CN221103916U

CN221103916U - Heat dissipation device

Info

Publication number: CN221103916U
Application number: CN202323033187.9U
Authority: CN
Inventors: 李孟涵; 曾庆镇
Original assignee: Shenzhen Envicool Technology Co Ltd
Current assignee: Shenzhen Envicool Technology Co Ltd
Priority date: 2023-11-09
Filing date: 2023-11-09
Publication date: 2024-06-07
Anticipated expiration: 2033-11-09

Abstract

The application provides a heat radiating device which is used for cooling a modular heat source and comprises a heat radiating part and a heat absorbing part arranged below the heat radiating part, wherein the heat radiating part and the heat absorbing part are respectively provided with a cavity for containing phase-change refrigerant, and the cavities of the heat radiating part and the heat absorbing part are mutually communicated; the heat dissipation part is used for releasing heat to an external medium and condensing the evaporated phase-change refrigerant; the heat absorbing part is used for absorbing heat of a heat source to evaporate the phase-change refrigerant; the heat absorbing part is provided with a mounting cavity, the shape of the mounting cavity is matched with the shape of the heat source, and the mounting cavity is used for accommodating all or part of the heat source. The heat dissipation device provided by the application has the advantages of simple structure, high heat dissipation efficiency, low energy consumption and the like.

Description

Heat dissipation device

Technical Field

The application relates to the technical field of temperature control equipment, in particular to a heat dissipation device.

Background

In recent years, with the continuous development of industries such as laser, energy, electronics and intelligent equipment, heat sources in various industries are highly integrated, and the heat flux density of the heat sources is larger and larger, for example, the efficiency of a highly integrated power module of a charging pile is generally about 95%, then 5% of the heat is converted into heat loss, and the heat loss is larger and larger along with the gradual increase of the power of the charging pile. This heat must be removed from the device or else the ageing of the device will be accelerated.

At present, a phase-change heat dissipation device which uses a substance with a lower boiling point as a heat exchange medium to help a heat source to dissipate heat has the advantages of small volume, low energy consumption, high reliability and the like. In the process of implementing the present application, the inventor finds that at least the following problems exist in the prior art: most heat dissipation devices are directly arranged above or on the side surface of the heat source, and the contact area between the heat source and the phase-change heat dissipation device is small, so that the heat exchange efficiency between the phase-change heat dissipation device and the heat source is low, the heat dissipation effect of the heat source is poor, and the safe and stable operation of the module type heat source cannot be effectively ensured.

Disclosure of Invention

In view of the above, the present application provides a heat dissipating device to solve the problem of poor heat dissipation effect caused by low heat exchange efficiency in the prior art.

In order to achieve the above object, the technical solution of the embodiment of the present application is as follows:

The embodiment of the application provides a heat dissipation device which is used for cooling a modular heat source and comprises a heat dissipation part and a heat absorption part arranged below the heat dissipation part, wherein the heat dissipation part and the heat absorption part are respectively provided with a cavity for containing a phase-change refrigerant, and the cavities of the heat dissipation part and the heat absorption part are mutually communicated; the heat dissipation part is used for releasing heat to an external medium and condensing the evaporated phase-change refrigerant; the heat absorbing part is used for absorbing heat of a heat source to evaporate the phase-change refrigerant; the heat absorbing part is provided with a mounting cavity, the shape of the mounting cavity is matched with the shape of the heat source, and the mounting cavity is used for accommodating all or part of the heat source.

In one embodiment, the mounting cavity is arranged at the bottom of the heat absorbing part and is formed by inwards sinking the bottom wall of the heat absorbing part.

In one embodiment, the mounting cavity is arranged in the middle of the heat absorbing part, and the mounting cavity is formed by recessing or penetrating one side wall of the heat absorbing part to the other side wall.

In one embodiment, the number of the installation cavities is more than two, the installation cavities are arranged on the heat absorbing part at intervals, each installation cavity is respectively used for installing one heat source, and each installation cavity is respectively matched with the appearance of the corresponding heat source.

In one embodiment, a heat conducting layer is filled between the heat source and the mounting cavity, and two sides of the heat conducting layer are respectively attached to the surfaces of the mounting cavity and the heat source.

In one embodiment, the heat dissipation part and the cavity of the heat absorption part are directly communicated, or the heat dissipation part and the cavity of the heat absorption part are communicated through a pipeline.

In one embodiment, the heat dissipation portion includes a plurality of heat dissipation units, a plurality of heat dissipation units are disposed on the heat absorption portion at intervals, and a plurality of heat dissipation units are orderly arranged or unordered arranged.

In one embodiment, the cross-sectional area of the heat dissipating unit gradually decreases from an end near the heat absorbing portion to an end far from the heat absorbing portion.

In one embodiment, the outer wall of the heat dissipation part is provided with a plurality of protruding parts, and the protruding parts are used for increasing the surface area of the heat dissipation part.

In one embodiment, the heat dissipating device further includes a fan disposed above or at a peripheral side of the heat dissipating part, for accelerating a gas flow velocity near the heat dissipating part.

The application has at least the following beneficial effects: the heat dissipation device provided by the application is characterized in that the heat dissipation part is positioned above the heat absorption part, the heat absorption part is used for carrying out heat exchange with an external cold source, the heat absorption part is used for carrying out heat exchange with a heat source, the phase-change refrigerant is used as a medium for heat exchange, the circulating power can be formed by only relying on gravity, the power device is not required to be additionally used, the system is simple to control, the manufacturing cost is low, and the energy consumption is effectively reduced. The heat radiating device is provided with the mounting cavity for accommodating the heat source at the heat absorbing part, so that the heat source is wholly or partially positioned in the mounting cavity, a plurality of surfaces of the heat source are contacted with the heat absorbing part, the heat radiating area of the heat source is increased, the heat exchanging efficiency is improved, and the heat radiating device is beneficial to ensuring the safe and stable operation of heat source equipment; the concave mounting cavity can also facilitate the mounting and fixing of the heat source.

Drawings

Fig. 1 is a schematic cross-sectional view of a heat dissipating device according to a first embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of a heat dissipating device according to a second embodiment of the present application.

Fig. 3 is a schematic cross-sectional view of a heat dissipating device according to a third embodiment of the present application.

Fig. 4 is a schematic cross-sectional view of a heat dissipating device according to a fourth embodiment of the present application.

Fig. 5 is a schematic structural diagram of a heat dissipating device according to a fifth embodiment of the present application.

Fig. 6 is a schematic structural diagram of a heat dissipating device according to a sixth embodiment of the present application.

The meaning of the various reference numerals in the drawings is as follows:

1. A blower; 2. a heat radiation unit; 21. a boss; 3. a heat absorbing section; 31. a mounting cavity; 4. a cavity; 5. a heat conducting layer; 6. a heat source; 7. a phase change refrigerant; 8. and (5) a pipeline.

Detailed Description

The technical scheme of the application is further elaborated below by referring to the drawings in the specification and the specific embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the implementations of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

The heat dissipation device provided by the embodiment of the application is used for cooling the modular heat source. The module type heat source can be an integrated power module of a charging pile, a power module of an energy storage system, a laser generator and the like.

As shown in fig. 1 and 2, the heat dissipating device of the present embodiment includes a heat dissipating portion and a heat absorbing portion 3 provided below the heat dissipating portion, the heat dissipating portion and the heat absorbing portion 3 being respectively provided with a cavity 4 for accommodating a phase-change refrigerant 7, the cavities 4 of the heat dissipating portion and the heat absorbing portion 3 being communicated with each other. The heat radiating portion radiates heat to the external medium, and condenses the evaporated phase-change refrigerant 7. The heat absorbing part 3 is used for absorbing heat of the heat source 6 and evaporating the phase-change refrigerant 7; the heat absorbing portion 3 is provided with a mounting cavity 31, the shape of the mounting cavity 31 is matched with the shape of the heat source 6, and the mounting cavity 31 is used for accommodating all or part of the heat source 6.

As shown in fig. 1 to 5, the heat radiating portion and the cavity 4 of the heat absorbing portion 3 are directly communicated, or as shown in fig. 6, the heat radiating portion and the cavity 4 of the heat absorbing portion 3 are communicated through a pipe 8.

As shown in fig. 3 and 4, the heat dissipation part includes a plurality of heat dissipation units 2, the plurality of heat dissipation units 2 are disposed on the heat absorption part 3 at intervals, and the plurality of heat dissipation units 2 are orderly arranged or unordered arranged. For example, the heat dissipating units 2 may be arranged in a random manner or in an array.

Specifically, the heat radiating portion and the cavity 4 of the heat absorbing portion 3 of the present embodiment are of a direct communication structure. The heat absorbing part 3 is a cuboid box structure at the bottom of the heat dissipating device, a plurality of heat dissipating units 2 are arranged on the upper surface of the heat absorbing part 3, the heat dissipating units 2 can be hollow cylinder structures, and the cross section of the cylinder is not limited, for example, the heat dissipating units can be cylinders, polygonal cylinders and the like.

The heat dissipating part and the heat absorbing part 3 are configured to accommodate the phase-change refrigerant 7 in the cavity 4, and the phase-change refrigerant 7 may be any one or more of R134a (1, 2-tetrafluoroethane), R142b (1, 1-difluoro-1-chloroethane), R114 (tetrafluorodichloroethane), R124 (chlorotetrafluoroethane), R1233Zd (E) (trans-1-chloro-3, 3-trifluoropropene), R1234Ze (Z) (cis-1, 3-tetrafluoropropene), R1234Ze (E) (trans-1, 3-tetrafluoropropene), R600A (isobutane), RC318 (octafluorocyclobutane), RE245fa (pentafluoropropane), R22 (chlorodifluoromethane), R32 (trifluoromethane), R407C (R32 refrigerant and R125 (pentafluoroethane) refrigerant plus R134a refrigerant mixed in a certain ratio), and R410A (mixture of R32 and R125).

As shown in fig. 5, in order to increase the heat dissipation area of the heat dissipation unit 2, a protrusion 21 may be provided on the outer wall surface of the heat dissipation unit 2 to facilitate heat exchange between the heat dissipation unit 2 and an external medium. The protruding portion 21 may have a fin-like, rib-like, or convex-point-like structure, for example. As shown in fig. 6, the side wall of the heat dissipating unit 2 may be configured to have an inclined structure, so that the cross-sectional area of the heat dissipating unit 2 gradually decreases from the end close to the heat absorbing portion 3 to the end far from the heat absorbing portion 3, and this design can also increase the surface area of the heat dissipating unit 2 to a certain extent, and at the same time, is beneficial for the phase-change refrigerant 7 to fall back into the cavity 4 of the heat absorbing portion 3 after condensation.

Specifically, as shown in fig. 1 and 3, the mounting cavity 31 may be provided at the bottom of the heat sink 3, for example, the bottom wall of the heat sink 3 is recessed inward to form the mounting cavity 31. Alternatively, as shown in fig. 2 and 4, the mounting cavity 31 may be provided in the middle of the heat sink 3, the mounting cavity 31 may be formed by recessing one side wall of the heat sink 3 inward, or a through hole type mounting cavity 31 may be provided in the middle of the heat sink 3. Preferably, the mounting cavity 31 is provided at a position below the heat absorbing portion 3, such as at the bottom or at the middle lower portion of the heat absorbing portion 3.

As shown in fig. 1 and 2, the heat absorbing part 3 may be provided with only one installation cavity 31 for heat dissipation of one heat source 6; as shown in fig. 3 to 6, a plurality of spaced mounting cavities 31 may also be provided to simultaneously dissipate heat from a plurality of heat sources 6. When the heat sink 3 is provided with a plurality of mounting cavities 31, the position of each mounting cavity 31 is not limited, and for example, may be disposed at the bottom of the heat sink 3 (as shown in fig. 3), or may be disposed at the middle of the heat sink 3 (as shown in fig. 4), or may be disposed at the bottom of the heat sink 3, or may be disposed at the middle of the heat sink 3 (as shown in fig. 5 and 6). The size and shape of each mounting cavity 31 may be the same or different, specifically designed according to the size and shape of each corresponding heat source 6.

The heat absorbing part 3 is provided with the installation cavity 31, so that the contact area between the heat absorbing part 3 and the heat source 6 can be effectively increased, for example, the installation cavity 31 arranged at the bottom can exchange heat with the heat source 6 on the side surface and the top of the heat source 6, and the installation cavity 31 arranged at the middle can exchange heat with the heat source 6 in all directions. The heat exchange efficiency is improved, and the safe and stable operation of the heat source 6 equipment is ensured.

As shown in fig. 3 and 4, to further enhance the heat dissipation effect of the heat dissipation device, a heat conducting layer 5 may be disposed between the mounting cavity 31 and the heat source 6, so that two sides of the heat conducting layer 5 are respectively attached to the outer wall of the mounting cavity 31 and the outer surface of the heat source 6, and heat is better conducted between the heat source 6 and the heat absorbing portion 3. The heat conductive layer 5 may be made of a material such as heat conductive silica gel, heat conductive silicone grease, or the like.

In order to accelerate the flow of the gas around the heat dissipation part and enable the heat dissipation part to dissipate heat more efficiently, one or more fans 1 may be arranged around the heat dissipation part, and the fans 1 may be arranged above or on the periphery of the heat dissipation part.

The working principle of the heat dissipating device of the embodiment of the application is as follows: the cavity 4 is filled with a phase-change refrigerant (the cavity 4 is not filled), the liquid refrigerant is arranged at the lower part of the cavity 4 under the action of gravity, and the gaseous refrigerant is arranged at the upper part of the cavity 4. After the heat source 6 works to generate heat, the heat is transferred to the liquid refrigerant in the cavity 4 of the heat absorbing part 3 through the contact surface at the mounting cavity 31, the liquid refrigerant absorbs heat and is vaporized to rise to the cavity 4 of the heat dissipating part, the temperature is lower because the heat dissipating part is far away from the heat source 6, and the heat is exchanged with the external air through the fan 1, the gaseous refrigerant is condensed and released at the heat dissipating part to be liquefied into the liquid refrigerant, and the liquid refrigerant flows into the cavity 4 of the heat absorbing part 3 along the inner wall of the cavity 4 at the heat dissipating part under the action of gravity, so that the circulation is performed.

The heat dissipating device provided by the embodiment of the application has the advantages that the control system is very simple, only the start and stop of the fan are required to be controlled, and the start and stop of the fan can be synchronously set with the start and stop of the heat source module or set for a period of time after the start and stop of the heat source module. According to the heat dissipation device provided by the embodiment of the application, the contact area between the heat dissipation device and the heat source is increased by arranging the mounting cavity, so that the heat dissipation efficiency is improved, and meanwhile, the heat source module is convenient to mount and fix. The phase-change refrigerant is used as a heat exchange medium, so that the whole volume of the heat dissipation device is effectively reduced, the structure is more compact, and meanwhile, the heat dissipation device has good heat uniformity and reliable temperature control. The heat dissipation device provided by the embodiment of the application does not need to be additionally provided with a power circulation device, such as a traditional compressor, a fluorine pump and the like, so that the overall structure of the heat dissipation device is simplified, and the energy consumption is reduced.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The heat dissipation device is used for cooling a modular heat source and is characterized by comprising a heat dissipation part and a heat absorption part arranged below the heat dissipation part, wherein the heat dissipation part and the heat absorption part are respectively provided with a cavity for containing a phase-change refrigerant, and the cavities of the heat dissipation part and the heat absorption part are mutually communicated; the heat dissipation part is used for releasing heat to an external medium and condensing the evaporated phase-change refrigerant; the heat absorbing part is used for absorbing heat of a heat source to evaporate the phase-change refrigerant; the heat absorbing part is provided with a mounting cavity, the shape of the mounting cavity is matched with the shape of the heat source, and the mounting cavity is used for accommodating all or part of the heat source.

2. The heat dissipating device of claim 1, wherein said mounting cavity is provided at a bottom of said heat sink portion, and is formed by a bottom wall of said heat sink portion being recessed inward.

3. The heat dissipating device of claim 1, wherein said mounting cavity is provided in a middle portion of said heat sink, said mounting cavity being formed by recessing or penetrating one side wall of said heat sink toward the other side wall.

4. The heat dissipating device of claim 1, wherein the number of said mounting cavities is two or more, said mounting cavities are spaced apart on said heat sink, each of said mounting cavities is for mounting one of said heat sources, and each of said mounting cavities is matched with the shape of the corresponding heat source.

5. The heat dissipating device of claim 1, wherein a heat conducting layer is filled between the heat source and the mounting cavity, and two sides of the heat conducting layer are respectively attached to the surfaces of the mounting cavity and the heat source.

6. The heat sink of claim 1, wherein the heat sink and the cavity of the heat sink are in direct communication or the heat sink and the cavity of the heat sink are in communication via a conduit.

7. The heat dissipating device of claim 1, wherein the heat dissipating unit comprises a plurality of heat dissipating units, the plurality of heat dissipating units are disposed on the heat absorbing unit at intervals, and the plurality of heat dissipating units are orderly arranged or unordered arranged.

8. The heat dissipating device of claim 7, wherein a cross-sectional area of said heat dissipating unit gradually decreases from an end closer to said heat sink to an end farther from said heat sink.

9. The heat dissipating device of claim 7, wherein an outer wall of said heat dissipating portion is provided with a plurality of protrusions for increasing a surface area of said heat dissipating portion.

10. The heat dissipating device according to any one of claims 1 to 9, further comprising a fan provided above or on the peripheral side of the heat dissipating portion for accelerating the gas flow rate in the vicinity of the heat dissipating portion.