CN221228739U - Atomizing core, atomizing subassembly and atomizing device - Google Patents
Atomizing core, atomizing subassembly and atomizing device Download PDFInfo
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- CN221228739U CN221228739U CN202323232618.4U CN202323232618U CN221228739U CN 221228739 U CN221228739 U CN 221228739U CN 202323232618 U CN202323232618 U CN 202323232618U CN 221228739 U CN221228739 U CN 221228739U
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- atomizing
- liquid guiding
- heating
- liquid
- core
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- 239000007788 liquid Substances 0.000 claims abstract description 111
- 238000010438 heat treatment Methods 0.000 claims abstract description 70
- 238000000889 atomisation Methods 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000000443 aerosol Substances 0.000 claims abstract description 12
- 239000002210 silicon-based material Substances 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000010703 silicon Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 4
- 241001391944 Commicarpus scandens Species 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000003921 oil Substances 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 5
- 239000000306 component Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical group [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
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Abstract
The application discloses an atomization core, an atomization assembly and an atomization device, and belongs to the technical field of atomization equipment. The atomizing core comprises a heating part and a liquid guide part, the liquid guide part is used for transmitting an atomizing substrate to the heating part, the heating part is made of silicon-based materials, and the heating part is used for heating the atomizing substrate to generate aerosol; the heating part is provided with a liquid guiding surface and an atomization surface, the liquid guiding part is provided with a supporting surface corresponding to the liquid guiding surface, and the liquid guiding surface is attached to and supported on the supporting surface. According to the atomization core provided by the application, the liquid guide surface is adhered and supported on the supporting surface, and the supporting surface is adhered to the liquid guide surface to form the surface, so that the liquid guide part can provide good support for the heating part, the integrity of the atomization core is improved, the atomization core is not easy to break in the assembly process, and the mass production of the atomization core is facilitated.
Description
Technical Field
The utility model relates to the technical field of atomizing equipment, in particular to an atomizing core, an atomizing assembly and an atomizing device.
Background
The atomizing core is used as a core component of the atomizing device and is used for heating the atomizing matrix to generate aerosol. To ensure good aerosol mouthfeel, rapid, uniform, consistent heating of the atomizing core is required. The existing atomizing core mainly comprises a fiber cotton atomizing core and a ceramic atomizing core. The fiber cotton of the fiber cotton atomization core is in non-uniform contact with the metal heating wire, so that the heating is non-uniform, and the atomization uniformity and consistency are poor; the ceramic atomizing core is sintered by porous ceramic, so that a structure with consistent pore diameter cannot be prepared, and atomization is also uneven. The atomization core prepared from the silicon-based material has the advantages of rapid heating, good uniformity, good consistency and the like, but is easy to damage in the assembly process, the yield of products is affected, and the mass production of the silicon-based material atomization core is difficult.
Disclosure of utility model
The application provides an atomization core, an atomization assembly and an atomization device, which can solve the technical problem that the mass production of the silicon-based material atomization core is difficult.
In order to solve the technical problems, the application provides an atomization core, which comprises a heating part and a liquid guiding part, wherein the liquid guiding part is used for transmitting an atomization substrate to the heating part, the heating part is made of silicon-based materials, and the heating part is used for heating the atomization substrate to generate aerosol; the heating part is provided with a liquid guiding surface and an atomization surface, the liquid guiding part is provided with a supporting surface corresponding to the liquid guiding surface, and the liquid guiding surface is attached to and supported on the supporting surface.
Optionally, the liquid guiding part is provided with a mounting groove, the supporting surface is arranged on the bottom wall of the mounting groove, and the heating part is embedded in the mounting groove.
In an embodiment, the support surface is provided with liquid guiding holes arranged in an array, the liquid guiding holes penetrate through the bottom wall of the mounting groove, and the liquid guiding holes are communicated with the mounting groove so as to transfer the atomized substrate to the heating part.
In one embodiment, the liquid guiding portion is made of glass.
In one embodiment, the heat generating part and the liquid guiding part are connected by adopting a bonding or gluing process.
In one embodiment, the liquid guiding hole is a circular hole, and the diameter of the liquid guiding hole is more than or equal to 0.025mm and less than or equal to 0.30mm; or the liquid guide hole is a strip-shaped hole, and the width of the liquid guide hole is more than or equal to 0.01mm and less than or equal to 0.05mm.
In one embodiment, the heating part is made of conductive silicon base material, the conductive silicon base material is made of monocrystalline silicon or polycrystalline silicon base material doped with metal atoms, two ends of the atomizing surface are provided with electrode contacts, and the electrode contacts are provided with electrode plating layers.
In an embodiment, the plurality of mounting grooves and the plurality of heating parts are arranged in a one-to-one correspondence manner and are respectively embedded in the plurality of mounting grooves.
In another aspect the application provides an atomising assembly comprising an atomising core as described above.
The application also provides an atomization device, which comprises the atomization assembly.
According to the atomization core provided by the application, the liquid guide surface is adhered and supported on the supporting surface, and the supporting surface is adhered to the liquid guide surface to form the surface, so that the liquid guide part can provide good support for the heating part, the integrity of the atomization core is improved, the atomization core is not easy to break in the assembly process, and the mass production of the atomization core is facilitated.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of an embodiment of an atomizing core according to the present disclosure along a viewing angle;
FIG. 2 is a schematic view of an embodiment of an atomizing core according to the present disclosure along another view;
FIG. 3 is a schematic cross-sectional view of an embodiment of an atomizing core according to the present disclosure;
FIG. 4 is a schematic cross-sectional view of an embodiment of an atomizing core according to the present disclosure along another view angle;
FIG. 5 is a schematic cross-sectional view of an atomizing assembly according to an embodiment of the present disclosure;
fig. 6 is a schematic structural view of an embodiment of an atomizing device according to the present disclosure.
Wherein:
A 100-atomization assembly;
10-atomizing core; 11-a heating part; 111-guiding the liquid level; 112-an atomization face; 1121-electrode contacts; 12-a liquid guiding part; 121-mounting slots; 1211-a support surface; 1212-liquid guiding hole;
20-an oil cup; 21-a suction nozzle;
500-atomizing means; 510-a control assembly; 520-power supply assembly.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is specifically noted that the following examples are only for illustrating the present utility model, but do not limit the scope of the present utility model. Likewise, the following examples are only some, but not all, of the examples of the present utility model, and all other examples, which a person of ordinary skill in the art would obtain without making any inventive effort, are within the scope of the present utility model.
In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. The terms "first," "second," "third," and the like in embodiments of the present utility model are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature. All directional indications (such as up, down, left, right, front, back … …) in the embodiments of the present utility model are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. The terms "comprising" and "having" and any variations thereof in embodiments of the present utility model are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may alternatively include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The application provides an atomizing core. Referring to fig. 1-4, the atomizing core 10 may include a heat generating portion 11 and a liquid guiding portion 12. The liquid guiding portion 12 is used for transferring the atomized substrate to the heat generating portion 11. The liquid guide portion 12 can be a porous medium, and by adjusting the pore size of the liquid guide portion 12, the liquid guide portion 12 can meet the supply rate of the atomized matrix, avoid dry combustion, have good oil locking property, and prevent the atomized matrix from leaking. The heating part 11 is made of silicon-based material, and the heating part 11 is used for heating the atomized matrix to generate aerosol. The silicon-based material can be monocrystalline silicon or polycrystalline silicon. The silicon-based material is suitable for processing by adopting processes such as etching (plasma or solvent etching) or physical vapor deposition (Physical Vapor Deposition, PVD), and the like, and the process can accurately control the processing precision, ensure the precision and the quality stability of the atomizing core 10, thereby improving the taste consistency of aerosol generated by atomizing the atomizing core 10.
The heat generating portion 11 has a liquid guiding surface 111 and an atomizing surface 112, and the liquid guiding portion 12 is provided with a support surface 1211 corresponding to the liquid guiding surface 111, and the liquid guiding surface 111 is bonded to and supported on the support surface 1211. The liquid guide surface 111 is one surface of the heat generating portion 11, and the liquid guide surface 111 may be a flat surface or a curved surface. The liquid guiding surface 111 is used for being attached to the supporting surface 1211, a plurality of micropores can be formed in the heating portion 11, the atomized matrix is transferred from the liquid guiding surface 111 to the atomizing surface 112 through the micropores, and the atomized matrix is atomized on the atomizing surface 112 to generate aerosol. The support surface 1211 corresponds to the liquid guiding surface 111, and means that the support surface 1211 and the liquid guiding surface 111 are matched in size and shape so that they can form a surface-to-surface joint.
According to the atomization core 10 provided by the application, the liquid guide surface 111 is attached to and supported on the supporting surface 1211, and the supporting surface 1211 and the liquid guide surface 111 form surface-to-surface attachment, so that the liquid guide part 12 can provide good support for the heating part 11, the integrity of the atomization core 10 is improved, the defects of low mechanical strength, brittleness and the like of a silicon-based material are overcome, the atomization core 10 is not easy to break in the assembly process, and the mass production of the atomization core 10 is facilitated.
Alternatively, the atomizing core 10 is in a block shape, and accordingly, the heat generating portion 11 and the liquid guiding portion 12 are also in a block shape. Illustratively, the heat generating portion 11 and the liquid guiding portion 12 may be rectangular parallelepiped, wherein the liquid guiding surface 111 and the atomizing surface 112 may be two surfaces of rectangular parallelepiped that are disposed opposite to each other.
Alternatively, the material of the liquid guiding part 12 may be ceramic or glass. The liquid guiding part 12 made of ceramic or glass can meet the supply rate of the atomized matrix and has good oil locking property. In one embodiment, the liquid guiding portion 12 is made of glass. Illustratively, the liquid guide 12 may be quartz glass, high silica glass, or silicate glass. On one hand, the glass material has better mechanical strength, and is not easy to break in the assembly process; on the other hand, the glass material has stable chemical property at high temperature and does not release harmful substances when heated.
Optionally, the heat generating part 11 and the liquid guiding part 12 are connected by adopting a bonding or gluing process. Through bonding or gluing technology for portion 11 that generates heat is connected as an organic wholely with drain portion 12, and drain portion 12 can support portion 11 that generates heat better, has strengthened the wholeness of atomizing core 10, ensures that atomizing core 10 is difficult for appearing the rupture in the assembly process.
In an embodiment, as shown in fig. 2 to 4, the liquid guiding portion 12 is provided with a mounting groove 121, the supporting surface 1211 is disposed on a bottom wall of the mounting groove 121, and the heating portion 11 is embedded in the mounting groove 121. Through setting up mounting groove 121, drain portion 12 encloses the portion 11 that generates heat in mounting groove 121 to form the protection of enclosing, further reduce the risk that the portion 11 that generates heat is damaged in the assembly process. Alternatively, the outer contour of the heat generating part 11 may be matched with the shape of the mounting groove 121, so that the outer circumferential surface of the heat generating part 11 may also be fitted with the inner wall of the mounting groove 121, further enhancing the integrity of the atomizing core 10.
In one embodiment, the number of the mounting grooves 121 and the number of the heat generating portions 11 are plural, and the plurality of heat generating portions 11 are embedded in the plurality of mounting grooves 121 in a one-to-one correspondence manner. Alternatively, the plurality of heat generating parts 11 are arranged on the liquid guiding part 12 at intervals, and the plurality of heat generating parts 11 may be arranged in rows or columns or in an array. By providing the plurality of heating portions 11, the plurality of heating portions 11 can be alternately heated independently or combined, thereby reducing the frequency or duration of use of the single heating portion 11 and improving the service life of the atomizing core 10.
Referring to fig. 1 and 3, in an embodiment, the supporting surface 1211 is provided with liquid guiding holes 1212 arranged in an array, the liquid guiding holes 1212 penetrate through the bottom wall of the mounting groove 121, and the liquid guiding holes 1212 are communicated with the mounting groove 121 to transfer the atomized substrate to the heat generating portion 11. Limiting the opening range of the liquid guiding hole 1212 to the setting range of the mounting groove 121 can maintain the integrity of the liquid guiding portion 12 outside the mounting groove 121, and reduce the weakening of the mechanical strength of the liquid guiding portion 12 by the opening, so that the liquid guiding portion 12 can provide sufficient supporting strength for the heat generating portion 11. The adjacent two rows or two columns of the liquid guide holes 1212 can be staggered, so that compared with the alignment of the adjacent two rows or two columns of the liquid guide holes 1212, the number of the holes on the same cross section of the liquid guide portion 12 is reduced, the weakening of the cross section of the liquid guide portion 12 by the holes can be reduced, and the strength of the liquid guide portion 12 is improved. The liquid guide holes 1212 may be formed by a laser drilling or etching process.
The cross-sectional shape of the fluid conduit 1212 may be circular, elliptical, or polygonal. In one embodiment, the fluid conducting holes 1212 are circular holes, and the diameter of the fluid conducting holes 1212 is 0.025mm or more and 0.30mm or less. Experiments show that if the diameter of the liquid guiding hole 1212 is smaller than 0.025mm, the diameter of the liquid guiding hole 1212 is smaller, the supply rate of the liquid guiding portion 12 is lower, and dry burning of the heat generating portion 11 may occur; if the diameter of the liquid guiding hole 1212 is larger than 0.30mm, the diameter of the liquid guiding hole 1212 is larger, the oil locking capability of the liquid guiding portion 12 is lower, and oil leakage may occur in the atomizing core 10. Alternatively, the diameter of the pilot hole 1212 is 0.025mm, 0.075mm, 0.12mm, 0.15mm, 0.20mm, 0.25mm, 0.28mm, 0.30mm, etc., without limitation. When the diameter of the liquid guiding hole 1212 is within the above range, the opening size of the liquid guiding hole 1212 is matched with the heating power of the heating portion 11, so that the liquid guiding portion 12 can meet the feeding rate requirement of the atomized substrate, and has good oil locking performance, so as to avoid leakage of the atomized substrate.
Optionally, the liquid guiding holes 1212 are elongated holes, and the width of the liquid guiding holes 1212 is 0.01mm or more and 0.05mm or less. Illustratively, the width of the pilot holes 1212 may be 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, etc., such that the pilot portion 12 may meet the feed rate requirements of the atomizing substrate as well as have good oil locking properties.
The heat-generating portion 11 may be a conductive plating layer deposited on a silicon-based substrate by PVD, or may be other arrangements, so long as the heat-generating portion 11 is capable of heating the atomized matrix when energized. In one embodiment, the heat generating portion 11 is made of conductive silicon. The heating part 11 is integrally formed by adopting a conductive silicon-based material, on one hand, a conductive coating is not required to be deposited on a silicon-based substrate, and the processing technology is simplified; on the other hand, the metal conductive electrode pattern does not need to be processed on the surface of the substrate as a heating element, so that the heating element processed on the surface of the substrate is prevented from falling off due to poor adhesion, and the reliability of the heating portion 11 is improved.
Alternatively, the conductive silicon substrate can be made of monocrystalline silicon or polycrystalline silicon doped with metal atoms. Wherein the doping metal atoms can be one or more of copper atoms, zinc atoms and manganese atoms.
In one embodiment, as shown in fig. 2 and 4, electrode contacts 1121 are provided at both ends of the atomizing face 112. The electrode contact 1121 may be electrically connected to an electrode to provide electrical energy to the atomizing core 10.
In one embodiment, electrode contact 1121 is provided with an electrode coating. The electrode coating can be made of one of gold, silver, copper or silver-palladium alloy. The electrode plating layer can reduce the contact resistance between the electrode and the heat generating portion 11. Gold, silver, copper or silver palladium alloy has good conductivity, and can reduce the risk of local high-temperature fusing at the contact part of the heating part 11 and the electrode.
The application provides an atomization assembly. Referring to fig. 5, an atomizing assembly 100 may include an oil cup 20 and an atomizing core 10 as described above. The atomizing core 10 is mounted in an oil cup 20, the oil cup 20 is used for storing an atomizing substrate, and the atomizing core 10 can heat the atomizing substrate to generate aerosol. One end of the oil cup 20 is provided with a suction nozzle 21, the suction nozzle 21 is communicated with the atomization core 10, and aerosol generated by heating the atomization core 10 can reach the suction nozzle 21. The above atomization assembly is only one embodiment of the present application, and other atomization assemblies having the atomization core 10 are also within the protection scope of the present application, and the specific structure of the atomization assembly is not described herein.
The application provides an atomization device. Referring to fig. 6, the atomizing device 500 may include the atomizing assembly 100, the control assembly 510, and the power assembly 520 as described above, wherein the control assembly 510 may control the atomizing assembly 100 to be connected to or disconnected from the power assembly 520 according to the pumping action to control the atomizing assembly 100 to heat the atomized substrate to generate aerosol or stop heating. Specifically, when the suction nozzle 21 sucks air, the control component 510 senses the negative pressure in the atomization device 500, the control component 510 controls the atomization component 100 to be communicated with the power component 520, and the atomization core 10 heats the atomized matrix to generate aerosol; when inhalation ceases, the control assembly 510 controls the atomizing assembly 100 to be disconnected from the power assembly 520 and the atomizing core 10 ceases to heat the atomizing substrate.
The atomizing core, the atomizing assembly and the atomizing device provided by the application have at least the following beneficial effects:
1. The liquid guiding surface 111 is attached to and supported on the supporting surface 1211, and the supporting surface 1211 forms surface-to-surface attachment with the liquid guiding surface 111, so that the liquid guiding portion 12 can provide good support for the heating portion 11, thereby improving the integrity of the atomizing core 10, ensuring that the atomizing core 10 is not easy to break in the assembly process, and being beneficial to mass production of the atomizing core 10.
2. The liquid guide part 12 is made of glass, so that on one hand, the glass has good mechanical strength and is not easy to break in the assembly process; on the other hand, the glass material has stable chemical property at high temperature and does not release harmful substances when heated.
3. The heating part 11 and the liquid guiding part 12 are connected by adopting a bonding or gluing process, so that the heating part 11 and the liquid guiding part 12 are connected into a whole, the liquid guiding part 12 can better support the heating part 11, the integrity of the atomizing core 10 is enhanced, and the atomizing core 10 is not easy to break in the assembly process.
4. The installation groove 121 is formed in the liquid guide part 12, the heating part 11 is embedded in the installation groove 121, the liquid guide part 12 encloses the heating part 11 in the installation groove 121 to form enclosed protection, and the risk that the heating part 11 is damaged in the assembly process is further reduced.
5. The installation groove 121 and the heating part 11 are a plurality of, and a plurality of heating parts 11 are embedded in a plurality of installation grooves 121 respectively in a one-to-one correspondence, and the plurality of heating parts 11 can be used for alternately and independently heating or combined heating, so that the use frequency or the use time of a single heating part 11 is reduced, and the service life of the atomizing core 10 can be prolonged.
6. The support surface 1211 is provided with the liquid guide holes 1212 arranged in an array, and the opening range of the liquid guide holes 1212 is limited in the setting range of the mounting groove 121, so that the integrity of the liquid guide part 12 outside the mounting groove 121 can be maintained, and the mechanical strength of the liquid guide part 12 is reduced by the opening, so that the liquid guide part 12 can provide sufficient support strength for the heating part 11.
7. The heating part 11 is made of conductive silicon base material, on one hand, a conductive coating is not required to be deposited on the silicon base substrate, and the processing technology is simplified; on the other hand, the metal conductive electrode pattern does not need to be processed on the surface of the substrate as a heating element, so that the heating element processed on the surface of the substrate is prevented from falling off due to poor adhesion, and the reliability of the heating portion 11 is improved.
The foregoing description is only a partial embodiment of the present utility model, and is not intended to limit the scope of the present utility model, and all equivalent devices or equivalent processes using the descriptions and the drawings of the present utility model or directly or indirectly applied to other related technical fields are included in the scope of the present utility model.
Claims (10)
1. An atomizing core, comprising:
The device comprises a heating part and a liquid guide part, wherein the liquid guide part is used for transmitting an atomized matrix to the heating part, the heating part is made of silicon-based materials, and the heating part is used for heating the atomized matrix to generate aerosol;
The heating part is provided with a liquid guiding surface and an atomization surface, the liquid guiding part is provided with a supporting surface corresponding to the liquid guiding surface, and the liquid guiding surface is attached to and supported on the supporting surface.
2. The atomizing core of claim 1, wherein the liquid guiding portion is provided with a mounting groove, the supporting surface is arranged on the bottom wall of the mounting groove, and the heating portion is embedded in the mounting groove.
3. The atomizing core of claim 2, wherein the support surface is provided with liquid guiding holes arranged in an array, the liquid guiding holes penetrate through the bottom wall of the mounting groove, and the liquid guiding holes are communicated with the mounting groove so as to transfer the atomized substrate to the heating part.
4. The atomizing core of claim 1, wherein the liquid guiding portion is a glass material.
5. The atomizing core of claim 1, wherein the heat generating portion is connected to the liquid guiding portion by a bonding or gluing process.
6. An atomizing core as set forth in claim 3, wherein said pilot hole is a circular hole, and the diameter of said pilot hole is 0.025mm or more and 0.30mm or less; or the liquid guide holes are strip-shaped holes, and the width of the liquid guide holes is more than or equal to 0.01mm and less than or equal to 0.05mm.
7. The atomizing core of claim 1, wherein the heating portion is made of a conductive silicon base material, the conductive silicon base material is made of monocrystalline silicon or polycrystalline silicon base material doped with metal atoms, two ends of the atomizing surface are provided with electrode contacts, and the electrode contacts are provided with electrode plating layers.
8. The atomizing core of claim 2, wherein the plurality of mounting grooves and the plurality of heat generating portions are embedded in the plurality of mounting grooves in one-to-one correspondence.
9. An atomizing assembly, comprising an atomizing core as set forth in any one of claims 1-8.
10. An atomizing device comprising the atomizing assembly of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323232618.4U CN221228739U (en) | 2023-11-28 | 2023-11-28 | Atomizing core, atomizing subassembly and atomizing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323232618.4U CN221228739U (en) | 2023-11-28 | 2023-11-28 | Atomizing core, atomizing subassembly and atomizing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221228739U true CN221228739U (en) | 2024-06-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323232618.4U Active CN221228739U (en) | 2023-11-28 | 2023-11-28 | Atomizing core, atomizing subassembly and atomizing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221228739U (en) |
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2023
- 2023-11-28 CN CN202323232618.4U patent/CN221228739U/en active Active
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