CN221134543U - Protection mechanism of wafer laser cutting machine - Google Patents

Protection mechanism of wafer laser cutting machine Download PDF

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Publication number
CN221134543U
CN221134543U CN202322883004.6U CN202322883004U CN221134543U CN 221134543 U CN221134543 U CN 221134543U CN 202322883004 U CN202322883004 U CN 202322883004U CN 221134543 U CN221134543 U CN 221134543U
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CN
China
Prior art keywords
box
dust collection
cutting machine
laser cutting
groups
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Active
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CN202322883004.6U
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Chinese (zh)
Inventor
汪训荣
明涛涛
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Wuhan Yuchang Laser Technology Co ltd
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Wuhan Yuchang Laser Technology Co ltd
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Abstract

The utility model discloses a protection mechanism of a wafer laser cutting machine, which comprises a protection box, wherein two groups of box doors are slidably arranged on one side of the protection box, one side of each box door is fixedly connected with an inserting block, one side of the other group of box doors is provided with a slot, the inserting blocks are inserted into the slots, the tops of the inserting blocks are also provided with clamping grooves, clamping blocks are clamped in the clamping grooves, an air cylinder is fixedly arranged at the tops of the protection box, the bottom ends of piston rods of the air cylinders penetrate through the protection box and are fixedly connected with a laser cutting machine main body, the two groups of box doors are attached by pulling two groups of handles, at the moment, the inserting blocks are positioned in the slots, and then the clamping blocks are driven by pushing rods to move, so that the clamping blocks are clamped in the clamping grooves to fix the inserting blocks, the two groups of box doors are further fixed, workers are protected.

Description

Protection mechanism of wafer laser cutting machine
Technical Field
The utility model relates to the technical field of laser cutting machines, in particular to a protection mechanism of a wafer laser cutting machine.
Background
The laser cutting machine focuses the laser emitted from the laser into high power density laser beam via the light path system, and the laser beam irradiates the surface of the workpiece to reach the melting point or boiling point, and the high pressure gas coaxial with the laser beam blows away molten or gasified metal to cut.
For example, a laser cutting machine (bulletin number: CN 219484593U) with a protection structure comprises a cutting machine, when a workpiece on a positioning plate needs to be fixed by being provided with a control component, an output shaft of the motor drives a gear to rotate by starting the motor, when the gear rotates, a rack drives a vertical rod to move under the action of a first spring, a clamping plate fixed on the surface of the vertical rod synchronously moves when the vertical rod moves, the workpiece abuts against a pressing rod in a fixed column when the clamping plate fixes the workpiece on the positioning plate, the pressing rod moves into the fixed column under the action of a second spring, the pressing rod abuts against one end of a balance rod, and because the balance rod is hinged with a supporting block, the other end of the balance rod lifts to push a cross rod to move in the fixed rod under the action of the third spring, and the clamping rod is clamped into the gear to be fixed by a clamping block, so that the workpiece can be fixed and meanwhile damage to the workpiece is avoided.
The structure of the device is comparatively complicated, manufacturing cost is great, and utilizes the motor to drive spare part operation and fix the guard gate, and the motor can take place the unable condition of opening of guard gate when breaking down, increases cost of maintenance, consequently we need to propose a wafer laser cutting machine protection machanism.
Disclosure of utility model
The utility model aims to provide a protection mechanism of a wafer laser cutting machine, which has the advantages of simple structure, low production cost, low failure rate of a mechanical structure, difficult damage and low maintenance cost, so as to solve the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a wafer laser cutting machine protection machanism, includes the protective housing, one side slidable mounting of protective housing has two sets of chamber doors, a set of wherein one side fixedly connected with inserted block of chamber door, another set of slot has been seted up to one side of chamber door, the inside at the slot is pegged graft to the inserted block, the draw-in groove has still been seted up at the top of inserted block, the inside joint of draw-in groove has the fixture block, the top fixed mounting of protective housing has the cylinder, the bottom of cylinder piston rod runs through protective housing and fixedly connected with laser cutting machine body, the inside fixed mounting of protective housing has the sucking disc, the bottom intercommunication of sucking disc has miniature suction pump, one side of protective housing is provided with the dust absorption subassembly that is used for absorbing dust and piece.
The dust collection assembly comprises a dust collection fan, the dust collection fan is arranged on one side of the protective box, a dust collection box is fixedly communicated with a dust collection end of the dust collection fan through a pipeline, a dust collection pipe is fixedly communicated with one side of the dust collection box, one end of the dust collection pipe penetrates through the protective box and is fixedly communicated with a dust collection cover, and the dust collection cover is located above the sucker.
One side of the protective box is fixedly provided with a supporting plate, and the dust suction fan and the dust collection box are fixedly arranged at the top of the supporting plate.
The protective box is located the upper and lower both ends of two sets of chamber doors and has all seted up the spout, two sets of the inside of spout is equal slidable mounting has two sets of sliders, four sets of the slider respectively with the upper and lower both ends fixed connection of two sets of chamber doors.
The box door is positioned at the top of the slot and is provided with a groove, the groove is communicated with the slot, and the clamping block is slidably arranged in the groove.
The utility model discloses a protective box, including the recess, the protective box is located the recess, the spacing groove has been seted up to one side of recess, the spacing groove is linked together with the recess, the inside slidable mounting in spacing groove has the push rod, the one end and the fixture block fixed connection of push rod.
The two groups of the box doors are provided with observation windows, and handles are fixedly arranged on one sides of the two groups of the box doors, which are positioned on the two groups of the observation windows.
The suction device is characterized in that a plurality of groups of suction holes are formed in the surface of the suction disc, a filter screen is fixedly arranged in each suction hole, the miniature suction pump is fixedly arranged at the inner bottom of the protective box, and the suction end of the miniature suction pump is fixedly communicated with the suction disc through a pipeline.
Compared with the prior art, the utility model has the beneficial effects that:
According to the utility model, the two groups of the handles are pulled to attach the two groups of the box doors, at the moment, the insert block is positioned in the slot, and the push rod drives the clamping block to move, so that the clamping block is clamped in the clamping slot to fix the insert block, and then the two groups of the box doors are fixed to protect workers.
Drawings
FIG. 1 is a schematic view of the front side of the present utility model;
FIG. 2 is a schematic view of the right side structure of the present utility model;
FIG. 3 is a schematic view of the structure of the door of the present utility model when the door is opened;
Fig. 4 is a schematic view of the present utility model in a cut-away configuration.
In the figure: 1. a protective box; 2. a door; 3. inserting blocks; 4. a clamping block; 5. a cylinder; 6. a laser cutter body; 7. a suction cup; 8. a micro getter pump; 9. a dust collection fan; 10. a dust collection box; 11. a dust collection pipe; 12. a dust hood; 13. a chute; 14. a slide block; 15. a push rod; 16. an observation window; 17. a handle; 18. a suction hole; 19. a filter screen; 20. and a support plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution:
The protection mechanism of the wafer laser cutting machine comprises a protection box 1, two groups of box doors 2 are slidably arranged on one side of the protection box 1, an inserting block 3 is fixedly connected to one side of one group of box doors 2, a slot is formed in one side of the other group of box doors 2, the inserting block 3 is inserted into the slot, a clamping groove is further formed in the top of the inserting block 3, a clamping block 4 is clamped in the clamping groove, an air cylinder 5 is fixedly arranged at the top of the protection box 1, the bottom end of a piston rod of the air cylinder 5 penetrates through the protection box 1 and is fixedly connected with a laser cutting machine body 6, a sucker 7 is fixedly arranged in the protection box 1, a micro suction pump 8 is communicated with the bottom of the sucker 7, air in the sucker 7 is sucked through the micro suction pump 8, negative pressure is formed in the sucker 7, a wafer on the surface of the sucker 7 is further fixed, and the position of the wafer is prevented from moving during cutting operation;
One side of the protective box 1 is provided with a dust collection assembly for absorbing dust and fragments, the dust collection assembly comprises a dust collection fan 9, the dust collection fan 9 is arranged on one side of the protective box 1, a dust collection box 10 is fixedly communicated with a dust collection end of the dust collection fan 9 through a pipeline, a dust collection pipe 11 is fixedly communicated with one side of the dust collection box 10, one end of the dust collection pipe 11 penetrates through the protective box 1 and is fixedly communicated with a dust collection cover 12, the dust collection cover 12 is positioned above the suction cup 7, air is extracted through a pipeline at the dust collection end of the dust collection fan 9, and the dust collection box 10 absorbs the dust and fragments generated during cutting into the dust collection box 10 through the dust collection pipe 11 and the dust collection cover 12, so that the inside of the protective box 1 is kept clean, and meanwhile, the damage of the dust to workers can be reduced;
A supporting plate 20 is fixedly arranged on one side of the protective box 1, the dust collection fan 9 and the dust collection box 10 are fixedly arranged on the top of the supporting plate 20, the supporting plate 20 supports the dust collection fan 9 and the dust collection box 10, and the exhaust end of the dust collection fan 9 is convenient for exhausting;
The protective box 1 is positioned at the upper end and the lower end of the two groups of box doors 2, sliding grooves 13 are formed in the upper end and the lower end of the two groups of box doors 2, two groups of sliding blocks 14 are slidably mounted in the two groups of sliding grooves 13, four groups of sliding blocks 14 are fixedly connected with the upper end and the lower end of the two groups of box doors 2 respectively, and the two groups of box doors 2 can be slidably mounted at one side of the protective box 1 through the cooperation of the two groups of sliding grooves 13 and the four groups of sliding blocks 14;
The top of the box door 2, which is positioned on the slot, is provided with a groove, the groove is communicated with the slot, the clamping block 4 is slidably arranged in the groove, one side of the protective box 1, which is positioned on the groove, is provided with a limit groove, the limit groove is communicated with the groove, the inside of the limit groove is slidably provided with a push rod 15, one end of the push rod 15 is fixedly connected with the clamping block 4, the clamping block 4 can be clamped in the clamping groove by moving the push rod 15, or the clamping block 4 is separated from the clamping groove, and the insertion block 3 can be fixed or cancelled;
The two groups of box doors 2 are provided with the observation windows 16, so that the cutting condition of wafers inside the protective box 1 can be observed through the two groups of observation windows 16, and handles 17 are fixedly arranged on one sides of the two groups of box doors 2, which are positioned on the two groups of observation windows 16, so that the two groups of box doors 2 can be conveniently moved through the two groups of handles 17;
The surface of sucking disc 7 has seted up a plurality of groups and has inhaled hole 18, and the inside of a plurality of groups of holes 18 is all fixed mounting has filter screen 19, and miniature aspirator pump 8 fixed mounting is in the interior bottom of protective housing 1, and miniature aspirator pump 8 inhale the end and pass through pipeline and sucking disc 7 fixed intercommunication, and filter screen 19 can prevent that the cutting from making the piece that produces enter into the inside of sucking disc 7, prevents that the piece from being inhaled to miniature aspirator pump 8's inside, avoids miniature aspirator pump 8 to take place the damage.
Working principle: when the wafer cutting machine is used, firstly, a wafer is placed on the surface of the sucker 7, air in the sucker 7 is sucked through the micro suction pump 8, so that negative pressure is formed in the sucker 7, the wafer on the surface of the sucker 7 is further fixed, the wafer is prevented from moving in position during cutting operation, then two groups of handles 17 are pulled to enable two groups of box doors 2 to be attached, at the moment, the insert block 3 is positioned in the slot, then the push rod 15 drives the clamping block 4 to move, the clamping block 4 is clamped in the clamping slot, the insert block 3 is fixed, further, the two groups of box doors 2 are fixed, workers are protected, the piston rod of the cylinder 5 stretches out and draws back, the laser cutting machine body 6 is driven to move, the wafer is cut, dust and scraps generated during cutting are sucked into the dust collection box 10 through the dust collection cover 12 and the dust collection pipe 11, damage to the workers can be reduced while the dust is kept in the dust collection box 1, after the cutting operation is finished, the fixing of the insert block 3 of the two groups of box doors 4 is released, the two groups of box doors 2 can be pulled apart, the structure is simple, the production cost is low, the machine is low in fault rate and maintenance cost is low, and easy to damage is low.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (8)

1. The utility model provides a wafer laser cutting machine protection machanism, is including being used for installing wafer laser cutting machine's protective housing (1), its characterized in that: two groups of box doors (2) are slidably arranged on one side of the protective box (1), one group of box doors (2) is fixedly connected with an inserting block (3), one group of box doors (2) is provided with an inserting groove, the inserting block (3) is inserted into the inserting groove, the top of the inserting block (3) is also provided with a clamping groove, and a clamping block (4) is clamped in the clamping groove;
The top fixed mounting of protective housing (1) has cylinder (5), the bottom of cylinder (5) piston rod runs through protective housing (1) and fixedly connected with laser cutting machine body (6), the inside fixed mounting of protective housing (1) has sucking disc (7), the bottom intercommunication of sucking disc (7) has miniature aspirator pump (8), one side of protective housing (1) is provided with the dust absorption subassembly that is used for absorbing dust and piece.
2. The wafer laser cutting machine protection mechanism according to claim 1, wherein: the dust collection assembly comprises a dust collection fan (9), the dust collection fan (9) is arranged on one side of the protective box (1), a dust collection end of the dust collection fan (9) is fixedly communicated with a dust collection box (10) through a pipeline, one side of the dust collection box (10) is fixedly communicated with a dust collection pipe (11), one end of the dust collection pipe (11) penetrates through the protective box (1) and is fixedly communicated with a dust collection cover (12), and the dust collection cover (12) is located above the sucker (7).
3. The wafer laser cutting machine protection mechanism according to claim 2, wherein: one side of the protective box (1) is fixedly provided with a supporting plate (20), and the dust suction fan (9) and the dust collection box (10) are fixedly arranged at the top of the supporting plate (20).
4. The wafer laser cutting machine protection mechanism according to claim 1, wherein: the protection box (1) is located the upper and lower both ends of two sets of chamber doors (2) and has all been seted up spout (13), two sets of the inside of spout (13) is all slidable mounting has two sets of sliders (14), four sets of slider (14) respectively with the upper and lower both ends fixed connection of two sets of chamber doors (2).
5. The wafer laser cutting machine protection mechanism according to claim 1, wherein: the box door (2) is positioned at the top of the slot and is provided with a groove, the groove is communicated with the slot, and the clamping block (4) is slidably arranged in the groove.
6. The wafer laser cutting machine protection mechanism according to claim 5, wherein: the utility model discloses a protective box, including baffle box, fixture block (4), baffle box (1), limiting groove has been seted up to one side that protective box (1) is located the recess, the limiting groove is linked together with the recess, the inside slidable mounting in limiting groove has push rod (15), the one end and the fixture block (4) fixed connection of push rod (15).
7. The wafer laser cutting machine protection mechanism according to claim 1, wherein: two groups of the box doors (2) are provided with observation windows (16), and handles (17) are fixedly arranged on one sides of the two groups of the box doors (2) located at the two groups of the observation windows (16).
8. The wafer laser cutting machine protection mechanism according to claim 1, wherein: the suction cup is characterized in that a plurality of groups of suction holes (18) are formed in the surface of the suction cup (7), a plurality of groups of filter screens (19) are fixedly installed in the suction holes (18), the miniature suction pump (8) is fixedly installed at the inner bottom of the protective box (1), and the suction end of the miniature suction pump (8) is fixedly communicated with the suction cup (7) through a pipeline.
CN202322883004.6U 2023-10-26 2023-10-26 Protection mechanism of wafer laser cutting machine Active CN221134543U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322883004.6U CN221134543U (en) 2023-10-26 2023-10-26 Protection mechanism of wafer laser cutting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322883004.6U CN221134543U (en) 2023-10-26 2023-10-26 Protection mechanism of wafer laser cutting machine

Publications (1)

Publication Number Publication Date
CN221134543U true CN221134543U (en) 2024-06-14

Family

ID=91389035

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322883004.6U Active CN221134543U (en) 2023-10-26 2023-10-26 Protection mechanism of wafer laser cutting machine

Country Status (1)

Country Link
CN (1) CN221134543U (en)

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