CN221381532U - Mounting bracket with heat conducting function and electronic equipment assembly - Google Patents

Abstract

The application provides a mounting bracket with a heat conducting function and an electronic equipment assembly, and belongs to the technical field of mounting equipment. The mounting bracket provided by the application comprises a bracket body and a heat dissipation piece, wherein the bracket body is used for bearing electronic equipment and is provided with a containing cavity for containing bundling cables of the electronic equipment in the cavity; the heat dissipation part is connected with the bracket body, is in thermal contact with the heat radiator of the electronic equipment and is matched and connected with the mounting structure of the electronic equipment, and the thermal contact surface of the heat dissipation part is in a zigzag shape or a wavy shape. The mounting bracket provided by the application can conveniently and rapidly store cables of electronic equipment, and can fully conduct heat and dissipate heat while meeting the cable storage requirement, so that the multiple requirements on the installation wiring neatness, the use stability and the heat dissipation efficiency in the installation and use processes of the electronic equipment are met.

Description

Mounting bracket with heat conducting function and electronic equipment assembly

Technical Field

The application relates to the technical field of mounting equipment, in particular to a mounting bracket with a heat conduction function and an electronic equipment assembly.

Background

WLAN (Wireless Local Area Network ) devices, ONT (Optical Network Terminal, optical network terminal), FTTR (fiber to the room, fiber to room) devices, cat devices, full house intelligent terminal devices, etc., generally require the use of mounting brackets to achieve mounting and fixing on a wall. In the use scenario of modern network devices such as gateways, routers, etc., cable management and heat dissipation efficiency are two key factors that directly affect the operational stability and lifetime of the device. Particularly in environments where space is limited, insufficient cable receiving space can cause a series of problems, with heat dissipation difficulties being particularly pronounced.

In the related art, due to the limited space on the mounting bracket, the cable receiving space is insufficient, and a plurality of cables are forced to be stacked together, which can significantly reduce the air circulation path, so that the heat dissipation of the electronic device is difficult.

Disclosure of utility model

The application provides a mounting bracket with a heat conducting function and an electronic equipment assembly, wherein the mounting bracket can conveniently and rapidly store cables of electronic equipment, and has heat conducting and radiating functions when meeting the cable storage requirement, so that the heat radiating efficiency can be effectively improved, and multiple requirements on the aspect of installation wiring cleanliness and the aspect of electronic equipment heat radiation are met.

In a first aspect, the present application provides a mounting bracket for carrying an electronic device, the mounting bracket comprising a bracket body, a wire hanging member, and a heat dissipating member, the bracket body having a receiving cavity with an opening; the wire hanging piece is connected to the cavity wall of the accommodating cavity; the binding cable of the electronic equipment can enter the accommodating cavity through the opening and is hung on the wire hanging piece; the heat dissipation piece is connected with the bracket body and can thermally contact with the heat radiator of the electronic equipment borne by the bracket body, and the thermal contact surface of the heat dissipation piece is in a zigzag shape or a wavy shape; the heat dissipation piece is connected with the mounting structure on the electronic equipment in a matched mode, so that the support body bears and fixes the electronic equipment.

In the scheme shown in the application, the mounting bracket comprises a bracket body with a containing cavity, so that the mounting bracket can contain cables of the electronic equipment through the containing cavity on the bracket body while bearing the electronic equipment. In consideration of the fact that the cables such as the power wires of the electronic equipment are generally in a bundling state when the electronic equipment is shipped, the accommodating cavity is provided with an opening, and the wire hanging piece is connected to the cavity wall of the accommodating cavity, so that when the electronic equipment is installed through the mounting bracket, the bundling cables of the electronic equipment can be sent into the accommodating cavity through the opening and are directly hung on the wire hanging piece, the step of knowing the bundling cables is omitted, the step of winding the cables on the wire winding disc is omitted, the convenience of the accommodating operation and the accommodating efficiency of the cables of the electronic equipment are improved, and the improvement of the installation and arrangement efficiency of the electronic equipment is facilitated.

In the scheme, the structural design of the mounting bracket is improved, so that the mounting bracket not only can bear and fix electronic equipment, but also can effectively improve the heat dissipation effect of the equipment. The bracket body is used for bearing electronic equipment such as a gateway. The design of the bracket body considers the stability of the structure and the equipment adapting to different sizes and shapes. The heat sink is connected to the bracket body and is capable of thermally contacting a heat sink on the electronic device. The heat sink may be made of a highly thermally conductive material, such as aluminum alloy or copper, to optimize heat transfer efficiency. The heat sink is designed to make direct physical contact with a heat sink (e.g., a heat sink or a heat dissipating fan) of the electronic device, thereby directly absorbing heat and rapidly conducting it to the environment. The heat dissipation piece is matched with a mounting structure (such as screw holes, buckling positions and the like) on the electronic equipment, so that the bracket is firmly connected with the equipment, and meanwhile, the effectiveness of thermal contact is ensured.

In one possible implementation, the wire hanging piece comprises at least two hooks, the at least two hooks are arranged in pairs, and the hook parts of the two hooks in pairs face away from each other; wherein the binding cable is suitable for being hung on at least one pair of hooks.

In the scheme shown in the application, the wire hanging piece comprises at least two hooks which are arranged in pairs, and the binding cable of the electronic equipment can be hung on at least one pair of hooks. Because the hook parts of each pair of hooks are away from each other, the hook parts can hook the bundling cables hung on the pair of hooks so as to prevent the bundling cables from falling off the hooks, on one hand, the hanging reliability of the bundling cables is ensured, on the other hand, the hooks are simple in structure, the required arrangement space is small, and the light-weight and miniaturized design of the mounting bracket is more facilitated.

In one possible implementation, the at least two hooks are connected to a bottom wall of the housing cavity and are arranged at intervals along the circumference of the bottom wall, the bottom wall being opposite to the opening.

In the scheme shown in the application, at least two hooks are connected to the bottom wall of the accommodating cavity, and the bottom wall is opposite to the opening, so that the operation convenience of hanging the binding cable is improved; and when the couple sets up on the diapire, the hook portion of couple is towards holding the lateral wall protrusion of chamber promptly, hangs the bundle cable of establishing on the couple and is in fact overlapped on the pole portion of couple to receive the blocking of hook portion, consequently can further reduce the probability that bundle cable slipped off from the couple, improved the string of tying up the cable and establish the reliability, and guaranteed the stability of tying up the cable in holding the intracavity.

In one possible implementation, the mounting bracket further includes a cover member covering the opening of the accommodating chamber, and the cover member is movably or detachably connected with the bracket body.

According to the scheme disclosed by the application, the cover plate piece is arranged to shield the opening of the accommodating cavity, so that the bundle cable can be further prevented from falling out of the accommodating cavity. Because the cover plate member and the plate body between are movably connected or detachably connected, the cover plate member can be installed or position-adjusted according to actual requirements, and the use scene and the use mode are more flexible.

In one possible implementation, the bracket body is provided with a rim portion surrounding the opening of the accommodating cavity; the cover plate member covers the outer side of the edge portion, and the inner side wall of the cover plate member is connected with the outer side wall of the edge portion.

In the scheme shown in the application, the edge part surrounding the opening of the accommodating cavity is arranged on the bracket body and is connected with the cover plate member in a matched manner, so that on one hand, the position of the cover plate member can be positioned, the cover plate member is ensured to play a role in shielding the opening of the accommodating cavity, and on the other hand, the cover plate member can be fixed relative to the bracket body, and the binding cable is prevented from falling from the accommodating cavity due to accidental opening of the cover plate member under the action of self gravity and other factors.

In one possible implementation manner, a first outlet is formed in the cover plate member, a second outlet is formed in the edge portion, and the first outlet is communicated with the second outlet; the first outlet and the second outlet are used for allowing two ends of the binding cable to pass through.

In the scheme shown in the application, the cover plate is provided with the first outlet, the edge part is provided with the second outlet, and the first outlet and the second outlet are communicated, so that two ends of the binding cable can pass through the first outlet and the second outlet to be respectively connected with a plug and electronic equipment, thereby meeting the wiring requirement.

In one possible implementation manner, one and the other of a rotation hole and a rotation shaft protrusion are respectively arranged on the cover plate member and the edge part, and the rotation shaft protrusion is positioned in the rotation hole so that the cover plate member can rotate relative to the bracket body; and/or, one of a clamping block and a clamping groove and the other of the clamping block and the clamping groove are respectively arranged on the inner side wall of the cover plate piece and the outer side wall of the edge part, and the clamping block is clamped in the clamping groove.

In the scheme shown in the application, the cover plate and the edge part are connected in a rotating way through the rotating hole and the rotating shaft bulge on one hand, and are clamped through the clamping block and the clamping groove on the other hand, so that when a binding cable needs to be hung, the cover plate can be rotated to expose the accommodating cavity and the wire hanging piece, and the wire hanging operation is convenient; after the bundling cable is hung, the cover plate member is rotated again to block the opening of the accommodating cavity and hang the bundling cable, and the cover plate member is clamped on the edge part to prevent the bundling cable from falling out of the accommodating cavity, so that the whole operation process is convenient and quick, and the hanging reliability of the bundling cable is good.

In one possible implementation manner, the bracket body is provided with a mounting hole, and the mounting hole is used for fixing the bracket body on a mounting carrier; the cover plate piece is provided with an avoidance notch, and the mounting hole is exposed from the avoidance notch.

In the scheme shown in the application, the mounting hole is arranged on the bracket body, the cover plate member is provided with the avoidance notch which can expose the mounting hole, the mounting hole can enable the mounting bracket to be directly fixed on the mounting carrier in a nailing mode so as to meet the arrangement requirement of the mounting bracket, and because of the arrangement of the avoidance notch, no interference exists between the cover plate member and the fixing nails for nailing, the normal rotation of the cover plate member and the normal nailing of the fixing nails are ensured.

In one possible embodiment, the cover part has at least one lightening opening; for any one of the lightening holes, at most one of the pair of hooks is exposed from the lightening hole.

In the scheme, at least one lightening hole is formed in the cover plate, so that the dead weight of the cover plate can be reduced, the light design of the mounting bracket and the electronic equipment assembly can be realized, meanwhile, the material can be saved, and the cost can be reduced. However, two hooks of a pair of hooks cannot be exposed from the same lightening hole at the same time, so that the situation that the bundling cable hung on the pair of hooks falls from the lightening hole to cause the cover plate member to fail is avoided.

In one possible implementation, the mounting bracket further includes a heat dissipation member connected to the bracket body and thermally connectable to a heat sink of the electronic device carried by the bracket body to increase a heat dissipation area.

In the scheme shown in the application, the mounting bracket comprises the heat dissipation part which is connected to the bracket body, and when the electronic equipment is also mounted on the bracket body, the heat dissipation part can be in thermal contact with the heat radiator in the electronic equipment, so that the heat dissipation area is enlarged, and the heat dissipation efficiency is improved.

In one possible implementation, the heat dissipation element is cooperatively connected with a mounting structure on the electronic device, so that the bracket body carries and fixes the electronic device.

In the scheme, the radiating piece can be matched and connected with the mounting structure on the electronic equipment, so that the radiating piece not only plays a role in strengthening heat radiation, but also plays a role in mounting and fixing the electronic equipment, and the electronic equipment can be mounted on the bracket main body.

In one possible implementation, the stent body is a metal stent; and/or, the heat dissipation piece and the bracket body are of an integrated structure.

In the scheme shown in the application, the bracket body may be a metal bracket, and/or the heat dissipation part and the bracket body are in an integrated structure, so that the heat dissipation part can further transfer heat from the heat radiator of the electronic equipment to the bracket body, and the heat dissipation area is further enlarged through the bracket body, so that the heat dissipation efficiency is further improved.

In a second aspect, the present application provides an electronic device assembly comprising an electronic device and a mounting bracket as claimed in any one of the first aspects, the electronic device being detachably connectable with the mounting bracket.

In the scheme shown in the application, the mounting bracket comprises a bracket body with a containing cavity, so that the mounting bracket can contain cables of the electronic equipment through the containing cavity on the bracket body while bearing the electronic equipment. In consideration of the fact that cables such as power cables of electronic equipment are generally in a bundling state when the cables are shipped, the accommodating cavity is provided with an opening, and a wire hanging piece is arranged on the cavity wall of the accommodating cavity, so that when the electronic equipment is installed through the mounting bracket, the bundling cables of the electronic equipment can be sent into the accommodating cavity through the opening and are directly hung on the wire hanging piece, the step of knowing of bundling the cables is omitted, the step of winding the cables on the wire winding disc is omitted, the convenience of accommodating operation and the accommodating efficiency of the cables of the electronic equipment are improved, and further improvement of the installation and arrangement efficiency of the electronic equipment is facilitated. In addition, the mounting bracket not only can provide stable physical support, but also can directly improve the heat dissipation performance of the electronic equipment through the integrated heat dissipation piece, reduce the overheat risk, prolong the service life of the equipment and enhance the user experience.

Drawings

FIG. 1 is an assembled schematic view of an electronic device assembly provided in an exemplary embodiment of the present application;

Fig. 2 is a schematic structural view of a mounting bracket hung with a binding cable according to an exemplary embodiment of the present application;

fig. 3 is a schematic structural view of a mounting bracket without a bundle cable according to an exemplary embodiment of the present application;

FIG. 4 is a schematic view of a mounting bracket in an open state of a cover member according to an exemplary embodiment of the present application;

FIG. 5 is a schematic cross-sectional view of a mounting bracket in a covered condition of a cover member according to an exemplary embodiment of the present application;

FIG. 6 is a schematic view of a stent body according to an exemplary embodiment of the present application;

FIG. 7 is a schematic view of a cover plate member according to an exemplary embodiment of the present application;

Fig. 8 is a schematic structural view of a mounting bracket in a covering state of a cover member according to an exemplary embodiment of the present application;

FIG. 9 is a schematic diagram of an arrangement of a heat sink in a mounting bracket and a heat sink in an electronic device according to an exemplary embodiment of the present application;

FIG. 10 is a schematic cross-sectional view of a connection of a mounting bracket to an electronic device, in accordance with an exemplary embodiment of the present application;

FIG. 11 is a schematic diagram illustrating the assembly of a mounting bracket with an electronic device according to an exemplary embodiment of the present application;

FIG. 12 is a schematic cross-sectional view of another attachment of a mounting bracket to an electronic device in accordance with an exemplary embodiment of the present application;

FIG. 13 is a schematic cross-sectional view of a connection of yet another mounting bracket to an electronic device provided in accordance with an exemplary embodiment of the present application;

reference numerals:

100. A mounting bracket;

1. A bracket body; 11. a receiving chamber; 111. an opening; 112. a bottom wall; 12. an edge portion; 121. a second outlet; 122. the rotating shaft is convex; 123. a clamping groove; 124. a first edge; 125. a second edge; 126. a third edge; 13. a mounting hole;

21. A hook; 211. a hook portion;

3. A cover plate member; 31. a first outlet; 32. a turning hole; 33. a clamping block; 34. avoiding the notch; 35. a lightening hole;

4. A heat sink;

5. A mounting member;

200. An electronic device; 210. binding the cable; 220. a heat sink; 230. a circuit board; 240. a heat conductive member; 250. a mounting structure; 260. a housing;

300. mounting a carrier; 310. a wall socket.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings.

In a home or office setting, it is often necessary to use mounting brackets to enable the mounting and securing of some electronic devices. Some installing supports also integrate the function of cable storage, and cables of installed electronic equipment, such as power lines, optical fiber lines, network cables and the like, can be stored, so that the wiring neatness in the installation process of the electronic equipment is improved.

In the related art, a mounting bracket having a cable receiving function is generally configured with a wire reel or other type of winding structure. When a user installs the electronic equipment by using the installation support, the electronic equipment and the cable thereof are taken out from the packaging box, the cable is firstly unwound and bound on the cable, then the cable is wound on the wire reel of the installation support one by one, then the installation support is fixed at the corresponding installation position on the wall body, after the fixing is finished, the electronic equipment is installed and fixed on the installation support, and finally the cable is connected to the corresponding interface on the electronic equipment. However, with the development of miniaturization trend of equipment, the structure of the mounting bracket is also made more and more compact, which results in very limited storage space for the cable on the mounting bracket, and small operating space for winding wire near the wire spool, so that the operation process of winding the power line is inconvenient.

The present embodiment relates to a mounting bracket 100 for carrying an electronic device 200 and implementing the mounting and fixing thereof on a mounting carrier 300. Since various cables of the electronic device 200 are generally bundled together by a cable tie when shipped, the mounting bracket 100 provided in the embodiment of the application can directly store the bundled cable 210 of the electronic device 200 when used for carrying the electronic device 200, without the need of unwinding the cable tie and omitting the step of winding the cable, thereby improving the convenience and the operation efficiency of the cable storage operation of the electronic device 200 and further being beneficial to improving the efficiency of the mounting arrangement of the electronic device 200. The binding cable 210 in the embodiment of the present application may be, for example, a power cord, a network cable, an optical fiber cord, etc.

The implementation and related structural features of the mounting bracket 100 provided in the embodiments of the present application are described below.

Fig. 1 is a schematic view of an environment in which a mounting bracket 100 according to an embodiment of the present application is used, in fig. 1, an electronic device 200 is carried on the mounting bracket 100 and is mounted on a wall socket 310. Fig. 2 is a schematic structural diagram of a mounting bracket 100 with a bundling cable 210 hanging an electronic device 200 (not shown) according to an embodiment of the present application. Fig. 3 is a schematic structural diagram of a mounting bracket 100 of a bundling cable 210 without an electronic device 200 (not shown) according to an embodiment of the present application.

Referring to fig. 1, a mounting bracket 100 according to an embodiment of the present application is used for carrying an electronic device 200. Referring to fig. 2, the mounting bracket 100 includes a bracket body 1, and a hanger connected to the bracket body 1. The bracket body 1 is box-shaped, the inside of the bracket body is hollow to form a containing cavity 11, one side of the containing cavity 11 is open, and when the electronic equipment 200 is borne by the mounting bracket 100, the bundling cable 210 of the electronic equipment 200 can be sent into the inside of the containing cavity 11 through the opening 111 so as to finish the containing of the cable, thereby improving the neatness of the mounting wiring of the electronic equipment 200. The wire hanging member is connected to a cavity wall of the accommodating cavity 11, for example, may be connected to a bottom wall 112 or a side wall of the accommodating cavity 11, and is used for hanging the bundling cable 210 of the electronic device 200, so as to fix the bundling cable 210 inside the accommodating cavity 11. Wherein the bottom wall 112 of the accommodating chamber 11 is opposite to the opening 111 of the accommodating chamber 11, and the side wall of the accommodating chamber 11 is adjacent to the opening 111 of the accommodating chamber 11 and is connected with the bottom wall 112 in an inclined or vertical manner.

In some examples, as shown in fig. 1, when the mounting bracket 100 carries the electronic device 200, the electronic device 200 is located at the opening side of the accommodating cavity 11 and is connected to the bracket body 1, and at this time, the bundling cable 210 of the electronic device 200 can enter the interior of the accommodating cavity 11 through the opening 111 and hang on the hanging wire member to achieve fixation. The electronic device 200 may also cover the opening 111 of the accommodating cavity 11, so that the cable is not visible on the panel side of the electronic device 200, thereby improving the installation and wiring neatness of the electronic device 200 and improving the visual effect of the electronic device 200 after installation.

In some examples, the hanger may include at least two hooks 21 arranged in pairs, and the strapping cable 210 may be hung on at least one pair of hooks 21 therein. For example, as shown in fig. 2, the wire hanging member includes four hooks 21, of which two hooks 21 arranged in one diagonal direction of the bottom wall 112 are one pair, two hooks 21 arranged in the other diagonal direction of the bottom wall 112 are the other pair, and the tying cable 210 is hung on one pair of hooks 21. As another example, as shown in fig. 3, the wire hanging member includes four hooks 21, of which two hooks 21 located at the left side of the accommodating chamber 11 are paired, two hooks 21 located at the right side of the accommodating chamber 11 are paired, and the strapping cable 210 can be hung on any one pair of hooks 21.

The binding cable 210 is specifically hung on which pair or pairs of hooks 21, and can be selected by a user according to actual requirements. For example, when the overall length of the tying cable 210 is relatively short, it may be hung on two hooks 21 located at the same side within the accommodating chamber 11, for example, on two hooks 21 located at the upper left corner and the lower left corner of the accommodating chamber 11 in fig. 3, respectively; when the overall length of the strapping cable 210 is relatively long, it may be hung on two hooks 21 diagonally arranged as shown in fig. 2; when the overall length of the strapping cable 210 is longer, it may be hung on a greater number of hooks 21, for example, on three hooks 21 respectively located at the upper left, lower left and lower right of the accommodating chamber 11 in fig. 3, so as to be arranged in an L-shape in the accommodating chamber 11.

It should be noted that, in the embodiment of the present application, the number of the bundling cables 210 accommodated in the accommodating chamber 11 may be selected according to actual requirements. In some scenarios, more than one lashing cable 210 may be accommodated in the accommodation chamber 11, e.g. simultaneously accommodating power and optical fiber wires, etc., and in such a case more than one lashing cable 210 may be hung on the same hanger 21 or on different hangers 21.

Generally, the strapping cable 210 of the electronic device 200 has a "8" shape with two loop structures. Therefore, when the binding cable 210 is hung on the pair of hooks 21, the two loop structures can be hung on the two hooks 21, respectively. Each of the hooks 21 includes a hook portion 211 and a lever portion connected, and as shown in fig. 2 and 3, for two hooks 21 of any pair of hooks 21, the hook portions 211 of the two hooks 21 are generally away from each other, so that the hook portions 211 of the two hooks 21 can respectively catch the wire body of the bundle cable 210, preventing the bundle cable 210 from being separated from the corresponding hooks 21.

In some examples, the wire hanging member may be connected with a side wall of the receiving chamber 11. For example, the rod portions of the pair of hooks 21 are respectively connected to the opposite side walls of the accommodating chamber 11, and the hook portion 211 of each hook 21 is connected to one end of the corresponding rod portion away from the bottom wall 112 and disposed toward the bottom wall 112 of the accommodating chamber 11. A wire hanging gap is formed between the hook portion 211 of each hanger 21 and the bottom wall 112 of the accommodating chamber 11, through which the strapping cable 210 can pass to hang on the corresponding hanger 21.

In other examples, the hanger may be connected to the bottom wall 112 of the receiving cavity 11. As shown in fig. 3, the rod portions of the plurality of hooks 21 are connected to the bottom wall 112 of the accommodating chamber 11, and the edges near the bottom wall 112 are arranged at intervals in the circumferential direction, and the hook portions 211 of the plurality of hooks 21 are connected to one end of the rod portions away from the bottom wall 112. A wire hanging gap is formed between the hook portion 211 of each hanger 21 and the sidewall of the receiving chamber 11, through which the strapping cable 210 can pass to be hung on the corresponding hanger 21.

The width of the hanging wire gap can be set according to actual requirements, and the embodiment of the application is not particularly limited. In some examples, the wire hanging gap is configured to allow the strapping cable 210 to easily pass therethrough to hang on the corresponding hook 21 and to prevent the strapping cable 210 that has been hung on the hook 21 from easily being pulled out therefrom, e.g., the wire hanging gap has a width that is greater than the diameter of the wire body of the strapping cable 210 and less than twice the diameter of the wire body of the strapping cable 210.

In some examples, in order to more effectively prevent the bundle cable 210 from coming out of the accommodating chamber 11, a cover member 3 is further provided at the opening 111 of the accommodating chamber 11, and the cover member 3 can cover at least a portion of the opening 111 of the accommodating chamber 11. After the cover plate member 3 is covered at the opening 111 of the accommodating chamber 11, even if the binding cable 210 falls off from the hanger 21, the binding cable 210 does not come out of the accommodating chamber 11 due to the shielding effect of the cover plate member 3.

Fig. 4 shows a schematic structural view of the mounting bracket 100 in the opened state of the cover member 3, fig. 8 shows a schematic structural view of the mounting bracket 100 in the covered state of the cover member 3, and fig. 5 is a schematic sectional view of the mounting bracket 100 in fig. 8. Wherein in the opened state of the cover plate member 3, the opening 111 of the accommodating chamber 11 is exposed, and at this time, the bundling cable 210 can be fed into the interior of the accommodating chamber 11 through the opening 111; in the state where the cover member 3 covers, the opening 111 of the accommodating chamber 11 is blocked by the cover member 3, and at this time, the bundle cable 210 located inside the accommodating chamber 11 cannot escape from the opening 111 of the accommodating chamber 11, and the bundle cable 210 located outside the accommodating chamber 11 cannot be fed into the inside of the accommodating chamber 11.

In some examples, as shown in fig. 7, the cover member 3 has a weight-reducing hole 35, and the weight-reducing hole 35 can reduce the weight of the cover member 3, thereby realizing a light-weight design of the assembly of the mounting bracket 100 and the electronic device 200, and saving materials and manufacturing cost. In the embodiment of the present application, the number, shape and arrangement position of the lightening holes 35 are not particularly limited as long as the structural strength and rigidity required for the deck member 3 to fulfill its function can be achieved.

It should be noted, however, that regarding the size of the lightening holes 35, the following requirements need to be satisfied: for any one of the lightening holes 35, at most one of the pair of hooks 21 can be exposed from the lightening hole 35, that is, both hooks 21 of the pair of hooks 21 cannot be exposed from one lightening hole 35 at the same time. This is to prevent the bundling cable 210 hung on the pair of hooks 21 from falling out of the weight-reducing hole 35, and to disable the cover member 3.

Illustratively, as shown in fig. 8, the deck member 3 is provided with two weight-reducing holes 35, wherein no hooks 21 are exposed in the weight-reducing holes 35 located at the upper side in fig. 8, and only one hook 21 located at the lower left corner of the accommodating chamber 11 is exposed in the weight-reducing holes 35 located at the lower side in fig. 8 (the other hook 21 provided in pair with the hook 21 is provided at the upper right corner of the accommodating chamber 11, the position of which is indicated by a broken line in fig. 3). In other examples, for the two hooks 21 located below in fig. 3, since the two hooks 21 are divided into two pairs of hooks 21, the strapping cable 210 is not hung at the same time and is hung only on the two hooks 21, and thus the two hooks 21 can be exposed from one weight-reducing hole 35 at the same time.

In some examples, the cover member 3 and the bracket body 1 are detachably connected, which may be, for example, a snap connection or a connection by means of screws. Taking a snap connection as an example, the cover member 3 in a covered state is actually snapped and fixed on the bracket body 1 and covers at least a part of the opening 111 of the accommodating cavity 11; the cover member 3 in the opened state is actually separated from the holder body 1 to expose the opening 111 of the accommodating chamber 11. That is, in the covering state, the cover member 3 and the holder body 1 are engaged with each other, and in the opening state, the cover member 3 and the holder body 1 are no longer engaged and are away from each other.

Then, one possible snap connection between the cover and the bracket body 1 is shown in fig. 6 and 7, for example, in which a clamping groove 123 is provided on the bracket body 1, and a clamping block 33 is provided on the cover member 3, where the clamping block 33 may be clamped in the clamping groove 123, so as to fix the cover member 3 on the bracket body 1. In order to enhance the fixing effect on the cover member 3, the number of the latch 33 and the latch groove 123 may be more than one, and more than one latch groove 123 may be provided around the opening 111 of the accommodating chamber 11.

In other examples, the cover member 3 is coupled to the bracket body 1, and relative movement, such as relative rotation or relative sliding, between the cover member 3 and the bracket body 1 can occur. Taking the relative rotation as an example, the cover member 3 in the covering state, as shown in fig. 8, can be rotated in a direction away from the opening 111 of the accommodating chamber 11 by external actuation, and after a certain angle of rotation, the opening 111 of the accommodating chamber 11 is exposed, so that the cover member 3 is in the open state shown in fig. 4; and the cover member 3 in the opened state, as shown in fig. 4, is rotatable in a direction approaching the opening 111 of the accommodating chamber 11 by external actuation, and covers at least a part of the opening 111 of the accommodating chamber 11 after rotating by a certain angle, so that the cover member 3 is brought into the covered state shown in fig. 8.

Then, one possible rotational connection between the cover member 3 and the holder body 1 is, for example, see fig. 6 and 7, two rotation shaft protrusions 122 are provided on the holder body 1, two rotation holes 32 are provided on the cover member 3, and the two rotation shaft protrusions 122 are respectively located in the two rotation holes 32 and can freely rotate around the axis of the rotation hole 32 in the corresponding rotation holes 32. Wherein the two spindle protrusions 122 are located at opposite sides of the opening 111 of the receiving chamber 11, respectively.

It should be noted that there may also be more than one way of connection between the deck member 3 and the carrier body 1 at the same time, for example, see fig. 5 to 8, there is a rotational connection and a snap connection between the deck member 3 and the carrier body 1 at the same time, and the rotational holes 32 and the snap blocks 33 are provided at opposite ends of the deck member 3, respectively.

As shown in fig. 4, in some examples, the bracket body 1 is further provided with a rim portion 12, where the rim portion 12 is configured to cooperate with the cover member 3, and serves to locate the cover member 3 on the one hand, and to fix the cover member 3 on the other hand. Referring to fig. 5, the rim 12 is disposed around the opening 111 of the receiving chamber 11, for example, the rim 12 may be connected to an edge of the opening 111 of the receiving chamber 11, or the rim 12 is disposed around an outside of the opening 111 of the receiving chamber 11 with a space from the opening 111 of the receiving chamber 11.

As shown in fig. 7, the cover member 3 has a box shape and includes a cover body and a frame connected to an edge of the cover body and perpendicular to the cover body. Referring to fig. 5, when the cover plate member 3 is in the covering state, the cover plate body of the cover plate member 3 is set up on top of the rim portion 12 and covers at least a part of the opening 111 of the accommodation chamber 11; the rim of the deck member 3 surrounds the outside of the rim portion 12, and the inner side wall of the rim is connected to the outer side wall of the rim portion 12.

In some embodiments, as shown in fig. 6, at least one of the rotation protrusion and the locking groove 123 may be provided on the rim portion 12, and since the rim portion 12 is fixedly connected to the bracket body 1, the cover member 3 may be rotatably connected to the bracket body 1 by the rim portion 12 and/or be locked to the bracket body 1. For example, referring to fig. 6, the edge portion 12 includes a first edge 124, a second edge 125 and a third edge 126 vertically connected in sequence, where the first edge 124 and the third edge 126 are opposite to each other, two rotation protrusions are respectively disposed at ends of the first edge 124 and the third edge 126 away from the second edge 125, and the clamping groove 123 is disposed on the second edge 125.

Generally, the two ends of the strapping cable 210 of the electronic device 200 need to be connected to corresponding connectors or interfaces. For example, when the binding cable 210 is a power cord, two ends of the power cord are respectively connected with a plug and a USB interface, wherein the plug is used for plugging in a power socket to take electricity, and the USB interface is used for electrically connecting with the electronic device 200 to supply power to the electronic device 200.

After the strapping cable 210 is received in the receiving cavity 11 and hung on the wire hanging member, in order to ensure normal use of the strapping cable 210, with continued reference to fig. 5 and 6, in some examples, the second edge 125 of the edge portion 12 is provided with a second wire outlet 121, and in a case that the strapping cable 210 is located in the receiving cavity 11, both ends of the strapping cable 210 may be threaded through the second wire outlet 121 and respectively inserted into a corresponding electrical device (e.g., a power outlet) or the electronic device 200.

For the mounting bracket 100 with the cover member 3, in some examples, referring to fig. 5 and 7, the cover member 3 is provided with a first outlet 31, and the first outlet 31 is located on a side of the second outlet 121 away from the opening 111 of the accommodating cavity 11 and is communicated with the second outlet 121, and two ends of the bundling cable 210 may pass through the communication positions of the first outlet 31 and the second outlet 121 to be respectively plugged into a corresponding electrical device (such as an electrical outlet) or the electronic device 200.

The communication area of the first outlet 31 and the second outlet 121 is not particularly limited in the embodiment of the present application, as long as the communication portion can allow both ends of the binding cable 210 to pass therethrough, so as to ensure normal implementation of the function of the binding cable 210. In some examples, as shown in fig. 5, the area of the first orthographic projection of the first outlet 31 on the set projection plane is greater than or equal to the area of the second orthographic projection of the second outlet 121 on the set projection plane, and the second orthographic projection coincides with or is located within the first orthographic projection. Wherein, the projection plane is set to be perpendicular to the opening directions of the first outlet 31 and the second outlet 121, that is, to the direction of the two ends of the strapping cable 210 going out from the first outlet 31 and the second outlet 121.

In other examples, the area of the first orthographic projection may be smaller than that of the second orthographic projection, and the first orthographic projection is located within the second orthographic projection, so that when the cover member 3 is in the covering state, the second edge 125 is not exposed from the first wire outlet 31, so that the overall structure of the mounting bracket 100 is simpler, and the visual effect is improved.

The manner in which the mounting bracket 100 and the electronic device 200 are coupled together and the associated structural features are described below.

As shown in fig. 11, a corresponding connection structure is provided on the mounting bracket 100, and a mounting structure 250 is provided on the back of the electronic device 200, and the mounting structure 250 can be in plug-in fit with the connection structure, so that the bracket body 1 carries and fixes the electronic device 200.

Illustratively, the connection structure on the mounting bracket 100 may be a plug tongue connected at the top of the bracket body 1; the mounting structure 250 on the electronic device 200 may be a slot into which the plug tongue may be inserted, wherein the electronic device 200 does not naturally fall off from the stand body 1 because the opening direction of the slot is different from the direction of the interaction force between the plug tongue and the slot (the opening direction of the slot is downward in fig. 9, the direction of the interaction force between the plug tongue and the slot is perpendicular to the paper surface).

Of course, in other examples of the present application, the connection structure and the mounting structure 250 may have other forms as long as the electronic device 200 can be detachably connected to the mounting bracket 100, for example, the connection structure on the mounting bracket 100 may be a first screw hole, the mounting structure 250 on the electronic device 200 may be a second screw hole, and the mounting bracket 100 and the electronic device 200 may be fastened together by screws sequentially passing through the first screw hole and the second screw hole.

In addition, with the trend of miniaturization of electronic devices, heat dissipation conditions of some electronic components in the electronic devices are becoming worse. In the related art, a radiator is added to radiate heat for corresponding electronic components, however, due to the small size of the device, the available arrangement space is small, the radiator has great limitation in arrangement, and the radiating effect is very limited.

In order to meet the current increasing heat dissipation demands, in the embodiment of the present application, on one hand, designing a heat dissipation scheme based on the electronic device product itself is considered, and on the other hand, designing a heat dissipation scheme in combination with the actual installation scenario of the electronic device product is considered.

For a heat dissipation scheme based on the electronic device product itself, in some examples of the present application, a heat sink 220 may be added to the electronic device 200, where the heat sink 220 may be connected to or disposed adjacent to an electronic component (e.g., a functional element on the circuit board 230, etc.) that is prone to generate heat in the electronic device 200, so as to absorb and conduct heat emitted by the electronic component. In other examples, heat dissipation holes may be formed in the housing 260 of the electronic device 200, so as to enhance the flow of air between the inside and the outside of the electronic device 200, so that the heat of the electronic components can be timely transferred to the outside through the air. In other examples, if the electronic device 200 has a metal housing (e.g., a metal center or a metal back plate), a heat conductor may also be disposed in the electronic device 200 that is in thermal contact with the heat-generating electronic components and with the metal housing, thereby conducting heat generated by the electronic components to the metal housing and dissipating the heat through the metal housing.

For a heat dissipation scheme based on the actual installation scenario of the product, in some embodiments of the present application, further strengthening of heat dissipation based on the mounting bracket 100 is also considered, for example, improvement of heat dissipation effect based on a connection structure on the mounting bracket 100 for cooperation with the electronic device 200 is considered. Referring to fig. 10 and 11, when the electronic apparatus 200 is carried and fixed on the mounting bracket 100, the connection structure on the mounting bracket 100 may protrude into the inside of the housing of the electronic apparatus 200, and thus the heat dissipation scheme may be arranged based on the connection structure.

In some examples, the connection structure may be made of a material with a high thermal conductivity, that is, the connection structure is used as the heat dissipation element 4, so that the connection structure has both a connection function and a heat dissipation function. The heat dissipation element 4 can conduct, diffuse or exchange heat generated by the electronic component to dissipate heat of the electronic component, so as to avoid the influence of the overhigh temperature of the electronic component on the performance of the electronic device 200.

The shape of the heat dissipation element 4 is not particularly limited in the embodiment of the present application, and may be selected by a designer according to actual requirements. For example, the heat dissipation element 4 may be formed in a plate shape or a flat shape similar to a plate shape, so that the heat dissipation element 4 has a larger heat conduction area.

Referring to fig. 9, a partial structure of a heat sink 4 mated with an electronic device 200 is shown when a heat-generating electronic component is a functional element, such as a processor, on a circuit board 230, where the heat sink 4 may be, for example, a plug tongue as described above. As shown in fig. 9, the circuit board 230, the heat sink 220, and the heat sink 4 are sequentially stacked in the thickness direction of the electronic device 200. The functional element that generates heat on the circuit board 230 and the heat sink 220 at least partially overlap along the thickness direction of the electronic device, that is, the orthographic projection of the functional element on the heat sink 220 along the thickness direction needs to at least partially overlap with the surface of the heat sink 220, so that the heat generated by the functional element in the working process can be conducted onto the heat sink 220 along the thickness direction, and preliminary heat dissipation is achieved. In addition, in the case where the heat spreader 220 is in direct contact with the heat sink 4, the heat spreader 220 and the heat sink 4 at least partially overlap in the thickness direction of the electronic device 200, that is, the orthographic projection of the heat spreader 220 on the heat sink 4 in the thickness direction needs to at least partially overlap with the surface of the heat sink 4, so that the heat conducted from the functional element to the heat spreader 220 can be continuously conducted to the heat sink 4 in the thickness direction, thereby realizing further heat dissipation.

Referring to fig. 9 and 10, a heat conductive member 240 may be further provided between the heat sink 220 of the electronic device 200 and the heat sink 4 of the mounting bracket 100 for the purpose of enhancing the heat transfer effect and protecting the heat sink 220. In the thickness direction of the electronic device 200, the circuit board 230, the heat sink 220, the heat conducting member 240, and the heat dissipating member 4 are sequentially stacked, that is, the heat dissipating member 4 is in indirect thermal contact with the heat sink 220 through the heat conducting member 240. The heat spreader 220 and the heat conducting member 240 at least partially overlap in the thickness direction of the electronic device 200, that is, the orthographic projection of the heat spreader 220 on the heat conducting member 240 in the thickness direction needs to at least partially overlap with the surface of the heat conducting member 240, so that the heat conducted by the functional element to the heat spreader 220 can be continuously conducted to the heat conducting member 240 in the thickness direction, and further conducted to the heat dissipating member 4 through the heat conducting member 240, so as to achieve further heat dissipation.

Taking the above-mentioned plugging tongue piece as the heat sink 4 as an example, as shown in fig. 10, the heat sink 4 is snapped into the electronic device 200 after being plugged into the socket, and the heat sink 4 and the heat sink 220 are indirectly in thermal contact with each other through the heat conductive member 240. In this case, the heat on the radiator 220 is transferred to the heat conducting member 240 in a heat conduction manner, and then transferred to the heat dissipating member 4 by the heat conducting member 240 in a heat conduction manner, and since the radiator 220 and the heat dissipating member 4 exchange heat with air respectively and simultaneously, compared with the scheme of dissipating heat only through the radiator 220 in the related art, the heat dissipating area is increased, and the heat dissipating efficiency is effectively improved.

It should be noted that, in order to achieve a better heat conduction effect, the heat conducting member 240 is a heat conducting structure, and the heat conductivity thereof is generally not lower than that of the heat sink 220. The heat conductive member 240 of the present application may be made of a heat conductive resin, a metal, etc., wherein the heat conductive resin may be PI (Polyimide) material (heat conductivity 0.4-0.8W/mk), silicone material (heat conductivity 0.8-2.0W/mk), polyurethane material (heat conductivity 0.2-0.3W/mk), for example; wherein the metal can be copper (with heat conductivity coefficient of above 400W/mk) or copper-containing alloy, aluminum (with heat conductivity coefficient of above 200W/mk) or aluminum-containing alloy, steel (with heat conductivity coefficient of above 100W/mk) or other materials.

In some examples, the thermally conductive member 240 may be, for example, a PI thermal pad. The PI thermal pad can be adhered to the radiator 220 by an adhesive, so that the PI thermal pad and the radiator 220 can be tightly adhered to each other, and the thermal conduction efficiency is improved. After the heat dissipation element 4 is inserted into the slot, the heat dissipation element 220 is in indirect thermal contact with the heat dissipation element 4 through the PI heat conduction pad, so that heat can be transferred from the heat dissipation element 220 to the heat dissipation element 4 through the PI heat conduction pad, and then transferred to air, heat transfer is realized, and more efficient cooling is performed on electronic components in the electronic equipment 200.

Further, as shown in fig. 12 or fig. 13, in order to make the heat dissipation element 4 have a larger heat dissipation area, the thermal contact surface of the heat dissipation element 4 (i.e. the contact surface between the heat dissipation element 4 and the heat sink 220 or the heat conduction element 240) may be designed to be saw-tooth-shaped or wave-shaped, so as to achieve a better heat dissipation effect. Fig. 12 is a schematic view of the contact surface of the heat dissipation element 4 and the heat conduction element 240 being designed to be saw-tooth, and fig. 13 is a schematic view of the contact surface of the heat dissipation element 4 and the heat conduction element 240 being designed to be wave-shaped.

In the embodiment of the present application, in order to further improve the heat dissipation effect, the bracket body 1 may also participate in heat dissipation.

In some examples, the stent body 1 may be a metal stent. As shown in fig. 10, the metal bracket is connected with the heat dissipation element 4, so that heat on the heat dissipation element 4 is transferred to the metal bracket and is transferred to air through the metal bracket to dissipate heat, thereby further expanding the heat dissipation area and further enhancing the heat dissipation effect.

The metal bracket can be a copper bracket, a steel bracket or an aluminum bracket, or can be a copper-containing, steel-containing or aluminum-containing alloy bracket, and has better mechanical strength and heat conduction performance.

In some examples, the heat dissipation element 4 and the bracket body 1 are integrally formed by using the same heat dissipation material, so that the integrally formed structure has better structural strength, and meanwhile, heat on the heat dissipation element 4 is transferred to the bracket body 1 and is transferred to air through the bracket body 1 for heat dissipation, thereby achieving the effects of further expanding the heat dissipation area and further enhancing the heat dissipation effect. Illustratively, the heat sink 4 and the bracket body 1 may be manufactured by an integral molding process using any one of PI, metal, alloy, and metal matrix composite.

It should be noted that, when the bracket body 1 and the heat dissipation element 4 are both made of metal, the structure other than the bracket body 1 and the heat dissipation element 4 in the mounting bracket 100 may be made of plastic, for example, the hanging wire element may be a plastic hook, and the cover plate element 3 may be a plastic cover plate, due to consideration of cost and product weight.

The manner of mounting engagement between the mounting bracket 100 and the mounting carrier 300 and related structural features are described below.

In some examples, the mounting bracket 100 may be nailed directly to the mounting carrier 300. The mounting carrier 300 in the embodiment of the present application may be, for example, a wall. Referring to fig. 8, the bracket body 1 is provided with mounting holes 13, and the mounting bracket 100 can be directly nailed to a wall by nailing a fixing nail penetrating the mounting holes 13 to the wall.

With continued reference to fig. 8, the cover member 3 is provided with a relief notch 34, and the relief notch 34 enables the mounting hole 13 to be exposed therefrom, so that no interference exists between the cover member 3 and the mounting hole 13 during the process of driving the fixing nail and during the process of switching the state of the cover member 3, thereby ensuring the normal rotation of the cover member 3 and the normal driving of the fixing nail.

Some users may find the stapling process cumbersome or unwilling to staple the wall, leaving behind staple holes, in which case the mounting bracket 100 may be secured to the wall using the mounting member 5 in a non-stapling manner.

Therefore, the embodiment of the application provides two different arrangement modes of the mounting bracket 100 based on the mounting holes 13 on the bracket body 1 and the mounting piece 5, that is, the mounting bracket 100 provided by the embodiment of the application can be suitable for at least two mounting scenes, and can meet the diversified layout requirements of users.

The embodiment of the application also provides an electronic device 200 assembly, and the electronic device 200 assembly comprises the electronic device 200 and the mounting bracket 100, wherein the electronic device 200 is detachably connected with the mounting bracket 100, and the mounting bracket 100 is used for mounting and fixing on a mounting carrier 300 (such as a wall body).

The electronic device in the embodiment of the application can include but is not limited to WLAN device, ONT device, FTTR device, optical modem, router, gateway, full house intelligent terminal device, etc.

In the description of the present application, "/" means "or" unless otherwise indicated, for example, A/B may mean A or B. "and/or" herein is merely an association relationship describing an association object, and means that three relationships may exist, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. Furthermore, "at least one" means one or more, and "a plurality" means two or more. The terms "first," "second," and the like do not limit the number and order of execution, and the terms "first," "second," and the like do not necessarily differ.

In the present application, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

Any combination of the above optional solutions may be adopted to form an optional embodiment of the present application, which is not described herein.

The foregoing description of the preferred embodiments of the present application is not intended to limit the application, but rather, the application is to be construed as limited to the appended claims.

Claims (10)

1. A mounting bracket is characterized in that the mounting bracket (100) comprises a bracket body (1) and a heat dissipation element (4),

The bracket body (1) is used for bearing the electronic equipment (200), and the bracket body (1) is provided with a containing cavity (11) for containing a bundling cable (210) of the electronic equipment (200);

The heat dissipation piece (4) is connected with the bracket body (1) and can be in thermal contact with a heat sink (220) of the electronic equipment (200) borne by the bracket body (1), and the thermal contact surface of the heat dissipation piece (4) is in a zigzag shape or a wavy shape;

the heat dissipation piece (4) is connected with a mounting structure (250) on the electronic equipment (200) in a matching way, so that the bracket body (1) bears and fixes the electronic equipment.

2. The mounting bracket according to claim 1, characterized in that the heat sink (4) is plate-shaped.

3. The mounting bracket according to claim 2, wherein the heat sink (4) is a plug tongue, the mounting structure (250) on the electronic device (200) is a socket, and the heat sink (4) is configured to be inserted into the mounting structure (250).

4. The mounting bracket according to claim 1, further comprising a heat conducting member (240), the heat conducting member (240) being arranged between the heat dissipating member (4) and the heat sink (220).

5. The mounting bracket according to claim 4, characterized in that the orthographic projection of the heat sink (220) onto the heat conducting member (240) in the thickness direction is at least partially coincident with the surface of the heat conducting member (240).

6. The mounting bracket of claim 5, wherein the thermal conductivity of the thermally conductive member (240) is not lower than the thermal conductivity of the heat sink (220).

7. The mounting bracket according to claim 6, wherein the heat conductive member (240) is made of a heat conductive resin or a metal material.

8. The mounting bracket of claim 7, wherein the thermally conductive member (240) is a polyimide PI thermal pad that is bonded to the heat sink (220) by an adhesive.

9. The mounting bracket according to claim 1, characterized in that the bracket body (1) is a metal bracket and/or that the heat sink (4) and the bracket body (1) are of an integrally formed structure.

10. An electronic device assembly, characterized in that the electronic device assembly comprises an electronic device (200) and a mounting bracket (100) according to any of claims 1-9, the electronic device (200) and the mounting bracket (100) being detachably connected.