CN221039167U - Connecting structure of wafer testing device and wafer testing device - Google Patents
Connecting structure of wafer testing device and wafer testing device Download PDFInfo
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- CN221039167U CN221039167U CN202322923208.8U CN202322923208U CN221039167U CN 221039167 U CN221039167 U CN 221039167U CN 202322923208 U CN202322923208 U CN 202322923208U CN 221039167 U CN221039167 U CN 221039167U
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- 238000012360 testing method Methods 0.000 title claims abstract description 40
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- 238000010586 diagram Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
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Abstract
The utility model provides a connecting structure of a wafer testing device and the wafer testing device, and relates to the technical field of wafer testing. The connecting structure comprises a mounting piece and a pivoting piece, wherein the mounting piece is arranged in the heat sink, the PCB and the clamp in a penetrating way, the bottom end of the mounting piece is connected with the heat sink, the top end of the mounting piece protrudes out of the clamp and is provided with a limiting part, the pivoting piece is arranged at the top of the clamp and is provided with a clamping part matched with the limiting part, the pivoting piece can rotate relative to the clamp so as to be connected with the mounting piece when rotating to a position where the clamping part is clamped with the limiting part, thereby connecting the PCB, the clamp and the heat sink, and separating the mounting piece when rotating to a position where the clamping part is separated from the limiting part, so that the heat sink is allowed to be separated from the PCB. According to the technical scheme, the bolts are replaced by the connecting structure, the heat sink and the PCB can be connected and separated through rotation of the pivoting piece, the operation is convenient, the damage is not easy, and the service life is long.
Description
Technical Field
The present utility model relates to wafer testing technology, and more particularly, to a connection structure of a wafer testing device and a wafer testing device.
Background
After the wafer testing device is filled with the wafer, the wafer is required to be placed in high-pressure arc extinguishing gas for testing, so that the wafer testing device is required to be sealed, and all components of the wafer testing device are connected through connecting pieces, so that the wafer is positioned in the sealing device.
In the prior art, each part of the wafer testing device is connected in a bolt connection mode, bolts are required to be screwed down and detached once when each wafer is tested, the service life of the bolts is greatly influenced, the bolts are damaged by using half-month screw teeth generally, the service life of the bolts is shortened, and the testing cost is increased.
Disclosure of utility model
An object of the first aspect of the present utility model is to provide a connection structure of a wafer testing device, which solves the technical problem of the prior art that the service life of a bolt is shorter, resulting in an increase in testing cost.
An object of the second aspect of the present utility model is to provide a wafer testing apparatus having the above-mentioned connection structure.
According to an object of a first aspect of the present utility model, there is provided a connection structure of a wafer testing apparatus, the wafer testing apparatus including a plurality of connection structures, and a heat sink, a PCB board, and a jig sequentially arranged from bottom to top, a sealing cavity for placing a wafer being defined between the heat sink and the PCB board, the connection structure including:
The mounting piece is penetrated in the heat sink, the PCB and the clamp and is vertically arranged, the bottom end of the mounting piece is connected with the heat sink, and the top end of the mounting piece protrudes out of the clamp and is provided with a limiting part;
And a pivoting member installed at the top of the jig and having a clamping portion engaged with the limiting portion, the pivoting member being configured to be rotatable with respect to the jig to be connected with the mounting member when rotated to a position where the clamping portion is clamped with the limiting portion, thereby connecting the PCB board, the jig and the heat sink, and to be separated from the mounting member when rotated to a position where the clamping portion is separated from the limiting portion, thereby allowing the heat sink to be separated from the PCB board.
Optionally, the pivot piece further includes a connecting portion arranged vertically, the clamping portion extends along a circumference of the connecting portion, and a gap exists between two ends of the clamping portion, so that the pivot piece is separated from the mounting piece when the pivot piece rotates to the position that the top end of the mounting piece is located in the gap.
Optionally, the limiting part is in a groove shape with an opening facing the pivoting part, the clamping part is formed by outwards protruding side walls of the connecting part, and the pivoting part is connected with the mounting part when rotating to a position where the upper surface of the clamping part is abutted to the upper side walls of the limiting part.
Optionally, the upper surface of either one of the two ends of the clamping portion is an inclined surface, so that the thickness of the clamping portion gradually increases from the end toward the other end.
Optionally, a mounting groove corresponding to the pivoting member is formed in the top of the clamp, and the bottom of the pivoting member is located in the mounting groove and can rotate relative to the mounting groove.
Optionally, the method further comprises:
The bearing is sleeved on the pivoting piece and is positioned between the clamping part and the clamp.
Optionally, the top of the pivot is provided with a bolt hole for cooperation with a wrench.
Optionally, the bottom end of the mounting member is connected to the heat sink by a screw.
Optionally, an avoidance portion is arranged at the circumferential edge of the bottom of the heat sink, and a connection point of the mounting piece and the heat sink is located at the avoidance portion.
According to a second aspect of the present utility model, a wafer testing apparatus is provided, which includes the above-mentioned connection structure.
The connecting structure comprises a mounting piece and a pivoting piece, wherein the mounting piece is arranged in the heat sink, the PCB and the clamp in a penetrating way, the bottom end of the mounting piece is connected with the heat sink, the top end of the mounting piece protrudes out of the clamp and is provided with a limiting part, the pivoting piece is arranged at the top of the clamp and is provided with a clamping part matched with the limiting part, the pivoting piece can rotate relative to the clamp so as to be connected with the mounting piece when rotating to a position where the clamping part is clamped with the limiting part, thereby connecting the PCB, the clamp and the heat sink, and separating the mounting piece when rotating to a position where the clamping part is separated from the limiting part, so that the heat sink is allowed to be separated from the PCB. According to the technical scheme, the bolts are replaced by the connecting structure, the heat sink and the PCB can be connected and separated through rotation of the pivoting piece, the operation is convenient, the damage is not easy, and the service life is long.
Further, in the utility model, the upper surface of any one of the two end parts of the clamping part is an inclined surface, so that the thickness of the clamping part gradually increases from the end part towards the other end part, and the end part of the clamping part can enter the limiting part more easily by arranging the inclined surface, thereby improving the convenience of operation.
The above, as well as additional objectives, advantages, and features of the present utility model will become apparent to those skilled in the art from the following detailed description of a specific embodiment of the present utility model when read in conjunction with the accompanying drawings.
Drawings
Some specific embodiments of the utility model will be described in detail hereinafter by way of example and not by way of limitation with reference to the accompanying drawings. The same reference numbers will be used throughout the drawings to refer to the same or like parts or portions. It will be appreciated by those skilled in the art that the drawings are not necessarily drawn to scale. In the accompanying drawings:
FIG. 1 is a schematic block diagram of a wafer test apparatus according to one embodiment of the present utility model at an angle;
FIG. 2 is a schematic block diagram of another angle of a wafer test apparatus according to one embodiment of the present utility model;
FIG. 3 is a schematic cross-sectional view of the wafer testing apparatus shown in FIG. 1;
FIG. 4 is a schematic block diagram of a connection structure in the wafer test apparatus shown in FIG. 1;
FIG. 5 is a schematic block diagram of the mounting of the connection structure of FIG. 4;
fig. 6 is a schematic structural view of a pivoting member of the connection structure of fig. 4.
Reference numerals:
100-wafer testing device, 10-connection structure, 20-fixture, 30-PCB board, 40-heat sink, 50-bolt, 11-mounting piece, 12-pivot piece, 13-bearing, 41-dodge portion, 111-pole portion, 112-extension portion, 113-mounting hole, 114-spacing portion, 121-connection portion, 122-joint portion, 123-bolt hole, 124-inclined plane.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Unless specifically stated and limited otherwise, the term "coupled" and the like are to be construed broadly and may be, for example, fixedly coupled, detachably coupled, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. Those of ordinary skill in the art will understand the specific meaning of the terms described above in the present utility model as the case may be.
Unless otherwise defined, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
Fig. 1 is a schematic structural view of a wafer test apparatus 100 according to an embodiment of the present utility model at one angle, fig. 2 is a schematic structural view of the wafer test apparatus 100 according to an embodiment of the present utility model at another angle, fig. 3 is a schematic cross-sectional view of the wafer test apparatus 100 shown in fig. 1, fig. 4 is a schematic structural view of a connection structure 10 in the wafer test apparatus 100 shown in fig. 1, fig. 5 is a schematic structural view of a mounting member 11 of the connection structure 10 in fig. 4, and fig. 6 is a schematic structural view of a pivoting member 12 of the connection structure 10 in fig. 4. As shown in fig. 1 to 6, in this embodiment, the wafer testing apparatus 100 includes a plurality of connection structures 10, and a heat sink 40, a PCB board 30 and a fixture 20 sequentially arranged from bottom to top, a sealing cavity for placing a wafer is defined between the heat sink 40 and the PCB board 30, the connection structures 10 include a mounting member 11 and a pivoting member 12, the mounting member 11 is disposed in the heat sink 40, the PCB board 30 and the fixture 20 in a penetrating manner, and is vertically arranged, a bottom end of the mounting member 11 is connected with the heat sink 40, and a top end of the mounting member 11 protrudes from the fixture 20 and has a limiting portion 114. The pivoting member 12 is mounted on the top of the jig 20 and has a clamping portion 122 engaged with the limiting portion 114, the pivoting member 12 is configured to be rotatable with respect to the jig 20 to be connected with the mounting member 11 when rotated to a position where the clamping portion 122 is clamped with the limiting portion 114, thereby connecting the PCB board 30, the jig 20 and the heat sink 40, and to be separated from the mounting member 11 when rotated to a position where the clamping portion 122 is separated from the limiting portion 114, thereby allowing the heat sink 40 to be separated from the PCB board 30, and the PCB board 30 and the jig 20 are directly taken out from above to be separated from the mounting member 11, while the mounting member 11 is always connected with the heat sink 40.
The connecting structure 10 is adopted to replace bolts, the heat sink 40 and the PCB 30 can be connected and separated through rotation of the pivoting piece 12, the operation is convenient, the damage is not easy, and the service life is long.
In this embodiment, through holes are formed in the fixture 20, the PCB board 30 and the heat sink 40, and the mounting member 11 sequentially passes through the through hole in the heat sink 40, the through hole in the PCB board 30 and the through hole in the fixture 20 from bottom to top until the bottom end of the mounting member 11 abuts against the heat sink 40. When the mounting member 11 moves up to the bottom end abutting against the heat sink 40, the top end of the mounting member 11 protrudes from the top of the jig 20, thereby exposing the stopper 114 on the mounting member 11.
In this embodiment, the bottom end of the mount 11 is connected to the heat sink 40 by a screw. Specifically, the mount 11 includes a shaft portion 111 and an extension portion 112 provided at the bottom of the shaft portion 111, the extension portion 112 being formed by extending the outer side wall of the shaft portion 111 outward, where the extension portion 112 is formed to extend toward both sides of the shaft portion 111. The extension 112 is provided with mounting holes 113 such that the bolts 50 connect the mount 11 with the heat sink 40 through the mounting holes 113. Here, the extension length of the lever 111 is designed according to the overall thickness of the clip 20, the PCB board 30 and the heat sink 40, and it must be ensured that the lever 111 can expose the limiting portion 114 after passing through the clip 20, the PCB board 30 and the heat sink 40 and be aligned with the clamping portion 122 of the pivot member 12.
In this embodiment, referring to fig. 4 to 6, the pivoting member 12 further includes a connecting portion 121 arranged vertically, and a catching portion 122 is arranged extending in a circumferential direction of the connecting portion 121 with a gap between both end portions of the catching portion 122 to separate the pivoting member 12 from the mounting member 11 when the pivoting member 12 is rotated until the tip end of the mounting member 11 is located in the gap. It will be appreciated that the clamping portion 122 does not extend along the entire periphery of the connecting portion 121, but only along a portion of the periphery of the connecting portion 121, with the clamping portion 122 being non-end-to-end. When the fixture 20, the PCB 30 and the heat sink 40 are required to be connected, the pivoting member 12 is rotated until the clamping portion 122 is clamped with the limiting portion 114, and when the heat sink 40 is required to be separated from the PCB 30, the pivoting member 12 is rotated until the clamping portion 122 is separated from the limiting portion 114, and the two are rotated in opposite directions. That is, if the pivot member 12 rotates counterclockwise to make the engaging portion 122 engage with the limiting portion 114, the pivot member 12 needs to rotate clockwise to disengage the two. In this embodiment, the size of the gap may be set according to specific design requirements.
In this embodiment, the limiting portion 114 is in a groove shape with an opening facing the pivoting member 12, the clamping portion 122 is formed by protruding the side wall of the connecting portion 121 outwards, and the pivoting member 12 is configured to be connected to the mounting member 11 when rotated to a position where the upper surface of the clamping portion 122 abuts against the upper side wall of the limiting portion 114, see fig. 4 to 6.
In a preferred embodiment, the upper surface of either one of the two ends of the clamping portion 122 is a slope 124, so that the thickness of the clamping portion 122 gradually increases from the end toward the other end, and by providing the slope 124, the end of the clamping portion 122 can more easily enter the limiting portion 114, improving the convenience of operation, see fig. 6 in particular. It can be understood that, since the inclined surface 124 is provided, the clamping portion 122 will not abut against the upper side wall of the limiting portion 114 when passing the limiting portion 114, and there is a gap, and the thickness of the clamping portion 122 gradually increases during the rotation, so that the connection between the clamping portion 122 and the upper side wall of the clamping portion 122 is achieved when the upper surface of the clamping portion is in abutment.
In this embodiment, the top of the clamp 20 is provided with a mounting groove arranged in correspondence with the pivoting member 12, and the bottom of the pivoting member 12 is located in the mounting groove and is rotatable relative to the mounting groove.
In a preferred embodiment, the connection structure 10 further includes a bearing 13, and the bearing 13 is sleeved on the pivot member 12 and located between the clamping portion 122 and the clamp 20, see fig. 3. This embodiment can perform a rotation pressure-bearing function by providing the bearing 13, and can make the pivoting member 12 rotate more smoothly.
In this embodiment, the top of the pivoting member 12 is provided with a bolt hole 123 for engagement with a wrench, and an operator can perform rotation of the pivoting member 12 by engaging the wrench with the bolt hole 123, and can also perform rotation by directly manually rotating the pivoting member 12. That is, this embodiment can either manually rotate the pivot member 12 directly or can rotate the pivot member 12 by a tool.
In this embodiment, the circumferential edge of the bottom of the heat sink 40 is provided with the avoiding portion 41, and the connection point between the mounting member 11 and the heat sink 40 is located at the avoiding portion 41, so that the mounting member 11 of the connection structure 10 can be hidden, the placement of the heat sink 40 is prevented from being affected, and the heat sink 40 can be placed horizontally.
The embodiment also provides a wafer testing apparatus 100, and the wafer testing apparatus 100 includes the connection structure 10. The connection structure 10 is not described in detail herein.
In this embodiment, referring to fig. 1, the heat sink 40 and the fixture 20 of the wafer test apparatus 100 each have a disk shape, and the wafer test apparatus 100 further includes a plurality of connection structures 10, the plurality of connection structures 10 being arranged at intervals along the circumference of the fixture 20. In this embodiment, the wafer test apparatus 100 includes 12 connection structures 10, and the 12 connection structures 10 are arranged in an array at the periphery of the fixture 20. In other embodiments, the number of connecting structures 10 may also be specifically set according to the diameter of the jig 20.
The connecting structure 10 is adopted to replace the bolt 50, the heat sink 40 and the PCB 30 can be connected and separated through the rotation of the pivoting piece 12, the operation is convenient, the damage is not easy, and the service life is long.
By now it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the utility model have been shown and described herein in detail, many other variations or modifications of the utility model consistent with the principles of the utility model may be directly ascertained or inferred from the present disclosure without departing from the spirit and scope of the utility model. Accordingly, the scope of the present utility model should be understood and deemed to cover all such other variations or modifications.
Claims (10)
1. The utility model provides a connection structure of wafer testing arrangement, its characterized in that, wafer testing arrangement includes a plurality of connection structure and from bottom to top heat sink, PCB board and the anchor clamps that arrange in proper order, the heat sink with be limited with the sealed chamber that is used for placing the wafer between the PCB board, connection structure includes:
The mounting piece is penetrated in the heat sink, the PCB and the clamp and is vertically arranged, the bottom end of the mounting piece is connected with the heat sink, and the top end of the mounting piece protrudes out of the clamp and is provided with a limiting part;
And a pivoting member installed at the top of the jig and having a clamping portion engaged with the limiting portion, the pivoting member being configured to be rotatable with respect to the jig to be connected with the mounting member when rotated to a position where the clamping portion is clamped with the limiting portion, thereby connecting the PCB board, the jig and the heat sink, and to be separated from the mounting member when rotated to a position where the clamping portion is separated from the limiting portion, thereby allowing the heat sink to be separated from the PCB board.
2. The connection according to claim 1, wherein,
The pivot piece further comprises a connecting portion which is arranged along the vertical direction, the clamping portion is arranged along the circumferential direction of the connecting portion, a gap exists between two end portions of the clamping portion, and the pivot piece is separated from the mounting piece when the pivot piece rotates until the top end of the mounting piece is located in the gap.
3. The connection structure according to claim 2, wherein,
The limiting part is in a groove shape with an opening facing the pivoting part, the clamping part is formed by outwards protruding side walls of the connecting part, and the pivoting part is connected with the mounting part when rotating to a position where the upper surface of the clamping part is abutted to the upper side walls of the limiting part.
4. The connecting structure according to claim 3, wherein,
The upper surface of either one of the two end portions of the clamping portion is an inclined surface so that the thickness of the clamping portion gradually increases from the end portion toward the other end portion.
5. The connecting structure according to claim 4, wherein a top portion of the jig is provided with a mounting groove arranged corresponding to the pivoting member, and a bottom portion of the pivoting member is located in the mounting groove and is rotatable relative to the mounting groove.
6. The connection structure according to claim 5, further comprising:
The bearing is sleeved on the pivoting piece and is positioned between the clamping part and the clamp.
7. The connection according to any one of claims 1 to 6, wherein,
The top of pivot piece is equipped with the bolt hole with spanner complex.
8. The connection according to any one of claims 1 to 6, wherein,
The bottom of the mounting piece is connected with the heat sink through a screw.
9. The connection structure according to claim 8, wherein,
And an avoidance part is arranged at the circumferential edge of the bottom of the heat sink, and the connection point of the mounting piece and the heat sink is positioned at the avoidance part.
10. Wafer testing device, characterized in that it comprises a connection structure according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322923208.8U CN221039167U (en) | 2023-10-30 | 2023-10-30 | Connecting structure of wafer testing device and wafer testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322923208.8U CN221039167U (en) | 2023-10-30 | 2023-10-30 | Connecting structure of wafer testing device and wafer testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221039167U true CN221039167U (en) | 2024-05-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322923208.8U Active CN221039167U (en) | 2023-10-30 | 2023-10-30 | Connecting structure of wafer testing device and wafer testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221039167U (en) |
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- 2023-10-30 CN CN202322923208.8U patent/CN221039167U/en active Active
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