CN221364587U - Semiconductor laser tube shell disassembling clamp - Google Patents
Semiconductor laser tube shell disassembling clamp Download PDFInfo
- Publication number
- CN221364587U CN221364587U CN202323379793.6U CN202323379793U CN221364587U CN 221364587 U CN221364587 U CN 221364587U CN 202323379793 U CN202323379793 U CN 202323379793U CN 221364587 U CN221364587 U CN 221364587U
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- sliding seat
- jig
- lifting
- semiconductor laser
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000010586 diagram Methods 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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Abstract
The utility model relates to the technical field of laser tube disassembly, in particular to a semiconductor laser tube disassembly clamp, wherein a main base is connected with a blade lifting assembly; the cutter head is rotationally connected to the blade lifting assembly; the jig body is connected to the main base through the jig translation assembly. When the laser positioning device is used, the positioning alignment of the laser during the disassembly of the semiconductor laser can be realized, the positioning accuracy of the cutterhead on the laser is improved, and the risk of damaging the chip inside the semiconductor laser is reduced.
Description
Technical Field
The utility model relates to the technical field of laser tube disassembly, in particular to a semiconductor laser tube shell disassembly clamp.
Background
The existing semiconductor lasers are all of transistor appearance structures, lens tube caps are welded on tube seats in a high-temperature vacuumizing sealing mode, and the lens tube caps are mainly divided into flat windows, ball windows, inclined windows and nonstandard windows.
The cap lens focuses and gathers the output light beams of the semiconductor laser, is used in rear-end (optical communication, optical storage, national defense, industry and medical) optical fiber transmission, and in some special transmission, has special size specification requirements on the lens cap. In the prior art, a clamp is dismantled from a lens tube cap, a semiconductor laser is positioned, and a blade is manually used for aligning the disassembly and assembly positions of the lens tube cap and the lens tube cap. When the blade aligns the dismouting position of cap lens, estimate lens cap diameter size through operator's experience, lead to demolish the in-process, the blade is inaccurate in the location on the lens cap, and the blade is drawn into the degree of depth inaccurately for the blade is lacerated inside laser chip, causes the damage of chip when disassembling.
Disclosure of utility model
The utility model aims to overcome the defects and shortcomings of the prior art and provides a clamp for disassembling a semiconductor laser tube shell.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
The utility model relates to a clamp for disassembling a semiconductor laser tube shell, which comprises a cutter head, a jig body and a main base; the main base is connected with a blade lifting assembly; the cutter head is rotationally connected to the blade lifting assembly; the jig body is connected to the main base through the jig translation assembly.
Further, the blade lifting assembly comprises a lifting fixing seat fixed on the main base through a cutter head fixing seat and a lifting sliding seat connected to the lifting fixing seat in a sliding manner; a lifting differential head body is connected between the lifting sliding seat and the lifting fixing seat;
The cutterhead is rotationally connected to the lifting sliding seat through a rotating shaft.
Further, the jig translation assembly comprises a jig translation base, a transverse sliding seat and a longitudinal sliding seat; the jig body is fixed on the transverse sliding seat; a longitudinal differential main body is connected between the jig translation base and the longitudinal sliding base; the longitudinal differential main body is used for pushing the longitudinal sliding seat to longitudinally slide on the jig translation base; a transverse differential head main body is connected between the transverse sliding seat and the longitudinal sliding seat; the transverse differential head main body is used for pushing the transverse sliding seat to transversely move on the longitudinal sliding seat.
Further, a laser positioning groove is formed in the top surface of the jig body.
Further, two radial ball bearings are fixed on the top surface of the jig body; and a convex ring is arranged at the top of the outer side wall of the radial ball bearing.
After the structure is adopted, the utility model has the beneficial effects that: the fixture body can fix and position the semiconductor laser when the fixture is used; after the semiconductor laser is fixed on the jig body, the cutter head is driven by the blade lifting assembly, so that the cutting edge of the cutter head and the disassembling position of the semiconductor laser are positioned on the same horizontal height; the jig body is driven to translate through the jig translation assembly, so that the cutting position of the semiconductor laser on the movable jig body is aligned and attached with the cutter head, the cutter head is rotated, the cutting edge of the cutter head is clamped into a gap between the semiconductor laser and the lens tube cap, and the lens tube cap is grinded and separated; the structure can realize the positioning alignment of the laser when the semiconductor laser is disassembled, improve the positioning accuracy of the cutter head on the laser, and reduce the risk of damaging the chip inside the semiconductor laser.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a block diagram of a blade lift assembly;
FIG. 3 is a block diagram of a jig translation assembly;
FIG. 4 is a block diagram of a jig body;
FIG. 5 is a block diagram of the foot tube in the jig body positioning state;
reference numerals illustrate:
1. A blade holder; 2. a blade lifting assembly; 201. a lifting micro-head body;
202. Lifting the sliding seat; 203. a first locking bolt; 204. a first connecting piece;
205. Lifting the fixing seat; 3. a rotating shaft; 4. a cutterhead; 5. a jig body; 501. a laser positioning groove;
502. a radial ball bearing; 502a, a convex ring; 6. a jig translation assembly; 601. translating the fixed base;
602. a second connecting piece; 603. a second locking bolt; 604. a lateral sliding seat;
605. a third locking bolt; 606. a lateral micro-head body; 607. a longitudinal sliding seat;
608. A longitudinal differential body; 7. a main base; 8. a cutter head fixing seat; A. foot tubes; a1, a tube seat.
Detailed Description
The utility model is further described below with reference to the accompanying drawings.
As shown in fig. 1 to 5, the utility model relates to a semiconductor laser tube disassembly clamp, which comprises a cutter head 4, a jig body 5 and a main base 7; the main base 7 is connected with a blade lifting assembly 2; the cutter head 4 is rotatably connected to the blade lifting assembly 2; the jig body 5 is connected to the main base 7 through the jig translation assembly 6;
The jig body 5 can fix and position the semiconductor laser A; after the semiconductor laser A is fixed on the jig body 5, the cutter head 4 is driven by the blade lifting assembly 2, so that the cutting edge of the cutter head 4 and the disassembling position of the semiconductor laser A are positioned on the same horizontal height;
The jig body 5 is driven to translate through the jig translation assembly 6, so that the cutting position of the semiconductor laser A on the movable jig body 5 is aligned and attached with the cutter disc 4, the cutter disc 4 is rotated, the cutting edge of the cutter disc 4 is clamped into a gap between the semiconductor laser A and the lens tube cap, and the lens tube cap is grinded and separated; the structure can realize the positioning alignment of the laser when the semiconductor laser is disassembled, improve the positioning precision of the cutter head 4 on the laser, and reduce the risk of damaging the chip inside the semiconductor laser.
As a preferred mode of the present utility model, the blade lifting assembly 2 includes a lifting fixing seat 205 fixed on the main base 7 through a cutterhead fixing seat 8 and a lifting sliding seat 202 slidably connected to the lifting fixing seat 205; a lifting differential head body 201 is connected between the lifting sliding seat 202 and the lifting fixed seat 205;
the cutter head 4 is rotatably connected to the lifting sliding seat 202 through the rotating shaft 3;
The lifting sliding seat 202 is fixedly provided with a blade fixing seat 1; the cutter head 4 is rotationally connected to the blade fixing seat 1 through a rotating shaft 3;
The lifting differential head body 201 is a differential head, the shell of the differential head is fixed on the lifting fixed seat 205, and the measuring rod of the differential head is fixed on the lifting sliding seat 202; by operating the lifting micro head body 201, the measuring rod stretches and contracts, so that the accurate lifting movement of the lifting sliding seat 202 is realized, and the position height of the cutter head 4 is adjusted; rotating the rotating shaft 3 to enable the cutter disc 4 to rotate, so that grinding, cutting and decomposing of the lens tube cap are realized; the lifting fixing seat 205 is fixedly provided with a first connecting sheet 204, after the position of the lifting sliding seat 202 is adjusted, the lifting sliding seat 202 is connected with the lifting sliding seat through a first locking bolt 203 in a threaded manner, the first connecting sheet 204 is pressed on the surface of the lifting sliding seat 202 by the head of the first locking bolt 203 to generate friction force, and the lifting sliding seat 202 and the first connecting sheet 204 are clamped and fixed to play a role in looseness prevention; at the time of adjustment of the elevating slide assembly 202, the first locking bolt 203 is released so that the elevating slide assembly 202 can freely slide on the elevating fixed assembly 205.
As a preferred mode of the present utility model, the jig translation assembly 6 includes a jig translation base 601, a lateral sliding seat 604 and a longitudinal sliding seat 607; the jig body 5 is fixed on the transverse sliding seat 604; a longitudinal differential body 608 is connected between the jig translation base 601 and the longitudinal sliding seat 607; the longitudinal differential body 608 is used for pushing the longitudinal sliding seat 607 to slide longitudinally on the jig translation base 601; a transverse differential head main body 606 is connected between the transverse sliding seat 604 and the longitudinal sliding seat 607; the transverse differential head main body 606 is used for pushing the transverse sliding seat 604 to transversely move on the longitudinal sliding seat 607;
The lateral micro head body 606 and the longitudinal micro head body 608 are micro heads, and the longitudinal position of the lateral sliding seat 604 on the longitudinal sliding seat 607 can be adjusted by rotating the lateral micro head body 606; the transverse position of the longitudinal sliding seat 607 on the jig translation base 601 can be adjusted by the transverse differential head main body 606; the two are combined, so that the plane position of the jig body 5 can be adjusted;
A second connecting sheet 602 is fixed on the jig translation base 601; the longitudinal sliding seat 607 is in threaded connection with a second locking bolt 603; the second connecting piece 602 is pressed on the longitudinal sliding seat 607 through the second locking bolt 603, so that the longitudinal sliding seat 607 cannot slide on the jig translation base 601, and the anti-loose purpose is achieved; similarly, the third connecting piece is pressed on the longitudinal sliding seat 607 by the third locking bolt 605 screwed on the transverse sliding seat 604, so as to play a role in skid resistance.
As a preferred mode of the present utility model, a laser positioning groove 501 is formed on the top surface of the jig body 5.
As a preferable mode of the present utility model, two radial ball bearings 502 are fixed on the top surface of the jig body 5; a convex ring 502a is arranged at the top of the outer side wall of the radial ball bearing 502; the stem A1 of the semiconductor laser a is positioned by being engaged under the collar 502a, and the semiconductor laser a is positioned on the jig body 5 by using the jig body 5 as a lower reference surface of the stem A1 and the bottom surface of the collar 502a as an upper reference surface of the stem A1.
The foregoing description is only of the preferred embodiments of the utility model, and all changes and modifications that come within the meaning and range of equivalency of the structures, features and principles of the utility model are therefore intended to be embraced therein.
Claims (5)
1. A semiconductor laser tube shell disassembling clamp is characterized in that: the fixture comprises a cutter head (4), a fixture body (5) and a main base (7); the main base (7) is connected with a blade lifting assembly (2); the cutter head (4) is rotationally connected to the blade lifting assembly (2); the jig body (5) is connected to the main base (7) through the jig translation assembly (6).
2. The semiconductor laser package disassembly jig of claim 1, wherein: the blade lifting assembly (2) comprises a lifting fixing seat (205) fixed on the main base (7) through a cutter head fixing seat (8) and a lifting sliding seat (202) connected on the lifting fixing seat (205) in a sliding manner; a lifting differential head body (201) is connected between the lifting sliding seat (202) and the lifting fixed seat (205);
The cutter head (4) is rotationally connected to the lifting sliding seat (202) through the rotating shaft (3).
3. The semiconductor laser package disassembly jig of claim 1, wherein: the jig translation assembly (6) comprises a jig translation base (601), a transverse sliding seat (604) and a longitudinal sliding seat (607); the jig body (5) is fixed on the transverse sliding seat (604); a longitudinal differential main body (608) is connected between the jig translation base (601) and the longitudinal sliding seat (607); the longitudinal differential body (608) is used for pushing the longitudinal sliding seat (607) to longitudinally slide on the jig translation base (601); a transverse differential head main body (606) is connected between the transverse sliding seat (604) and the longitudinal sliding seat (607); the transverse differential head body (606) is used for pushing the transverse sliding seat (604) to transversely move on the longitudinal sliding seat (607).
4. The semiconductor laser package disassembly jig of claim 1, wherein: a laser positioning groove (501) is formed in the top surface of the jig body (5).
5. The semiconductor laser package disassembly jig of claim 4, wherein: two radial ball bearings (502) are fixed on the top surface of the jig body (5); the top of the outer side wall of the radial ball bearing (502) is provided with a convex ring (502 a).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202323379793.6U CN221364587U (en) | 2023-12-12 | 2023-12-12 | Semiconductor laser tube shell disassembling clamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202323379793.6U CN221364587U (en) | 2023-12-12 | 2023-12-12 | Semiconductor laser tube shell disassembling clamp |
Publications (1)
Publication Number | Publication Date |
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CN221364587U true CN221364587U (en) | 2024-07-19 |
Family
ID=91857234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202323379793.6U Active CN221364587U (en) | 2023-12-12 | 2023-12-12 | Semiconductor laser tube shell disassembling clamp |
Country Status (1)
Country | Link |
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CN (1) | CN221364587U (en) |
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2023
- 2023-12-12 CN CN202323379793.6U patent/CN221364587U/en active Active
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