CN221124667U - Testing device for wafer test - Google Patents
Testing device for wafer test Download PDFInfo
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- CN221124667U CN221124667U CN202322926546.7U CN202322926546U CN221124667U CN 221124667 U CN221124667 U CN 221124667U CN 202322926546 U CN202322926546 U CN 202322926546U CN 221124667 U CN221124667 U CN 221124667U
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- heat sink
- connecting piece
- limiting
- sliding grooves
- test device
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- 238000012360 testing method Methods 0.000 title claims abstract description 63
- 238000007789 sealing Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
The utility model provides a testing device for wafer testing, and relates to the technical field of wafer testing. The limiting ring is rotatably arranged at the bottom of the heat sink, the limiting ring is provided with a plurality of first sliding grooves which are arranged at intervals along the circumferential direction of the limiting ring, the inner wall of each first sliding groove is provided with a convex first limiting part, the first connecting piece is arranged in the first sliding grooves of the clamp, the PCB, the heat sink and the limiting ring in a penetrating mode, the top end of the first connecting piece is connected with the clamp, and the bottom end of the first connecting piece is provided with a clamping part. The limiting ring is arranged to be locked with the first connecting piece when rotated to the position where the clamping part is clamped with the first limiting part, so that the heat sink, the PCB and the clamp are connected; and unlocking the first connecting piece when rotating to a position where the clamping part is separated from the first limiting part, so that the heat sink is allowed to be separated from the PCB. According to the technical scheme, the heat sink is connected with and separated from the PCB board through the rotation of the limit ring and the clamping and separation of the first connecting piece, so that the structure is simple, and the heat sink is easy to realize.
Description
Technical Field
The utility model relates to the technical field of wafer testing, in particular to a testing device for wafer testing.
Background
In the prior art, each part of the wafer testing device is connected in a bolt connection mode, bolts are required to be screwed down and detached once when each wafer is tested, the service life of the bolts is greatly influenced, the bolts are damaged by using half-month screw teeth generally, the service life of the bolts is shortened, and the testing cost is increased.
Disclosure of utility model
The utility model aims to provide a testing device for wafer testing, which solves the technical problem that the service life of a bolt is short in the prior art, so that the testing cost is increased.
It is a further object of the utility model to enable automation of the test device.
According to an object of the present utility model, there is provided a testing apparatus for wafer testing, comprising:
the heat sink, the PCB and the clamp are sequentially arranged from bottom to top, and a sealing cavity for placing the wafer is defined between the heat sink and the PCB;
The limiting ring is rotatably arranged at the bottom of the heat sink and is provided with a plurality of first sliding grooves which are arranged at intervals along the circumferential direction of the limiting ring, and the inner wall of each first sliding groove is provided with a first protruding limiting part;
Each first connecting piece corresponds to one first sliding groove, the first connecting pieces penetrate through the clamp, the PCB, the heat sink and the first sliding grooves of the limiting rings, the top ends of the first connecting pieces are connected with the clamp, and the bottom ends of the first connecting pieces are provided with clamping parts;
The limiting ring is arranged to be locked with the first connecting piece when rotated to the position where the clamping part is clamped with the first limiting part, so that the heat sink, the PCB and the clamp are connected; and unlocking the first connecting piece when the first connecting piece rotates to the position where the clamping part is separated from the first limiting part, so that the heat sink is allowed to be separated from the PCB.
Optionally, the first sliding groove is in a strip shape, and the first limiting part extends along the extending direction of the first sliding groove and is in a U shape;
the clamping part is formed by inwards recessing the outer wall of the first connecting piece, and the first connecting piece is arranged to be locked with the limiting ring when at least part of the first limiting part is positioned in the clamping part.
Optionally, the two ends of the first limiting part and the inner wall of the first chute form an avoidance part, and the size of the avoidance part is larger than that of the bottom end of the first connecting piece, so that the first connecting piece is allowed to be separated from the limiting ring when the limiting ring rotates to the position that the first connecting piece is located at the avoidance part.
Optionally, the stop collar further has a plurality of second spouts that are arranged along its circumference interval, the inner wall department of second spout is equipped with bellied second spacing portion, testing arrangement still includes:
The second connecting pieces correspond to the second sliding grooves, are connected with the heat sink and the limit ring, and can slide along the second sliding grooves when the limit ring rotates.
Optionally, the first sliding grooves and the second sliding grooves are arranged at intervals one by one, and the extension length of the first sliding grooves is consistent with that of the second sliding grooves.
Optionally, the first sliding grooves and the second sliding grooves are arranged in an array along the circumferential direction of the limit ring.
Optionally, a mounting portion for mounting a stop collar is provided at the bottom periphery of the heat sink, and the bottom of the stop collar is flush with the bottom of the heat sink when the stop collar is mounted at the mounting portion.
Optionally, at least one operation part is arranged on the periphery of the limit ring, so that the limit ring is driven to rotate when at least one operation part is operated.
Optionally, the operation part is serrated.
Optionally, the method further comprises:
The driving part is provided with a gear meshed with the operating part so as to drive the limit ring to rotate when the driving part operates.
The limiting ring is rotatably arranged at the bottom of the heat sink, the limiting ring is provided with a plurality of first sliding grooves which are arranged at intervals along the circumferential direction of the limiting ring, the inner wall of each first sliding groove is provided with a convex first limiting part, the first connecting piece is arranged in the first sliding grooves of the clamp, the PCB, the heat sink and the limiting ring in a penetrating mode, the top end of the first connecting piece is connected with the clamp, and the bottom end of the first connecting piece is provided with a clamping part. The limiting ring is arranged to be locked with the first connecting piece when rotated to the position where the clamping part is clamped with the first limiting part, so that the heat sink, the PCB and the clamp are connected; and unlocking the first connecting piece when rotating to a position where the clamping part is separated from the first limiting part, so that the heat sink is allowed to be separated from the PCB. According to the technical scheme, the heat sink is connected with and separated from the PCB board through the rotation of the limit ring and the clamping and separation of the first connecting piece, so that the structure is simple, and the heat sink is easy to realize.
Furthermore, the operation part of the limit ring is in a zigzag shape, the test device further comprises a driving part, the driving part is provided with a gear meshed with the operation part, and the limit ring is driven to rotate when the driving part operates, so that the automation of the test device is realized, the limit ring can be driven to rotate without manual operation, and the unlocking and locking of the limit ring and the first connecting piece are realized.
The above, as well as additional objectives, advantages, and features of the present utility model will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present utility model when read in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the utility model will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:
FIG. 1 is a schematic block diagram of a test apparatus for wafer testing in accordance with one embodiment of the present utility model;
FIG. 2 is a schematic cross-sectional view of a section of the test device shown in FIG. 1;
FIG. 3 is a schematic cross-sectional view of another cross-section of the test device shown in FIG. 1;
FIG. 4 is a schematic connection diagram of a stop collar and a first connector in the test apparatus of FIG. 1;
FIG. 5 is a schematic enlarged view at A in FIG. 4;
FIG. 6 is a schematic block diagram of a first connector of the test apparatus of FIG. 1;
Fig. 7 is a schematic structural view of a jig in the test apparatus shown in fig. 1.
Reference numerals:
100-testing device, 10-PCB board, 20-anchor clamps, 30-spacing collar, 40-heat sink, 50-first connecting piece, 60-second connecting piece, 70-sealed chamber, 41-installation department, 31-first spout, 311-first spacing portion, 312-dodging portion, 32-second spout, 321-second spacing portion, 33-operating portion, 51-the bottom of first connecting piece, 52-joint portion.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature, i.e. one or more such features. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. When a feature "comprises or includes" a feature or some of its coverage, this indicates that other features are not excluded and may further include other features, unless expressly stated otherwise.
Unless specifically stated and limited otherwise, the term "coupled" and the like are to be construed broadly and may be, for example, fixedly coupled, detachably coupled, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. Those of ordinary skill in the art will understand the specific meaning of the terms described above in the present utility model as the case may be.
Unless otherwise defined, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
Fig. 1 is a schematic structural view of a test apparatus 100 for wafer testing according to an embodiment of the present utility model, fig. 2 is a schematic sectional view of one section of the test apparatus 100 shown in fig. 1, fig. 3 is a schematic sectional view of another section of the test apparatus 100 shown in fig. 1, fig. 4 is a schematic connection diagram of a retainer ring 30 and a first connection member 50 in the test apparatus 100 shown in fig. 1, fig. 5 is a schematic enlarged view at a in fig. 4, fig. 6 is a schematic structural view of the first connection member 50 in the test apparatus 100 shown in fig. 1, and fig. 7 is a schematic structural view of a clamp 20 in the test apparatus 100 shown in fig. 1. As shown in fig. 1 to 7, in a specific embodiment, a testing apparatus 100 for testing a wafer includes a heat sink 40, a PCB board 10 and a fixture 20 sequentially arranged from bottom to top, and a sealing cavity for placing the wafer is defined between the heat sink 40 and the PCB board 10. The testing device 100 further comprises a stop collar 30 and a plurality of first connecting pieces 50, the stop collar 30 is rotatably arranged at the bottom of the heat sink 40, the stop collar 30 is provided with a plurality of first sliding grooves 31 which are arranged at intervals along the circumferential direction of the stop collar 30, and the inner wall of the first sliding groove 31 is provided with a raised first stop portion 311. Each first connecting piece 50 corresponds to one first chute 31, the first connecting piece 50 penetrates through the first chute 31 of the clamp 20, the PCB 10, the heat sink 40 and the limit ring 30, the top end of the first connecting piece 50 is connected with the clamp 20, and the bottom end 51 of the first connecting piece 50 is provided with a clamping part 52. The limit ring 30 is arranged to be locked with the first connecting piece 50 when rotated to a position where the clamping part 52 is clamped with the first limit part 311, thereby connecting the heat sink 40, the PCB board 10 and the clamp 20; unlock with the first connector 50 when rotated to a position where the clamping portion 52 is disengaged from the first limiting portion 311, thereby allowing the heat sink 40 to be separated from the PCB board 10. Here, it is understood that the retainer ring 30 has a circular ring shape.
The heat sink 40 is connected with and separated from the PCB board 10 by the rotation of the limit ring 30 and the first connecting piece 50 in this embodiment, and the structure is simple and easy to implement.
In this embodiment, the first chute 31 is elongated, and the first limiting portion 311 extends along the extending direction of the first chute 31 and has a U-shape. The clamping portion 52 is formed by recessing the outer wall of the first connecting member 50 inward, and the first connecting member 50 is configured to lock with the stop collar 30 when at least part of the first stop portion 311 is located in the clamping portion 52. Here, the first sliding groove 31 extends along the circumferential direction of the stop collar 30, and the extension length thereof may be set according to specific design requirements. That is, when the first limiting portion 311 is located in the clamping portion 52, the limiting ring 30 and the connecting piece are in a locked state, and the PCB 10 and the heat sink 40 cannot be detached.
In this embodiment, the two end portions of the first limiting portion 311 and the inner wall of the first chute 31 form the avoiding portion 312, and the size of the avoiding portion 312 is larger than the size of the bottom end 51 of the first connecting member 50, so as to allow the first connecting member 50 to be separated from the limiting ring 30 when the limiting ring 30 rotates to the position of the first connecting member 50 at the avoiding portion 312, that is, the limiting ring 30 and the first connecting member 50 are in an unlocked state. It will be appreciated that the relief 312 is located at either end of the first chute 31. The state switching can be realized through the rotation of the limit ring 30, namely the state switching between the first connecting piece 50 and the unlocking state and the locking state, so that the operation is simple, and the structure is simple.
In a preferred embodiment, the stop collar 30 further has a plurality of second sliding grooves 32 spaced apart along the circumference thereof, and the inner wall of the second sliding groove 32 is provided with a convex second stop 321, and the testing device 100 further includes a plurality of second connecting members 60, each second connecting member 60 corresponds to one second sliding groove 32, and the second connecting members 60 are connected with the heat sink 40 and the stop collar 30 and can slide along the second sliding grooves 32 when the stop collar 30 rotates. Here, the second stopper 321 extends along the inner wall of the second chute 32 for a full circle, and the escape portion 312 is not provided, so that the second link 60 is in a locked state with the stopper 30 regardless of the movement to any position of the second chute 32.
This embodiment can prevent the retainer ring 30 from falling off the clamp 20 during rotation by providing the second chute 32 and the second connector 60. That is, the stop collar 30 and the second connecting member 60 are always in the locked state, and the second connecting member 60 is connected to the clamp 20, which corresponds to limiting the rotation position of the stop collar 30, so as to prevent the stop collar 30 from falling off. Here, the second connection member 60 may be a bolt.
In this embodiment, the plurality of first sliding grooves 31 and the plurality of second sliding grooves 32 are arranged at intervals one by one, and the extension lengths of the first sliding grooves 31 and the second sliding grooves 32 are identical, so that interference can be prevented during rotation of the stop collar 30.
In this embodiment, the plurality of first sliding grooves 31 and the plurality of second sliding grooves 32 are arranged in an array along the circumferential direction of the retainer ring 30, so that the stability of connection can be ensured, and the connection points of the clamp 20 are all arranged at equal intervals. In other embodiments, the arrangement positions of the first chute 31 and the second chute 32 may be set according to specific design requirements.
In a preferred embodiment, the bottom periphery of the heat sink 40 is provided with a mounting portion 41 for mounting the stop collar 30, and when the stop collar 30 is mounted on the mounting portion 41, the bottom of the stop collar 30 is flush with the bottom of the heat sink 40, so that the stop collar 30 can be positioned, and the aesthetic property can be improved. The stop collar 30 is correspondingly sleeved at the bottom of the heat sink 40. In addition, when the retainer ring 30 is mounted to the mounting portion 41, the outer side of the retainer ring 30 may be disposed flush with the outer side of the heat sink 40, that is, not protruding from the heat sink 40, and the outer diameter of the retainer ring 30 is identical to the diameter of the heat sink 40, so that the aesthetic property of the test device 100 may be further improved.
In this embodiment, at least one operation portion 33 is provided on the circumferential side of the retainer ring 30 to rotate the retainer ring 30 when the at least one operation portion 33 is operated. Here, the operation portion 33 may be provided to protrude from the jig 20, so that a person can operate it conveniently. In this embodiment, the number of the operation portions 33 is four, and the four operation portions 33 are arranged at equal intervals in the circumferential direction of the retainer ring 30. In other embodiments, the number of the operation portions 33 may be set according to specific design requirements, for example, according to the size of the outer diameter of the stop collar 30, and the larger the outer diameter of the stop collar 30, the larger the number of the operation portions 33, the smaller the outer diameter of the stop collar 30, and the smaller the number of the operation portions 33.
In this embodiment, the operation portion 33 is serrated. The testing device 100 further comprises a driving component, and the driving component is provided with a gear meshed with the operation part 33 so as to drive the limit ring 30 to rotate when the driving component operates, thereby realizing the automation of the testing device 100, and the limit ring 30 can be driven to rotate without manual operation, so that the unlocking and locking of the limit ring 30 and the first connecting piece 50 are realized.
In this embodiment, when the heat sink 40 and the PCB 10 need to be detached, the heat sink 40 can be taken out from the lower side only by rotating the stop collar 30 until the clamping portion 52 of the first connecting member 50 is located at the avoiding portion 312, thereby separating the heat sink 40 from the PCB 10.
According to the embodiment, through the arrangement of the limit ring 30 and the first connecting piece 50, the heat sink 40 and the PCB 10 can be connected and separated by utilizing the cooperation of the limit ring 30 and the first connecting piece, the structure is simple, the implementation is easy, and the service life is long compared with a connection mode of screwing by using bolts.
By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the utility model have been shown and described herein in detail, many other variations or modifications of the utility model consistent with the principles of the utility model may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the utility model. Accordingly, the scope of the present utility model should be understood and deemed to cover all such other variations or modifications.
Claims (10)
1. A test apparatus for testing a wafer, comprising:
the heat sink, the PCB and the clamp are sequentially arranged from bottom to top, and a sealing cavity for placing the wafer is defined between the heat sink and the PCB;
The limiting ring is rotatably arranged at the bottom of the heat sink and is provided with a plurality of first sliding grooves which are arranged at intervals along the circumferential direction of the limiting ring, and the inner wall of each first sliding groove is provided with a first protruding limiting part;
Each first connecting piece corresponds to one first sliding groove, the first connecting pieces penetrate through the clamp, the PCB, the heat sink and the first sliding grooves of the limiting rings, the top ends of the first connecting pieces are connected with the clamp, and the bottom ends of the first connecting pieces are provided with clamping parts;
The limiting ring is arranged to be locked with the first connecting piece when rotated to the position where the clamping part is clamped with the first limiting part, so that the heat sink, the PCB and the clamp are connected; and unlocking the first connecting piece when the first connecting piece rotates to the position where the clamping part is separated from the first limiting part, so that the heat sink is allowed to be separated from the PCB.
2. The test device of claim 1, wherein the test device comprises a plurality of test elements,
The first sliding groove is strip-shaped, and the first limiting part extends along the extending direction of the first sliding groove and is U-shaped;
the clamping part is formed by inwards recessing the outer wall of the first connecting piece, and the first connecting piece is arranged to be locked with the limiting ring when at least part of the first limiting part is positioned in the clamping part.
3. The test device according to claim 2, wherein,
The two ends of the first limiting part and the inner wall of the first sliding groove form an avoidance part, and the size of the avoidance part is larger than that of the bottom end of the first connecting piece, so that the first connecting piece is allowed to be separated from the limiting ring when the limiting ring rotates to the position of the first connecting piece at the avoidance part.
4. A test device according to any one of claims 1 to 3, wherein the stop collar further has a plurality of second runners arranged in spaced relation along its circumference, the second runners having raised second stops at their inner walls, the test device further comprising:
The second connecting pieces correspond to the second sliding grooves, are connected with the heat sink and the limit ring, and can slide along the second sliding grooves when the limit ring rotates.
5. The test device of claim 4, wherein the test device comprises a plurality of test elements,
The first sliding grooves and the second sliding grooves are arranged at intervals one by one, and the extension length of the first sliding grooves is consistent with that of the second sliding grooves.
6. The test device of claim 5, wherein the test device comprises a plurality of test elements,
The first sliding grooves and the second sliding grooves are arranged in an array mode along the circumferential direction of the limit ring.
7. A test device according to any one of claims 1 to 3,
The bottom periphery of the heat sink is provided with a mounting part for mounting a limit ring, and the bottom of the limit ring is flush with the bottom of the heat sink when the limit ring is mounted on the mounting part.
8. A test device according to any one of claims 1 to 3,
At least one operation part is arranged on the periphery of the limit ring, so that the limit ring is driven to rotate when at least one operation part is operated.
9. The test device of claim 8, wherein the test device comprises a plurality of test elements,
The operation part is in a saw-tooth shape.
10. The test apparatus of claim 9, further comprising:
The driving part is provided with a gear meshed with the operating part so as to drive the limit ring to rotate when the driving part operates.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322926546.7U CN221124667U (en) | 2023-10-30 | 2023-10-30 | Testing device for wafer test |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322926546.7U CN221124667U (en) | 2023-10-30 | 2023-10-30 | Testing device for wafer test |
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CN221124667U true CN221124667U (en) | 2024-06-11 |
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CN202322926546.7U Active CN221124667U (en) | 2023-10-30 | 2023-10-30 | Testing device for wafer test |
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2023
- 2023-10-30 CN CN202322926546.7U patent/CN221124667U/en active Active
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