CN221028735U - Device for sealing Wafer in LAM electroplating equipment - Google Patents
Device for sealing Wafer in LAM electroplating equipment Download PDFInfo
- Publication number
- CN221028735U CN221028735U CN202322452892.6U CN202322452892U CN221028735U CN 221028735 U CN221028735 U CN 221028735U CN 202322452892 U CN202322452892 U CN 202322452892U CN 221028735 U CN221028735 U CN 221028735U
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- sealing ring
- ring
- lam
- wafer
- stainless steel
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- 238000007789 sealing Methods 0.000 title claims abstract description 103
- 238000009713 electroplating Methods 0.000 title claims abstract description 24
- 239000010935 stainless steel Substances 0.000 claims abstract description 20
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 11
- 230000007774 longterm Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a device for sealing Wafer in LAM electroplating equipment, which comprises a lower sealing ring and an upper sealing ring, wherein the upper sealing ring is arranged at the upper end of the lower sealing ring in a fitting way, a stainless steel ring is arranged between the lower sealing ring and the upper sealing ring, the stainless steel ring is connected in a clamping way to the middle part of a mounting cavity, the mounting cavity is respectively arranged in the middle parts of the lower sealing ring and the upper sealing ring, and fixing lugs are fixedly connected at the edge of the lower end of the upper sealing ring and are arranged at equal angles at the lower end of the upper sealing ring. The device for sealing Wafer in the LAM electroplating equipment is characterized in that the stainless steel ring is clamped in the mounting cavity, so that the strength of the sealing ring in the use process can be improved, deformation in the long-term use process is prevented, and the sealing ring is conveniently positioned by clamping the fixing protrusion with the Wafer sheet, so that the sealing ring is prevented from shifting in the use process.
Description
Technical Field
The utility model relates to the technical field related to LAM electroplating equipment, in particular to a device for sealing Wafer in LAM electroplating equipment.
Background
Electroplating means that one or more single metal or alloy electroplating processes are selected to process the parts according to the requirements of the parts, such as electroplating or dip plating, so as to achieve the aims of corrosion resistance, wear resistance and attractive appearance, and when the electroplating operation is carried out on the products, the electroplating operation is carried out by means of corresponding electroplating equipment, and in the electroplating equipment, the sealing performance of Wafer sheets needs to be ensured when the Wafer sheets are processed;
However, in the prior art, when a Wafer sheet is sealed, the sealing ring is easy to shift during use and poor in stability, and the sealing ring is easy to deform during long-term use, so that the overall sealing effect is affected;
For this purpose we propose a means of sealing Wafer in LAM electroplating equipment to solve the above problems.
Disclosure of utility model
The utility model aims to provide a device for sealing Wafer in LAM electroplating equipment, which solves the problems that in the prior art, when Wafer sheets are normally sealed, a sealing ring is easy to shift during use, the stability is poor, and the sealing ring is easy to deform during long-term use, so that the overall sealing effect is affected.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the device for sealing Wafer in the LAM electroplating equipment comprises a lower sealing ring and an upper sealing ring which is attached to the upper end of the lower sealing ring;
the upper end of the upper sealing ring is fixedly connected with a fixed brace;
Further comprises:
The stainless steel ring is arranged between the lower sealing ring and the upper sealing ring, is connected to the middle part of the mounting cavity in a clamping manner, and is respectively arranged in the middle parts of the lower sealing ring and the upper sealing ring;
The fixed lug, fixed lug fixed connection is in the edge of upper seal circle lower extreme, and fixed lug is equiangular setting in the lower extreme of upper seal circle to be the one-to-one setting between fixed lug and the fixed connection groove.
Preferably, through holes are formed in the left end and the right end of the stainless steel ring, and positioning pins for positioning are connected in the middle of the through holes in a penetrating manner.
Preferably, the upper end and the lower end of the locating pin are both clamped and connected with locating grooves, and the locating grooves are formed in the bottom of the mounting cavity.
Preferably, the fixing protruding block is connected to the middle of the fixing connecting groove in a clamping mode, and the fixing protruding block is in interference fit with the fixing connecting groove.
Preferably, the fixed connection groove is arranged at the edge of the upper end of the lower sealing ring at equal angles, the lower end of the lower sealing ring is fixedly connected with a fixed protrusion, and the fixed protrusion is arranged at the lower end of the lower sealing ring at equal angles.
Compared with the prior art, the utility model has the beneficial effects that: according to the device for sealing Wafer in the LAM electroplating equipment, in the actual use process, the strength of the sealing ring in the use process can be improved through the clamping of the stainless steel ring in the installation cavity, deformation in the long-term use process is prevented from being caused, the actual sealing effect is influenced, the positioning pin is combined, the positioning of the lower sealing ring, the upper sealing ring and the installation cavity is facilitated, the assembly of the lower sealing ring and the upper sealing ring is facilitated through the combination of the fixing lug, the positioning of the sealing ring is facilitated through the clamping of the fixing lug and the Wafer sheet, and the deviation of the sealing ring in the use process is prevented;
1. The stainless steel ring is clamped in the mounting cavity, so that the strength of the sealing ring in the use process is greatly improved, and the sealing ring is prevented from deforming in the long-term use process to influence the actual sealing effect;
2. The stainless steel ring is provided with a through hole, a locating pin and a locating groove, the locating pin is connected in the through hole in a penetrating way, and meanwhile, the locating pin is installed in the middle of the locating groove in a clamping way, so that the stainless steel ring, the lower sealing ring and the upper sealing ring can be positioned conveniently;
3. Be equipped with fixed lug, fixed connection groove and fixed protruding, through interference fit between fixed lug and the fixed connection groove, be convenient for connect and fix a position between lower floor's sealing washer and the upper sealing washer, through fixing protruding and Wafer sheet between carry out the block, be convenient for fix a position the sealing washer, prevent that the sealing washer from taking place the skew in the use.
Drawings
FIG. 1 is a schematic view of the front cut-away structure of the present utility model;
FIG. 2 is a schematic diagram of the explosion structure of the lower seal ring, the stainless steel ring and the locating pin connection of the utility model;
FIG. 3 is a schematic diagram of the front view of the connection of the upper seal ring, the fixing lug and the fixing brace;
fig. 4 is a schematic view showing the bottom structure of the connection of the lower seal ring and the fixing protrusion.
In the figure: 1. a lower seal ring; 2. an upper seal ring; 3. a mounting cavity; 4. a stainless steel ring; 5. a through hole; 6. a positioning pin; 7. a positioning groove; 8. fixing the brace; 9. a fixing bump; 10. a fixed connection groove; 11. and fixing the protrusion.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a device that seals Wafer in LAM electroplating equipment, includes lower floor's sealing washer 1, upper sealing washer 2, installation cavity 3, stainless steel ring 4, through-hole 5, locating pin 6, constant head tank 7, fixed brace 8, fixed lug 9, fixed connection groove 10 and fixed protruding 11.
When the device for sealing Wafer in the LAM electroplating equipment is used, as shown in figures 1, 2 and 3, the sealing ring is formed by combining a lower sealing ring 1 and an upper sealing ring 2, the middle parts of the lower sealing ring 1 and the upper sealing ring 2 are respectively provided with a mounting cavity 3, a stainless steel ring 4 is clamped and mounted in the mounting cavity 3 in the middle of the lower sealing ring 1, then a positioning pin 6 is connected in a through hole 5 in a penetrating way, meanwhile, the positioning pin 6 is clamped and connected with a positioning groove 7, and further limiting is conveniently carried out between the lower sealing ring 1 and the stainless steel ring 4, then the upper sealing ring 2 is clamped and connected to the upper end of the stainless steel ring 4, the upper end of the stainless steel ring 4 is clamped and connected to the mounting cavity 3 in the middle of the upper sealing ring 2, the upper end of the positioning pin 6 is clamped and connected to the positioning groove 7 in the middle of the upper sealing ring 2, meanwhile, the edge of the lower end of the upper sealing ring 2 is provided with a fixing lug 9, the fixing lug 9 and a fixing groove 10 which is equiangular and is formed in the upper end of the lower sealing ring 1 are arranged in a one-to-one correspondence way, the upper sealing ring 2 drives the fixing lug 9 and the lower sealing ring 2 to be tightly connected with the lower sealing ring 1 through the fixing groove 10, and the fixing lug 10 is tightly matched and tightly connected with the sealing ring 2;
Through the setting of stainless steel ring 4, the intensity of sealing washer in the in-service use has been promoted greatly, prevent that the sealing washer from taking place to warp in long-term use, prolonged the life of sealing washer, simultaneously prevent to influence sealed effect, combine the figure 4 to show moreover, lower extreme equiangular degree of lower floor's sealing washer 1 is provided with fixed bulge 11, through carrying out the block between fixed bulge 11 and the Wafer thin slice, be convenient for fix a position between sealing washer and the Wafer thin slice, promote the stability of sealing washer in the use, prevent that the sealing washer from taking place to shift in long-term use, and the upper end fixedly connected with of upper sealing washer 2 is fixed brace 8, when needs change the sealing washer, because the sealing washer surface is comparatively smooth, inconvenient taking, can upwards stimulate fixed brace 8 and drive the sealing washer and dismantle, it is very convenient to use.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The device for sealing Wafer in the LAM electroplating equipment comprises a lower sealing ring (1) and an upper sealing ring (2) which is attached to the upper end of the lower sealing ring (1);
the upper end of the upper sealing ring (2) is fixedly connected with a fixing brace (8);
characterized by further comprising:
The stainless steel ring (4) is arranged between the lower-layer sealing ring (1) and the upper-layer sealing ring (2), the stainless steel ring (4) is connected to the middle part of the mounting cavity (3) in a clamping mode, and the mounting cavity (3) is respectively arranged in the middle parts of the lower-layer sealing ring (1) and the upper-layer sealing ring (2);
The fixing lug (9), the edge of fixed lug (9) fixed connection upper seal circle (2) lower extreme, and fixed lug (9) are equiangular setting in the lower extreme of upper seal circle (2) to be the one-to-one setting between fixed lug (9) and fixed connection groove (10).
2. The device for sealing Wafer in LAM electroplating equipment according to claim 1, wherein: through holes (5) are formed in the left end and the right end of the stainless steel ring (4), and locating pins (6) used for locating are connected in the middle of the through holes (5) in a penetrating mode.
3. The device for sealing Wafer in LAM electroplating equipment according to claim 2, wherein: the upper end and the lower end of the locating pin (6) are respectively connected with a locating groove (7) in a clamping mode, and the locating grooves (7) are formed in the bottom of the mounting cavity (3).
4. The device for sealing Wafer in LAM electroplating equipment according to claim 1, wherein: the fixing lug (9) is connected to the middle part of the fixing connecting groove (10) in a clamping mode, and the fixing lug (9) is in interference fit with the fixing connecting groove (10).
5. The device for sealing Wafer in an LAM electroplating apparatus according to claim 4, wherein: the fixed connection groove (10) is arranged at the edge of the upper end of the lower-layer sealing ring (1) at equal angles, the lower end of the lower-layer sealing ring (1) is fixedly connected with the fixed protrusion (11), and the fixed protrusion (11) is arranged at the lower end of the lower-layer sealing ring (1) at equal angles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322452892.6U CN221028735U (en) | 2023-09-11 | 2023-09-11 | Device for sealing Wafer in LAM electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322452892.6U CN221028735U (en) | 2023-09-11 | 2023-09-11 | Device for sealing Wafer in LAM electroplating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221028735U true CN221028735U (en) | 2024-05-28 |
Family
ID=91176748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322452892.6U Active CN221028735U (en) | 2023-09-11 | 2023-09-11 | Device for sealing Wafer in LAM electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221028735U (en) |
-
2023
- 2023-09-11 CN CN202322452892.6U patent/CN221028735U/en active Active
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