CN221464035U - Pure water heating device for silicon wafer cleaning machine - Google Patents
Pure water heating device for silicon wafer cleaning machine Download PDFInfo
- Publication number
- CN221464035U CN221464035U CN202321482099.4U CN202321482099U CN221464035U CN 221464035 U CN221464035 U CN 221464035U CN 202321482099 U CN202321482099 U CN 202321482099U CN 221464035 U CN221464035 U CN 221464035U
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- China
- Prior art keywords
- heat exchange
- pure water
- air
- silicon wafer
- air inlet
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 238000004140 cleaning Methods 0.000 title claims abstract description 46
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 17
- 239000010703 silicon Substances 0.000 title claims abstract description 17
- 238000010438 heat treatment Methods 0.000 title claims abstract description 16
- 238000005406 washing Methods 0.000 claims description 5
- 229920000742 Cotton Polymers 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 210000002421 cell wall Anatomy 0.000 claims 1
- 238000011084 recovery Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The pure water heating device for the silicon wafer cleaning machine comprises a machine body, a gas supply mechanism, a gas exhaust mechanism, a heat exchange pipe, a gas inlet and a gas outlet, wherein the gas supply mechanism is arranged on one side of the machine body, the heat exchange end of the gas supply mechanism is positioned in a cleaning tank of the machine body, the gas exhaust mechanism is arranged on the gas exhaust end of the gas supply mechanism, the heat exchange pipes are equidistantly arranged in the cleaning tank in the machine body and are fixedly connected, the gas inlet and the gas outlet of the heat exchange pipes are positioned outside the cleaning tank, and the gas inlet and the gas outlet of the heat exchange pipes are respectively communicated with the gas inlet pipe and the gas inlet end of the gas exhaust mechanism; according to the pure water heating device for the silicon wafer cleaning machine, hot steam emitted by other devices is guided by the air supply mechanism, pure water in the cleaning tank is subjected to heat exchange by the heat exchange pipe in the air supply mechanism, the pure water in the cleaning tank is heated, the consumption of electric energy is reduced, resources are reused, the steam subjected to heat exchange is discharged by the air exhaust mechanism, and condensed water generated during heat exchange is collected for resource recovery.
Description
Technical Field
The utility model relates to the technical field of silicon wafer cleaning, in particular to a pure water heating device for a silicon wafer cleaning machine.
Background
The pure water in the cleaning tank is required to be heated to 40-60 degrees in the cleaning process, and the pure water is heated by the electric heating pipe before, so that the processing cost is increased, but a large amount of steam can be emitted by the thermal power plant during working, and the steam is directly discharged, so that the waste of resources is caused.
Disclosure of utility model
In order to overcome the defects in the background technology, the utility model discloses a pure water heating device for a silicon wafer cleaning machine, which is characterized in that hot steam emitted by other devices is guided by an air supply mechanism, pure water in a cleaning tank is subjected to heat exchange by a heat exchange pipe in the air supply mechanism, the pure water in the cleaning tank is heated, the consumption of electric energy is reduced, resources are reused, the steam subjected to heat exchange is discharged by an exhaust mechanism, and condensed water generated during heat exchange is collected to recycle the resources.
In order to achieve the aim of the utility model, the utility model adopts the following technical scheme:
The pure water heating device for the silicon wafer cleaning machine comprises a machine body, wherein a gas supply mechanism is arranged on one side of the machine body, a heat exchange end of the gas supply mechanism is positioned in a cleaning tank of the machine body, and an exhaust mechanism is arranged on an exhaust end of the gas supply mechanism.
The air supply mechanism comprises a shunt tube, a pneumatic valve, an air inlet tube, a heat exchange tube and a temperature sensor, wherein the heat exchange tubes are equidistantly arranged in a cleaning tank in the machine body and are fixedly connected, air inlet and air outlet openings of the heat exchange tubes are all positioned outside the cleaning tank, the air inlet and air outlet openings of the heat exchange tubes are respectively communicated with the air inlet ends of the air inlet tube and the air outlet mechanism, the pneumatic valve is arranged on the air inlet tube, an air inlet of the pneumatic valve is communicated with an air inlet of the shunt tube, and the temperature sensor is equidistantly arranged on the tank wall of the cleaning tank in the machine body and is fixedly connected with the tank wall.
The outer surfaces of the shunt tubes and the air inlet pipes are respectively wrapped with heat preservation cotton.
The shunt tubes and the intake pipe are hard tubes.
The heat exchange tube is a coil, and the coil is distributed at the bottom of the cleaning tank.
The exhaust mechanism comprises an air duct, an exhaust pipe, a water collecting tank, a flow guide pipe and a condenser, wherein an air inlet of the air duct is communicated with an air outlet of the heat exchange pipe, an air outlet of the air duct is communicated with an air inlet of the condenser, an air outlet of the condenser is communicated with the air inlet of the exhaust pipe, a water outlet of the condenser is communicated with the water collecting tank through the flow guide pipe, and the water collecting tank is located at a fixed end of the machine body.
Due to the adoption of the technical scheme, the utility model has the following beneficial effects:
According to the pure water heating device for the silicon wafer cleaning machine, hot steam emitted by other devices is guided by the air supply mechanism, pure water in the cleaning tank is subjected to heat exchange by the heat exchange pipe in the air supply mechanism, the pure water in the cleaning tank is heated, the consumption of electric energy is reduced, resources are reused, the steam subjected to heat exchange is discharged by the air exhaust mechanism, and condensed water generated during heat exchange is collected for resource recovery.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a cross-sectional view of the present utility model;
FIG. 3 is an enlarged schematic view of the structure of the present utility model at A;
1. A body; 2. an exhaust mechanism; 201. an air duct; 202. an exhaust pipe; 203. a water collection tank; 204. a flow guiding pipe; 205. a condenser; 3. a gas supply mechanism; 301. a shunt; 302. a pneumatic valve; 303. an air inlet pipe; 304. a heat exchange tube.
Description of the embodiments
The utility model will be explained in more detail by the following examples, the purpose of which is to protect all technical improvements within the scope of the utility model.
The utility model provides a pure water heating device for silicon chip cleaning machine, includes organism 1, air feed mechanism 3 is installed to one side of organism 1, and air feed mechanism 3's heat transfer end is located the washing tank of organism 1, carries out the water conservancy diversion through air feed mechanism 3 to hot steam, makes hot steam heat the pure water in the washing tank, install exhaust mechanism 2 on air feed mechanism 3's the exhaust end, discharges the steam after the heat transfer through exhaust mechanism 2 to collect the comdenstion water that carries in the steam, control air feed mechanism 3 carries out work through the control mechanism on the organism 1, and supplies power for the consumer in the air feed mechanism 3 through the control mechanism on the organism 1.
The air supply mechanism 3 comprises a shunt tube 301, a pneumatic valve 302, an air inlet tube 303, a heat exchange tube 304 and a temperature sensor, wherein the heat exchange tube 304 is equidistantly arranged in a cleaning tank in the machine body 1 and is fixedly connected, the air inlet and outlet ports of the heat exchange tube 304 are all positioned outside the cleaning tank, the air inlet and outlet ports of the heat exchange tube 304 are respectively communicated with the air inlet ends of the air inlet tube 303 and the air outlet mechanism 2, the air inlet tube 303 is provided with the pneumatic valve 302, the air inlet of the pneumatic valve 302 is communicated with the air inlet of the shunt tube 301, the temperature sensor is equidistantly arranged on the tank wall of the cleaning tank in the machine body 1 and is fixedly connected with the air inlet of the shunt tube 301, the temperature of pure water in the cleaning tank is detected through the temperature sensor, detection data are transmitted to a control mechanism in the machine body 1, the received data are subjected to finishing analysis through the control mechanism in the machine body 1, and the pneumatic valve 302 is started and closed according to different temperatures of the pure water in the cleaning tank.
The outer surfaces of the shunt tubes 301 and the air inlet tubes 303 are respectively wrapped with heat insulation cotton.
The shunt tubes 301 and the air inlet tubes 303 are hard tubes, and the hard tubes can be steel tubes or hard plastic tubes with certain supporting capacity.
The heat exchange tube 304 is a coil, and the coil is distributed at the bottom of the cleaning tank, so that pure water in the cleaning tank is effectively heated.
The exhaust mechanism 2 comprises an air duct 201, an exhaust pipe 202, a water collecting tank 203, a guide pipe 204 and a condenser 205, wherein an air inlet of the air duct 201 is communicated with an air outlet of a heat exchange pipe 304, an air outlet of the air duct 201 is communicated with an air inlet of the condenser 205, an air outlet of the condenser 205 is communicated with the air inlet of the exhaust pipe 202, a water outlet of the condenser 205 is communicated with the water collecting tank 203 through the guide pipe 204, and the water collecting tank 203 is positioned on a fixed end of the machine body 1.
When the pure water heating device for the silicon wafer cleaning machine is used, a worker conveys hot steam generated by the work of a thermal power plant into the split pipe 301, the hot steam is conveyed into the heat exchange pipe 304 through the split pipe 301, pure water in the cleaning tank in the machine body 1 is heated through the heat exchange pipe 304, the temperature of the pure water in the cleaning tank is detected through the temperature sensor on the wall of the cleaning tank, detection information is transmitted into the control mechanism on the machine body 1, the data are subjected to finishing analysis through the control mechanism on the machine body 1, after the pure water reaches a certain temperature, the pneumatic valve 302 is closed through the control mechanism on the machine body 1, the hot steam stops to be provided, the hot steam can move along the heat exchange pipe 304, heat exchange is carried out between the hot steam and the pure water in the cleaning tank in the moving process of the hot steam, the pure water is heated through the condenser 205, the condensed water generated during the heat exchange of the steam is collected through the condenser 205, the collected condensed water is conveyed into the water collection tank 203, and the filtered steam is discharged into a trench through the exhaust pipe 202.
While the utility model has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (6)
1. The pure water heating device for the silicon wafer cleaning machine comprises a machine body (1), and is characterized in that: an air supply mechanism (3) is arranged on one side of the machine body (1), the heat exchange end of the air supply mechanism (3) is positioned in the cleaning tank of the machine body (1), and an exhaust mechanism (2) is arranged on the exhaust end of the air supply mechanism (3).
2. The pure water heating apparatus for a silicon wafer cleaning machine according to claim 1, wherein: the utility model provides a gas supply mechanism (3) is including shunt tubes (301), pneumatic valve (302), intake pipe (303), heat exchange tube (304) and temperature sensor, heat exchange tube (304) equidistance is arranged in the washing tank in organism (1) and fixed connection, and the inlet and outlet of heat exchange tube (304) all are located outside the washing tank, the inlet and outlet of heat exchange tube (304) communicates with the inlet end of intake pipe (303) and exhaust mechanism (2) respectively, be equipped with pneumatic valve (302) on intake pipe (303), and the air inlet of pneumatic valve (302) is linked together with the air inlet of shunt tubes (301), temperature sensor equidistance is arranged on the cell wall of washing tank in organism (1) and fixed connection.
3. The pure water heating apparatus for a silicon wafer cleaning machine according to claim 2, wherein: the outer surfaces of the shunt tubes (301) and the air inlet tubes (303) are respectively wrapped with heat insulation cotton.
4. The pure water heating apparatus for a silicon wafer cleaning machine according to claim 2, wherein: the shunt tube (301) and the air inlet tube (303) are hard tubes.
5. The pure water heating apparatus for a silicon wafer cleaning machine according to claim 2, wherein: the heat exchange tube (304) is a coil, and the coil is distributed at the bottom of the cleaning tank.
6. The pure water heating apparatus for a silicon wafer cleaning machine according to claim 1, wherein: the exhaust mechanism (2) comprises an air duct (201), an exhaust pipe (202), a water collecting tank (203), a guide pipe (204) and a condenser (205), wherein an air inlet of the air duct (201) is communicated with an air outlet of a heat exchange pipe (304), an air outlet of the air duct (201) is communicated with an air inlet of the condenser (205), an air outlet of the condenser (205) is communicated with an air inlet of the exhaust pipe (202), a water outlet of the condenser (205) is communicated with the water collecting tank (203) through the guide pipe (204), and the water collecting tank (203) is located at a fixed end of the machine body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321482099.4U CN221464035U (en) | 2023-06-12 | 2023-06-12 | Pure water heating device for silicon wafer cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321482099.4U CN221464035U (en) | 2023-06-12 | 2023-06-12 | Pure water heating device for silicon wafer cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221464035U true CN221464035U (en) | 2024-08-02 |
Family
ID=92342627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321482099.4U Active CN221464035U (en) | 2023-06-12 | 2023-06-12 | Pure water heating device for silicon wafer cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221464035U (en) |
-
2023
- 2023-06-12 CN CN202321482099.4U patent/CN221464035U/en active Active
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