CN221493710U - Special-shaped section extrusion die - Google Patents
Special-shaped section extrusion die Download PDFInfo
- Publication number
- CN221493710U CN221493710U CN202323205607.7U CN202323205607U CN221493710U CN 221493710 U CN221493710 U CN 221493710U CN 202323205607 U CN202323205607 U CN 202323205607U CN 221493710 U CN221493710 U CN 221493710U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- cooling
- water tank
- wall
- extrusion die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001125 extrusion Methods 0.000 title claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 68
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims description 36
- 238000005057 refrigeration Methods 0.000 claims description 7
- 239000007769 metal material Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 230000002159 abnormal effect Effects 0.000 claims 1
- 239000000110 cooling liquid Substances 0.000 abstract description 24
- 238000005507 spraying Methods 0.000 abstract description 2
- 239000002826 coolant Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 241000883990 Flabellum Species 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a special-shaped section extrusion die which comprises a fixed plate, wherein the top surface of the fixed plate is fixedly connected with a fixed ring, the inner wall of the fixed ring is fixedly connected with a die main body, the bottom surface of the fixed plate is fixedly connected with a connecting block, the bottom surface of the connecting block is fixedly connected with a fixed frame, a filling assembly is started to inject cooling liquid into a water tank, a semiconductor refrigerating sheet is started to reduce the temperature of the cooling liquid, a heat dissipation mechanism is started to conduct heat dissipation work on the heat dissipation end of the semiconductor refrigerating sheet, a circulation assembly is started to drive the cooling liquid to enter a cooling mechanism, the low temperature in the cooling liquid is transferred into the die main body through the cooling mechanism to conduct cooling work, and meanwhile, the cooling liquid flows back into the water tank through the circulation assembly to conduct circulating cooling work, so that the aim of facilitating rapid cooling of the extrusion die is achieved, and the problems that the cooling liquid is difficult to recycle and the cooling efficiency is low due to cooling of cooling the die through air cooling and spraying are avoided.
Description
Technical Field
The utility model relates to the technical field of extrusion dies, in particular to a special-shaped section extrusion die.
Background
Extrusion dies are also known as extrusion dies, which are one type of forming die, except that the way in which they are discharged is by extrusion. The aluminum alloy is widely applied to aluminum special-shaped structures and also used in plastic parts. The extruder is used for making pipes or profiles at the front end of the extruder. In short, a mold is a tool for molding an article, which is composed of various parts, and a different mold is composed of different parts, which realizes the processing of the outer shape of the article mainly by changing the physical state of the molded material.
In alloy material extrusion process, because the self heat of material and the heat that the friction produced all can make extrusion die rise gradually in the use, when mould itself temperature is too high, then can lead to hardness and the plasticity of mould to reduce the life of mould, consequently need use cooling arrangement to cool down the work to the mould, and current cooling mode is usually forced air cooling and sprays the cooling, but forced air cooling's cooling effect is relatively poor, and sprays the coolant liquid recovery work difficulty of cooling, leads to the cooling efficiency of mould low.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a special-shaped section extrusion die which is used for solving the problems in the background art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
The utility model provides an opposite type section bar extrusion die, includes the fixed plate, fixed plate top surface fixedly connected with solid fixed ring, gu fixed ring inner wall fixedly connected with mould main part, fixed plate bottom surface fixedly connected with connecting block, connecting block bottom surface fixedly connected with fixed frame, fixed frame inner wall fixedly connected with water tank, water tank inner wall fixedly connected with semiconductor refrigeration piece, the water tank surface is provided with heat dissipation mechanism, the inside filling subassembly that is provided with of water tank, mould main part surface is provided with cooling body, the inside circulation subassembly that is provided with of water tank.
Preferably, the heat dissipation mechanism comprises fan housing, support, servo motor and flabellum, fan housing and water tank surface fixed connection, support and fan housing inner wall fixed connection, servo motor and support inner wall fixed connection, flabellum and servo motor output fixed connection.
Preferably, the filling assembly consists of a filling pipe and an electromagnetic valve, wherein the filling pipe is fixedly connected with the inner wall of the water tank, and the electromagnetic valve is fixedly connected with the inner wall of the water tank.
Preferably, the cooling mechanism comprises a fixed groove and a cooling pipe, the fixed groove is formed in the surface of the die main body, and the cooling pipe is fixedly connected with the inner wall of the fixed groove.
Preferably, the circulating assembly comprises a liquid inlet pipe, a return pipe and a water pump, wherein the liquid inlet pipe is fixedly connected with the inner wall of the water tank, the liquid outlet end of the liquid inlet pipe is fixedly connected with the liquid inlet end of the cooling pipe, the return pipe is fixedly connected with the inner wall of the water tank, the liquid inlet end of the return pipe is fixedly connected with the liquid outlet end of the cooling pipe, the water pump is fixedly connected with the inner wall of the liquid inlet pipe, and the water pump is fixedly connected with the top surface of the water tank.
Preferably, the fixing frame is rectangular, and the fixing frame is made of metal materials.
Preferably, the number of the semiconductor refrigerating sheets is multiple, and the semiconductor refrigerating sheets are all positioned in the water tank.
Compared with the prior art, the utility model has the beneficial effects that: according to the special-shaped section extrusion die, a filling component is started to inject cooling liquid into a water tank, a semiconductor refrigerating sheet is started to reduce the temperature of the cooling liquid, a heat dissipation mechanism is started to conduct heat dissipation work on a heat dissipation end of the semiconductor refrigerating sheet, a circulation component is started to drive the cooling liquid to enter a cooling mechanism, low temperature in the cooling liquid is transmitted into a die main body through the cooling mechanism to conduct cooling work, and meanwhile the cooling liquid flows back into the water tank through the circulation component to conduct circulation cooling work; the aim of being convenient for carry out quick cooling to extrusion die has been realized, has avoided because of cooling down to the mould through forced air cooling and spray cooling, and the work difficulty is retrieved to the coolant liquid that leads to, and the low problem of cooling efficiency.
Drawings
FIG. 1 is an isometric view of a structure of the present utility model;
FIG. 2 is an enlarged view of the structure A of the present utility model;
Fig. 3 is a rear cross-sectional view of the structure of the present utility model.
In the figure: 1. a fixing plate; 2. a fixing ring; 3. a mold body; 4. a connecting block; 5. a fixed frame; 6. a water tank; 7. a semiconductor refrigeration sheet; 8. a fan housing; 9. a bracket; 10. a servo motor; 11. a fan blade; 12. a filling pipe; 13. an electromagnetic valve; 14. a fixing groove; 15. a cooling tube; 16. a liquid inlet pipe; 17. a return pipe; 18. and (3) a water pump.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to figures 1-3, an extrusion die for a special-shaped profile comprises a fixed plate 1, a fixed ring 2 is fixedly connected to the top surface of the fixed plate 1, a die main body 3 is fixedly connected to the inner wall of the fixed ring 2, a connecting block 4 is fixedly connected to the bottom surface of the fixed plate 1, a fixed frame 5 is fixedly connected to the bottom surface of the connecting block 4, the fixed frame 5 is rectangular, the fixed frame 5 is made of a metal material, the strength of the fixed frame 5 made of the metal material is higher, the fixed frame 5 is not easy to deform and damage after being stressed and is more durable, a water tank 6 is fixedly connected to the inner wall of the fixed frame 5, semiconductor refrigerating sheets 7 are fixedly connected to the inner wall of the water tank 6, the number of the semiconductor refrigerating sheets 7 is multiple, the semiconductor refrigerating sheets 7 are all positioned in the water tank 6 and used for reducing the temperature of cooling liquid, the cooling efficiency is improved, a heat dissipation mechanism is arranged on the surface of the water tank 6 and consists of a fan housing 8, a bracket 9, a servo motor 10 and fan blade 11, the fan housing 8 is fixedly connected with the surface of the water tank 6, the bracket 9 is fixedly connected with the inner wall of the fan housing 8, the servo motor 10 is fixedly connected with the inner wall of the bracket 9, the fan blades 11 are fixedly connected with the output end of the servo motor 10 and are used for radiating the semiconductor refrigerating plate 7, the problem that the semiconductor refrigerating plate 7 is overheated and damaged is avoided, the water tank 6 is internally provided with a filling component, the filling component consists of a filling pipe 12 and an electromagnetic valve 13, the filling pipe 12 is fixedly connected with the inner wall of the water tank 6, the electromagnetic valve 13 is fixedly connected with the inner wall of the water tank 6 and is used for filling and replacing cooling liquid, the cooling liquid is convenient to store, the surface of the die main body 3 is provided with a cooling mechanism, the cooling mechanism consists of a fixed groove 14 and a cooling pipe 15, the fixed groove 14 is arranged on the surface of the die main body 3, the cooling pipe 15 is fixedly connected with the inner wall of the fixed groove 14, bear coolant liquid flow, be convenient for transmit the low temperature in the coolant liquid and cool down the work, the inside circulating assembly that is provided with of water tank 6, circulating assembly comprises feed liquor pipe 16, back flow 17 and water pump 18, feed liquor pipe 16 and water tank 6 inner wall fixed connection, and feed liquor pipe 16 goes out liquid end and cooling tube 15 feed liquor end fixed connection, back flow 17 and water tank 6 inner wall fixed connection, and back flow 17 feed liquor end and cooling tube 15 go out liquid end fixed connection, water pump 18 and feed liquor pipe 16 inner wall fixed connection, and water pump 18 and water tank 6 top surface fixed connection, be used for driving the coolant liquid and flow, be convenient for carry out the circulative cooling work, open the filling assembly and pour into coolant liquid into water tank 6, start semiconductor refrigeration piece 7 and reduce the coolant liquid temperature, start radiating mechanism and carry out the heat dissipation work to semiconductor refrigeration piece 7 exothermic end, start-up circulating assembly drives the coolant liquid and gets into cooling mechanism, the low temperature in the coolant liquid passes through cooling mechanism and passes through in the mould main part 3 can cool down the work, the coolant liquid through circulating assembly backward flow to water tank 6 simultaneously, can circulate the cooling work, the realization is convenient for carrying out the quick cooling to the extrusion mould, because of spraying and cooling the cooling to the cooling mould has been difficult to the cooling efficiency, and the cooling problem is difficult is retrieved to the cooling liquid because of cooling.
The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.
When in use: firstly, a solenoid valve 13 is opened to inject cooling liquid into a water tank 6 through a filling pipe 12, a semiconductor refrigerating sheet 7 is started to absorb heat and release heat, the heat in the cooling liquid is absorbed through a heat absorbing end of the semiconductor refrigerating sheet 7 to reduce the temperature of the cooling liquid, a servo motor 10 is started to drive a fan blade 11 to rotate, air in an air suction cover 8 is pumped through rotation of the fan blade 11, heat released by a heat release end of the semiconductor refrigerating sheet 7 is driven to be discharged through flow of the air, a water pump 18 is started to pump the cooling liquid cooled in the water tank 6 through a liquid inlet pipe 16 to enter a cooling pipe 15, low temperature in the cooling liquid is transferred into a die main body 3 through the cooling pipe 15 in the cooling liquid flowing process, the cooling liquid temperature is gradually increased, and the cooling liquid after the temperature increase flows back to the water tank 6 through a return pipe 17, so that the cooling liquid can be cooled and cooled.
To sum up, this profiled bar extrusion die opens filling subassembly and pours into coolant liquid into water tank 6, start semiconductor refrigeration piece 7 and reduce coolant liquid temperature, start radiating mechanism and dispel the heat work to semiconductor refrigeration piece 7 heat release end, start circulating assembly and drive coolant liquid and get into cooling mechanism in, the low temperature in the coolant liquid passes through cooling mechanism and transmits in to the mould main part 3 can carry out cooling down work, simultaneously the coolant liquid passes through circulating assembly backward flow to in the water tank 6, can carry out the cooling down work circularly, the realization is convenient for carry out quick refrigerated target to extrusion die, avoided because of cooling down to the mould through forced air cooling and spray cooling, and lead to coolant liquid recovery work difficulty, and the problem that cooling efficiency is low, be used for solving the problem that proposes in the above-mentioned background art.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides an abnormal shape extrusion die, includes fixed plate (1), its characterized in that, fixed plate (1) top surface fixedly connected with solid fixed ring (2), gu fixed ring (2) inner wall fixedly connected with mould main part (3), fixed plate (1) bottom surface fixedly connected with connecting block (4), connecting block (4) bottom surface fixedly connected with fixed frame (5), fixed frame (5) inner wall fixedly connected with water tank (6), water tank (6) inner wall fixedly connected with semiconductor refrigeration piece (7), water tank (6) surface is provided with cooling mechanism, water tank (6) inside is provided with the filling subassembly, mould main part (3) surface is provided with cooling body, water tank (6) inside is provided with circulation subassembly.
2. The special-shaped section extrusion die of claim 1, wherein the heat dissipation mechanism consists of a fan cover (8), a bracket (9), a servo motor (10) and fan blades (11), the fan cover (8) is fixedly connected with the surface of the water tank (6), the bracket (9) is fixedly connected with the inner wall of the fan cover (8), the servo motor (10) is fixedly connected with the inner wall of the bracket (9), and the fan blades (11) are fixedly connected with the output end of the servo motor (10).
3. The profiled bar extrusion die as claimed in claim 1, wherein the filling assembly comprises a filling pipe (12) and an electromagnetic valve (13), the filling pipe (12) is fixedly connected with the inner wall of the water tank (6), and the electromagnetic valve (13) is fixedly connected with the inner wall of the water tank (6).
4. The special-shaped section extrusion die according to claim 1, wherein the cooling mechanism consists of a fixing groove (14) and a cooling pipe (15), the fixing groove (14) is formed on the surface of the die main body (3), and the cooling pipe (15) is fixedly connected with the inner wall of the fixing groove (14).
5. The special-shaped section extrusion die according to claim 1, wherein the circulation assembly consists of a liquid inlet pipe (16), a return pipe (17) and a water pump (18), the liquid inlet pipe (16) is fixedly connected with the inner wall of the water tank (6), the liquid outlet end of the liquid inlet pipe (16) is fixedly connected with the liquid inlet end of the cooling pipe (15), the return pipe (17) is fixedly connected with the inner wall of the water tank (6), the liquid inlet end of the return pipe (17) is fixedly connected with the liquid outlet end of the cooling pipe (15), the water pump (18) is fixedly connected with the inner wall of the liquid inlet pipe (16), and the water pump (18) is fixedly connected with the top surface of the water tank (6).
6. The profiled bar extrusion die as claimed in claim 1, wherein the fixing frame (5) is rectangular, and the fixing frame (5) is made of metal material.
7. The profiled bar extrusion die as claimed in claim 1, wherein the number of the semiconductor refrigerating sheets (7) is plural, and the plural semiconductor refrigerating sheets (7) are all located inside the water tank (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323205607.7U CN221493710U (en) | 2023-11-27 | 2023-11-27 | Special-shaped section extrusion die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323205607.7U CN221493710U (en) | 2023-11-27 | 2023-11-27 | Special-shaped section extrusion die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221493710U true CN221493710U (en) | 2024-08-09 |
Family
ID=92143676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323205607.7U Active CN221493710U (en) | 2023-11-27 | 2023-11-27 | Special-shaped section extrusion die |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221493710U (en) |
-
2023
- 2023-11-27 CN CN202323205607.7U patent/CN221493710U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214645658U (en) | Circulating water cooling structure for injection mold | |
| CN109203396A (en) | Cooling device is used in a kind of work of injection mold | |
| CN220808463U (en) | Novel quick cooling device for modified plastic processing | |
| CN221493710U (en) | Special-shaped section extrusion die | |
| CN117301454A (en) | Cooling system for injection mold processing | |
| CN217622117U (en) | Temperature control device of plastic extruding machine for producing extruded sheet | |
| CN215746261U (en) | Sewage pump casing foundry goods mould | |
| CN215550849U (en) | One-step dry-method forming die for automobile interior trim parts capable of being rapidly cooled | |
| CN211251282U (en) | Plastic extruding machine with cooling mechanism for manufacturing PET plastic steel belt | |
| CN219338526U (en) | Forming device with circulation liquid cooling function | |
| CN220240041U (en) | Pouring cooling device for valve casting | |
| CN221022214U (en) | Injection mold with cooling structure | |
| CN220499864U (en) | Plastic mold convenient for cooling and forming | |
| CN221324813U (en) | Cooling device is used in aluminium alloy production | |
| CN216181966U (en) | Circulating cooling structure of mould pressing rubber coating piece mould | |
| CN214188395U (en) | Energy-saving consumption-reducing mould temperature controller | |
| CN220482423U (en) | Flange pad multilayer forming die for rubber processing | |
| CN216048674U (en) | Circulating water supply device for emulsifier cooling box | |
| CN220681542U (en) | External auxiliary cooling equipment for injection mold | |
| CN219153658U (en) | Injection mold capable of shortening cooling time | |
| CN117960825B (en) | Aluminum alloy profile molding cooling system | |
| CN214687800U (en) | Quick refrigerated make-up machine | |
| CN220280448U (en) | Cooling device for plastic wire drawing | |
| CN219686333U (en) | ASA curtain coating membrane machine | |
| CN217942291U (en) | High-precision sheet metal structure welding rapid-cooling anti-deformation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |