CN221149825U - Capacitor packaging heat dissipation structure - Google Patents
Capacitor packaging heat dissipation structure Download PDFInfo
- Publication number
- CN221149825U CN221149825U CN202322608197.4U CN202322608197U CN221149825U CN 221149825 U CN221149825 U CN 221149825U CN 202322608197 U CN202322608197 U CN 202322608197U CN 221149825 U CN221149825 U CN 221149825U
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- Prior art keywords
- base
- heat dissipation
- frame
- penetrating
- capacitor
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- 239000003990 capacitor Substances 0.000 title claims abstract description 36
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 32
- 230000000149 penetrating effect Effects 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 13
- 241000883990 Flabellum Species 0.000 abstract description 9
- 239000002184 metal Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a capacitor packaging heat dissipation structure which comprises a base, wherein a support is fixedly arranged at the left part and the right part of the lower end of the base, a group of brackets are fixedly arranged at the left end and the right end of the base, mounting holes penetrating up and down are formed in the upper ends of the two groups of brackets, the two groups of brackets are distributed symmetrically left and right, and each group of brackets is two. According to the capacitor packaging heat dissipation structure, the base is arranged, so that the mounting stability of electronic elements can be enhanced; through setting up radiating component, can strengthen electronic component's radiating effect, when using, when electronic component when the heat that produces when the operation need handle, drive the spliced pole through the motor, drive the flabellum by the spliced pole again, under the rotation of flabellum, make wind-force inhale in the mount from the inlet port to under the effect of motor and flabellum, make wind-force carry to electronic component, under the effect of wind-force, make the heat that electronic component produced be convenient for follow the heat dissipation groove discharge simultaneously.
Description
Technical Field
The utility model relates to the technical field of capacitor packaging heat dissipation, in particular to a capacitor packaging heat dissipation structure.
Background
The traditional capacitor adopts winding type to wind the positive electrode, the negative electrode and the electrolytic paper together to form a cylinder, and then electrolyte is added to form the winding type capacitor. This approach results in a large limitation in the size of the capacitive element formed, and in industrial production, existing production processes and approaching limits. Therefore, solid laminated polymer capacitors have been developed.
The prior art (patent number: CN 216648080U) discloses a capacitor packaging structure, which comprises a capacitor unit, a metal upper cover, a metal base fixedly connected with the metal upper cover, and an insulating piece for isolating the capacitor unit from the metal base; the metal base and the metal upper cover form a cavity for accommodating the capacitor unit; the capacitor unit comprises a capacitor body and a pin electrically connected with the capacitor body, wherein the pin penetrates through the metal base and is connected with a preset electronic element; the insulating piece is arranged between the metal base and the pin. The utility model has the beneficial effects that: the capacitor packaging structure adopts a metal material as a packaging shell, and the existing technology for the metal material can make the metal very light and thin, so that even if the size of a capacitor plate is large, the whole capacitor packaging structure can keep very small volume. The important defect of the metal material is that the metal material has conductivity, so that an insulating part is arranged between the capacitor unit and the packaging shell to realize the insulation between the capacitor unit and the packaging shell.
The existing capacitor packaging heat dissipation structure has the following defects that the electronic element inside the existing capacitor packaging structure can generate heat when in use, and the electronic element is easy to damage due to high temperature due to the general heat dissipation effect of the packaging structure, so that a novel capacitor packaging heat dissipation structure is provided.
Disclosure of utility model
The utility model mainly aims to provide a capacitor packaging heat dissipation structure which can effectively strengthen the heat dissipation effect of electronic elements.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
The utility model provides a electric capacity encapsulation heat radiation structure, includes the base, the equal fixed mounting in base lower extreme left part and lower extreme right part has the support, the equal fixed mounting in base left end and right-hand member has a set of support, two sets of the mounting hole of upper and lower break-through has all been seted up to the support upper end, two sets of the support is bilateral symmetry distribution and every group sets up to two, the base upper end is provided with the encapsulation frame, encapsulation frame upper end middle part fixed mounting has cooling module.
Preferably, the connecting groove is formed in the upper end of the base, and the plurality of heat dissipation grooves penetrating up and down are formed in the middle of the upper end of the base.
Preferably, the bracket is provided with a Z-shaped structure, and a plurality of radiating grooves are distributed equidistantly.
Preferably, the mounting groove of upper and lower break-through has been seted up at packaging frame upper end middle part, a set of perforation of break-through around packaging frame front end lower part and rear end lower part all have been seted up, base upper end middle part fixedly connected with installing frame, the standing groove has been seted up to the installing frame upper end, the equal fixedly connected with cushion of inside front side and inside rear side of standing groove, installing frame front end and rear end equal screw thread alternate to be connected with a set of gim peg.
Preferably, the heat dissipation assembly comprises a fixing frame, a plurality of air inlets penetrating up and down are formed in the upper end of the fixing frame, a motor is fixedly connected inside the fixing frame, a rotating column is fixedly connected to the output end of the motor, a plurality of fan blades are fixedly connected to the lower portion of the outer surface of the rotating column, and the fixing frame is clamped in the mounting groove.
Preferably, two groups of the through holes are distributed in a front-back symmetrical mode, each group of the through holes is two, two groups of the fixing bolts are distributed in a front-back symmetrical mode, each group of the fixing bolts are two, the fixing bolts penetrate through the through holes and are connected to the mounting frame in a threaded penetrating mode, a plurality of the air inlet holes are distributed in an annular array mode, and a plurality of the fan blades are distributed in an annular array mode.
Compared with the prior art, the utility model has the following beneficial effects:
1. In the utility model, the stability of the installation of the electronic element can be enhanced by arranging the base, when the electronic element is used, the electronic element is firstly placed in the installation frame and is reinforced by the packaging frame and the fixing bolt, and then the base is reinforced by the bracket, so that the overall stability is enhanced;
2. According to the utility model, the heat dissipation effect of the electronic element can be enhanced by arranging the heat dissipation component, when the electronic element is in use, when heat generated during operation needs to be processed, the motor drives the rotating column, the rotating column drives the fan blades, wind power is sucked into the fixing frame from the air inlet under the rotation of the fan blades, the wind power is conveyed to the electronic element under the action of the motor and the fan blades, and meanwhile, the heat generated by the electronic element is conveniently discharged from the heat dissipation groove under the action of the wind power.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a capacitor package heat dissipation structure according to the present utility model;
FIG. 2 is a schematic diagram of the whole structure of a base of a heat dissipation structure of a capacitor package according to the present utility model;
FIG. 3 is a schematic diagram of the whole structure of a package frame of a capacitor package heat dissipation structure according to the present utility model;
fig. 4 is a schematic diagram of the overall structure of a heat dissipating component of a capacitor package heat dissipating structure according to the present utility model.
In the figure: 1. a base; 2. a support; 3. a bracket; 4. a mounting hole; 5. a packaging frame; 6. a heat dissipation assembly; 7. a connection groove; 8. a heat sink; 51. a mounting groove; 52. perforating; 53. a mounting frame; 54. a placement groove; 55. a cushion block; 56. a fixing bolt; 61. a fixing frame; 62. an air inlet hole; 63. a motor; 64. rotating the column; 65. and (3) a fan blade.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-4, a capacitor packaging heat dissipation structure comprises a base 1, wherein a support 2 is fixedly installed at the left part and the right part of the lower end of the base 1, a group of brackets 3 are fixedly installed at the left end and the right end of the base 1, mounting holes 4 penetrating up and down are formed in the upper ends of the two groups of brackets 3, the two groups of brackets 3 are symmetrically distributed left and right and are arranged in two groups, a packaging frame 5 is arranged at the upper end of the base 1, and a heat dissipation assembly 6 is fixedly installed in the middle of the upper end of the packaging frame 5.
The upper end of the base 1 is provided with a connecting groove 7, and the middle part of the upper end of the base 1 is provided with a plurality of heat dissipation grooves 8 which are penetrated up and down; the bracket 3 is provided with a Z-shaped structure, and a plurality of radiating grooves 8 are distributed equidistantly; the middle part of the upper end of the packaging frame 5 is provided with a mounting groove 51 which is vertically penetrated, the lower part of the front end and the lower part of the rear end of the packaging frame 5 are provided with a group of penetrating holes 52 which are longitudinally penetrated, the middle part of the upper end of the base 1 is fixedly connected with a mounting frame 53, the upper end of the mounting frame 53 is provided with a placing groove 54, the front side and the rear side of the inside of the placing groove 54 are fixedly connected with a cushion block 55, and the front end and the rear end of the mounting frame 53 are respectively in threaded penetrating connection with a group of fixing bolts 56; by providing the base 1, the stability of the mounting of the electronic component can be enhanced, and when in use, the electronic component is firstly placed in the mounting frame 53, reinforced by the package frame 5 and the fixing bolt 56, and then reinforced by the support 3 to the base 1, thereby enhancing the overall stability.
The heat dissipation assembly 6 comprises a fixing frame 61, a plurality of air inlets 62 penetrating through the fixing frame 61 from top to bottom are formed in the upper end of the fixing frame 61, a motor 63 is fixedly connected inside the fixing frame 61, a rotating column 64 is fixedly connected to the output end of the motor 63, a plurality of fan blades 65 are fixedly connected to the lower portion of the outer surface of the rotating column 64, and the fixing frame 61 is clamped in the mounting groove 51; two groups of perforations 52 are symmetrically distributed front and back, two groups of fixing bolts 56 penetrate through the perforations 52 and are connected to the mounting frame 53 in a threaded penetrating manner, a plurality of air inlets 62 are distributed in an annular array, and a plurality of fan blades 65 are distributed in an annular array; through setting up the radiating component 6, can strengthen the radiating effect of electronic component, when using, when the heat that electronic component produced when the operation need handle, drive through motor 63 and rotate post 64, drive the flabellum 65 by rotating post 64 again, in the rotation of flabellum 65, make wind-force inhale mount 61 from inlet port 62, and under the effect of motor 63 and flabellum 65, make wind-force carry to electronic component, simultaneously under the effect of wind-force, make the heat that electronic component produced be convenient for follow radiating groove 8 discharge.
It should be noted that, the present utility model is a capacitor packaging heat dissipation structure, by setting the base 1, the stability of the installation of the electronic component can be enhanced, when in use, the electronic component is firstly placed in the installation frame 53, and is reinforced by the packaging frame 5 and the fixing bolt 56, and then the base 1 is reinforced by the bracket 3, so as to enhance the overall stability; through setting up the radiating component 6, can strengthen the radiating effect of electronic component, when using, when the heat that electronic component produced when the operation need handle, drive through motor 63 and rotate post 64, drive the flabellum 65 by rotating post 64 again, in the rotation of flabellum 65, make wind-force inhale mount 61 from inlet port 62, and under the effect of motor 63 and flabellum 65, make wind-force carry to electronic component, simultaneously under the effect of wind-force, make the heat that electronic component produced be convenient for follow radiating groove 8 discharge.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a electric capacity encapsulation heat radiation structure, includes base (1), its characterized in that: the novel heat dissipation device is characterized in that a support (2) is fixedly installed at the left part of the lower end of the base (1) and the right part of the lower end of the base, a group of supports (3) are fixedly installed at the left end and the right end of the base (1), mounting holes (4) penetrating up and down are formed in the upper ends of the supports (3), the supports (3) are distributed symmetrically left and right, the supports are arranged in two groups, a packaging frame (5) is arranged at the upper end of the base (1), and a heat dissipation assembly (6) is fixedly installed at the middle part of the upper end of the packaging frame (5).
2. The capacitor package heat dissipation structure of claim 1, wherein: the upper end of the base (1) is provided with a connecting groove (7), and the middle part of the upper end of the base (1) is provided with a plurality of heat dissipation grooves (8) which are vertically penetrated.
3. The capacitor package heat dissipation structure of claim 2, wherein: the bracket (3) is provided with a Z-shaped structure, and a plurality of radiating grooves (8) are distributed equidistantly.
4. A capacitor pack heat sink structure as claimed in claim 3, wherein: the packaging frame is characterized in that an installation groove (51) penetrating up and down is formed in the middle of the upper end of the packaging frame (5), a group of penetrating holes (52) penetrating up and down are formed in the lower portion of the front end and the lower portion of the rear end of the packaging frame (5), an installation frame (53) is fixedly connected to the middle of the upper end of the base (1), a placing groove (54) is formed in the upper end of the installation frame (53), cushion blocks (55) are fixedly connected to the front side and the rear side of the inside of the placing groove (54), and a group of fixing bolts (56) are connected to the front end and the rear end of the installation frame (53) in a threaded penetrating mode.
5. The capacitor pack heat sink structure of claim 4, wherein: the heat dissipation assembly (6) comprises a fixing frame (61), a plurality of air inlets (62) penetrating up and down are formed in the upper end of the fixing frame (61), a motor (63) is fixedly connected inside the fixing frame (61), a rotating column (64) is fixedly connected to the output end of the motor (63), a plurality of fan blades (65) are fixedly connected to the lower portion of the outer surface of the rotating column (64), and the fixing frame (61) is clamped in the mounting groove (51).
6. The capacitor pack heat sink structure of claim 5, wherein: two groups of through holes (52) are symmetrically distributed front and back, each group is two, two groups of fixing bolts (56) are symmetrically distributed front and back, each group of fixing bolts (56) penetrate through the through holes (52) and are connected to the mounting frame (53) in a threaded penetrating mode, a plurality of air inlet holes (62) are distributed in an annular array mode, and a plurality of fan blades (65) are distributed in an annular array mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322608197.4U CN221149825U (en) | 2023-09-26 | 2023-09-26 | Capacitor packaging heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322608197.4U CN221149825U (en) | 2023-09-26 | 2023-09-26 | Capacitor packaging heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221149825U true CN221149825U (en) | 2024-06-14 |
Family
ID=91384549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322608197.4U Active CN221149825U (en) | 2023-09-26 | 2023-09-26 | Capacitor packaging heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221149825U (en) |
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2023
- 2023-09-26 CN CN202322608197.4U patent/CN221149825U/en active Active
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