CN221249890U - Multilayer epoxy board lamination device - Google Patents
Multilayer epoxy board lamination device Download PDFInfo
- Publication number
- CN221249890U CN221249890U CN202323231437.XU CN202323231437U CN221249890U CN 221249890 U CN221249890 U CN 221249890U CN 202323231437 U CN202323231437 U CN 202323231437U CN 221249890 U CN221249890 U CN 221249890U
- Authority
- CN
- China
- Prior art keywords
- plate
- laminating
- plates
- blanking
- multilayer epoxy
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Links
- 239000004593 Epoxy Substances 0.000 title claims abstract description 38
- 238000003475 lamination Methods 0.000 title claims description 14
- 238000010030 laminating Methods 0.000 claims abstract description 38
- 238000004140 cleaning Methods 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000005304 joining Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a multilayer epoxy plate laminating device, which relates to the technical field of multilayer epoxy plate laminating and comprises a device base, wherein four supporting rods are symmetrically arranged at the upper end of the device base, a limiting guide rod is arranged at the upper end of the supporting rods, a plurality of laminating structures are movably arranged on the limiting guide rod, a blanking cleaning structure is arranged on the device base, the blanking cleaning structure consists of a cylinder, a connecting substrate, a supporting plate, a blanking push rod and a cleaning cushion, the blanking cleaning structure can automatically blanking laminated multilayer epoxy plates, simultaneously, the surfaces of the laminating plates and the matched plates can be cleaned in the blanking process, sundries are prevented from adhering to the surfaces of the laminating plates and the matched plates, further, the probability that the multilayer epoxy plates are pressed and damaged by the sundries adhering to the surfaces of the laminating plates and the matched plates in the laminating process of the laminating can be finally avoided, meanwhile, the labor intensity of operators can be reduced, and the laminating efficiency of the multilayer epoxy plates is improved.
Description
Technical Field
The utility model relates to the technical field of multilayer epoxy board lamination, in particular to a multilayer epoxy board lamination device.
Background
Multi-layer epoxy board lamination is a manufacturing process that involves laminating multiple layers of epoxy resin boards together to increase their thickness and strength. In the lamination of multi-layer epoxy panels, it is often necessary to use a press to tightly bond the multi-layer panels together. The traditional press can have certain use defect in the in-process that uses, fold the multilayer epoxy board that the pressure was accomplished promptly when the unloading, often need artifical manual unloading to can increase operation workman's intensity of labour, simultaneously, use the efficiency that the manual unloading was carried out also relatively poor, and then can reduce the efficiency that the multilayer epoxy board was folded, and traditional press is when using, because do not set up clean structure on it, thereby when the surface adhesion of the pressure plate of press has debris, carry out the in-process of folding to the multilayer epoxy board, the debris of adhesion at the pressure plate surface is easy with the multilayer epoxy board pressure wound, and then can reduce the finished product quality of multilayer epoxy board, therefore need a multilayer epoxy board laminating device to solve above-mentioned problem.
Disclosure of utility model
The utility model mainly aims to provide a multilayer epoxy board laminating device which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
The utility model provides a multilayer epoxy board laminating device, includes the equipment base, four bracing pieces are installed to the upper end symmetry of equipment base, spacing guide arm is installed to the upper end of bracing piece, movable mounting has a plurality of to fold the pressure structure on the spacing guide arm, install the clean structure of unloading on the equipment base, the clean structure of unloading comprises cylinder, connection base board, backup pad, unloading push rod and clean cushion, connection base board is located one side of a plurality of to fold the pressure structure and installs simultaneously on the telescopic link of cylinder, the backup pad has a plurality of and vertically even the installation at connection base board's inner, the unloading push rod has a plurality of and installs the inner at a plurality of backup pad respectively, clean cushion has a plurality of and installs the upper and lower both ends at the unloading push rod respectively.
Preferably, two hydraulic cylinders are fixedly arranged in the equipment base, and the supporting rods are fixedly connected with the equipment base and the limiting guide rod.
Preferably, the limiting guide rod is sleeved with a plurality of return springs, a top plate is fixedly arranged at the upper end of the limiting guide rod, and a matching plate is fixedly arranged at the lower end of the top plate.
Preferably, the laminating structure comprises laminating plates and mounting plates, the four mounting plates are symmetrically arranged on the end faces of the laminating plates, the mounting plates are fixedly connected with the laminating plates, the mounting plates are movably sleeved on the limiting guide rods, and the reset springs are fixedly connected with the two upper and lower adjacent mounting plates.
Preferably, the cylinder on the blanking cleaning structure is fixedly arranged at the upper end of the equipment base, and the cylinder is positioned between the two hydraulic cylinders.
Preferably, the connecting substrate on the blanking cleaning structure is fixedly connected with the telescopic rod and the supporting plate of the air cylinder, and the blanking push rod is fixedly connected with the supporting plate and the cleaning cushion.
Compared with the prior art, the utility model has the following beneficial effects:
through setting up the clean structure of unloading, this clean structure of unloading can carry out automatic unloading to the multilayer epoxy board that the lamination was accomplished, simultaneously, can also clean the surface of folding clamp plate and joining in marriage the board at the in-process of unloading, thereby make the surface that folds clamp plate and joining in marriage the board keep clean state, avoid folding clamp plate and joining in marriage the surface adhesion debris of board, and then finally can avoid the multilayer epoxy board to be pressed the probability of damaging at folding clamp plate and joining in marriage the board surface by the debris that is attached when folding the pressure, can also reduce operation workman's intensity of labour simultaneously, promote the efficiency that the multilayer epoxy board was folded.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the structure of the blanking cleaning structure of the present utility model after being removed;
Fig. 3 is a schematic structural view of the discharging cleaning structure of the present utility model.
In the figure: 1. an equipment base; 2. a support rod; 3. a limit guide rod; 4. a lamination structure; 5. a blanking cleaning structure; 6. a top plate; 7. matching plates; 8. a return spring; 9. a hydraulic cylinder; 10. a stacking plate; 11. a mounting plate; 12. a cylinder; 13. a connection substrate; 14. a support plate; 15. a blanking push rod; 16. and cleaning the soft cushion.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
Referring to fig. 1, 2 and 3, the laminated epoxy plate laminating device comprises a device base 1, four supporting rods 2 are symmetrically arranged at the upper end of the device base 1, a limiting guide rod 3 is arranged at the upper end of each supporting rod 2, a plurality of laminating structures 4 are movably arranged on each limiting guide rod 3, two hydraulic cylinders 9 are fixedly arranged in the device base 1, each supporting rod 2 is fixedly connected with the device base 1 and each limiting guide rod 3, a plurality of return springs 8 are sleeved on each limiting guide rod 3, a top plate 6 is fixedly arranged at the upper end of each limiting guide rod 3, a matching plate 7 is fixedly arranged at the lower end of each top plate 6, each laminating structure 4 consists of a laminating plate 10 and a mounting plate 11, the mounting plates 11 are symmetrically arranged on the end faces of the laminating plates 10, the mounting plates 11 are fixedly connected with the laminating plates 10, the mounting plates 11 are movably sleeved on the limiting guide rods 3, and the return springs 8 are fixedly connected with two mounting plates 11 which are adjacent to each other.
Referring to fig. 1, fig. 2, fig. 3, the multi-device base 1 is provided with a blanking cleaning structure 5, the blanking cleaning structure 5 is composed of a cylinder 12, a connecting base plate 13, a supporting plate 14, a blanking push rod 15 and a cleaning cushion 16, the connecting base plate 13 is located on one side of a plurality of stacking structures 4 and is simultaneously arranged on a telescopic rod of the cylinder 12, the supporting plate 14 is provided with a plurality of and longitudinally and uniformly arranged at the inner end of the connecting base plate 13, the blanking push rod 15 is provided with a plurality of and is respectively arranged at the inner ends of the plurality of supporting plates 14, the cleaning cushion 16 is provided with a plurality of and is respectively arranged at the upper end and the lower end of the blanking push rod 15, the cylinder 12 on the blanking cleaning structure 5 is fixedly arranged at the upper end of the device base 1, the cylinder 12 is located between two hydraulic cylinders 9, the connecting base plate 13 and the cylinder 12 on the blanking cleaning structure 5 are fixedly connected with the telescopic rod, the supporting plate 14 and the cleaning cushion 16 are fixedly connected, the blanking push rod 15 and the supporting plate 14 are arranged, the blanking cleaning structure 5 is capable of automatically blanking the completed multi-layer epoxy plate, and simultaneously, the surface of stacking and the surface of the multi-layer epoxy plate can be further prevented from being stacked by the adhesive plate 10 and the surface of the adhesive plate 10, and the surface of the multi-layer epoxy plate can be further prevented from being stacked by the adhesive plate 10, and the adhesive plate can be further prevented from being attached to the surface of the adhesive plate 10, and the adhesive plate can be further stacked by the adhesive plate 10, and the adhesive plate can be further effectively and attached to the adhesive plate and the surface can be protected.
It should be noted that, the utility model is a multi-layer epoxy plate laminating device, when laminating the multi-layer epoxy plates, the multi-layer epoxy plates coated with glue can be placed at the upper end of the laminating plate 10 on the laminating structure 4, then the hydraulic cylinder 9 is started, at this time, the telescopic rod of the hydraulic cylinder 9 can push the laminating structure 4 upwards, thereby finally laminating the multi-layer epoxy plates together by using the laminating plate 10 and the matching plate 7, in the process, the reset spring 8 can be compressed by the mounting plate 11 on the laminating structure 4, after lamination of the multi-layer epoxy plates is completed, the telescopic rod on the hydraulic cylinder 9 can be reset downwards, at this time, the laminating structure 4 can also reset under the elastic force of gravity and the reset spring 8, then the cylinder 12 on the blanking cleaning structure 5 can be started to carry out blanking, at this time, the telescopic rod of the cylinder 12 can pull the connecting substrate 13, the supporting plate 14, the blanking push rod 15 and the cleaning cushion 16 to the laminating structure 4, and then the blanking push rod 15 and the cleaning cushion 16 are continuously moved to the upper side of the laminating structure 4 along with the movement of the blanking push rod 15 and the cleaning push plate 16, thereby the surface of the multi-layer epoxy plates 10 is continuously pressed from the laminating plate 10 and the laminating plate 16 is cleaned by using the pressing plate 10 and the upper end of the laminating plate 10, and the cleaning cushion 16 can be completed after the blanking plate 16 is cleaned, and the surface of the cleaning push rod 16 is cleaned by the blanking plate 10 continuously.
The foregoing description is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments, or that equivalents may be substituted for part of the technical features thereof. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a multilayer epoxy board laminating device, includes equipment base (1), four bracing pieces (2) are installed to the upper end symmetry of equipment base (1), spacing guide arm (3) are installed to the upper end of bracing piece (2), movable mounting has a plurality of to fold pressure structure (4), its characterized in that on spacing guide arm (3): install unloading clean structure (5) on equipment base (1), unloading clean structure (5) comprises cylinder (12), connection base plate (13), backup pad (14), unloading push rod (15) and clean cushion (16), connection base plate (13) are located one side of a plurality of stack structure (4) and install simultaneously on the telescopic link of cylinder (12), backup pad (14) have a plurality of and vertically even install the inner at connection base plate (13), unloading push rod (15) have a plurality of and install the inner at a plurality of backup pad (14) respectively, clean cushion (16) have a plurality of and install the upper and lower both ends at unloading push rod (15) respectively.
2. The multilayer epoxy board lamination apparatus of claim 1, wherein: two hydraulic cylinders (9) are fixedly installed in the equipment base (1), and the supporting rods (2) are fixedly connected with the equipment base (1) and the limiting guide rods (3).
3. The multilayer epoxy board lamination apparatus of claim 2, wherein: the limiting guide rod (3) is sleeved with a plurality of reset springs (8), a top plate (6) is fixedly arranged at the upper end of the limiting guide rod (3), and a matching plate (7) is fixedly arranged at the lower end of the top plate (6).
4. A multilayer epoxy board lamination apparatus according to claim 3, characterized in that: the folding structure (4) is composed of a folding plate (10) and a mounting plate (11), the four mounting plates (11) are symmetrically arranged on the end face of the folding plate (10), the mounting plate (11) is fixedly connected with the folding plate (10), the mounting plate (11) is movably sleeved on the limiting guide rod (3), and the reset spring (8) is fixedly connected with two upper and lower adjacent mounting plates (11).
5. The multilayer epoxy board lamination apparatus of claim 4, wherein: the cylinder (12) on the blanking cleaning structure (5) is fixedly arranged at the upper end of the equipment base (1), and the cylinder (12) is positioned between the two hydraulic cylinders (9).
6. The multilayer epoxy board lamination apparatus of claim 5, wherein: the connecting substrate (13) on the blanking cleaning structure (5) is fixedly connected with the telescopic rod of the air cylinder (12) and the supporting plate (14), and the blanking push rod (15) is fixedly connected with the supporting plate (14) and the cleaning cushion (16).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202323231437.XU CN221249890U (en) | 2023-11-29 | 2023-11-29 | Multilayer epoxy board lamination device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202323231437.XU CN221249890U (en) | 2023-11-29 | 2023-11-29 | Multilayer epoxy board lamination device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN221249890U true CN221249890U (en) | 2024-07-02 |
Family
ID=91632369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202323231437.XU Active CN221249890U (en) | 2023-11-29 | 2023-11-29 | Multilayer epoxy board lamination device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN221249890U (en) |
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2023
- 2023-11-29 CN CN202323231437.XU patent/CN221249890U/en active Active
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