CN221089569U - Processing jig for semiconductor component - Google Patents
Processing jig for semiconductor component Download PDFInfo
- Publication number
- CN221089569U CN221089569U CN202323003250.4U CN202323003250U CN221089569U CN 221089569 U CN221089569 U CN 221089569U CN 202323003250 U CN202323003250 U CN 202323003250U CN 221089569 U CN221089569 U CN 221089569U
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- base
- telescopic rod
- fixedly connected
- semiconductor component
- jig
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 239000000428 dust Substances 0.000 claims abstract description 23
- 238000001179 sorption measurement Methods 0.000 claims abstract description 21
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000002699 waste material Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a processing jig for semiconductor components, which belongs to the technical field of processing jigs and comprises a base, wherein an operation table is rotationally arranged on the base, a jig plate is fixedly arranged on the operation table, a round adsorption plate is fixedly arranged at the top end of the jig plate, an air passing groove is formed in the round adsorption plate, a sealing ring is arranged outside the air passing groove on the round adsorption plate, a vacuum machine is connected to the jig plate, a dust removing brush is rotationally arranged on the operation table and is rotationally arranged on the outer side of the jig plate, the height and the length of the dust removing brush are adjustable, a mounting cross beam is slidingly arranged above the operation table, and a cutting mechanism is rotationally arranged on the mounting cross beam.
Description
Technical Field
The utility model belongs to the technical field of processing tools, and particularly relates to a processing tool for a semiconductor component.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, the conductivity is easy to control, the semiconductor can be used as an element material for information processing, and the core units of many electronic products such as computers, mobile phones and digital recorders process information by utilizing the conductivity change of the semiconductor, and common semiconductor materials include silicon, germanium, gallium arsenide and the like.
Debris is generated during semiconductor processing and is accumulated for a long time to easily block some air holes, so that equipment is damaged.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model aims to provide a processing jig for semiconductor components.
The aim of the utility model can be achieved by the following technical scheme:
The processing jig for the semiconductor component comprises a base, wherein an operation table is rotationally arranged on the base, a jig plate is fixedly arranged on the operation table, a circular adsorption plate is fixedly arranged at the top end of the jig plate, an air passing groove is formed in the circular adsorption plate, a sealing ring is arranged outside the air passing groove on the circular adsorption plate, and a vacuum machine is connected to the jig plate;
The dust removing brush is arranged on the operating platform and located on the outer side of the jig plate in a rotating mode, the height and the length of the dust removing brush are adjustable, the mounting cross beam is arranged above the operating platform in a sliding mode, the cutting mechanism is arranged on the mounting cross beam in a rotating mode, and the distance between the cutting mechanism and the mounting cross beam is adjustable.
Further, the base is equipped with rotatable first belt pulley with the operation panel rotation junction, is located the below rotation of first belt pulley on the base and is equipped with the second belt pulley, is connected through the belt between first belt pulley and the second belt pulley, fixedly connected with second motor on the second belt pulley, second motor and base fixed connection.
Further, the number of the gas passing grooves is larger than two.
Further, a cavity is formed among the operating platform, the jig plate and the circular adsorption plate, the cavity is communicated with the air pipe, the air pipe is connected with the vacuum machine, and the vacuum machine is fixedly connected with the base.
Further, the ring gear and the pinion are rotatably arranged on the outer side of the jig plate on the operating platform, the ring gear and the pinion are in meshed transmission, the first motor is connected to the pinion, and the first motor is fixedly connected with the operating platform.
Further, the ring gear is fixedly provided with a support frame, a slide bar is arranged on the support frame in a sliding manner, a connecting seat is rotationally arranged on the slide bar, a first telescopic rod is fixedly arranged on the connecting seat, and the extension end of the first telescopic rod is fixedly connected with the dust removing brush.
Further, the base is provided with a second telescopic rod and a first telescopic cylinder which are symmetrically arranged on two sides of the operating platform, the second telescopic rod and the first telescopic cylinder are fixedly connected with the base, and the output end of the first telescopic cylinder is fixedly connected with the extension end of the second telescopic rod and the mounting cross beam.
Further, the second telescopic cylinder and the third telescopic rod are rotatably arranged on the mounting cross beam, the second telescopic cylinder and the third telescopic rod are coaxially rotated, the third motor is connected to the mounting cross beam, the second telescopic cylinder and the third telescopic rod are simultaneously driven to rotate through the third motor, and the cutting mechanism is fixedly connected to the output end of the second telescopic cylinder and the extension end of the third telescopic rod.
Further, the cutting mechanism is a small-sized cutting machine.
Furthermore, the base is also detachably provided with a screen and a dust collecting groove.
The utility model has the beneficial effects that:
According to the utility model, the operation table, the jig plate, the circular adsorption plate and the vacuum source are arranged, the semiconductor workpiece is adsorbed on the operation table by utilizing negative pressure, meanwhile, the sealing ring is arranged on the circular adsorption plate, so that the adsorption effect is better, the dust removing brush is rotationally arranged on the outer side of the jig plate and used for removing powder scraps remained on the surface of the cut semiconductor workpiece, the scraps are prevented from entering the cavity through the air groove, the height of the dust removing brush is adjustable, the height of the dust removing brush can be adjusted according to the thickness of the workpiece, the dust removing brush is suitable for workpieces without thickness, the dust removing brush can be rotated for 180 degrees during cutting operation, the influence on a cutting machine is avoided, and meanwhile, the detachable screen mesh is arranged on the base and used for collecting the cut waste, so that the waste is collected and reused.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to those skilled in the art that other drawings can be obtained according to these drawings without inventive effort.
FIG. 1 is a schematic diagram I of the overall structure of the present utility model;
FIG. 2 is an enlarged schematic view of the structure of part A of the present utility model;
FIG. 3 is a schematic diagram II of the overall structure of the present utility model;
Fig. 4 is a cross-sectional view of the internal cavity of the present utility model.
The reference numerals in the figures illustrate: 1. a base; 2. an operation table; 3. a jig plate; 4. a circular adsorption plate; 5. a gas passing groove; 6. a ring gear; 7. a pinion gear; 8. a first motor; 9. a gas pipe; 10. a vacuum machine; 11. a first pulley; 12. a belt; 13. a second motor; 14. a first telescopic cylinder; 15. a second telescopic rod; 16. mounting a cross beam; 17. a second telescopic cylinder; 18. a third telescopic rod; 19. a cutting mechanism; 20. a third motor; 21. a support frame; 22. a slide bar; 23. a connecting seat; 24. a first telescopic rod; 25. a dust removing brush; 26. a screen; 27. a dust collection tank; 28. a cavity; 29. and (3) sealing rings.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "open," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like indicate orientation or positional relationships, merely for convenience in describing the present utility model and to simplify the description, and do not indicate or imply that the components or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
As shown in fig. 1, a processing fixture for semiconductor components comprises a base 1, wherein an operation table 2 is rotationally arranged on the base 1, a rotatable first belt pulley 11 is arranged at a rotational connection position of the base 1 and the operation table 2, a second belt pulley is rotationally arranged below the first belt pulley 11 on the base 1, the first belt pulley 11 and the second belt pulley are connected through a belt 12, a second motor 13 is fixedly connected to the second belt pulley, and the second motor 13 is fixedly connected with the base 1.
As shown in fig. 4, a jig plate 3 is fixedly arranged on the operating platform 2, and the jig plate 3 is specifically of an internal hollow structure. The circular adsorption plate 4 is fixedly arranged at the top end of the jig plate 3, a plurality of air passing grooves 5 are formed in the circular adsorption plate 4, sealing rings 29 are arranged outside the air passing grooves 5 on the circular adsorption plate 4, a cavity 28 is formed among the operating platform 2, the jig plate 3 and the circular adsorption plate 4, the cavity 28 is communicated with the air pipe 9, the air pipe 9 is connected with the vacuum machine 10, and the vacuum machine 10 is fixedly connected with the base 1.
As shown in fig. 1-2, a ring gear 6 and a pinion 7 are rotatably arranged on the outer side of the jig plate 3 on the operating platform 2, the ring gear 6 and the pinion 7 are in meshed transmission, a first motor 8 is connected on the pinion 7, the first motor 8 is fixedly connected with the operating platform, a supporting frame 21 is fixedly arranged on the ring gear 6, a sliding rod 22 is slidably arranged on the supporting frame 21, a connecting seat 23 is rotatably arranged on the sliding rod 22, a first telescopic rod 24 is fixedly arranged on the connecting seat 23, and a dust removing brush 25 is fixedly arranged at the extension end of the first telescopic rod 24.
The base 1 is further symmetrically provided with a second telescopic rod 15 and a first telescopic cylinder 14 on two sides of the operating platform 2, the second telescopic rod 15 and the first telescopic cylinder 14 are fixedly connected with the base 1, the output end of the first telescopic cylinder 14 and the extension end of the second telescopic rod 15 are fixedly connected with a mounting cross beam 16, the mounting cross beam 16 is rotationally provided with a second telescopic cylinder 17 and a third telescopic rod 18, the second telescopic cylinder 17 and the third telescopic rod 18 are coaxially rotated, the mounting cross beam 16 is connected with a third motor 20, the second telescopic cylinder 17 and the third telescopic rod 18 are simultaneously driven to rotate through the third motor 20, the output end of the second telescopic cylinder 17 and the extension end of the third telescopic rod 18 are fixedly connected with a cutting mechanism 19, and the cutting mechanism 19 can be a small-sized cutting machine.
As shown in fig. 3, the base 1 is further detachably provided with a screen 26 and a dust collecting groove 27, the dust collecting groove 27 is located below the screen 26, and the detachable connection mode may be a clamping connection, a hooking connection, a threaded connection, or the like.
When the vacuum machine is used, a round semiconductor workpiece is placed on the round adsorption plate 4, the vacuum machine 10 is started after the round semiconductor workpiece is placed, the vacuum machine 10 pumps vacuum in the cavity 28, the semiconductor workpiece is adsorbed on the round adsorption plate 4, the sealing ring 29 can further play a sealing role, the negative pressure suction effect is better, the semiconductor workpiece is prevented from falling, the mounting beam 16 is lowered through the first telescopic cylinder 14 after the workpiece is fixed, the length of the second telescopic cylinder 17 is adjusted, the cutting mechanism 19 is used for cutting the edge of the workpiece, the cutting mechanism 19 can be driven to rotate through the third motor 20, the edge of the semiconductor workpiece is cut, and the mounting beam 16 is retracted upwards after the cutting is completed.
The second motor 13 works to drive the operation table 2 to rotate a certain angle, cut waste is poured into the screen 26, small-sized scraps enter the screen 26 to fall into the dust collection groove 27, and the operation table 2 returns to the original position.
Then the first motor 8 drives the ring gear 6 to rotate, the dust removing brush 25 fixedly connected with the ring gear 6 moves circularly along with the ring gear, powder waste adhered to the surface of a workpiece is removed, the cut powder waste is prevented from falling into the air passing groove 5, the dust removing brush 25 can slide up and down and simultaneously rotate, the up and down sliding and the rotation are in damping fit, no external force is exerted, and the relative fixed state can be maintained.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (10)
1. The utility model provides a processing tool of semiconductor components, its characterized in that includes base (1), rotates on base (1) and is equipped with operation panel (2), is fixedly equipped with tool board (3) on operation panel (2), and tool board (3) top is fixedly equipped with circular adsorption plate (4), has seted up on circular adsorption plate (4) and has crossed air groove (5), is located on circular adsorption plate (4) and crosses air groove (5) and be equipped with sealing washer (29) outward, is connected with vacuum machine (10) on tool board (3);
The dust removing brush (25) is rotationally arranged on the outer side of the jig plate (3) on the operating platform (2), the height and the length of the dust removing brush (25) are adjustable, the mounting cross beam (16) is slidably arranged above the operating platform (2), the cutting mechanism (19) is rotationally arranged on the mounting cross beam (16), and the distance between the cutting mechanism (19) and the mounting cross beam (16) is adjustable.
2. The processing jig of the semiconductor component according to claim 1, wherein a rotatable first belt pulley (11) is arranged at the rotating connection part of the base (1) and the operating platform (2), a second belt pulley is rotatably arranged below the first belt pulley (11) on the base (1), the first belt pulley (11) is connected with the second belt pulley through a belt (12), a second motor (13) is fixedly connected to the second belt pulley, and the second motor (13) is fixedly connected with the base (1).
3. A processing jig for semiconductor components according to claim 1, characterized in that the number of said gas passing grooves (5) is greater than two.
4. A semiconductor component processing jig according to claim 1, characterized in that a cavity (28) is formed between the operating table (2), the jig plate (3) and the circular adsorption plate (4), the cavity (28) is communicated with a gas pipe (9), the gas pipe (9) is connected with a vacuum machine (10), and the vacuum machine (10) is fixedly connected with the base (1).
5. The semiconductor component processing jig according to claim 1, wherein the operating table (2) is provided with a ring gear (6) and a pinion (7) in a rotating manner on the outer side of the jig plate (3), the ring gear (6) and the pinion (7) are in meshed transmission, the pinion (7) is connected with a first motor (8), and the first motor (8) is fixedly connected with the operating table.
6. The processing jig of a semiconductor component according to claim 5, wherein a supporting frame (21) is fixedly arranged on the ring gear (6), a sliding rod (22) is slidably arranged on the supporting frame (21), a connecting seat (23) is rotatably arranged on the sliding rod (22), a first telescopic rod (24) is fixedly arranged on the connecting seat (23), and the extension end of the first telescopic rod (24) is fixedly connected with the dust removing brush (25).
7. The processing jig of the semiconductor component according to claim 1, wherein the base (1) is further symmetrically provided with a second telescopic rod (15) and a first telescopic cylinder (14) at two sides of the operating platform (2), the second telescopic rod (15) and the first telescopic cylinder (14) are fixedly connected with the base (1), and the output end of the first telescopic cylinder (14) and the extension end of the second telescopic rod (15) are fixedly connected with the mounting cross beam (16).
8. The processing jig of a semiconductor component according to claim 1, wherein the mounting beam (16) is rotatably provided with a second telescopic cylinder (17) and a third telescopic rod (18), the second telescopic cylinder (17) and the third telescopic rod (18) are coaxially rotated, the mounting beam (16) is connected with a third motor (20), the second telescopic cylinder (17) and the third telescopic rod (18) are simultaneously driven to rotate by the third motor (20), and a cutting mechanism (19) is fixedly connected with an output end of the second telescopic cylinder (17) and an extension end of the third telescopic rod (18).
9. A semiconductor component processing tool according to claim 8, wherein the cutting mechanism (19) is a mini-cutter.
10. A semiconductor component processing jig according to claim 1, characterized in that the base (1) is detachably provided with a screen (26) and a dust collection groove (27).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323003250.4U CN221089569U (en) | 2023-11-03 | 2023-11-03 | Processing jig for semiconductor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323003250.4U CN221089569U (en) | 2023-11-03 | 2023-11-03 | Processing jig for semiconductor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221089569U true CN221089569U (en) | 2024-06-07 |
Family
ID=91305142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323003250.4U Active CN221089569U (en) | 2023-11-03 | 2023-11-03 | Processing jig for semiconductor component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221089569U (en) |
-
2023
- 2023-11-03 CN CN202323003250.4U patent/CN221089569U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |