CN221456631U - Plastic injection mold convenient to heat dissipation - Google Patents

Plastic injection mold convenient to heat dissipation Download PDF

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Publication number
CN221456631U
CN221456631U CN202420032191.9U CN202420032191U CN221456631U CN 221456631 U CN221456631 U CN 221456631U CN 202420032191 U CN202420032191 U CN 202420032191U CN 221456631 U CN221456631 U CN 221456631U
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CN
China
Prior art keywords
water tank
injection mold
heat dissipation
cavity
inboard
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CN202420032191.9U
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Chinese (zh)
Inventor
涂怀学
陈康军
林剑
钟剑文
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Juzexin Precision Mold Technology Co ltd In Shunde District Foshan City
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Juzexin Precision Mold Technology Co ltd In Shunde District Foshan City
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Application filed by Juzexin Precision Mold Technology Co ltd In Shunde District Foshan City filed Critical Juzexin Precision Mold Technology Co ltd In Shunde District Foshan City
Priority to CN202420032191.9U priority Critical patent/CN221456631U/en
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Publication of CN221456631U publication Critical patent/CN221456631U/en
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Abstract

The utility model relates to a plastic injection mold convenient for heat dissipation, which comprises a base, wherein the upper end of the base is fixedly connected with a lower shell, the upper end of the lower shell is provided with an upper shell, and the inner sides of the lower shell and the upper shell are respectively provided with a mold body; the side walls of the lower shell and the upper shell are provided with cavities, and the upper end of the base is fixedly connected with a water tank communicated with the cavities. This plastic injection mold convenient to heat dissipation, through the start-up of water pump, the conveyer pipe carries the inboard of lower casing cavity with the water in its water tank, under the cooperation of joint and bellows, the inboard water of lower casing enters into the inboard of last casing, then flow back to the inboard of water tank through the fluid-discharge tube, refrigeration operation is carried out through the inboard semiconductor refrigeration board of water tank, under the cooperation of heat-absorbing plate and heat conducting rod, thereby make the inboard of cavity is transmitted to the heat of the inside machined part of its mould, flow through water, dispel the heat fast to its machined part, thereby the machining efficiency of machined part has been improved.

Description

Plastic injection mold convenient to heat dissipation
Technical Field
The utility model relates to the technical field of plastic injection molds, in particular to a plastic injection mold convenient for heat dissipation.
Background
The plastic mould is a tool for processing plastic to form the plastic, is matched with a plastic forming machine in the plastic processing industry, and is a tool for endowing a plastic product with complete configuration and accurate size; because of the variety of plastics and the variety of processing methods, the structures of the plastic molding machine and the plastic products are various, so the variety and the structure of the plastic mold are also various.
Most injection mold is when using, probably because radiating efficiency is lower to probably make injection mold can not dispel the heat fast, thereby probably can not make the product in the injection mold quick shaping, reduced production efficiency.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides the plastic injection mold convenient for heat dissipation, which has the advantages of high heat dissipation efficiency, high production efficiency and the like, and solves the problems that most injection molds cannot quickly dissipate heat due to low heat dissipation efficiency, products in the injection molds cannot be quickly molded and the production efficiency is reduced when the injection molds are used.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the plastic injection mold comprises a base, wherein the upper end of the base is fixedly connected with a lower shell, the upper end of the lower shell is provided with an upper shell, and the inner sides of the lower shell and the upper shell are respectively provided with a mold body;
The lower shell is provided with a cavity with the side wall of the upper shell, the upper end of the base is fixedly connected with a water tank communicated with the cavity, the inner side wall of the water tank is provided with a water pump communicated with the cavity, the inner side wall of the water tank is fixedly provided with a semiconductor refrigeration plate, and the inner side wall of the die body is fixedly connected with a heat absorbing plate.
Further, the outer sides of the lower shell and the upper shell are respectively communicated with a joint, and a corrugated pipe is communicated between the two joints.
Further, the water tank is communicated with the cavity on the inner side of the upper shell through a liquid discharge pipe.
Further, a liquid adding port is formed in the upper end of the water tank, and a blocking cover is mounted on the inner side of the liquid adding port.
Further, the output end of the water pump is communicated with a conveying pipe, and the other end of the conveying pipe is communicated with the cavity on the inner side of the lower shell.
Further, the outside fixedly connected with heat conduction stick of absorber plate, the heat conduction stick runs through and extends to the inboard of cavity.
Compared with the prior art, the technical scheme of the application has the following beneficial effects:
This plastic injection mold convenient to heat dissipation, through the start-up of water pump, the conveyer pipe carries the inboard of lower casing cavity with the water in its water tank, under the cooperation of joint and bellows, the inboard water of lower casing enters into the inboard of last casing, then flow back to the inboard of water tank through the fluid-discharge tube, refrigeration operation is carried out through the inboard semiconductor refrigeration board of water tank, under the cooperation of heat-absorbing plate and heat conducting rod, thereby make the inboard of cavity is transmitted to the heat of the inside machined part of its mould, flow through water, dispel the heat fast to its machined part, thereby the machining efficiency of machined part has been improved.
Drawings
FIG. 1 is a schematic diagram of the front view of the structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the structure of the present utility model;
Fig. 3 is a schematic perspective view of the structural shell of the present utility model.
In the figure: 1. a base; 2. a lower housing; 3. an upper housing; 301. a joint; 302. a bellows; 4. a die body; 5. a cavity; 6. a water tank; 601. a liquid discharge pipe; 602. a liquid adding port; 603. a blanking cover; 7. a water pump; 701. a delivery tube; 8. a semiconductor refrigeration plate; 9. a heat absorbing plate; 901. a heat conduction rod.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, a plastic injection mold with heat dissipation convenience in this embodiment includes a base 1, a lower housing 2 is fixedly connected to an upper end of the base 1, an upper housing 3 is mounted at an upper end of the lower housing 2, a middle of the lower housing 2 and the upper housing 3 is concave, connectors 301 are respectively communicated with an outer side of the lower housing 2 and an outer side of the upper housing 3, the connectors 301 are L-shaped, a bellows 302 is respectively communicated between the two connectors 301, and the connectors 301 are matched with the bellows 302, so that liquid inside the lower housing 2 can enter an inner side of the upper housing 3, and mold bodies 4 are respectively arranged inside the lower housing 2 and the upper housing 3.
The side walls of the lower shell 2 and the upper shell 3 are respectively provided with a cavity 5, the upper end of the base 1 is fixedly connected with a water tank 6 communicated with the cavities 5, the water tank 6 is communicated with the cavities 5 at the inner side of the upper shell 3 through a liquid discharge pipe 601, the upper end of the water tank 6 is provided with a liquid adding port 602, and the inner side of the liquid adding port 602 is provided with a blocking cover 603;
The water pump 7 with cavity 5 intercommunication is installed to the inside wall of water tank 6, the output intercommunication of water pump 7 has conveyer pipe 701, the other end and the cavity 5 intercommunication of lower casing 2 inboard of conveyer pipe 701, the inside wall fixed mounting of water tank 6 has semiconductor refrigeration board 8, the inside wall fixedly connected with absorber plate 9 of mould body 4, the specification looks adaptation of absorber plate 9 and the inside wall of mould body 4, the outside fixedly connected with heat conduction stick 901 of absorber plate 9, the quantity of heat conduction stick 901 is a plurality of, heat conduction stick 901 runs through and extends to the inboard of cavity 5.
In this embodiment, the heat dissipation treatment can be rapidly performed on the workpiece by the cooperation between the lower housing 2 and the heat absorbing plate 9.
The working principle of the embodiment is as follows:
Through the start-up of water pump 7, the conveyer pipe 701 carries the inboard of the cavity 5 of lower casing 2 with the water in its water tank 6, under the cooperation of joint 301 and bellows 302, the inboard water of lower casing 2 enters into the inboard of last casing 3, then flow back to the inboard of water tank 6 through the fluid-discharge tube 601, refrigeration operation is carried out through the inboard semiconductor refrigeration board 8 of water tank 6, under the cooperation of heat-conducting rod 901 through absorber plate 9, thereby make the heat transfer of the inboard machined part of its mould body 4 to the inboard of cavity 5, through the flow of water, dispel the heat fast to its machined part, thereby improved the machining efficiency of machined part.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a plastics injection mold convenient to heat dissipation, includes base (1), its characterized in that: the upper end of the base (1) is fixedly connected with a lower shell (2), an upper shell (3) is arranged at the upper end of the lower shell (2), and die bodies (4) are arranged on the inner sides of the lower shell (2) and the upper shell (3);
The utility model discloses a die, including lower casing (2), upper casing (3), cavity (5) have all been seted up to the lateral wall of lower casing (2) and upper casing (3), the upper end fixedly connected with of base (1) with water tank (6) of cavity (5) intercommunication, water pump (7) with cavity (5) intercommunication are installed to the inside wall of water tank (6), the inside wall fixed mounting of water tank (6) has semiconductor refrigeration board (8), the inside wall fixedly connected with absorber plate (9) of die body (4).
2. The plastic injection mold facilitating heat dissipation according to claim 1, wherein: the outer sides of the lower shell (2) and the upper shell (3) are respectively communicated with a joint (301), and a corrugated pipe (302) is communicated between the two joints (301).
3. The plastic injection mold facilitating heat dissipation according to claim 1, wherein: the water tank (6) is communicated with the cavity (5) at the inner side of the upper shell (3) through a liquid discharge pipe (601).
4. The plastic injection mold facilitating heat dissipation according to claim 1, wherein: the upper end of the water tank (6) is provided with a liquid adding port (602), and the inner side of the liquid adding port (602) is provided with a blanking cover (603).
5. The plastic injection mold facilitating heat dissipation according to claim 1, wherein: the output end of the water pump (7) is communicated with a conveying pipe (701), and the other end of the conveying pipe (701) is communicated with a cavity (5) at the inner side of the lower shell (2).
6. The plastic injection mold facilitating heat dissipation according to claim 1, wherein: the heat-conducting rod (901) is fixedly connected to the outer side of the heat-absorbing plate (9), and the heat-conducting rod (901) penetrates through and extends to the inner side of the cavity (5).
CN202420032191.9U 2024-01-05 2024-01-05 Plastic injection mold convenient to heat dissipation Active CN221456631U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202420032191.9U CN221456631U (en) 2024-01-05 2024-01-05 Plastic injection mold convenient to heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202420032191.9U CN221456631U (en) 2024-01-05 2024-01-05 Plastic injection mold convenient to heat dissipation

Publications (1)

Publication Number Publication Date
CN221456631U true CN221456631U (en) 2024-08-02

Family

ID=92350924

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202420032191.9U Active CN221456631U (en) 2024-01-05 2024-01-05 Plastic injection mold convenient to heat dissipation

Country Status (1)

Country Link
CN (1) CN221456631U (en)

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