CN221086226U - TFT seals quick curing system of gluing - Google Patents
TFT seals quick curing system of gluing Download PDFInfo
- Publication number
- CN221086226U CN221086226U CN202321983421.1U CN202321983421U CN221086226U CN 221086226 U CN221086226 U CN 221086226U CN 202321983421 U CN202321983421 U CN 202321983421U CN 221086226 U CN221086226 U CN 221086226U
- Authority
- CN
- China
- Prior art keywords
- tft
- assembly line
- fan
- encapsulation
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004026 adhesive bonding Methods 0.000 title description 2
- 238000009434 installation Methods 0.000 claims abstract description 10
- 238000007605 air drying Methods 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000012956 testing procedure Methods 0.000 claims abstract description 6
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 abstract description 12
- 238000007789 sealing Methods 0.000 abstract description 12
- 239000010409 thin film Substances 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 5
- 235000004692 Eucalyptus globulus Nutrition 0.000 description 1
- 240000007002 Eucalyptus tereticornis Species 0.000 description 1
- 235000019134 Eucalyptus tereticornis Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a TFT (thin film transistor) sealing and quick curing system, which comprises: the air drying units are arranged on the production line before the testing procedure; the air drying unit includes: the installation rack is inclined relative to the assembly line, and the fan is installed on the installation rack, so that the air outlet surface of the fan is arranged at a preset angle relative to the assembly line. The utility model increases a plurality of high-speed fans on the assembly line from the glue sealing to the testing procedure, maintains a specific angle, accelerates the curing efficiency while meeting the improvement of the appearance yield of the product, improves the working efficiency of the production line and reduces the manufacturing cost.
Description
Technical Field
The utility model relates to the technical field of TFT (thin film transistor) sealing glue curing, in particular to a TFT sealing glue rapid curing system.
Background
In order to improve the condition that a finger touches an ITO line of an LCD to cause corrosion of the ITO line in the manual operation process of the TFT (liquid crystal display module), the LCD is subjected to sealing protection by sealing blue glue of an ITO terminal, and then a test process is carried out, but in the actual process, the blue glue of the ITO is damaged secondarily by a tester and the condition that the test waits for a long time due to incomplete curing of the sealing glue is caused, so that the efficiency is low.
Disclosure of utility model
The utility model aims to provide a TFT (thin film transistor) sealing and quick curing system for solving the technical problems in the background technology.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
A TFT encapsulant rapid cure system comprising: the air drying units are arranged on the production line before the testing procedure; the air drying unit includes: the installation rack is inclined relative to the assembly line, and the fan is installed on the installation rack, so that the air outlet surface of the fan is arranged at a preset angle relative to the assembly line.
In some embodiments, the mounting frames are disposed on either side of the pipeline.
In some embodiments, the mounting brackets on the two sides are symmetrically arranged relative to the pipeline.
In some embodiments, the mount is inclined at an angle of 40 ° to the pipeline.
In some embodiments, the mounting brackets on both sides of the assembly line are spaced apart.
In some embodiments, the mounting frame is 8-15cm high relative to the pipeline.
Compared with the prior art, the utility model has the following beneficial effects:
The utility model increases a plurality of high-speed fans on the production line from the glue sealing to the testing procedure, maintains a specific angle, accelerates the curing efficiency while meeting the improvement of the appearance yield of the product, improves the working efficiency of the production line, reduces the manufacturing cost-!
Drawings
Fig. 1 is a schematic structural view of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the preferred embodiments of the present application will be described in more detail with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of the application. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be fixedly connected, or indirectly connected through intermediaries, for example, or may be in communication with each other between two elements or in an interaction relationship between the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present application, it should be understood that the terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship of the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or display that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or display.
A TFT sealing compound rapid curing system according to an embodiment of the present application will be described in detail below with reference to fig. 1. It is noted that the following examples are only for explaining the present application and are not to be construed as limiting the present application.
Example 1:
as shown in fig. 1, a TFT encapsulation rapid curing system includes: the air drying units are arranged on the assembly line 1 before the testing procedure; the air drying unit includes: the installation frame 2 and the fan 3, the installation frame sets up with respect to the pipeline slope, and the fan is installed on the installation frame, make the air-out face of fan is the relative pipeline setting of preset angle.
After the product is sealed through the upstream point gum machine, the product flows to the blanking assembly line, when the product moves on the assembly line, the high-speed fan inclines and is cooled by strong wind, after the blue gum is air-dried through a plurality of high-pressure fans in succession, a test operator can directly take the product for testing, and the test efficiency of the product is improved.
The tilting outward 40 degree process is performed because blue glue may be caused to flow upward to the POL side of the LCD during the wind pressure process. Simultaneously, will the mounting bracket sets up in the both sides of assembly line respectively, the mounting bracket of both sides sets up relative assembly line symmetry, the inclination of mounting bracket relative assembly line is 40. The height of the mounting frame relative to the assembly line is 8-15cm. The height of the outlet wind of the fan from the assembly line is 8-15cm. Preferably 10cm. And the adjustment is slightly carried out according to different products. Therefore, when the TFT sealing glue is quickly cured by using the high-speed fan, blue glue cannot flow to the POL surface of the LCD, so that the directions of the wind at two sides are opposite. Of course, more preferable technical scheme is that the installation racks on two sides of the assembly line are arranged at intervals. Therefore, the rapid solidification of the TFT sealing glue can be further realized, and meanwhile, blue glue is prevented from flowing to the POL surface of the LCD.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (6)
1. A TFT encapsulation rapid cure system, comprising: the air drying units are arranged on the production line before the testing procedure; the air drying unit includes: the installation rack is inclined relative to the assembly line, and the fan is installed on the installation rack, so that the air outlet surface of the fan is arranged at a preset angle relative to the assembly line.
2. The TFT encapsulation rapid cure system of claim 1, wherein the mounting frames are disposed on each side of the assembly line.
3. The TFT encapsulation rapid cure system of claim 2, wherein the mounting frames on both sides are symmetrically disposed with respect to the assembly line.
4. A TFT encapsulation rapid cure system according to any one of claims 1 to 3, wherein the mounting frame is inclined at an angle of 40 ° to the line.
5. The TFT encapsulation rapid cure system of claim 2, wherein the mounting frames on both sides of the assembly line are spaced apart.
6. The TFT encapsulation rapid cure system of claim 4, wherein the mounting frame has a height of 8-15cm relative to the line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321983421.1U CN221086226U (en) | 2023-07-26 | 2023-07-26 | TFT seals quick curing system of gluing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321983421.1U CN221086226U (en) | 2023-07-26 | 2023-07-26 | TFT seals quick curing system of gluing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221086226U true CN221086226U (en) | 2024-06-07 |
Family
ID=91329295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321983421.1U Active CN221086226U (en) | 2023-07-26 | 2023-07-26 | TFT seals quick curing system of gluing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221086226U (en) |
-
2023
- 2023-07-26 CN CN202321983421.1U patent/CN221086226U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |