CN221227834U - PCB (printed circuit board) makeup structure - Google Patents

Abstract

The utility model provides a PCB (printed circuit board) makeup structure which comprises a plurality of formed PCB boards and connecting frames which are sequentially arranged, wherein each formed PCB board is respectively connected with the connecting frames, a weakening area is formed between the plurality of formed PCB boards and the connecting frames, and the weakening area is used for dispersing stress. The PCB imposition structure can avoid the deformation problem caused by stress concentration and improve the connection stability and reliability of the formed PCB.

Description

PCB (printed circuit board) makeup structure

Technical Field

The utility model relates to the technical field of PCB boards, in particular to a splice structure of a PCB.

Background

With the continuous development of electronic products, more and more electronic products need to use middle-large size ultrathin PCBs (printed circuit boards), as shown in fig. 1, the existing PCB substrate 21 comprises a plurality of molded PCBs 211 and process edges 212, the process edges 212 are connected at two sides of the molded PCBs 211, the process edges 212 are in solid connection with the molded PCBs 211, no through holes are arranged, the process edges 212 at two sides are fixed in a processing jig, when the PCB substrate 21 is subjected to reflow soldering, the stress is concentrated in the middle of the molded PCBs 211 due to deformation of the PCB substrate, the stress cannot be released, and when the PCB substrate 21 returns to normal temperature, the flatness of the PCB substrate 21 cannot be recovered, so that serious deformation is caused.

Disclosure of utility model

Accordingly, the present utility model is directed to a structure for assembling a PCB, which can avoid the problem of deformation caused by stress concentration and improve the connection stability and reliability of the molded PCB.

The utility model provides a PCB imposition structure which comprises a plurality of formed PCB boards and connecting frames which are sequentially arranged, wherein each formed PCB board is respectively connected with the connecting frames, a weakening area is formed between the plurality of formed PCB boards and the connecting frames, and the weakening area is used for dispersing stress.

In an optional mode, the weakening area is provided with a plurality of strip-shaped holes, and a connecting part is arranged between two adjacent strip-shaped holes and is connected with the connecting frame and the formed PCB.

In an alternative mode, each of the molded PCB boards includes a first side and a second side, the first side and the second side are disposed opposite to each other, at least two of the first sides are connected to the connecting frame, and at least two of the second sides are connected to the connecting frame.

In an alternative way, the distance between two adjacent strip-shaped holes is 7 mm-10 mm.

In an alternative manner, the weakened area is provided with a plurality of round holes, and each round hole is arranged along the length direction of the connecting frame.

In an optional manner, the connecting frame comprises a first bracket and a second bracket, the first bracket and the second bracket are arranged at intervals, the formed PCB is connected between the first bracket and the second bracket, and the weakened areas are respectively formed between the first bracket and the formed PCB, and between the second bracket and the formed PCB.

In an optional manner, each of the molded PCB boards is disposed at intervals along the length direction of the first bracket or the length direction of the second bracket, and a milling groove is disposed between every two adjacent molded PCB boards.

In an alternative mode, the first bracket and the second bracket are respectively provided with a positioning hole, and the positioning holes are used for fixing the makeup structure of the PCB.

In an alternative manner, the weakened zone further includes a plurality of vias, each of which communicates with the milling groove, respectively.

In an alternative mode, the via hole comprises a first hole section and a second hole section which are communicated with each other, the first hole section is communicated with the milling groove and the second hole section, the width of the milling groove is smaller than that of the first hole section, and the width of the first hole section is larger than that of the second hole section.

According to the PCB layout structure, the weakening area is arranged between the formed PCB and the connecting frame, when the PCB is subjected to reflow soldering and is deformed at high temperature, the stress concentration phenomenon of the central area of the formed PCB can be reduced, the tensile force is reduced, the deformation of the formed PCB can be recovered when the formed PCB returns to normal temperature, and the stability and the reliability of the formed PCB are improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a conventional PCB substrate.

Fig. 2 is a schematic structural view of an imposition structure of a PCB of the present utility model.

Fig. 3 is a schematic partial structure of a imposition structure of a PCB according to another embodiment of the present utility model.

Detailed Description

Specific embodiments of the present utility model will be described in detail below with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art without making any inventive effort, are intended to be within the scope of the present utility model.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "disposed," "mounted," "connected," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms described above will be understood to those of ordinary skill in the art in a specific context.

The terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," and the like are used as references to orientations or positional relationships based on the orientation or positional relationships shown in the drawings, or the orientation or positional relationships in which the inventive product is conventionally disposed in use, merely for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore are not to be construed as limiting the utility model.

The terms "first," "second," "third," and the like, are merely used for distinguishing between similar elements and not necessarily for indicating or implying a relative importance or order.

The terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a list of elements does not include only those elements but may include other elements not expressly listed.

The makeup structure of the PCB is used for large-size PCB makeup, as shown in FIG. 2, the makeup structure of the PCB comprises a plurality of formed PCB boards 11 and connecting frames which are sequentially arranged, each formed PCB board 11 is respectively connected with the connecting frame, a weakening area 101 is formed between the plurality of formed PCB boards 11 and the connecting frames, and when the PCB is subjected to reflow soldering, the weakening area 101 is used for dispersing stress so as to avoid deformation of the formed PCB boards 11; reflow soldering refers to a soldering technique for connecting an electronic component and a circuit board, and melts solder paste by a heat source and solder a connection portion between the electronic component and the circuit board. In this embodiment, the connecting frame includes a first bracket 121 and a second bracket 122, the first bracket 121 and the second bracket 122 are respectively in a strip shape, the first bracket 121 and the second bracket 122 are arranged at intervals, the molded PCB 11 is connected between the first bracket 121 and the second bracket 122, and the weakened areas 101 are respectively formed between the first bracket 121 and the molded PCB 11, and between the second bracket 122 and the molded PCB 11.

The PCB splice structure of the utility model sets the weakening zone 101 between the formed PCB 11 and the connecting frame, when the PCB is subjected to reflow soldering and deformation at high temperature, the stress concentration phenomenon in the central area of the formed PCB 11 can be reduced, the tensile force is reduced, the deformation of the formed PCB 11 can be recovered when the formed PCB 11 returns to normal temperature, and the stability and the reliability of the formed PCB 11 are improved.

Preferably, the weakened area 101 is provided with a plurality of strip-shaped holes 102, a connecting portion 123 is disposed between two adjacent strip-shaped holes 102, the connecting portion 123 is connected between the connecting frame and the molded PCB 11, the distance between two adjacent strip-shaped holes 102 is 7 mm-10 mm, that is, the width of the connecting portion 123 is 7 mm-10 mm, for example, but not limited to, 7mm, 8mm, 9mm or 10 mm.

Preferably, each of the molded PCB boards 11 includes a first side and a second side, the first side and the second side are disposed opposite to each other, at least two connecting portions 123 of the first side are connected to the connecting frame, and at least two connecting portions 123 of the second side are connected to the connecting frame.

In another preferred embodiment, as shown in fig. 3, the weakened section 101 is provided with a plurality of circular holes 106, each circular hole 106 being located along the length of the connector.

With continued reference to fig. 2, each of the molded PCBs 11 is disposed along the length direction of the first bracket 121, that is, each of the molded PCBs 11 is disposed along the length direction of the second bracket 122, and a milling groove 105 is disposed between every two adjacent molded PCBs 11, wherein the milling groove 105 is used for penetrating a milling cutter to separate the two adjacent molded PCBs 11.

Preferably, the first bracket 121 and the second bracket 122 are respectively provided with a positioning hole 103, and the positioning holes 103 are used for fixing the makeup structure of the PCB; the base plate made of bakelite plates is arranged on the station of the processing jig, and the locating columns corresponding to the locating holes 103 are also arranged on the base plate, so that when the PCB is required to be fixed on the station of the processing jig, the locating holes 103 of the first bracket 121 and the second bracket 122 are aligned with the locating columns of the base plate.

With continued reference to fig. 2, the weakened zone 101 further includes a plurality of vias 104, each via 104 is respectively connected to the milling groove 105, wherein the via 104 includes a first hole section and a second hole section that are mutually connected, the first hole section is connected to the milling groove 105 and the second hole section, the width of the milling groove 105 is smaller than that of the first hole section, and the width of the first hole section is larger than that of the second hole section, so that two adjacent molded PCB boards 11 can be separated conveniently, and the direction of the width of the location is the same as that of the connecting portion 123.

The present utility model is not limited to the above embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present utility model are intended to be included in the scope of the present utility model. Accordingly, the scope of the utility model should be assessed as that of the appended claims.

Claims (8)

1. The utility model provides a PCB's makeup structure, its characterized in that includes shaping PCB board (11) and link that a plurality of arrange in proper order, each shaping PCB board (11) connect respectively in the link, a plurality of shaping PCB board (11) with be formed with between the link and weaken district (101), weaken district (101) are used for dispersing stress, weaken district (101) are equipped with a plurality of bar hole (102), adjacent two be equipped with connecting portion (123) between bar hole (102), connecting portion (123) connect link with shaping PCB board (11), each shaping PCB board (11) include first side and second side respectively, first side with the second side sets up relatively, first side has at least two connecting portion (123) with the link is connected, second side has at least two connecting portion (123) with the link is connected.

2. The imposition structure of the PCB according to claim 1, characterized in that the distance between two adjacent strip-shaped holes (102) is 7-10 mm.

3. The imposition structure of the PCB according to claim 1, characterized in that the weakened zone (101) is provided with a plurality of circular holes (106), each circular hole (106) being arranged along the length direction of the connection frame.

4. A imposition structure of a PCB according to claim 2 or 3, characterized in that the connection frame comprises a first support (121) and a second support (122), the first support (121) and the second support (122) are arranged at intervals, the molded PCB board (11) is connected between the first support (121) and the second support (122), and the weakened areas (101) are formed between the first support (121) and the molded PCB board (11) and between the second support (122) and the molded PCB board (11), respectively.

5. The imposition structure of claim 4, wherein each of said molded PCB boards (11) is disposed at intervals along a length direction of said first bracket (121) or a length direction of said second bracket (122), and a milling groove (105) is provided between each adjacent two of said molded PCB boards (11).

6. The imposition structure of claim 5 wherein said first bracket (121) and said second bracket (122) are provided with positioning holes (103) respectively, said positioning holes (103) being used for fixing said imposition structure of said PCB.

7. The imposition structure of the PCB of claim 5 wherein said weakened zone (101) further comprises a plurality of vias (104), each of said vias (104) being in communication with said milling groove (105).

8. The imposition structure of claim 7 wherein said via (104) includes a first hole section and a second hole section in communication with each other, said first hole section communicating said milling groove (105) with said second hole section, a width of said milling groove (105) being smaller than a width of said first hole section, a width of said first hole section being greater than a width of said second hole section.