CN221059831U - Artificial nail bonding plate - Google Patents
Artificial nail bonding plate Download PDFInfo
- Publication number
- CN221059831U CN221059831U CN202322885556.0U CN202322885556U CN221059831U CN 221059831 U CN221059831 U CN 221059831U CN 202322885556 U CN202322885556 U CN 202322885556U CN 221059831 U CN221059831 U CN 221059831U
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- China
- Prior art keywords
- hollowed
- artificial nail
- plate
- utility
- buffer layer
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Links
- 239000003292 glue Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 32
- 239000012790 adhesive layer Substances 0.000 claims description 21
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
Abstract
The utility model discloses an artificial nail bonding plate which comprises a hollowed-out plate and a back plate, wherein the hollowed-out plate is bonded with the back plate, a hollowed-out groove for embedding an artificial nail is formed in the hollowed-out plate, and a glue layer is arranged on the back plate at the position corresponding to the hollowed-out groove; the utility model can conveniently compare the artificial nails, does not influence the aesthetic property of the artificial nails, and is convenient to select.
Description
Technical Field
The utility model belongs to the technical field of artificial nails, and particularly relates to an artificial nail bonding plate.
Background
Most of the existing manual nail placing devices are packaged by nail boxes with fixed placing grooves. In the packaging process, the artificial nails are placed in the plastic sucking grooves and are directly adhered through adhesive tapes. However, the artificial nails are directly placed in the plastic suction grooves, so that the problems that the placement is not attractive and the artificial nails are easy to shift and drop exist, and the plastic suction package is not environment-friendly, if the artificial nails are directly adhered through the adhesive tape, the adhesive tape is easy to adhere to foreign matters, and the attractiveness is affected.
Disclosure of utility model
The utility model aims to solve the technical problem of providing an artificial nail bonding plate which can practically solve the problems of unattractive appearance and easy falling of the prior art.
In order to solve the technical problems, the utility model adopts the following technical scheme:
The utility model provides an artifical nail bonding board, its includes fretwork board and backplate, the fretwork board the backplate bonds, be equipped with the fretwork groove that can supply artifical nail embedding on the fretwork board, on the backplate with the department that corresponds in fretwork groove is equipped with the glue film.
As a preferable scheme of the utility model, the backboard comprises a buffer layer and a bottom plate, wherein the buffer layer is positioned between the backboard and the hollowed-out plate, one surface of the buffer layer is bonded with the hollowed-out plate, and the other surface of the buffer layer is bonded with the bottom plate.
As a preferable mode of the utility model, the thickness of the buffer layer is 0.1mm-10mm.
As a preferable scheme of the utility model, the thickness of the adhesive layers is 0.05mm-2mm.
As a preferable scheme of the utility model, the primary adhesion force F1 of the adhesive layer is more than or equal to 5N/mm, and the holding adhesion force F2 of the adhesive layer is more than or equal to 8N/mm.
As a preferable scheme of the utility model, the hollowed-out grooves are arranged in two or more rows.
As a preferable scheme of the utility model, the gap between two adjacent hollowed-out grooves is 0.01mm-4mm.
As a preferable scheme of the utility model, the upper cover of the hollowed-out plate is provided with a transparent film.
As a preferable scheme of the utility model, surrounding edges are arranged on the periphery of the hollowed-out plate.
As a preferable scheme of the utility model, the adhesive layer is pressure-sensitive adhesive, and the buffer layer is made of foam.
Compared with the prior art, the artificial nail bonding plate provided by the utility model has the beneficial effects that:
When packaging, placing the artificial nail in the hollow groove, wherein the hollow groove can play a role in quick positioning, secondly, the adhesive layer can enable the artificial nail to be fixed in the hollow groove, so that the artificial nail is prevented from falling off, the adhesion of the artificial nail can be ensured, and meanwhile, the artificial nail is placed in the hollow groove and can also prevent the adhesive layer from being exposed, so that dust is prevented from falling off on the adhesive layer; when the artificial nails are needed to be selected, the artificial nails can be directly compared, and the artificial nails are adhered into the hollow grooves after the comparison is finished, so that the method is convenient and quick; the utility model can conveniently compare the artificial nails, does not influence the aesthetic property of the artificial nails, and is convenient to select.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings of the embodiments will be briefly described below.
FIG. 1 is a schematic view of an artificial nail bonding plate according to an embodiment of the utility model;
fig. 2 is an exploded view of an artificial nail bonding sheet provided by an embodiment of the utility model.
The marks in the figure:
A hollowed-out plate 1; an adhesive layer 2; a back plate 3; an artificial nail 4; a hollow groove 5; a buffer layer 6; a bottom plate 7.
Detailed Description
The following describes in further detail the embodiments of the present utility model with reference to the drawings and examples. The following examples are illustrative of the utility model and are not intended to limit the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. It should be understood that the terms "first," "second," and the like are used herein to describe various information, but such information should not be limited to these terms, which are used merely to distinguish one type of information from another. For example, a "first" message may also be referred to as a "second" message, and similarly, a "second" message may also be referred to as a "first" message, without departing from the scope of the utility model.
As shown in fig. 1 to 2, a preferred embodiment of the present utility model provides an artificial nail 4 bonding board, which includes a hollowed board 1 and a back board 3, wherein the hollowed board 1 is directly bonded with the back board 3, a hollowed slot 5 into which the artificial nail 4 is embedded is provided on the hollowed board 1, and a glue layer 2 is provided on a corresponding part of the back board 3 to the hollowed slot 5.
It should be noted that, the size of the artificial nail 4 may be the same size or different sizes according to the actual requirement, and the hollowed-out groove 5 is adaptively adjusted according to the size of the artificial nail 4.
When packaging, the artificial nail 4 is placed in the hollow groove 5, the hollow groove 5 can play a role in quick positioning, secondly, the adhesive layer 2 can enable the artificial nail 4 to be fixed in the hollow groove 5, so that falling is avoided, adhesion of the artificial nail 4 can be ensured, meanwhile, the artificial nail is placed in the hollow groove, the adhesive layer 2 can be prevented from being exposed, and dust is prevented from falling on the adhesive layer 2; when the artificial nails 4 are needed to be selected, the artificial nails 4 can be directly compared, and the artificial nails 4 are adhered into the hollow grooves 5 after the comparison is finished, so that the method is convenient and quick; the utility model can conveniently compare the artificial nails 4, does not influence the aesthetic property of the artificial nails 4, and is convenient to select.
In this embodiment, the back plate 3 is configured as the bottom plate 7, and of course, the back plate 3 may also be configured to include a buffer layer 6 and a bottom plate 7, where the buffer layer 6 is located between the back plate 3 and the hollowed plate 1, one surface of the buffer layer 6 is bonded with the hollowed plate 1, and the other surface of the buffer layer 6 is bonded with the bottom plate 7. Therefore, the buffer layer 6 can play a role of buffering in the transportation process, damage caused by collision of the artificial nail 4 is avoided, and the use is convenient. In this embodiment, for convenience in connection, the adhesive layer 2 is disposed on the buffer layer 6, one surface of the buffer layer 6 is adhered to the hollowed board 1 through the adhesive layer 2, and the other surface of the buffer layer 6 is adhered to the bottom board 7 through the adhesive layer 2; in other embodiments, the buffer layer 6 and the hollowed out board 1 and the buffer layer 6 and the bottom board 7 may be bonded by glue.
In this embodiment, the back plate 3, the buffer layer 6 and the hollowed-out plate 1 are all rectangular, and in other embodiments, the back plate 3, the buffer layer 6 and the hollowed-out plate 1 may be set to other shapes according to actual needs.
The thickness of the buffer layer 6 is, for example, 0.1mm to 10mm. In the concrete implementation, the thickness of the buffer layer 6 can be selected according to the actual use requirement, so that the use is convenient.
The thickness of the glue layer 2 is, for example, 0.05mm-2mm.
Illustratively, the initial adhesion F1 of the adhesive layer 2 is more than or equal to 5N/mm, and the holding adhesion F2 of the adhesive layer 2 is more than or equal to 8N/mm.
Illustratively, the hollowed-out grooves 5 are provided with two or more rows. Therefore, the volume of the bonding plate can be reduced, and the bonding plate is convenient to carry.
Illustratively, in order to facilitate the taking and placing of the artificial nail 4, a gap between two adjacent hollowed-out grooves 5 is 0.01mm-4mm.
Illustratively, the upper cover of the hollowed-out plate 1 is provided with a transparent film. Therefore, the transparent film can avoid the falling ash of the artificial nail 4, and can facilitate the selection of the artificial nail 4. In other embodiments, the transparent film may be replaced with a transparent cover or other form according to actual use requirements.
Illustratively, surrounding edges are arranged around the hollowed-out plate 1. In other embodiments, the peripheral edge may also be provided around the back plate 3.
Illustratively, the adhesive layer 2 is a pressure-sensitive adhesive, and the material of the buffer layer 6 is foam. In other embodiments, the adhesive layer 2 may be other forms of adhesive tape, and the buffer layer 6 may be non-woven fabric, paper or the like.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and substitutions can be made by those skilled in the art without departing from the technical principles of the present utility model, and these modifications and substitutions should also be considered as being within the scope of the present utility model.
Claims (10)
1. The utility model provides an artifical nail bonding board, its characterized in that includes fretwork board and backplate, the fretwork board with the backplate bonds, be equipped with the fretwork groove that can supply artifical nail embedding on the fretwork board, the backplate with the department that corresponds in fretwork groove is equipped with the glue film.
2. An artificial nail bonding plate according to claim 1, wherein the back plate comprises a buffer layer and a bottom plate, the buffer layer is located between the back plate and the hollowed-out plate, one surface of the buffer layer is bonded with the hollowed-out plate, and the other surface of the buffer layer is bonded with the bottom plate.
3. An artificial nail bonding sheet according to claim 2, wherein said cushioning layer has a thickness of 0.1mm to 10mm.
4. An artificial nail bonding sheet according to claim 1, wherein the thickness of the glue layers is 0.05mm-2mm.
5. An artificial nail bonding board according to claim 4, characterized in that the primary adhesion force F1 of the adhesive layer is not less than 5N/mm, and the holding adhesion force F2 of the adhesive layer is not less than 8N/mm.
6. The artificial nail bonding board according to claim 1, wherein the hollowed-out grooves are provided with two or more rows.
7. An artificial nail bonding sheet according to claim 6, wherein the gap between two adjacent ones of said hollowed-out grooves is 0.01mm-4mm.
8. An artificial nail bonding plate according to claim 1, wherein the hollowed-out plate upper cover is provided with a transparent film.
9. An artificial nail bonding plate according to claim 1, wherein surrounding edges are provided around the hollowed-out plate.
10. An artificial nail bonding plate according to claim 2, wherein the adhesive layer is a pressure sensitive adhesive, and the cushioning layer is foam.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322885556.0U CN221059831U (en) | 2023-10-26 | 2023-10-26 | Artificial nail bonding plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322885556.0U CN221059831U (en) | 2023-10-26 | 2023-10-26 | Artificial nail bonding plate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN221059831U true CN221059831U (en) | 2024-06-04 |
Family
ID=91250827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202322885556.0U Active CN221059831U (en) | 2023-10-26 | 2023-10-26 | Artificial nail bonding plate |
Country Status (1)
Country | Link |
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CN (1) | CN221059831U (en) |
-
2023
- 2023-10-26 CN CN202322885556.0U patent/CN221059831U/en active Active
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