CN221260855U - Low temperature thermal conductivity testing device - Google Patents
Low temperature thermal conductivity testing device Download PDFInfo
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- CN221260855U CN221260855U CN202323021721.4U CN202323021721U CN221260855U CN 221260855 U CN221260855 U CN 221260855U CN 202323021721 U CN202323021721 U CN 202323021721U CN 221260855 U CN221260855 U CN 221260855U
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- 238000012360 testing method Methods 0.000 title claims abstract description 60
- 238000010438 heat treatment Methods 0.000 claims abstract description 92
- 238000001816 cooling Methods 0.000 claims abstract description 76
- 238000009413 insulation Methods 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims 2
- 239000012056 semi-solid material Substances 0.000 abstract description 23
- 238000000034 method Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000004519 grease Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses a low-temperature thermal conductivity testing device, which relates to the technical field of experimental equipment and comprises a heating body with a heating surface, a cooling body with a cooling surface and a heat insulation surrounding shield, wherein the heating body and the cooling body are arranged at intervals, the heating surface is opposite to the cooling surface, and a testing cavity is formed by surrounding the heating surface, the cooling surface and the heat insulation surrounding shield; the heat insulation surrounding baffle is detachably connected with the heating body and the cooling body respectively; the heating surface is provided with a first temperature sensor, the cooling surface is provided with a second temperature sensor, and the sensing part of the first temperature sensor and the sensing part of the second temperature sensor are positioned in the test cavity. Unlike the prior art, the device has a closed test chamber for holding a semi-solid material sample in a shape between a heat source and a cold source so as to provide a stable heat flow to the sample, thereby achieving a stable test of the semi-solid material without the holding state.
Description
Technical Field
The utility model belongs to the technical field of experimental equipment, and further relates to a low-temperature thermal conductivity testing device.
Background
Semi-solid materials are a special class of substances that are intermediate between liquids and solids. The semisolid material not only has good mechanical properties, but also has excellent electric conductivity and thermal conductivity, so that the semisolid material has potential application prospects in the aspects of electric conduction, heat dissipation and thermal management. For example, in the aspect of aircraft structural design, the semi-solid material can be applied to heat insulation and heat preservation layers of the aircraft, and plays roles of reducing the weight of the aircraft and improving maneuverability. Due to the wide application of semi-solid materials in the aerospace field, the study of low temperature thermal conductivity is particularly important.
The measurement method of the thermal conductivity is generally divided into a steady-state method and an unsteady-state method, and the application of the steady-state method to the measurement of the thermal conductivity of the material is mostly used in domestic and foreign researches. At present, most of materials for low temperature heat conductivity research at home and abroad are solid materials, heat insulation materials and the like, and the heat conductivity test of semi-solid materials is rarely researched. For example, chinese patent application number 201210243783.7 discloses a thermal conductivity tester, which tests thermal conductivity of LED substrate, die bonding layer, thermal interface thermal silicone grease, and the object to be tested is solid and is fixed between a heating module and a cooling module. And finally calculating to obtain the value of the heat conductivity by measuring the temperature difference of the two ends of the sample.
Semi-solid materials are a class of materials that have semi-fluid properties, with a particular shape, but are difficult to fix in shape due to their own flowability. Therefore, the adoption of scientific testing devices and experimental methods to determine the thermal conductivity of semi-solid materials in low temperature environments is of particular importance.
Disclosure of utility model
Therefore, the utility model provides a low-temperature thermal conductivity testing device, which has the advantage of being capable of measuring the thermal conductivity of a semisolid material, and solves the problems by using the following technical points:
The low-temperature thermal conductivity testing device comprises a heating body with a heating surface, a cooling body with a cooling surface and a heat insulation surrounding shield, wherein the heating body and the cooling body are arranged at intervals, the heating surface is opposite to the cooling surface, and the heating surface, the cooling surface and the heat insulation surrounding shield form a testing cavity; the heat insulation surrounding baffle is detachably connected with the heating body and the cooling body respectively; the heating surface is provided with a first temperature sensor, the cooling surface is provided with a second temperature sensor, and the sensing part of the first temperature sensor and the sensing part of the second temperature sensor are positioned in the test cavity.
As described above, the present application provides a low-temperature thermal conductivity testing apparatus having an advantage of being able to measure the thermal conductivity of a semi-solid material. Specifically, the semisolid material to be tested is filled in the test cavity formed by enclosing the heating surface, the cooling surface and the heat insulation enclosure, one side of the material is fully contacted with the heating surface, and the cooling surface is fully contacted with the other side of the material. The heating body should be connected to a heat source device such as a heating plate, and the cooling body should be connected to a refrigerator or the like. And in the test, one end of the sample to be tested is kept in good contact with the cooling body, the other end of the sample is kept in good thermal contact with the heating body, and heat required by the experiment is added on the heating body. After the heat transfer process has reached steady state, a steady temperature gradient is established across the sample, i.e., a steady flow of heat is caused to pass through the sample only in the axial direction of the sample, and when the heat transfer process has reached steady state, a steady temperature gradient is established in the axial direction of the sample, whereby the thermal conductivity of the sample is measured and calculated. Unlike the prior art, the device has a closed test chamber for holding a semi-solid material sample in a shape between a heat source and a cold source so as to provide a stable heat flow to the sample, thereby achieving a stable test of the semi-solid material without the holding state. In addition, the heat-insulating enclosure is detachably connected with the heating body and the cooling body respectively, namely, the testing cavity can expose an opening so as to take and place a tested sample. The heat insulation surrounding shield can also separate the heat source and the cold source, and create good heat insulation conditions in the sample bin so as to reduce the influence of heat leakage on the heat conductivity test and form stable temperature gradient distribution on the sample.
The further technical scheme is as follows:
The heating body is a cylinder, the bottom surface plane of the cylinder forms the heating surface, and the cooling body is a cylinder, and the top surface plane of the cylinder forms the cooling surface. The cylinder is able to deliver a more uniform heat distribution for the test sample.
To make the heat transfer more uniform, set to: the heat insulation fence is a closed annular fence, and the test cavity is cylindrical.
The heating surface is provided with an annular first positioning groove extending along the normal direction of the heating surface, and the size of the first positioning groove is matched with that of the heat insulation surrounding shield; the cooling surface is provided with an annular second positioning groove extending along the normal direction of the cooling surface, and the size of the second positioning groove is matched with that of the heat insulation surrounding shield. This characteristic has given the thermal-insulated fender and heating member, a installation fixed mode of cooling body, and thermal-insulated fender can insert in the second constant head tank of seting up on the cooling surface, and the heating member can be placed on thermal-insulated fender through first constant head tank. In this characteristic, the size of constant head tank and thermal-insulated fender that encloses are matchd means that the size between the groove width of constant head tank and the wall thickness that thermal-insulated fender is enclosed to the two clearance fit is satisfied to can dismouting between constant head tank and the thermal-insulated fender that encloses, in addition, the constant head tank should not be too big with thermal-insulated clearance that encloses between the fender two, avoids semi-solid measured material inflow gap.
The bottom of the second positioning groove is provided with a plurality of positioning holes, and the positioning holes are circumferentially arranged in an array at intervals; the bottom of the heat insulation enclosing shield is provided with a plurality of positioning rods matched with the positioning holes. This characteristic has given the thermal-insulated location that encloses between fender and the cooling portion and prevents, and the locating lever that the circumference was listed as inserts in the locating hole can avoid thermal-insulated enclosing to take place circumferential displacement relative to the cooling portion. Therefore, when the sample is added before the test, the heat-insulating fence can be fixed on the cooling body, but a heating body is not installed, the test cavity at the moment is a groove body formed by a cooling surface and the heat-insulating fence in a surrounding way, and the sample is added on the cooling surface through the opening until the rated measurement volume is reached.
The material of the heat insulation enclosure is G10 material. G10 is a composite material of glass fiber and resin laminate, and is a heat insulating material having relatively low heat conductivity, and is capable of separating a heating portion and a cooling portion.
The top surface plane of the heating body is provided with a plurality of heating plates, and the axis of the heating body which surrounds the cylinder shape is a central circumference interval array. The heating plate and the hot plate keep good thermal contact so as to ensure uniform temperature distribution at the hot end of the sample and ensure that the output heat can be transferred to the hot end of the sample as completely as possible. The temperature distribution of the hot end of the sample is ensured to be uniform, the conditions of high half temperature and low half temperature are avoided, and larger errors caused to experimental measurement results due to unstable temperature of the hot end of the sample are prevented.
Still further, the number of the heating plates is 4.
The heating body is made of red copper, and the cooling body is made of red copper. The red copper is selected as a material, has good heat conduction performance, and also has good heat conduction performance in a low-temperature environment, so that good thermal contact between a cold end and a hot end and between the cold and hot plates can be ensured when the heat conduction silicone grease heat conductivity is tested in the low-temperature environment, and the heat output by the heating plate can be transferred to the hot end of the sample as completely as possible.
The beneficial effects of the utility model are as follows:
The application provides a low-temperature thermal conductivity testing device, which has the advantage of being capable of measuring the thermal conductivity of a semisolid material. Specifically, the semisolid material to be tested is filled in the test cavity formed by enclosing the heating surface, the cooling surface and the heat insulation enclosure, one side of the material is fully contacted with the heating surface, and the cooling surface is fully contacted with the other side of the material. The heating body should be connected to a heat source device such as a heating plate, and the cooling body should be connected to a refrigerator or the like. And in the test, one end of the sample to be tested is kept in good contact with the cooling body, the other end of the sample is kept in good thermal contact with the heating body, and heat required by the experiment is added on the heating body. After the heat transfer process has reached steady state, a steady temperature gradient is established across the sample, i.e., a steady flow of heat is caused to pass through the sample only in the axial direction of the sample, and when the heat transfer process has reached steady state, a steady temperature gradient is established in the axial direction of the sample, whereby the thermal conductivity of the sample is measured and calculated. Unlike the prior art, the device has a closed test chamber for holding a semi-solid material sample in a shape between a heat source and a cold source so as to provide a stable heat flow to the sample, thereby achieving a stable test of the semi-solid material without the holding state. In addition, the heat-insulating enclosure is detachably connected with the heating body and the cooling body respectively, namely, the testing cavity can expose an opening so as to take and place a tested sample. The heat insulation surrounding shield can also separate the heat source and the cold source, and create good heat insulation conditions in the sample bin so as to reduce the influence of heat leakage on the heat conductivity test and form stable temperature gradient distribution on the sample.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model.
FIG. 1 is a schematic cross-sectional three-dimensional view of the present utility model;
FIG. 2 is a schematic overall three-dimensional view of the present utility model;
In the figure: 1. a heating body; 2. a cooling body; 3. a heat insulation enclosure; 4. a test chamber; 5. a first temperature sensor; 6. a second temperature sensor; 7. a first positioning groove; 8. a second positioning groove; 9. a positioning rod; 10. and heating the sheet.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present utility model are included in the protection scope of the present utility model.
Examples
1-2, The low temperature thermal conductivity testing device comprises a heating body 1 with a heating surface, a cooling body 2 with a cooling surface and a heat insulation surrounding block 3, wherein the heating body 1 and the cooling body 2 are arranged at intervals, the heating surface faces the cooling surface, and the heating surface, the cooling surface and the heat insulation surrounding block 3 are surrounded to form a testing cavity 4; the heat insulation surrounding shield 3 is detachably connected with the heating body 1 and the cooling body 2 respectively; the heating surface is provided with a first temperature sensor 5, the cooling surface is provided with a second temperature sensor 6, and the sensing part of the first temperature sensor 5 and the sensing part of the second temperature sensor 6 are positioned in the test cavity 4.
As described above, the present application provides a low-temperature thermal conductivity testing apparatus having an advantage of being able to measure the thermal conductivity of a semi-solid material. Specifically, the semisolid material to be tested is filled in the test cavity 4 formed by enclosing the heating surface, the cooling surface and the heat insulation enclosing shield 3, one side of the material is fully contacted with the heating surface, and the other side of the material is fully contacted with the cooling surface. The heating body 1 should be connected to a heat source device such as a heating sheet 10, and the cooling body 2 should be connected to a refrigerator or the like. During testing, one end of a sample to be tested is kept in good contact with the cooling body 2, the other end of the sample is kept in good thermal contact with the heating body 1, and heat required by experiments is added to the heating body 1. After the heat transfer process has reached steady state, a steady temperature gradient is established across the sample, i.e., a steady flow of heat is caused to pass through the sample only in the axial direction of the sample, and when the heat transfer process has reached steady state, a steady temperature gradient is established in the axial direction of the sample, whereby the thermal conductivity of the sample is measured and calculated. Unlike the prior art, the device has a closed test chamber 4 for holding a semi-solid material sample in a shape between a heat source and a cold source so as to provide a stable flow of heat to the sample, thereby achieving a stable test of the semi-solid material without the holding state. In addition, the heat-insulating enclosure 3 is detachably connected with the heating body 1 and the cooling body 2 respectively, namely, the testing cavity 4 can expose an opening so as to take and place a tested sample. The heat insulation enclosure 3 can also separate a heat source and a cold source, and create good heat insulation conditions in the sample bin so as to reduce the influence of heat leakage on the heat conductivity test and form stable temperature gradient distribution on the sample.
The further technical scheme is as follows:
The heating body 1 is a cylinder, the bottom surface plane of the cylinder forms the heating surface, and the cooling body 2 is a cylinder, the top surface plane of the cylinder forms the cooling surface. The cylinder is able to deliver a more uniform heat distribution for the test sample.
To make the heat transfer more uniform, set to: the heat insulation fence 3 is a closed annular fence, and the test cavity 4 is cylindrical in shape.
The heating surface is provided with an annular first positioning groove 7 extending along the normal direction of the heating surface, and the size of the first positioning groove 7 is matched with that of the heat insulation surrounding shield 3; the cooling surface is provided with a ring-shaped second positioning groove 8 extending along the normal direction of the cooling surface, and the size of the second positioning groove 8 is matched with that of the heat insulation surrounding shield 3. This characteristic gives a mode of installation and fixation of thermal-insulated fender 3 and heating member 1, cooling body 2, and thermal-insulated fender 3 can insert in the second constant head tank 8 of seting up on the cooling surface, and heating member 1 can place on thermal-insulated fender 3 through first constant head tank 7. In this characteristic, the size of constant head tank and thermal-insulated fender 3 match means that the size between the groove width of constant head tank and the wall thickness of thermal-insulated fender 3 satisfies two clearance fit to can dismouting between constant head tank and the thermal-insulated fender 3, in addition, the clearance between constant head tank and the thermal-insulated fender 3 should not be too big, avoids semi-solid measured material inflow gap.
The bottom of the second positioning groove 8 is provided with a plurality of positioning holes, and the positioning holes are circumferentially arranged in an array at intervals; the bottom of the heat insulation enclosing shield 3 is provided with a plurality of positioning rods 9 matched with the positioning holes. This characteristic has given a kind of location between thermal-insulated fender 3 and the cooling portion and has prevented, and the locating lever 9 that the circumference was listed as inserts in the locating hole can avoid thermal-insulated fender 3 to take place the circumference displacement relative to the cooling portion. Therefore, when the heat-insulating fence 3 is added to the sample before the test, the heat-insulating fence 3 can be fixed on the cooling body 2, but the heating body 1 is not installed, the test cavity 4 at the moment is a groove body formed by enclosing a cooling surface and the heat-insulating fence 3, and the opening is formed at the top of the groove body, and the sample is added to the cooling surface through the opening until the rated measurement volume is reached.
The material of the heat insulation enclosure 3 is G10 material. G10 is a composite material of glass fiber and resin laminate, and is a heat insulating material having relatively low heat conductivity, and is capable of separating a heating portion and a cooling portion.
The top surface plane of the heating body 1 is provided with a plurality of heating plates 10, and the heating plates 10 are arranged in a central circumference interval array around the axis of the cylindrical heating body 1. The heat patch 10 should be in good thermal contact with the hot plate to ensure uniform temperature distribution at the hot end of the sample and to ensure that the heat output is transferred to the hot end of the sample as completely as possible. The temperature distribution of the hot end of the sample is ensured to be uniform, the conditions of high half temperature and low half temperature are avoided, and larger errors caused to experimental measurement results due to unstable temperature of the hot end of the sample are prevented.
Still further, the number of the heating plates 10 is 4.
The heating body 1 is made of red copper, and the cooling body 2 is made of red copper. The red copper is selected as a material, has good heat conduction performance, and also has good heat conduction performance in a low-temperature environment, so that good thermal contact between a cold end and a hot end and between the cold and hot plates can be ensured when the heat conduction silicone grease heat conductivity is tested in the low-temperature environment, and the heat output by the heating plate 10 can be transferred to the hot end of a sample as completely as possible.
The above is a preferred embodiment of the present utility model, and a person skilled in the art can also make alterations and modifications to the above embodiment, so that the present utility model is not limited to the above specific embodiment, and any obvious improvements, substitutions or modifications made by a person skilled in the art on the basis of the present utility model are all within the scope of the present utility model.
Claims (9)
1. The low-temperature thermal conductivity testing device is characterized by comprising a heating body (1) with a heating surface, a cooling body (2) with a cooling surface and a heat insulation surrounding shield (3), wherein the heating body (1) and the cooling body (2) are arranged at intervals, the heating surface is opposite to the cooling surface, and the heating surface, the cooling surface and the heat insulation surrounding shield (3) are surrounded to form a testing cavity (4); the heat insulation surrounding shield (3) is detachably connected with the heating body (1) and the cooling body (2) respectively; the heating surface is provided with a first temperature sensor (5), the cooling surface is provided with a second temperature sensor (6), and the sensing part of the first temperature sensor (5) and the sensing part of the second temperature sensor (6) are positioned in the test cavity (4).
2. The low-temperature thermal conductivity testing device according to claim 1, wherein the heating body (1) is a cylinder, the bottom surface plane of the cylinder forms the heating surface, and the cooling body (2) is a cylinder, the top surface plane of the cylinder forms the cooling surface.
3. The low-temperature thermal conductivity testing device according to claim 2, wherein the heat insulation enclosure (3) is a closed annular enclosure, and the testing cavity (4) is cylindrical in shape.
4. A low temperature thermal conductivity testing device according to claim 3, wherein the heating surface is provided with a ring-shaped first positioning groove (7) extending along the normal direction of the heating surface, and the size of the first positioning groove (7) is matched with that of the heat insulation surrounding barrier (3); the cooling surface is provided with an annular second positioning groove (8) extending along the normal direction of the cooling surface, and the size of the second positioning groove (8) is matched with that of the heat insulation surrounding barrier (3).
5. The low-temperature thermal conductivity testing device according to claim 4, wherein a plurality of positioning holes are formed in the bottom of the second positioning groove (8), and the positioning holes are circumferentially arranged in an array at intervals; the bottom of the heat insulation surrounding shield (3) is provided with a plurality of positioning rods (9) matched with the positioning holes.
6. A low temperature thermal conductivity testing device according to claim 3, characterized in that the material of the insulating enclosure (3) is a G10 material.
7. The low-temperature thermal conductivity testing device according to claim 2, characterized in that the top surface plane of the heating body (1) is provided with a plurality of heating plates (10), the heating plates (10) being arranged in a central circumferential interval array around the axis of the cylindrical heating body (1).
8. The low temperature thermal conductivity testing device according to claim 7, wherein the number of heating plates (10) is 4.
9. The low-temperature thermal conductivity testing device according to claim 6, wherein the heating body (1) is made of red copper, and the cooling body (2) is made of red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323021721.4U CN221260855U (en) | 2023-11-07 | 2023-11-07 | Low temperature thermal conductivity testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323021721.4U CN221260855U (en) | 2023-11-07 | 2023-11-07 | Low temperature thermal conductivity testing device |
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| Publication Number | Publication Date |
|---|---|
| CN221260855U true CN221260855U (en) | 2024-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323021721.4U Active CN221260855U (en) | 2023-11-07 | 2023-11-07 | Low temperature thermal conductivity testing device |
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| CN (1) | CN221260855U (en) |
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2023
- 2023-11-07 CN CN202323021721.4U patent/CN221260855U/en active Active
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