CN221102409U - Electronic equipment - Google Patents

Abstract

The application discloses an electronic device, comprising: comprising the following steps: a grounding part; a main board arranged at the grounding part; the frame body is arranged around the main board and the grounding part; the first antenna is arranged on the frame body and is arranged at intervals with the grounding part, and the first antenna comprises a feed point and a grounding point, and the feed point is electrically connected with the main board; the connecting plate is connected between the grounding part and the grounding point; and the capacitance detection part is arranged on the connecting plate and is respectively and electrically connected with the grounding part and the first antenna.

Description

Electronic equipment

Technical Field

The application belongs to the technical field of communication equipment, and particularly relates to electronic equipment.

Background

Currently, in order to enable the intelligent electronic device to reach a corresponding electromagnetic wave energy absorption ratio (SpecificAbsorption Rate, SAR) standard value, a SAR-Sensor (electromagnetic wave energy absorption ratio Sensor) is designed, and the SAR-Sensor can determine the contact state between a user and the electronic device by detecting a capacitance, and when a human body approaches the electronic device, the SAR-Sensor notifies a master control to reduce radio frequency power so as to reduce radio frequency radiation.

In the related art, an antenna is electrically connected with a main board through a ground feeding elastic sheet, a ground return path of the antenna needs to pass through the main board firstly, then passes through copper leakage at a screw hole of the main board, is connected with a screw column of a frame body through the copper leakage, and is further connected to a grounding part of the frame body, and the whole ground return path is long and complex, so that the inductance of the whole ground return path is increased, and the radiation efficiency of the antenna is seriously affected.

Disclosure of utility model

The application aims to provide an electronic device, which at least solves one of the problems that the inductance of the whole ground return path is increased and the radiation efficiency of an antenna is seriously affected due to the fact that the ground return path of the antenna in the related art is long and complex.

In order to solve the technical problems, the application is realized as follows:

An embodiment of the present application provides an electronic device, including: a grounding part; a main board arranged at the grounding part; the frame body is arranged around the main board and the grounding part; the first antenna is arranged on the frame body and is arranged at intervals with the grounding part, and the first antenna comprises a feed point and a grounding point, and the feed point is electrically connected with the main board; the connecting plate is connected between the grounding part and the grounding point; and the capacitance detection part is arranged on the connecting plate and is respectively and electrically connected with the grounding part and the first antenna.

In an embodiment of the application, an electronic device includes a frame, a main board, a first antenna, a connection board and a capacitance detection portion, the main board is disposed on a grounding portion, the frame is disposed around the main board and the grounding portion, the first antenna is disposed on the frame and is spaced from the grounding portion, so that the first antenna floats relative to the grounding portion, the first antenna includes a feeding point and a grounding point, the feeding point is electrically connected with the main board, the grounding point is electrically connected with the connection board, and the connection board is electrically connected with the grounding portion, thereby forming a loop of the first antenna. The capacitive detection part is arranged on the connecting plate, current signals sent by the main board are transmitted to the first antenna, then the current signals are transmitted to the connecting plate through the first antenna, and the current signals are transmitted to the grounding part on the frame body after passing through the capacitive detection part. The connecting plate is connected between the grounding part and the first antenna, so that the grounding of the first antenna is realized, the grounding is not required to be realized through a main board and screws on the main board, the layout of the internal structure of the electronic equipment is more compact, the return path is shortened, and the performance of the first antenna is improved.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is one of the schematic structural diagrams of an electronic device according to an embodiment of the present application;

FIG. 2 is a second schematic diagram of an electronic device according to an embodiment of the application;

fig. 3 is a simulation diagram of the electronic device according to the embodiment of the present application and the electronic device in the related art with respect to the high-frequency antenna efficiency.

Reference numerals:

1 frame body, 10 grounding part, 2 main board, 20 first protruding part, 3 first antenna, 30 second protruding part, 32 feed point, 34 grounding point, 4 connecting plate, 40 copper exposing part, 5 capacitance detecting part, 50 distributed capacitance, 52 electromagnetic wave absorption ratio sensor, 6 spring sheet, 7 second antenna, 70 first end, 72 second end.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "thickness", "upper", "lower", "inner", "outer", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

An electronic device according to an embodiment of the present application is described below with reference to fig. 1 to 3.

As shown in fig. 1, an electronic device according to some embodiments of the present application includes: a grounding part 10; a main board 2 provided in the ground 10; a frame 1, the frame 1 being disposed around the main board 2 and the grounding portion 10; the first antenna 3 is arranged in the frame body 1, the first antenna 3 and the grounding part 10 are arranged at intervals, the first antenna 3 comprises a feeding point 32 and a grounding point 34, and the feeding point 32 is electrically connected with the main board 2; a connection plate 4 connected between the ground 10 and the ground point 34; the capacitance detection unit 5 is provided on the connection board 4, and the capacitance detection unit 5 is electrically connected to the ground unit 10 and the first antenna 3, respectively.

In the embodiment of the application, the electronic device comprises a frame 1, a main board 2, a first antenna 3, a connecting plate 4 and a capacitance detection part 5, wherein the main board 2 is arranged on a grounding part 10, the frame 1 is arranged around the main board 2 and the grounding part 10, the first antenna 3 is arranged on the frame 1, and the first antenna 3 and the grounding part 10 are arranged at intervals, so that the first antenna 3 floats relative to the grounding part 10, the first antenna 3 comprises a feeding point 32 and a grounding point 34, the feeding point 32 is electrically connected with the main board 2, the grounding point 34 is electrically connected with the connecting plate 4, and the connecting plate 4 is electrically connected with the grounding part 10, thereby forming a loop of the first antenna 3. The capacitance detection part 5 is arranged on the connecting plate 4, and a current signal sent by the main board 2 is transmitted to the first antenna 3, then transmitted to the connecting plate 4 by the first antenna 3, and transmitted to the grounding part 10 on the frame body 1 after passing through the capacitance detection part 5. The connecting plate 4 is connected between the grounding part 10 and the first antenna 3, so that the grounding of the first antenna 3 is realized, the grounding is not required to be realized through the main board 2 and screws on the main board 2, the layout of the internal structure of the electronic equipment is more compact, the grounding return path is shortened, and the performance of the first antenna 3 is improved.

It can be understood that the first antenna 3 uses the capacitance detection portion 5 to realize the adjustment of radiation power, and the first antenna 3 and the grounding portion 10 are arranged at intervals, so that a suspension scheme is adopted between the first antenna 3 and the grounding portion 10, no connection material is adopted for grounding, and the situation that the direct current flows back to the ground is avoided, and further, the capacitance change parameter cannot be detected after the direct current flows back to the ground to be short-circuited is avoided.

In a specific application, the capacitance detection portion 5 can detect the capacitance value of the first antenna 3, further determine the distance between the user and the electronic device, and feed back the distance to the motherboard 2, so that the motherboard 2 can adjust the radiation power of the first antenna 3.

It can be understood that when the user approaches the electronic device, the capacitance value detected by the capacitance detection portion 5 changes, so as to determine the distance or the contact state between the user and the electronic device, specifically, when the user approaches the electronic device, the capacitance value detected by the capacitance detection portion 5 changes, so as to feed back to the motherboard 2, so that the motherboard 2 reduces the radiation power of the first antenna 3, thereby protecting the health of the human body.

Optionally, at least a portion of the housing 1 is a non-metal piece, and the first antenna 3 is a metal piece.

Alternatively, the first antenna 3 is of unitary construction with the housing 1.

Alternatively, the connection board 4 is a flexible circuit board.

According to some embodiments of the present application, a gap is provided between the frame 1 and the main board 2, and the connection board 4 is disposed at the gap.

In this embodiment, a gap is formed between the main board 2 and the frame 1, and the connection board 4 is disposed at the gap, so that the first antenna 3 on the frame 1 is electrically connected to the main board 2, and the length of the connection board 4 can be reduced, thereby shortening the path of the whole loop.

Alternatively, the connection plate 4 connects the ground 10 and the main board 2 at a gap.

Alternatively, all of the connection plates 4 are disposed at the gaps, so that both ends of the connection plates 4 are directly electrically connected to the ground portion 10 and the first antenna 3, respectively, or both ends of the connection plates 4 are electrically connected to the ground portion 10 and the first antenna 3, respectively, through other electrical connection structures.

Alternatively, a part of the connection board 4 is provided at a gap, for example, the connection board 4 spans the gap between the frame 1 and the main board 2, and both ends of the connection board 4 are located outside the gap between the frame 1 and the main board 2, and the ground 10 and the first antenna 3 are electrically connected to the connection board 4, respectively.

According to some embodiments of the present application, the main board 2 is provided with a first protruding portion 20, the first protruding portion 20 protrudes in a direction approaching the frame 1, the first antenna 3 is provided with a second protruding portion 30, the second protruding portion 30 protrudes in a direction approaching the main board 2, the feeding point 32 is provided on the second protruding portion 30, and the first protruding portion 20 and the second protruding portion 30 are electrically connected.

In this embodiment, the first protruding portion 20 is provided on the motherboard 2, the second protruding portion 30 is provided on the first antenna 3, and the first protruding portion 20 and the second protruding portion 30 protrude in directions approaching each other, so that the motherboard 2 is electrically connected to the first antenna 3. Specifically, the signal is transmitted from the main board 2 to the first antenna 3 through the first protruding portion 20, and then transmitted from the first antenna 3 to the grounding portion 10 through the connecting plate 4 and the capacitance detecting portion 5 on the connecting plate 4, so as to form a loop.

According to some embodiments of the application, the electronic device further comprises: the spring plate 6, the first protruding portion 20 and the second protruding portion 30 are electrically connected through the spring plate 6.

In this embodiment, the electronic device further comprises a spring 6 for electrically connecting the first protruding portion 20 and the second protruding portion 30, so as to realize signal transmission between the motherboard 2 and the first antenna 3.

Optionally, the first antenna 3 is provided with a feeding point 32 and a grounding point 34, the main board 2 is electrically connected with the feeding point 32 through the elastic sheet 6, and the grounding point 34 is electrically connected with the capacitance detection portion 5.

Specifically, the spring plate 6 is electrically connected to the feeding point 32 of the first antenna 3 through the second protruding portion 30, the capacitance detecting portion 5 is electrically connected to the grounding point 34 of the first antenna 3, a signal is transmitted from the main board 2 to the first antenna 3 through the spring plate 6 and the feeding point 32 of the first antenna 3, and then is transmitted to the grounding portion 10 through the grounding point 34 via the connection board 4 and the capacitance detecting portion 5 on the connection board 4, so as to form a loop. Optionally, a third protruding part is further provided on the first antenna 3, the third protruding part protrudes toward the main board 2, and the connection board 4 is electrically connected with the third protruding part.

As shown in fig. 1, according to some embodiments of the present application, both ends of the connection board 4 are respectively provided with copper exposing portions 40, and the connection board 4 is electrically connected to the first antenna 3 and the ground portion 10 through the copper exposing portions 40, respectively.

In this embodiment, the metal copper foil of the exposed surface at both ends of the connection board 4 forms the exposed copper portion 40, and the connection board 4 connects the first antenna 3 and the ground portion 10 through the exposed copper portion 40, respectively, to realize electrical connection with the first antenna 3 and the ground portion 10, thereby forming a ground return path of the first antenna 3.

According to some embodiments of the present application, the thickness of the copper-exposed portion 40 is 0.03mm or more and 0.05mm or less.

In this embodiment, too thick copper exposing portion 40 affects the overall layout of the electronic device, and thus affects the overall thickness of the electronic device, and too thin copper exposing portion 40 affects the connection strength with first antenna 3 and grounding portion 10, so that the thickness of copper exposing portion 40 is set between 0.03mm and 0.05mm, which not only ensures the connection strength between connecting plate 4 and grounding portion 10 and first antenna 3, but also avoids affecting the overall thickness of the electronic device.

In a specific application, the thickness of the copper-exposed portion 40 is set to any of 0.03mm, 0.04mm, and 0.05 mm.

According to some embodiments of the present application, the copper exposed portions 40 at both ends of the connection board 4 are welded to the first antenna 3 and the ground portion 10, respectively.

In this embodiment, the copper exposing portion 40 at one end of the connection board 4 is welded to the first antenna 3, and the copper exposing portion 40 at the other end of the connection board 4 is welded to the grounding portion 10, so that the connection strength between the connection board 4 and the first antenna 3 and the grounding portion 10 is ensured.

Alternatively, the copper exposing part 40 at one end of the connecting plate 4 is connected with the first antenna 3 by ultrasonic welding or laser welding; the copper exposed portion 40 at the other end of the connection plate 4 is connected to the ground portion 10 by ultrasonic welding or laser welding.

Alternatively, the welding range of the copper-exposed portion 40 to the first antenna 3 is approximately 2mm×2mm. The welding range of the copper-exposed portion 40 and the frame body 1 is approximately 2mm×2mm.

The ground test portion is soldered to the connection board 4 by a surface mount technology (Surface Mounted Technology, SMT).

According to some embodiments of the present application, a portion of the grounding portion 10 is exposed at an edge of the motherboard 2, and the connection board 4 is electrically connected to the portion of the grounding portion 10 exposed at the motherboard 2.

In this embodiment, a part of the grounding portion 10 is exposed at the edge of the motherboard 2, and the connection board 4 can be directly connected to the exposed part of the grounding portion 10, so as to facilitate connection between the connection board 4 and the grounding portion 10, and reduce connection difficulty between the connection board 4 and the grounding portion 10.

Optionally, at least a portion of the grounding portion 10 is exposed to the motherboard 2 along the periphery of the motherboard 2.

Alternatively, the area of the ground 10 is larger than the area of the main board 2.

According to some embodiments of the application, the connection plate 4 comprises a flexible connection plate.

In this embodiment, the connection board 4 is a flexible connection board, and its length design is flexible, and can be connected with the first antenna 3 and the grounding portion 10 at the ideal length design point of the first antenna 3, so that the length of the first antenna 3 does not need to be changed for grounding of the first antenna 3, so as to further ensure the resonant frequency of the first antenna 3, reduce the reflux inductance of the whole loop to the greatest extent, thereby constructing a very short return path of the first antenna 3, and ensuring the performance of the first antenna 3.

According to some embodiments of the application, the first antenna 3 is of unitary construction with the housing 1.

In this embodiment, the first antenna 3 is integrally structured with the housing 1, so that the first antenna 3 is not limited to the space inside the electronic device.

As shown in fig. 1 and 2, according to some embodiments of the present application, the capacitance detecting section 5 includes: the distributed capacitor 50 is arranged on the connecting plate 4, and one end of the distributed capacitor 50 is electrically connected with the first antenna 3; the electromagnetic wave absorption ratio sensor 52 is arranged on the connecting plate 4, one end of the electromagnetic wave absorption ratio sensor 52 is electrically connected with the other end of the distributed capacitor 50, and the other end of the electromagnetic wave absorption ratio sensor 52 is electrically connected with the grounding part 10.

In this embodiment, the capacitance detecting portion 5 includes a distributed capacitance 50 and an electromagnetic wave absorption ratio sensor 52 that are disposed on the connection board 4, one end of the distributed capacitance 50 is electrically connected to the first antenna 3, the distributed capacitance 50 is used for blocking direct current, the first end 70 of the electromagnetic wave absorption ratio sensor 52 is connected to the other end of the distributed capacitance 50, the other end of the electromagnetic wave absorption ratio sensor 52 is electrically connected to the grounding portion 10, so as to form a loop of the first antenna 3, so as to obtain a corresponding capacitance value according to a magnetic field change near the first antenna 3, further determine a contact state between a user and the electronic device, and implement adjustment of radiation power of the first antenna 3 by the main board 2.

Alternatively, one end of the electromagnetic wave absorption ratio sensor 52 is electrically connected to the other end of the distributed capacitor 50, and the other end of the electromagnetic wave absorption ratio sensor 52 is electrically connected to the ground 10 for detecting the capacitance value of the first antenna 3 so that the main board 2 adjusts the radiation power of the first antenna 3.

According to some embodiments of the present application, the capacitance detecting portion 5 is welded to the connection plate 4.

In this embodiment, the capacitance detecting portion 5 is welded to the connection plate 4, and connection of the ground detecting portion to the connection plate 4 is achieved.

According to some embodiments of the application, the electronic device further comprises: the second antenna 7, the second antenna 7 is located in the frame 1, the second antenna 7 includes a first end 70 and a second end 72, the first end 70 is spaced from the first antenna 3, and the grounding portion 10 is connected to the first end 70.

In this embodiment, the electronic device further includes a second antenna 7, the second antenna 7 is disposed on the housing 1 and disconnected from the first antenna 3, and the grounding portion 10 is connected to the second end 72 of the second antenna 7, so that grounding of the second antenna 7 is achieved.

Optionally, the frame 1 is a middle frame of the electronic device.

Optionally, the electronic device includes a cell phone, a tablet computer, a wearable device, and the like.

In a specific application, the electronic equipment provided by the application does not need to design the ground feeding tongue piece, and the high-frequency ground feeding elastic piece in the related technology is removed. A flexible circuit board (Flexible Printed Circuit, FPC) is designed, a distributed capacitor 50 (direct current blocking) and an electromagnetic wave absorption ratio sensor 52 (Specific Absorption Ratesensor, sar-sensor) are welded to the FPC through SMT patches, metal copper foils are leaked from two ends of the FPC, one end of the FPC is welded on a first antenna 3 of a middle frame through ultrasonic welding, the other end of the FPC is welded on a grounding part 10 of the middle frame, the whole grounding return path is not switched through a main board 2, the structure layout is compact, and a very short Sar-sensor high-frequency grounding return path can be constructed. The Sar-sensor can judge the contact state of the user and the mobile phone by detecting the capacitance, if the user's head/body is detected to be close to the mobile phone (such as making a call against the ear or directly putting the mobile phone on the leg to watch the user), the mobile phone is informed, the maximum transmitting power is reduced, and the radiation quantity of the mobile phone is controlled within a safe range, so that the user is protected.

The application can achieve the following advantages:

As shown in fig. 3, the high-frequency grounding is implemented by the PCB according to the scheme in the related art, and the middle frame is implemented by the high-frequency grounding according to the scheme provided by the present application, so that the performance of the first antenna is improved in the scheme provided by the present application. Specifically, the electronic device provided by the application constructs a very short high-frequency ground return path (for example, the ground return path of the first antenna 3), and compared with the construction of the high-frequency path through a main board (Printed Circuit Board, PCB) in the related art, the first antenna 3 in the electronic device provided by the application can be improved by 15% -20% in mid-frequency performance in a comparable manner; the high-frequency performance can be improved by more than 20% by the same ratio.

Compared with the related art, the application is not limited by the layout of the main board 2 and the screw column, the length design of the FPC is flexible, and the inductance of the whole loop is designed to be small by welding the circuit with the main ground nearby at the ideal length point of the first antenna 3 frequency band of the middle frame.

According to the application, the ground-feeding elastic sheet does not need to be designed, the Sar-sensor distributed capacitor 50 and the Sar-sensor are welded on the FPC, the FPC is relatively hard in layout, the layout is relatively flexible, the utilization rate of the PCB can be effectively saved, and the utilization rate of the cloth board is improved.

Specifically, when the electromagnetic wave absorption ratio sensor 52 (Specific Absorption Ratesensor, sar-sensor) is arranged on the metal mobile phone, an FPC is designed, the Sar-sensor distributed capacitor 50 and the Sar-sensor are welded to the FPC through SMT patches, metal copper foils are leaked from two ends of the FPC, the thickness of the copper foils is 0.03mm-0.05mm, the welding area is 2mm multiplied by 2mm through ultrasonic welding (synchronous laser welding), one end of the welding area is welded on the first antenna 3 of the middle frame, the welding position can be flexibly selected, and the other end of the welding area is welded on the main ground (such as the grounding part 10) of the middle frame. The whole ground path is not switched through the main board 2, the structural layout is compact, and the layout limitation of the main board 2 and the screw column is avoided. In addition, the FPC is flexible in length design, and the return inductance of the whole loop can be reduced to the maximum extent by welding the return ground at the ideal length point of the 3-frequency band layout of the first antenna at the distance from the designed straight line of the main ground. Thus, a short Sar-sensor high-frequency return path can be constructed. Such as a global positioning system (Global Position System, GPS), wireless connection (WIRELESS FIDELITY, wifi) antenna.

As shown in fig. 2, the electrical signal of the whole circuit is conducted to the antenna radio frequency device on the main board 2 to emit a current signal, the current passes through the feeding spring piece (e.g. spring piece 6) on the main board 2, the middle frame tongue piece (e.g. second protruding part 30), the first antenna 3, the FPC, the Sarsensor capacitor (dc blocking), the sensor and the middle frame main ground, so as to form a sarsenor antenna loop.

Compared with the related art, in the electronic equipment provided by the application, the whole ground return path of the first antenna 3 is obviously shortened, and the ground return path is not required to be constructed through the main board 2, so that the path is shortened by approximately 7mm, and the conduction inductance of the corresponding ground return path is obviously reduced, thereby achieving the purpose of improving the efficiency of the first antenna 3.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An electronic device, comprising:

A grounding part;

A main board arranged on the grounding part;

a frame body disposed around the main board and the grounding portion;

The first antenna is arranged on the frame body and is arranged at intervals with the grounding part, the first antenna comprises a feed point and a grounding point, and the feed point is electrically connected with the main board;

A connection plate connected between the ground portion and the ground point;

And the capacitance detection part is arranged on the connecting plate and is respectively and electrically connected with the grounding part and the first antenna.

2. The electronic device of claim 1, wherein a gap is provided between the frame and the motherboard, and the connection board is disposed at the gap.

3. The electronic device according to claim 2, wherein a first protruding portion is provided on the main board, the first protruding portion protrudes in a direction approaching the frame, a second protruding portion is provided on the first antenna, the second protruding portion protrudes in a direction approaching the main board, the feeding point is provided on the second protruding portion, and the first protruding portion and the second protruding portion are electrically connected.

4. The electronic device of claim 3, further comprising:

The first protruding part and the second protruding part are electrically connected through the elastic piece.

5. The electronic device according to any one of claims 1 to 4, wherein both ends of the connection board are respectively provided with copper-exposed portions, and the connection board is electrically connected to the first antenna and the ground portion through the copper-exposed portions, respectively.

6. The electronic device according to claim 5, wherein a thickness of the copper-exposed portion is 0.03mm or more and 0.05mm or less.

7. The electronic device according to any one of claims 1 to 4, wherein a portion of the ground portion is exposed at an edge of the motherboard, and the connection board is electrically connected to the portion of the ground portion exposed at the motherboard.

8. The electronic device of any one of claims 1-4, wherein the connection board comprises a flexible connection board.

9. The electronic device according to any one of claims 1 to 4, characterized in that the capacitance detection section includes:

The distributed capacitor is arranged on the connecting plate, and one end of the distributed capacitor is electrically connected with the first antenna;

The electromagnetic wave absorption ratio sensor is arranged on the connecting plate, one end of the electromagnetic wave absorption ratio sensor is electrically connected with the other end of the distributed capacitor, and the other end of the electromagnetic wave absorption ratio sensor is electrically connected with the grounding part.

10. The electronic device of any one of claims 1-4, further comprising:

The second antenna is arranged on the frame body and comprises a first end and a second end, the first end is spaced from the first antenna, and the grounding part is connected with the first end.