility model.

Claims

1. A liquid-cooled heat sink, comprising:

The heat conducting plate is used for being connected with a heat source, the upper end of the heat conducting plate is provided with a mounting groove, and two sides of the mounting groove extend outwards to form a plurality of clamping grooves which are symmetrically distributed and communicated with each other;

2. The liquid-cooled heat sink of claim 1, wherein a heat dissipating cavity is formed between each two adjacent copper plates in communication with the microchannel.

3. The liquid cooling heat sink according to claim 1, wherein two ends of each copper plate are formed with engaging portions extending outward along a length direction thereof, and the engaging portions are inserted into the engaging grooves when the copper plates are placed in the mounting grooves.

4. The liquid-cooled heat sink of claim 2 wherein the cover plate comprises:

5. The liquid cooling heat sink as claimed in claim 4, wherein the heat conducting plate is provided with a first connecting hole, the top cover is provided with a second connecting hole, and the first connecting hole and the second connecting hole can be connected by a fixing piece when aligned so as to prevent relative displacement between the heat conducting plate and the top cover.

6. The liquid cooling heat sink as claimed in claim 4, wherein a mounting plate is further provided between the top cover and the heat conducting plate, an extension block is formed at the periphery of the mounting plate, and a mounting hole for mounting and fixing the liquid cooling heat sink is formed in the extension block.

7. The liquid-cooled heat sink of claim 1, wherein the plurality of micro-channels are arranged linearly and regularly when the plurality of copper plates are placed in the mounting recess.

8. The liquid cooling heat sink as claimed in claim 1, wherein the mounting groove has a cooling liquid inlet and a cooling liquid outlet at both ends thereof, respectively, the cooling liquid outlet being located below the liquid inlet and communicating therewith, and the cooling liquid outlet being located below the liquid outlet and communicating therewith.