CN221035413U

CN221035413U - High-brightness reflection light source for wafer detection

Info

Publication number: CN221035413U
Application number: CN202322763156.2U
Authority: CN
Inventors: 刘康生; 杨伟强
Original assignee: Dongguan Chuangshi Photoelectric Co ltd
Current assignee: Dongguan Chuangshi Photoelectric Co ltd
Priority date: 2023-10-16
Filing date: 2023-10-16
Publication date: 2024-05-28
Anticipated expiration: 2033-10-16

Abstract

The utility model discloses a wafer high-brightness reflection light source, which relates to the technical field of light sources of image measuring instruments and comprises an aspheric reflector, wherein a heat dissipation assembly is arranged at the top of the aspheric reflector, a PCB (printed circuit board) is arranged at the bottom of the heat dissipation assembly and positioned in the aspheric reflector, LED (light-emitting diode) lamp strips are arranged on the outer surface of the PCB, a plurality of groups of lamp beads are arranged on the outer surface of each LED lamp strip at equal intervals in a circumferential shape, a power line is arranged at the top of the heat dissipation assembly, the LED lamp strips are electrified to enable the groups of lamp beads to emit light, the light irradiates the inner surface of the aspheric reflector, the light is reflected through the inner surface structure of the aspheric reflector, the light is concentrated under the aspheric reflector, the structure reflects the light, the light brightness is increased, so that the requirement of wafer detection is met, compared with the existing light source structure, the number of the lamp beads required to be used is small, the detection cost is reduced, and meanwhile, the energy-saving effect is realized.

Description

High-brightness reflection light source for wafer detection

Technical Field

The utility model relates to the technical field of light sources of image measuring instruments, in particular to a wafer high-brightness reflection light source.

Background

When the surface of the wafer is detected, the wafer is irradiated by a light source, so that the image measuring instrument is convenient for detecting the surface of the wafer;

At present, light emitted by a lamp bead in a light source is directly irradiated on a wafer, the light is scattered, part of the light cannot irradiate on the wafer, so that the light brightness cannot meet detection requirements, the lamp bead is required to be added to increase the light brightness, the detection requirements are met, and the detection cost is high.

Disclosure of utility model

Aiming at the defects of the prior art, the utility model provides a wafer high-brightness reflective light source, which solves the problems in the background art.

In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a high bright reflection light source of wafer detection, includes the aspheric surface reflector, radiating component is installed at the top of aspheric surface reflector, radiating component's bottom just is located the inside of aspheric surface reflector and is provided with the PCB board, the surface of PCB board is provided with the LED lamp strip.

As a further technical scheme of the utility model, the outer surface of the LED lamp strip is in a circular shape and is provided with a plurality of groups of lamp beads at equal intervals, the top of the heat dissipation assembly is provided with a power line, and the output end of the power line is connected with the input end of the PCB.

As a further technical scheme of the utility model, the heat dissipation assembly comprises heat dissipation teeth, a bottom plate is arranged below the heat dissipation teeth, and the bottoms of the heat dissipation teeth and the bottom plate are fixedly connected through a plurality of groups of bolts.

As a further technical scheme of the utility model, the top of the heat dissipation tooth and the top of the aspheric surface reflector are fixedly connected through a plurality of groups of bolts, and the bottom of the heat dissipation tooth extends to the interior of the aspheric surface reflector.

As a further technical scheme of the utility model, the outer surface of the bottom of the heat dissipation tooth is provided with a stepped groove, and the inner surface of the PCB is connected with the inner annular surface of the stepped groove.

As a further technical scheme of the utility model, the top edge of the bottom plate is connected with the convex edge, and the convex edge is positioned at the outer side of the bottom of the PCB.

Advantageous effects

The utility model provides a wafer high-brightness reflective light source. Compared with the prior art, the method has the following beneficial effects:

The utility model provides a high bright reflection light source of wafer detection, make many groups lamp pearl send light through LED lamp strip circular telegram, light shines the internal surface at aspheric surface reflector, make light appear reflecting through aspheric surface reflector internal surface structure, realize light collection under the aspheric surface reflector, this structure is through reflecting light, increase light luminance, thereby satisfy the demand that the wafer detected, and this structure is less than the required lamp pearl quantity that uses of current light source structure, reducible detection cost, realize energy-conserving effect simultaneously.

Drawings

FIG. 1 is a schematic diagram of a wafer high brightness reflective light source;

FIG. 2 is a schematic diagram of a split structure of a wafer-level high-brightness reflective light source;

FIG. 3 is a schematic diagram of the reflection of light from a wafer to a high-brightness reflective light source;

fig. 4 is a schematic diagram of a split structure of a heat dissipating component in a wafer-level high-brightness reflective light source.

In the figure: 1. an aspherical reflector; 2. a heat dissipation assembly; 21. radiating teeth; 22. a stepped groove; 23. a bottom plate; 24. a convex edge; 3. a PCB board; 4. LED light bar; 5. and a power supply line.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution for a wafer detection highlight reflection light source: the utility model provides a high bright reflection light source of wafer detection, includes aspheric surface reflector 1, and radiating element 2 is installed at the top of aspheric surface reflector 1, and radiating element 2's bottom just is located the inside of aspheric surface reflector 1 and is provided with PCB board 3, and the surface of PCB board 3 is provided with LED lamp strip 4, and the outward appearance of LED lamp strip 4 is circumference form and equidistant a plurality of groups lamp pearl that are provided with, and radiating element 2's top is provided with power cord 5, and power cord 5's output links to each other with PCB board 3's input.

It should be noted that, the power cord 5 provides the electric energy to the PCB board 3, and then LED lamp strip 4 circular telegram makes many groups lamp pearl send light, and light shines the internal surface at aspheric surface reflector 1, makes light appear reflecting through aspheric surface reflector 1 internal surface structure, realizes that light gathers under aspheric surface reflector 1, and this structure is through reflecting light, increases light luminance to satisfy the demand that the wafer detected, and this structure is less than the lamp pearl quantity that current light source structure needs to use, reducible detection cost, realizes energy-conserving effect simultaneously.

Referring to fig. 4, the heat dissipation assembly 2 includes heat dissipation teeth 21, a bottom plate 23 is disposed below the heat dissipation teeth 21, the bottom of the heat dissipation teeth 21 and the bottom plate 23 are fixedly connected through a plurality of groups of bolts, the top of the heat dissipation teeth 21 and the top of the aspheric surface reflector 1 are fixedly connected through a plurality of groups of bolts, the bottom of the heat dissipation teeth 21 extends to the interior of the aspheric surface reflector 1, a step groove 22 is formed on the outer surface of the bottom of the heat dissipation teeth 21, the inner surface of the PCB board 3 is connected with the inner annular surface of the step groove 22, a convex edge 24 is connected with the top edge of the bottom plate 23, and the convex edge 24 is located at the outer side of the bottom of the PCB board 3.

It should be noted that, through fixing the PCB board 3 and the LED light bar 4 inside the stepped groove 22, and then forming fixed connection with the bottom of the heat dissipation tooth 21 and the bottom plate 23 through the bolt, and then installing the bottom of the heat dissipation assembly 2 inside the aspherical reflector 1, and forming fixed connection with the top of the heat dissipation tooth 21 and the top of the aspherical reflector 1 through the bolt, thereby making the PCB board 3 and the LED light bar 4 be located inside the aspherical reflector 1, and thus completing the assembly of the light source structure.

The working principle of the utility model is as follows: when the LED lamp strip is used, the power line 5 provides electric energy for the PCB 3, and then the LED lamp strip 4 is electrified to enable a plurality of groups of lamp beads to emit light, the light irradiates the inner surface of the aspheric surface reflector 1, the light is reflected through the inner surface structure of the aspheric surface reflector 1, and the light is collected under the aspheric surface reflector 1.

Claims

1. The utility model provides a high bright reflection light source of wafer detection, its characterized in that, includes aspheric surface reflector (1), radiating component (2) are installed at the top of aspheric surface reflector (1), the bottom of radiating component (2) just is provided with PCB board (3) in the inside of aspheric surface reflector (1), the surface of PCB board (3) is provided with LED lamp strip (4).

2. The wafer detection highlight reflection light source according to claim 1, wherein the outer surface of the LED light bar (4) is in a circular shape and is provided with a plurality of groups of light beads at equal intervals, the top of the heat dissipation assembly (2) is provided with a power line (5), and the output end of the power line (5) is connected with the input end of the PCB (3).

3. The wafer detection highlight reflection light source according to claim 1, wherein the heat dissipation assembly (2) comprises heat dissipation teeth (21), a bottom plate (23) is arranged below the heat dissipation teeth (21), and the bottom of the heat dissipation teeth (21) and the bottom plate (23) form fixed connection through a plurality of groups of bolts.

4. A wafer inspection highlighting reflective light source according to claim 3, wherein the top of the heat dissipating tooth (21) and the top of the aspherical reflector (1) are fixedly connected by a plurality of sets of bolts, and the bottom of the heat dissipating tooth (21) extends into the aspherical reflector (1).

5. A wafer detection highlight reflection light source according to claim 3, wherein the bottom outer surface of the heat dissipation tooth (21) is provided with a step groove (22), and the inner surface of the PCB board (3) is connected with the inner ring surface of the step groove (22).

6. A wafer inspection highlighting reflective light source as claimed in claim 3, characterized in that the top edge of the bottom plate (23) is connected with a flange (24), said flange (24) being located outside the bottom of the PCB board (3).