CN221176198U

CN221176198U - Semiconductor chip supporting device

Info

Publication number: CN221176198U
Application number: CN202322719402.4U
Authority: CN
Inventors: 陈全磊; 姜明
Original assignee: Xi'an Hangzhi Electronic Technology Co ltd
Current assignee: Xi'an Hangzhi Electronic Technology Co ltd
Priority date: 2023-10-11
Filing date: 2023-10-11
Publication date: 2024-06-18
Anticipated expiration: 2033-10-11

Abstract

The utility model relates to the technical field of semiconductor chip processing and discloses a semiconductor chip supporting device which comprises a bracket, wherein a fixing frame is fixed on the bracket, two pressing plates are arranged on the fixing frame, clamping grooves are formed in opposite side surfaces of the two pressing plates, a driving assembly is arranged on the fixing frame, and a plurality of elastic connecting pieces are arranged on the two pressing plates. When the supporting device is used, when the sliding block extends out of the opening, a worker stops rotating the screw rod, the position of the sliding block plays a role in warning the worker, the excessive clamping force applied to the chip by the compression block can be avoided, the phenomenon that the chip is deformed due to excessive stress is avoided, and the chip is protected.

Description

Semiconductor chip supporting device

Technical Field

The utility model relates to the technical field of semiconductor chip processing, in particular to a semiconductor chip supporting device.

Background

Semiconductor chip processing is a process that involves the fabrication of semiconductor chips that are widely used in computer, communication devices, electronics, and various other technical applications.

When processing the semiconductor chip, need use strutting arrangement to fix the chip to carry out processing to the chip, strutting arrangement among the prior art is through two splint centre gripping to the chip both sides, and this kind of fixed mode has certain limitation, when the clamping dynamics of both sides splint is too big, causes the chip both sides to receive the damage easily, and when having the stitch around the chip, then the fixed mode of centre gripping of both sides causes the condition that the stitch was buckled easily, makes the semiconductor chip receive the damage, is unfavorable for strutting arrangement's in-service use.

Therefore, there is a need to design a semiconductor chip supporting device to solve the above-mentioned problems.

Disclosure of utility model

The utility model aims to solve the defects in the prior art and provides a semiconductor chip supporting device.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

The utility model provides a semiconductor chip strutting arrangement, includes the support, be fixed with the mount on the support, be provided with two pressure strips on the mount, two the draw-in groove has all been seted up on the side that the pressure strip is relative, be provided with drive assembly on the mount, two all be provided with a plurality of elastic connection spare on the pressure strip.

As a preferable technical scheme of the utility model, the driving assembly comprises a screw, a guide rod, two driving plates and two connecting plates, wherein the screw is rotationally assembled on the fixing frame, the guide rod is fixed on the fixing frame, the two driving plates are sleeved on the screw in a threaded manner, the two driving plates are sleeved on the guide rod in a sliding manner, and the two connecting plates are respectively fixed on the two driving plates.

As a preferable technical scheme of the utility model, the elastic connecting piece comprises an outer cylinder, an inner rod, a first spring, an opening, a sliding block, a side plate and a second spring, wherein the outer cylinder is fixed on the connecting plate, the inner rod is movably inserted into the outer cylinder, one end of the inner rod extends to the outside of the outer cylinder and is fixedly connected with the pressing plate, the first spring is assembled between the outer cylinder and the inner rod, the opening is formed in the outer cylinder, the sliding block is connected in the opening in a sliding mode, the side plate is fixed on the sliding block, and the second spring is assembled between the side plate and the inner face of the outer cylinder.

As a preferable technical scheme of the utility model, two sections of threads with the same length and opposite directions are arranged on the screw rod.

As a preferable technical scheme of the utility model, one end of the screw is provided with a knob.

In a preferred embodiment of the present utility model, the inner surface of the outer tube and the outer surface of the inner rod are bonded to each other.

The utility model has the following beneficial effects:

Through the motion of interior pole and the position change of slider, can realize exerting suitable clamping force to the chip, avoid the chip to receive too big pressure and deformation, this helps protecting the structural integrity and the performance stability of chip, because the device can provide appropriate compaction dynamics and protect the chip, the chip of processing out is more likely to have higher quality standard, reduces the production of bad product.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor chip supporting device according to the present utility model;

FIG. 2 is an enlarged view of the structure at A of FIG. 1;

FIG. 3 is an enlarged view of the structure at B of FIG. 1;

FIG. 4 is a schematic view of the structure of the elastic connector;

Fig. 5 is an enlarged view of the structure at C of fig. 4.

In the figure: 1a bracket, 2a fixing frame, 3 a pressing plate, 4 a clamping groove, 5 a driving component, 51 a screw rod, 52 a guide rod, 53 a driving plate, 54 a connecting plate, 6 an elastic connecting piece, 61 an outer cylinder, 62 an inner rod, 63 a first spring, 64 an opening, 65 a sliding block, 66 a side plate and 67 a second spring.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-5, a semiconductor chip supporting device, including support 1, support 1 has regulatory function, the angle of chip is adjusted to the staff of being convenient for, the concrete structure and the theory of operation of support 1 do not regard as the innovation part of this technical scheme, not show in the figure, do not too much in this and do not give more attention to, be fixed with mount 2 on the support 1, be provided with two pressure strip 3 on the mount 2, pressure strip 3 adopts rubber materials to make, avoid pressure strip 3 to cause the damage to the chip, draw-in groove 4 has all been seted up on the side that two pressure strip 3 are relative, be provided with drive assembly 5 on the mount 2, all be provided with a plurality of elastic connection spare 6 on two pressure strip 3.

Referring to fig. 1 to 5, the driving assembly 5 includes a screw rod 51, a guide rod 52, two driving plates 53 and two connecting plates 54, the screw rod 51 is rotatably assembled on the fixing frame 2, the guide rod 52 is fixed on the fixing frame 2, the two driving plates 53 are all in threaded connection with the screw rod 51, the two driving plates 53 are all in sliding connection with the guide rod 52, the two connecting plates 54 are respectively fixed on the two driving plates 53, and the two pressing plates 3 are convenient to approach each other by arranging the driving assembly 5.

Referring to fig. 1 to 5, the elastic connecting member 6 includes an outer cylinder 61, an inner rod 62, a first spring 63, an opening 64, a slider 65, a side plate 66 and a second spring 67, the outer cylinder 61 is fixed on the connecting plate 54, the inner rod 62 is movably inserted into the outer cylinder 61, one end of the inner rod 62 extends to the outside of the outer cylinder 61 and is fixedly connected with the pressing plate 3, the first spring 63 is assembled between the outer cylinder 61 and the inner rod 62, the opening 64 is opened on the outer cylinder 61, the slider 65 is slidably connected in the opening 64, the side plate 66 is fixed on the slider 65, the second spring 67 is assembled between the side plate 66 and the inner face of the outer cylinder 61, and when the two pressing plates 3 are mutually close, the two pressing plates 3 cannot move continuously when pressing the chip together, and at this time, the corresponding inner rod 62 is driven to move by the pressing plates 3, so that the inner rod 62 is retracted into the outer cylinder 61, the pressing plates 3 are prevented from directly applying pressure to the chip to protect the chip.

Referring to fig. 1-5, screw 51 is provided with two threads of equal length and opposite direction, so that screw 51 can drive two compacting plates 3 to approach each other when rotating.

Referring to fig. 1-5, a knob is mounted at one end of the screw 51 to facilitate the rotation of the screw 51 by a worker.

Referring to fig. 1 to 5, the inner surface of the outer cylinder 61 and the outer surface of the inner rod 62 are bonded to each other, and the connection stability between the outer cylinder 61 and the inner rod 62 is ensured.

The specific working principle of the utility model is as follows:

When the semiconductor chip supporting device provided by the utility model is used, a worker firstly places a chip between two compression plates 3, then rotates the screw rod 51, and as the screw rod 51 is provided with two sections of threads with the same length and opposite directions, under the limit action of the guide rod 52, the screw rod 51 can drive the two driving plates 53 to approach each other when rotating, so that the two connecting plates 54 drive the two compression plates 3 to approach each other through the plurality of elastic connecting pieces 6 until two sides of the chip are respectively clamped into the two clamping grooves 4;

In the process that two pressure plates 3 are approaching to each other, when two pressure plates 3 push down the chip jointly, two pressure plates 3 can't continue to remove, at this moment pressure plate 3 can drive corresponding interior pole 62 and take place to remove, make interior pole 62 retract in urceolus 61, avoid pressure plate 3 directly to exert the pressure on the chip, play the guard action to the chip, in addition, the in-process that interior pole 62 retracted in urceolus 61, the cambered surface position of slider 65 can be extruded to one end of interior pole 62, make slider 65 take place to remove, slider 65 can stretch out from opening 64 when removing, based on above-mentioned process, the staff can observe the position of slider 65 at the in-process of rotating screw rod 51, when slider 65 stretches out from opening 64, the staff stops rotating screw rod 51, the position of slider 65 plays the warning effect to the staff, can avoid the clamp block 3 to exert too big clamping force to the chip, and then avoid the chip atress too big phenomenon that appears to warp, play the guard action to the chip.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a semiconductor chip strutting arrangement, includes support (1), its characterized in that, be fixed with mount (2) on support (1), be provided with two clamp plates (3) on mount (2), two draw-in groove (4) have all been seted up on the side that clamp plate (3) are relative, be provided with drive assembly (5) on mount (2), two all be provided with a plurality of elastic connection spare (6) on clamp plate (3).

2. A semiconductor chip supporting device according to claim 1, wherein the driving assembly (5) comprises a screw (51), a guide rod (52), two driving plates (53) and two connecting plates (54), the screw (51) is rotatably assembled on the fixing frame (2), the guide rod (52) is fixed on the fixing frame (2), the two driving plates (53) are both in threaded connection with the screw (51), the two driving plates (53) are both in sliding connection with the guide rod (52), and the two connecting plates (54) are respectively fixed on the two driving plates (53).

3. The semiconductor chip supporting device according to claim 2, wherein the elastic connecting member (6) comprises an outer cylinder (61), an inner rod (62), a first spring (63), an opening (64), a sliding block (65), a side plate (66) and a second spring (67), the outer cylinder (61) is fixed on the connecting plate (54), the inner rod (62) is movably inserted into the outer cylinder (61), one end of the inner rod (62) extends to the outside of the outer cylinder (61) and is fixedly connected with the pressing plate (3), the first spring (63) is assembled between the outer cylinder (61) and the inner rod (62), the opening (64) is formed in the outer cylinder (61), the sliding block (65) is slidably connected in the opening (64), the side plate (66) is fixed on the sliding block (65), and the second spring (67) is assembled between the side plate (66) and the inner face of the outer cylinder (61).

4. A semiconductor chip supporting apparatus according to claim 2, wherein the screw (51) is provided with two threads of the same length and of opposite directions.

5. A semiconductor chip supporting apparatus according to claim 4, wherein one end of the screw (51) is mounted with a knob.

6. A semiconductor chip supporting apparatus according to claim 3, wherein the inner surface of said outer cylinder (61) and the outer surface of said inner rod (62) are bonded to each other.