CN221079954U - Silicon wafer bearing device - Google Patents

Abstract

The application discloses a silicon wafer bearing device, which comprises a bearing basket and a pressing cover, wherein the bearing basket is provided with an inner cavity, an opening and a plurality of perforations, the inner cavity is used for accommodating silicon wafers, the opening and the perforations are communicated with the inner cavity and penetrate through the outer surface of the bearing basket, a plurality of clamping grooves are formed in at least part of the inner wall of the bearing basket at intervals, the silicon wafers are respectively inserted into the clamping grooves, a first gap is reserved between the side wall of the clamping groove and the silicon wafers, the pressing cover is detachably arranged on the opening and presses each silicon wafer, and two opposite ends of each silicon wafer are respectively abutted against the pressing cover and the inner bottom wall of the bearing basket. The scheme can solve the problem that the silicon wafer bearing device related to the related technology has the technical effect that the silicon wafer is difficult to erode by the liquid medicine because part of the etched surface of the silicon wafer is clamped by the clamping structure.

Description

Silicon wafer bearing device

Technical Field

The application belongs to the technical field of manufacturing and design of photovoltaic modules, and particularly relates to a silicon wafer bearing device.

Background

The silicon wafer bearing device is a device for bearing silicon wafers. In the corrosion process of the silicon wafer, a plurality of clamping grooves are arranged in the silicon wafer bearing device at intervals, so that the silicon wafers are placed in the silicon wafer bearing device at intervals through the clamping grooves, and each silicon wafer can be etched by the liquid medicine, so that the process efficiency is improved. Meanwhile, the clamping groove is arranged to clamp the silicon wafer, so that the silicon wafer is prevented from being easily damaged due to shaking in the process. However, when the silicon wafer is clamped in the structure, the end part of the silicon wafer is opposite to the bottom wall of the clamping groove, and the etched surface of the silicon wafer is opposite to the side wall of the clamping groove, so that part of the etched surface of the silicon wafer is tightly attached to the side wall of the clamping groove and is difficult to be etched by the liquid medicine, and the etched surface of the silicon wafer is difficult to be completely etched, so that the technological effect is affected.

Disclosure of utility model

The utility model discloses a silicon wafer bearing device, which aims to solve the problem that the process effect of a silicon wafer is affected because part of the etched surface of the silicon wafer is clamped by a clamping structure and is difficult to be etched by liquid medicine in the silicon wafer bearing device related to the related technology.

In order to solve the technical problems, the utility model provides the following technical scheme:

a silicon wafer bearing device comprises a bearing basket and a gland, wherein,

The bearing basket is provided with an inner cavity, an opening and a plurality of perforations, the inner cavity is used for accommodating silicon wafers, the opening and the perforations are communicated with the inner cavity and penetrate through the outer surface of the bearing basket, a plurality of clamping grooves are formed in at least part of the inner wall of the bearing basket at intervals, the silicon wafers are respectively inserted into the clamping grooves, a first gap is formed between the side wall of the clamping groove and the silicon wafers,

The pressing cover is detachably arranged on the opening and presses each silicon wafer, so that two opposite ends of each silicon wafer are respectively abutted against the pressing cover and the inner bottom wall of the bearing basket.

The technical scheme adopted by the utility model can achieve the following technical effects:

According to the silicon wafer bearing device disclosed by the embodiment of the application, the structure of the silicon wafer bearing device related to the related technology is improved, the pressing cover is arranged, the clamping grooves are formed in at least part of the inner wall of the bearing basket at intervals, the silicon wafers are respectively inserted into the clamping grooves of the inner cavity of the bearing basket, so that the silicon wafers can be distributed in the inner cavity at intervals, the first gap is arranged between the side wall of the clamping groove and the silicon wafers, the side wall of the clamping groove is prevented from being tightly attached to part of the etching surface of the silicon wafers, meanwhile, the pressing cover is arranged at the opening of the bearing basket in a detachable mode, each silicon wafer can be pressed, and therefore two opposite ends of each silicon wafer are respectively abutted to the pressing cover and the inner bottom wall of the bearing basket, and the plurality of through holes are formed in the bearing basket, so that the opening and the plurality of through holes are communicated with the inner cavity and penetrate through the outer surface of the bearing basket, and chemical liquid can enter the inner cavity to etch the silicon wafers. In this kind of structure, the first clearance between draw-in groove's lateral wall and the silicon chip makes the draw-in groove can not press from both sides tight silicon chip, avoids the part of silicon chip to soak the etching surface and the lateral wall of draw-in groove closely laminating together, and leads to the part of silicon chip to soak the etching surface and be difficult to by the liquid medicine etching, simultaneously, the opposite both ends of silicon chip respectively with gland and bear the weight of the interior diapire butt of basket to can avoid influencing the etching surface of silicon chip when realizing that the silicon chip is fixed, make the silicon chip in fixed its etching surface can all be corroded simultaneously, avoid influencing the technological effect of silicon chip as far as possible.

Drawings

FIG. 1 is an assembly view of a silicon wafer carrier disclosed in an embodiment of the present application;

FIG. 2 is a cross-sectional view of a gland as disclosed in an embodiment of the present application;

FIG. 3 is a block diagram of a carrier basket according to an embodiment of the present application.

Reference numerals illustrate:

100-bearing basket, 110-inner cavity, 120-opening, 130-perforation, 140-clamping groove, 150-sliding groove, 160-second mounting plate 170-third mounting plate, 180-connecting rod, 181-first connecting rod, 182-second connecting rod, 183-third connecting rod, 184-second protrusion,

200-Gland, 210-gland body, 211-guide bar, 220-first mounting plate, 221-recess, 222-threaded hole, 223-first protrusion, 224-guide hole, 230-threaded rod, 231-threaded rod body, 232-rotary operating handle.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to specific embodiments of the present utility model and corresponding drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The technical scheme disclosed by each embodiment of the utility model is described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 3, an embodiment of the present application discloses a silicon wafer carrying device, which includes a carrying basket 100 and a pressing cover 200.

The carrier basket 100 is used for carrying silicon wafers. The carrier basket 100 has an inner cavity 110, an opening 120 and a plurality of perforations 130, the inner cavity 110 is used for accommodating a silicon wafer, the opening 120 and the plurality of perforations 130 are communicated with the inner cavity 110 and penetrate to the outer surface of the carrier basket 100, so that the liquid medicine can enter the inner cavity 110 through the opening 120 and the plurality of perforations 130, and the silicon wafer is etched. The bearing basket 100 is provided with a plurality of clamping grooves 140 at intervals on at least part of the inner wall, a plurality of silicon wafers are respectively inserted into the clamping grooves 140, and a first gap is reserved between the side wall of the clamping groove 140 and the silicon wafers, so that the clamping grooves 140 are prevented from clamping the silicon wafers under the condition that the silicon wafers are inserted into the clamping grooves 140, and the situation that part of the etching surfaces of the silicon wafers are tightly attached to the side wall of the clamping groove 140, so that the part of the etching surfaces of the silicon wafers are difficult to be etched by liquid medicine is avoided.

The capping 200 is a core member that realizes fixation of the silicon wafer. The pressing cover 200 is detachably mounted on the opening 120, and compresses each silicon wafer, so that two opposite ends of each silicon wafer are respectively abutted against the pressing cover 200 and the inner bottom wall of the bearing basket 100, and a plurality of silicon wafer clamps are fixed between the pressing cover 200 and the inner bottom wall of the bearing basket 100, so that the silicon wafers are prevented from being easily damaged due to shaking in the process. Specifically, the gland 200 may be detachably mounted to the opening 120 by screwing or clamping, which is not limited in this embodiment of the present application. The inner bottom wall of the carrier basket 100 is opposite to the opening 120.

In embodiments of the present application, the gland 200 may partially cover the opening 120 to allow the medical fluid to more quickly enter the interior cavity 110. Of course, the gland 200 may also completely cover the opening 120, so that the contact area between the gland 200 and the end of the silicon wafer can be increased, and the gland 200 can more stably compress the silicon wafer.

According to the silicon wafer carrying device disclosed by the embodiment of the application, through improving the structure of the silicon wafer carrying device related to the related art, by arranging the gland 200 and arranging the plurality of clamping grooves 140 on at least part of the inner wall of the carrying basket 100 at intervals, the plurality of silicon wafers are respectively inserted into the plurality of clamping grooves 140 of the inner cavity 110 of the carrying basket 100, so that the plurality of silicon wafers can be distributed in the inner cavity 110 at intervals, and by arranging the first gap between the side wall of the clamping groove 140 and the silicon wafers, the side wall of the clamping groove 140 is prevented from being tightly adhered to part of the etching surface of the silicon wafers, and meanwhile, when the gland 200 is arranged at the opening 120 of the carrying basket 100, each silicon wafer can be tightly pressed, so that two opposite ends of each silicon wafer are respectively abutted against the gland 200 and the inner bottom wall of the carrying basket 100, and by arranging the plurality of through holes 130 on the carrying basket 100, the opening 120 and the plurality of through holes 130 are communicated with the inner cavity 110 and all penetrate through the outer surface of the carrying basket 100, so that liquid medicine can enter the inner cavity 110 through the through holes 130 and the opening 120 to etch the silicon wafers 110.

In this structure, the first gap between the side wall of the clamping groove 140 and the silicon wafer makes the clamping groove 140 not clamp the silicon wafer, so that the situation that the part of the etching surface of the silicon wafer is tightly attached to the side wall of the clamping groove 140 and is difficult to be etched by the liquid medicine is avoided, meanwhile, the opposite two ends of the silicon wafer are respectively abutted against the gland 200 and the inner bottom wall of the bearing basket 100, so that the etching surface of the silicon wafer is prevented from being influenced while the silicon wafer is fixed, and the etching surface of the silicon wafer is prevented from being etched completely while the silicon wafer is fixed, so that the technological effect of the silicon wafer is prevented from being influenced as much as possible.

In a further technical solution, the gland 200 may include a gland body 210, a first mounting plate 220 and a threaded rod 230, the first mounting plate 220 may be detachably mounted on the opening 120, the first mounting plate 220 may have a groove 221 and a threaded hole 222, the groove 221 may be opposite to the inner cavity 110, and the gland body 210 may be movably disposed in the groove 221, so as to avoid that the gland body 210 is easily deviated during the movement and is difficult to compress a plurality of silicon wafers. The threaded bore 222 may be in communication with the recess 221 and threadedly engaged with the threaded rod 230 such that the threaded rod 230 may be able to enter the recess 221 through the threaded bore 222, wherein the length of the threaded rod 230 extending into the recess 221 may be adjusted by rotating the threaded rod 230 such that the gland 200 may be converted between the compressed and decompressed states by rotating the threaded rod 230.

In a specific operation, in the state that the gland 200 is compressed, the threaded rod 230 passes through the threaded hole 222 toward the end of the inner bottom wall of the carrier basket 100 to collide with the gland body 210, so that the gland body 210 compresses each silicon wafer, that is, the threaded rod 230 extends into the groove 221 toward the end of the inner bottom wall of the carrier basket 100 and compresses the gland body 210, so that the gland body 210 compresses each silicon wafer, and opposite ends of each silicon wafer respectively abut against the gland body 210 and the inner bottom wall of the carrier basket 100.

In the decompressed state of the gland 200, the end of the threaded rod 230 facing the inner bottom wall of the carrier basket 100 is separated from the gland body 210, and the gland body 210 is not compressed by the threaded rod 230, so that the gland body 210 can move, and the silicon wafer in the inner cavity 110 is in a fixed state. At this time, the silicon wafer can be taken out by sequentially removing the first mounting plate 220 and the capping body 210.

In this structure, since the groove 221 is formed in the first mounting plate 220, a certain gap is formed between the first mounting plate 220 and the silicon wafer, and the gland 200 can be adjusted to a decompressed state when the gland 200 is mounted or dismounted, so that the problem that the silicon wafer is damaged due to the fact that the first mounting plate 220 is easy to strike the silicon wafer or the first mounting plate 220 is easy to transmit vibration to the gland body 210 due to vibration when the gland 200 is dismounted can be solved.

In order to avoid tilting of the gland body 210 when moving in the groove 221, the first mounting plate 220 may have a guide hole 224, the gland body 210 may have a guide bar 211, and the guide bar 211 may be slidably matched with the guide hole 224 along a penetrating direction of the guide hole 224, so that the motion of the gland body 210 can be guided by the matching of the guide bar 211 and the guide hole 224, and of course, the guide bar 211 may be limitedly matched with the guide hole 224 along a radial direction of the guide hole 224, so as to avoid shaking of the guide bar 211 during the motion process and avoid tilting of the gland body 210, and further avoid the situation that the threaded rod 230 easily compresses the tilted gland body 210 while guiding the motion of the gland body 210, so that the gland body 210 impacts a plurality of silicon wafers to cause the breakage of the plurality of silicon wafers.

Of course, the guide holes 224 and the guide rods 211 may be plural, and the guide rods 211 may be slidably matched with the guide holes 224 in a one-to-one correspondence, so as to guide the movement of the gland body 210 more stably, and avoid that the gland body 210 swings around the guide rods 211 during the movement to be difficult to compress all silicon wafers.

To facilitate rotation of the threaded rod 230, the threaded rod 230 may include a threaded rod body 231 and a rotary operating handle 232, the threaded rod body 231 may be threadably engaged with the threaded bore 222, and the rotary operating handle 232 may be secured to an end of the threaded rod body 231 facing away from the inner bottom wall of the carrier basket 100. This structure enables the rotation of the threaded rod body 231 by rotating the rotary operation handle 232, thereby facilitating the application of force by the user, and making it easier for the user to rotate the threaded rod 230.

In a preferred embodiment, the gland 200 may further include a slider, the first mounting plate 220 may have a first protrusion 223, the first protrusion 223 may be disposed at two opposite ends of the first mounting plate 220 and may form a sidewall of the groove 221, the slider may be fixed to the first protrusion 223, the carrier basket 100 may have a chute 150, the chute 150 may be disposed on the opposite sidewall of the carrier basket 100, and two ends of the chute 150 may respectively penetrate through an inner surface and an outer surface of the sidewall of the carrier basket 100, so as to avoid blocking the sliding of the slider in the chute 150, and enable the slider to slide out of the chute 150, thereby removing the first mounting plate 220 from the opening 120.

The chute 150 may be matched with the shape of the slider so that the first mounting plate 220 can be stably mounted at the opening 120, avoiding the difficulty in fixing the silicon wafer due to shaking of the first mounting plate 220. Meanwhile, the sliding block may be slidably matched with the sliding groove 150 along the penetrating direction of the sliding groove 150, so as to realize the disassembly and assembly of the first mounting plate 220 by sliding the sliding block in the sliding groove 150 along the penetrating direction of the sliding groove 150, specifically, when the first mounting plate 220 is mounted at the opening 120, the sliding block is positioned in the sliding groove 150, and by pushing the first mounting plate 220 along the penetrating direction of the sliding groove 150, the sliding block can slide out of the sliding groove 150, so that the first mounting plate 220 is disassembled from the opening 120.

In addition, the sliding block can be in limit fit with the sliding groove 150 along the notch direction of the sliding groove 150, so that the first mounting plate 220 is prevented from moving along the direction parallel to the notch direction of the sliding groove 150 under the condition that the first mounting plate 220 is mounted at the opening 120, and the threaded rod 230 is prevented from being difficult to abut against the cap body 210 due to the fact that the threaded rod 230 is prevented from being driven to move when the threaded rod 230 is rotated.

As described above, the first mounting plate 220 with such a structure can realize the quick assembly and disassembly of the first mounting plate 220 through the sliding fit of the sliding block and the sliding chute 150, thereby being beneficial to improving the working efficiency. Of course, the first mounting plate 220 may also be detachably mounted to the opening 120 by a threaded connection, and the specific mounting manner of the first mounting plate 220 is not limited in the embodiments of the present application.

In one possible technical solution, the slider may be a trapezoidal slider. The width direction of the trapezoidal sliding block may be perpendicular to the penetrating direction of the sliding groove 150 and the notch direction, and the width of the trapezoidal sliding block may be gradually increased from a direction close to the first mounting plate 220 to a direction far away from the first mounting plate 220, so that the sliding block is in limit fit with the sliding groove 150 along the notch direction of the sliding groove 150. Of course, the slider may also be a dovetail slider or a T-shaped slider, and the embodiment of the present application does not limit the specific shape of the slider.

In a more preferred embodiment, the silicon wafers may be arranged in the inner cavity 110 along a direction parallel to the penetrating direction of the chute 150, and of course, the alignment direction of the clamping groove 140 may be parallel to the penetrating direction of the chute 150. Specifically, when the first mounting plate 220 is assembled and disassembled, the slider on one side of the first mounting plate 220 is located in the inner cavity 110, and in order to avoid the slider from colliding with the silicon wafer to cause the silicon wafer to break, a second gap needs to be provided between the silicon wafer and the inner surface of the side wall of the carrier basket 100 provided with the chute 150 to accommodate the slider.

Specifically, the second gap between the silicon wafer and the inner surface of the sidewall of the carrier basket 100 provided with the chute 150 may be adjusted by adjusting the loading number of the silicon wafer, so that the second gap can be flexibly set according to actual demands. Of course, a third gap may be provided between the clamping groove 140 and the inner surface of the side wall of the carrying basket 100 provided with the sliding groove 150, so that a second gap is provided between the silicon wafer inserted in the clamping groove 140 and the inner surface of the side wall of the carrying basket 100 provided with the sliding groove 150, and the silicon wafer is prevented from being broken due to collision between the sliding block and the silicon wafer when the first mounting plate 220 is dismounted as much as possible.

In an embodiment of the present application, the carrier basket 100 may have a second mounting plate 160, a third mounting plate 170, and a link 180, and the link 180 may include a first link 181, a second link 182, a third link 183, and a plurality of second protrusions 184. The first ends of the first, second and third links 181, 182 and 183 may be fixedly connected to the second mounting plate 160, and the second ends of the first, second and third links 181, 182 and 183 may be fixedly connected to the third mounting plate 170, that is, the second and third mounting plates 160 and 170 are disposed at both ends of the first, second and third links 181, 182 and 183, respectively, to form opposite sidewalls of the carrier basket 100.

The first and second links 181 and 182 may be disposed opposite to form two other opposing sidewalls of the carrier basket 100, with the sidewalls of the carrier basket 100 formed by the first and second links 181 and 182 being adjacent to the sidewalls of the carrier basket 100 formed by the second and third mounting plates 160 and 170. The third link 183 may be located on the same side of the first link 181 and the second link 182 to form a bottom wall of the carrier basket 100, wherein an inner bottom wall of the carrier basket 100 is located inside the bottom wall of the carrier basket 100. In this case, the second mounting plate 160, the third mounting plate 170, the first link 181, and the second link 182 may enclose the inner cavity 110, ends of the second mounting plate 160 and the third mounting plate 170 facing away from the third link 183 may enclose the opening 120 together with the first link 181 and the second link 182, and the first link 181 and the second link 182 may enclose the perforation 130 with the third link 183, respectively.

Meanwhile, the plurality of second protrusions 184 may be fixed on at least one of the first, second and third links 181, 182 and 183 at intervals and uniformly, and the second protrusions 184 may form sidewalls of the card slot 140, that is, a plurality of silicon chips are respectively inserted between the plurality of adjacent second protrusions 184, with a first gap between the second protrusions 184 and the silicon chips. The structure is simpler, is favorable for saving production materials and reducing manufacturing cost, and meanwhile, the plurality of perforations 130 and the openings 120 of the structure are large in size, so that liquid medicine can conveniently enter the inner cavity 110, and the liquid medicine can rapidly enter the inner cavity 110, and the process efficiency is improved.

Of course, the gland 200 may be detachably mounted to the ends of the second and third mounting plates 160 and 170 facing away from the third link 183, such that the gland 200 partially covers the opening 120, thereby enabling the liquid medicine to more rapidly enter the inner cavity 110, which is advantageous for improving process efficiency.

In a further embodiment, the first link 181, the second link 182, and the third link 183 may be plural, and the second protrusions 184 may be fixed on the first link 181, the second link 182, and the third link 183 at intervals and uniformly. The structure is beneficial to improving the overall strength of the bearing basket 100, and can enable the silicon wafer to be inserted into the bearing basket 100 more stably, so that the silicon wafer is prevented from falling down in the bearing basket 100 when a gland is not installed, the silicon wafer is prevented from falling from a gap among the first connecting rod 181, the second connecting rod 182 and the third connecting rod 183 as much as possible, and the stability of the silicon wafer installation is further facilitated.

In a more preferred embodiment, the second protrusion 184 may be a triangular protrusion, so as to reduce the area of the portion of the silicon wafer that may contact the sidewall of the card slot 140 but is not adhered to the sidewall, so as to avoid affecting the etching of the silicon wafer by the liquid medicine as much as possible. Of course, the second protrusion 184 may be a trapezoid protrusion, which is not limited by the embodiment of the present application.

In the embodiments of the present utility model, the different embodiments are mainly described, and as long as the different optimization features of the embodiments are not contradictory, the different optimization features can be combined to form a better embodiment, and in consideration of brevity of line text, the description is omitted here.

The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are to be protected by the present utility model.

Claims (10)

1. A silicon wafer bearing device is characterized by comprising a bearing basket (100) and a gland (200),

The bearing basket (100) is provided with an inner cavity (110), an opening (120) and a plurality of perforations (130), the inner cavity (110) is used for accommodating silicon wafers, the opening (120) and the perforations (130) are communicated with the inner cavity (110) and penetrate through the outer surface of the bearing basket (100), a plurality of clamping grooves (140) are formed in at least part of the inner wall of the bearing basket (100) at intervals, the silicon wafers are respectively inserted into the clamping grooves (140), a first gap is formed between the side wall of the clamping groove (140) and the silicon wafers,

The pressing cover (200) is detachably arranged on the opening (120) and presses each silicon wafer, so that two opposite ends of each silicon wafer are respectively abutted against the pressing cover (200) and the inner bottom wall of the bearing basket (100).

2. The wafer carrier of claim 1, wherein the gland (200) comprises a gland body (210), a first mounting plate (220) and a threaded rod (230), the first mounting plate (220) is detachably mounted to the opening (120), the first mounting plate (220) has a groove (221) and a threaded hole (222), the groove (221) is opposite to the inner cavity (110), the gland body (210) is movably disposed in the groove (221), the threaded hole (222) is in communication with the groove (221) and is in threaded engagement with the threaded rod (230), the gland (200) is switchable between a compressed state and a decompressed state by rotating the threaded rod (230),

When the gland (200) is in the compressed state, the end part of the threaded rod (230) facing the inner bottom wall of the bearing basket (100) passes through the threaded hole (222) to be in interference with the gland body (210), so that each silicon wafer is compressed by the gland body (210);

The end of the threaded rod (230) facing the inner bottom wall of the carrying basket (100) is separated from the gland body (210) in the decompressed state of the gland (200).

3. The silicon wafer carrier of claim 2, wherein the pressing cover (200) further comprises a slider, the first mounting plate (220) has a first protrusion (223), the first protrusion (223) is disposed at two opposite ends of the first mounting plate (220) and forms a sidewall of the recess (221), the slider is fixed to the first protrusion (223), the carrier basket (100) has a sliding groove (150), the sliding groove (150) is disposed on the opposite sidewall of the carrier basket (100), two ends of the sliding groove (150) respectively penetrate through the inner surface and the outer surface of the sidewall of the carrier basket (100),

The sliding groove (150) is matched with the sliding block in shape, the sliding block is in sliding fit with the sliding groove (150) along the penetrating direction of the sliding groove (150), and is in limit fit with the sliding groove (150) along the notch of the sliding groove (150) in the upward direction.

4. A silicon wafer carrier as claimed in claim 3 wherein the slider is a trapezoidal slider.

5. The silicon wafer carrier of claim 2, wherein the threaded rod (230) comprises a threaded rod body (231) and a rotary operating handle (232), the threaded rod body (231) is in threaded engagement with the threaded hole (222), and the rotary operating handle (232) is fixed to an end of the threaded rod body (231) facing away from the inner bottom wall of the carrier basket (100).

6. The silicon wafer carrier of claim 2, wherein the first mounting plate (220) has a guide hole (224), the gland body (210) has a guide bar (211), and the guide bar (211) is slidably engaged with the guide hole (224) along a penetrating direction of the guide hole (224).

7. The silicon wafer carrier as set forth in claim 6 wherein the guide holes (224) and the guide bars (211) are plural, and the guide bars (211) are slidably fitted to the guide holes (224) in one-to-one correspondence.

8. The silicon wafer carrier of claim 1 wherein the carrier basket (100) has a second mounting plate (160), a third mounting plate (170) and a link (180), the link (180) comprising a first link (181), a second link (182), a third link (183) and a plurality of second protrusions (184),

The first ends of the first connecting rod (181), the second connecting rod (182) and the third connecting rod (183) are fixedly connected with the second mounting plate (160), the second ends of the first connecting rod (181), the second connecting rod (182) and the third connecting rod (183) are fixedly connected with the third mounting plate (170), the first connecting rod (181) and the second connecting rod (182) are oppositely arranged, the third connecting rod (183) is positioned on the same side of the first connecting rod (181) and the second connecting rod (182), the plurality of second bulges (184) are uniformly fixed on at least one of the first connecting rod (181), the second connecting rod (182) and the third connecting rod (183) at intervals,

The second mounting plate (160), the third mounting plate (170), the first connecting rod (181) and the second connecting rod (182) enclose an inner cavity (110), the second mounting plate (160) and the third mounting plate (170) deviate from the end part of the third connecting rod (183) and enclose an opening (120) together with the first connecting rod (181) and the second connecting rod (182), and the first connecting rod (181) and the second connecting rod (182) enclose a perforation (130) with the third connecting rod (183) respectively, and the second bulge (184) is used for forming the side wall of the clamping groove (140).

9. The silicon wafer carrier of claim 8 wherein the first link (181), the second link (182), and the third link (183) are each plural, and the second protrusions (184) are fixed on the first link (181), the second link (182), and the third link (183) at intervals and uniformly.

10. The wafer carrier of claim 8 wherein said second protrusions (184) are triangular protrusions.