CN221022120U - Mould for processing junction box cover - Google Patents
Mould for processing junction box cover Download PDFInfo
- Publication number
- CN221022120U CN221022120U CN202322673984.7U CN202322673984U CN221022120U CN 221022120 U CN221022120 U CN 221022120U CN 202322673984 U CN202322673984 U CN 202322673984U CN 221022120 U CN221022120 U CN 221022120U
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- fixed
- die box
- box
- die
- lower die
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 83
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 238000005057 refrigeration Methods 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 3
- 230000002457 bidirectional effect Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 3
- 229920003023 plastic Polymers 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 12
- 238000005034 decoration Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a die for processing a junction box cover, which relates to the technical field of junction box cover processing and comprises a lower die box and a cooling assembly; and (3) a lower die box: an upper die box is arranged in the lower die box, an injection molding opening is formed in the upper end of the rear side of the lower die box, a connecting frame is fixed at the upper end of the side face of the upper die box, two corresponding clamping columns are fixed at the lower side of the connecting frame, two corresponding clamping grooves are formed in the upper side of the lower die box, the clamping columns are clamped in the clamping grooves, a top die assembly is arranged at the lower side of the lower die box, a refrigerating assembly is arranged on the side face of the upper die box, and a die clamping assembly is arranged at the front side and the rear side of the lower die box; and (3) a cooling assembly: the water storage device comprises a water inlet pipe, a water pump, a connecting pipe, a fixed pipe, a water storage cavity and a return pipe, wherein a water outlet hole is formed in the upper side of the upper die box, the water inlet pipe is fixed in the water outlet hole, and cooling and demoulding can be performed rapidly.
Description
Technical Field
The utility model relates to the technical field of junction box cover processing, in particular to a die for processing a junction box cover.
Background
In home decoration, the junction box is one of electrical auxiliary materials, because the electric wire for decoration passes through the electric wire tube, the junction part (such as a longer line or a corner of the electric wire tube) of the electric wire tube is used as a transition, the electric wire tube is connected with the junction box, the electric wire in the junction box is connected with the junction box, the effect of protecting the electric wire and connecting the electric wire is achieved, and the junction box cover is an important component part of the junction box;
The existing junction box cover is formed by injection molding in the production and processing process, an injection mold is needed under the condition, the existing injection mold cannot cool the injection molded material rapidly after injection molding, meanwhile, products are easy to adhere to the mold during demolding, and demolding cannot be performed rapidly, so that the mold for processing the junction box cover is provided.
Disclosure of utility model
The utility model aims to overcome the existing defects, provides a die for processing a junction box cover, can rapidly cool and demould, and can effectively solve the problems in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a die for processing a junction box cover comprises a lower die box and a cooling assembly;
And (3) a lower die box: an upper die box is arranged in the lower die box, an injection molding opening is formed in the upper end of the rear side of the lower die box, a connecting frame is fixed at the upper end of the side face of the upper die box, two corresponding clamping columns are fixed at the lower side of the connecting frame, two corresponding clamping grooves are formed in the upper side of the lower die box, the clamping columns are clamped in the clamping grooves, a top die assembly is arranged at the lower side of the lower die box, a refrigerating assembly is arranged on the side face of the upper die box, and a die clamping assembly is arranged at the front side and the rear side of the lower die box;
And (3) a cooling assembly: the water storage device comprises a water inlet pipe, a water pump, a connecting pipe, a fixed pipe, a water storage cavity and a return pipe, wherein the upper side of an upper die box is provided with a water outlet hole, the water inlet pipe is fixed in the water outlet hole, the right end of the water inlet pipe is fixed in the water inlet of the water pump, the connecting pipe is fixed in the water outlet of the water pump, the water storage cavity is arranged at the lower end of the lower die box, two corresponding fixing holes are arranged at the left side and the right side of the water storage cavity, the left end and the right end of the fixed pipe are fixed in the two fixing holes, the lower end of the connecting pipe is fixed on the circumferential surface of the fixed pipe, the connecting pipe is communicated with the fixed pipe, the circumferential surface of the fixed pipe is provided with a fixing port, the return pipe is fixed in the fixing hole arranged at the upper side of the upper die box, the input end of the water pump is electrically connected with the output end of an external control switch group, and the material for producing the junction box cover is cooled by a cooling assembly.
Further, the top die assembly comprises a first electric telescopic rod and a top plate, two corresponding grooves are formed in the lower side of the lower die box, the first electric telescopic rod is arranged in the grooves, the top plate is arranged at the lower end of the inner portion of the lower die box, telescopic arms of the two first electric telescopic rods are fixed on the lower side of the top plate, the input end of the first electric telescopic rod is electrically connected with the output end of an external PLC controller, and the formed junction box cover is ejected out through the arrangement of the top die assembly.
Further, the refrigeration subassembly contains semiconductor refrigeration piece and temperature sensor, two corresponding mounting grooves have been seted up to the upside of going up the mould case, the internally mounted of mounting groove has semiconductor refrigeration piece, the refrigeration end of semiconductor refrigeration piece is located the inside of mounting groove, the radiating end of semiconductor refrigeration piece is located the outside of mounting groove, the internally mounted of going up the mould case has temperature sensor, temperature sensor is connected with outside PLC controller two-way electricity, the output of outside PLC controller is connected to the input electricity of semiconductor refrigeration piece, cools off the inside water of going up the mould case through setting up the refrigeration subassembly.
Further, the compound die assembly comprises a fixed block, a mounting seat and a second electric telescopic rod, two corresponding fixed blocks are fixed on the front side and the rear side of the connecting frame, two corresponding mounting seats are fixed on the front side and the rear side of the lower die box, the second electric telescopic rod is mounted on the upper side of the mounting seat, the telescopic arm of the second electric telescopic rod is fixed on the lower side of the corresponding fixed block, and the input end of the second electric telescopic rod is electrically connected with the output end of an external PLC controller and drives the upper die box to move through the arrangement of the compound die assembly.
Further, four corresponding supporting legs are fixed on the lower side of the lower die box, a bottom plate is fixed on the lower side of the four supporting legs, and the lower die box is supported through the supporting legs and the bottom plate.
Further, the inside of the water filling port that upper mould case upside set up is fixed with the water injection pipe, the upper end lock joint of water injection pipe has the block, and the inside of going into the upper mould case is passed through to the required water of cooling.
Compared with the prior art, the utility model has the beneficial effects that: the die for processing the junction box cover has the following advantages:
1. The refrigerating assembly is arranged to cool the internal water of the upper die box after injection molding, the cooled water will primarily cool the material in the lower die box, after the primary cooling, the water pump is started to inject the water into the water storage cavity through the connecting pipe, the water entering the water storage cavity cools the further water material, and under the condition, the material can be rapidly cooled to be molded;
2. Through setting up the top die assembly and making can start two first electric telescopic handle after terminal box cover cooling shaping and make the roof upwards move, the roof upwards moves can be ejecting with fashioned material, can accomplish the drawing of patterns under such circumstances, and is very swift.
Drawings
FIG. 1 is a schematic view of the front side structure of the present utility model;
FIG. 2 is a schematic view of a cooling module according to the present utility model;
Fig. 3 is a schematic structural diagram of a refrigeration assembly according to the present utility model.
In the figure: the device comprises a lower die box 1, an upper die box 2, a connecting frame 3, a cooling component 4, a water inlet pipe 41, a water pump 42, a connecting pipe 43, a fixed pipe 44, a water storage cavity 45, a return pipe 46, a top die component 5, a first electric telescopic rod 51, a top plate 52, a refrigerating component 6, a semiconductor refrigerating sheet 61, a temperature sensor 62, a die clamping component 7, a fixed block 71, a mounting seat 72, a second electric telescopic rod 73, a clamping column 8, a supporting leg 9, a bottom plate 10, a water injection pipe 11 and a cap 12.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present embodiment provides a technical solution: a die for processing a junction box cover comprises a lower die box 1 and a cooling assembly 4;
Lower die box 1: an upper die box 2 is arranged inside, an injection molding opening is arranged at the upper end of the rear side of a lower die box 1, a connecting frame 3 is fixed at the upper end of the side surface of the upper die box 2, two corresponding clamping columns 8 are fixed at the lower side of the connecting frame 3, two corresponding clamping grooves are formed at the upper side of the lower die box 1, the clamping columns 8 are clamped inside the clamping grooves, a top die assembly 5 is arranged at the lower side of the lower die box 1, a refrigerating assembly 6 is arranged at the side surface of the upper die box 2, a die clamping assembly 7 is arranged at the front side and the rear side of the lower die box 1, the top die assembly 5 comprises a first electric telescopic rod 51 and a top plate 52, two corresponding grooves are formed at the lower side of the lower die box 1, a first electric telescopic rod 51 is arranged inside the grooves, telescopic arms of the two first electric telescopic rods 51 are all fixed at the lower side of the top plate 52, the input ends of the first electric telescopic rods 51 are electrically connected with the output ends of an external PLC controller, the refrigerating assembly 6 comprises a semiconductor refrigerating sheet 61 and a temperature sensor 62, two corresponding mounting grooves are formed in the upper side of the upper die box 2, the semiconductor refrigerating sheet 61 is mounted in the mounting grooves, the refrigerating end of the semiconductor refrigerating sheet 61 is positioned in the mounting grooves, the radiating end of the semiconductor refrigerating sheet 61 is positioned outside the mounting grooves, the temperature sensor 62 is mounted in the upper die box 2, the temperature sensor 62 is electrically connected with an external PLC (programmable logic controller) in a bidirectional manner, the input end of the semiconductor refrigerating sheet 61 is electrically connected with the output end of the external PLC controller, the die clamping assembly 7 comprises a fixed block 71, a mounting seat 72 and a second electric telescopic rod 73, two corresponding fixed blocks 71 are fixed on the front side and the rear side of the connecting frame 3, two corresponding mounting seats 72 are fixed on the front side and the rear side of the lower die box 1, the second electric telescopic rod 73 is mounted on the upper side of the mounting seat 72, the telescopic arm of the second electric telescopic rod 73 is fixed at the lower side of the corresponding fixed block 71, the input end of the second electric telescopic rod 73 is electrically connected with the output end of an external PLC controller, the upper die box 2 is driven to move by arranging the die assembly 7, water in the upper die box 2 is cooled by arranging the refrigerating assembly 6, and the molded junction box cover is ejected by arranging the ejecting die assembly 5;
Cooling module 4: the water storage device comprises a water inlet pipe 41, a water pump 42, a connecting pipe 43, a fixed pipe 44, a water storage cavity 45 and a return pipe 46, wherein a water outlet hole is formed in the upper side of an upper die box 2, the water inlet pipe 41 is fixed in the water outlet hole, the right end of the water inlet pipe 41 is fixed in the water inlet of the water pump 42, the connecting pipe 43 is fixed in the water outlet of the water pump 42, the water storage cavity 45 is formed in the lower end of the lower die box 1, two corresponding fixing holes are formed in the left side and the right side of the inner portion of the water storage cavity 45, the left end and the right end of the fixed pipe 44 are fixed in the two fixing holes, the lower end of the connecting pipe 43 is fixed on the circumferential surface of the fixed pipe 44, the connecting pipe 43 is communicated with the fixed pipe 44, a fixing hole is formed in the circumferential surface of the fixed pipe 44, the return pipe 46 is fixed in the fixing hole, the upper end of the return pipe 46 is fixed in the water inlet hole arranged in the upper side of the upper die box 2, the input end of the water pump 42 is electrically connected with the output end of an external control switch group, and the material for producing the junction box cover is cooled by the cooling assembly 4.
Wherein: four corresponding supporting legs 9 are fixed on the lower side of the lower die box 1, a bottom plate 10 is fixed on the lower side of the four supporting legs 9, and the lower die box 1 is supported by the supporting legs 9 and the bottom plate 10.
Wherein: the inside of the water filling port that upper mould case 2 upside set up is fixed with water injection pipe 11, and the upper end lock joint of water injection pipe 11 has block 12, and the inside of upper mould case 2 is entered into through water injection pipe 11 to the required water of cooling.
The working principle of the die for processing the junction box cover provided by the utility model is as follows: the injection molding opening arranged at the rear side of the lower die box 1 is injected into the lower die box 1, the injection molding opening is closed after injection, then water is injected into the lower die box 1 through the water injection pipe 11, the injection starting semiconductor refrigerating piece 61 is injected to cool the water in the lower die box 1, the cooled water is used for initially cooling the material in the lower die box 1, the water pump 42 is started to inject the water into the water storage cavity 45 through the connecting pipe 43 after the initial cooling, the water in the water storage cavity 45 is used for cooling the further water material, the material can be rapidly cooled to be molded under the condition, the upper die box 2 is enabled to be separated from the lower die box 1 by starting the two second electric telescopic rods 73 after the material is cooled to be molded, the top plate 52 is enabled to be moved upwards by starting the two first electric telescopic rods 51 after the separation, and the molded junction box cover can be ejected by the upward movement of the top plate 52, so that the demolding can be completed very fast.
It should be noted that the external PLC controller disclosed in the above embodiment is specifically designated by the siemens S7-200, the water pump 42 may be se:Sub>A WQD-12-0.55L1 water pump, the first electric telescopic rod 51 and the second electric telescopic rod 73 may be TGC-se:Sub>A high-thrust electric telescopic rods, the semiconductor refrigerating plate 61 may be se:Sub>A C1204 multi-stage semiconductor refrigerating plate, the temperature sensor 62 may be an LSC I-TZ03 laser focusing type infrared temperature sensor, and the external PLC controller controls the water pump 42, the first electric telescopic rod 51, the second electric telescopic rod 73 and the semiconductor refrigerating plate 61 to operate in se:Sub>A manner commonly used in the prior art.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (6)
1. A mould of terminal box cover processing, its characterized in that: comprises a lower die box (1) and a cooling assembly (4);
Lower die box (1): the inside is provided with upper die box (2), the upper end of lower die box (1) rear side is provided with the mouth of moulding plastics, the upper end of upper die box (2) side is fixed with connecting frame (3), the downside of connecting frame (3) is fixed with two corresponding draw-in grooves, two corresponding draw-in grooves have been seted up to the upside of lower die box (1), draw-in grooves (8) joint is in the inside of draw-in groove, top die subassembly (5) are installed to the downside of lower die box (1), refrigeration subassembly (6) are installed to the side of upper die box (2), compound die subassembly (7) are installed to the front and back both sides of lower die box (1);
Cooling module (4): contain inlet tube (41), water pump (42), connecting pipe (43), fixed pipe (44), retaining chamber (45) and back flow (46), the apopore has been seted up to the upside of going up moulding box (2), the inside of apopore is fixed with inlet tube (41), the right-hand member of inlet tube (41) is fixed in the inside of the water inlet of water pump (42), the inside of the delivery port of water pump (42) is fixed with connecting pipe (43), retaining chamber (45) have been seted up to the inside lower extreme of lower moulding box (1), two corresponding fixed orifices have been seted up to the left and right sides of the inside of retaining chamber (45), the inside at two fixed orifices is fixed to the left and right sides both ends of fixed pipe (44), the lower extreme of connecting pipe (43) is fixed on the periphery of fixed pipe (44), connecting pipe (43) communicate with each other with fixed pipe (44), the inside of fixed orifice is fixed with back flow (46) on the periphery of fixed pipe (44), the upper end of back flow (46) is fixed in the inside of water pump (2) and is connected to the outside of the inside of water pump (42).
2. The die for processing a junction box cover according to claim 1, wherein: the top die assembly (5) comprises a first electric telescopic rod (51) and a top plate (52), two corresponding grooves are formed in the lower side of the lower die box (1), the first electric telescopic rod (51) is mounted in the grooves, the top plate (52) is arranged at the lower end of the inner portion of the lower die box (1), telescopic arms of the two first electric telescopic rods (51) are fixed on the lower side of the top plate (52), and the input end of the first electric telescopic rod (51) is electrically connected with the output end of an external PLC controller.
3. The die for processing a junction box cover according to claim 1, wherein: the refrigerating assembly (6) comprises a semiconductor refrigerating sheet (61) and a temperature sensor (62), two corresponding mounting grooves are formed in the upper side of the upper die box (2), the semiconductor refrigerating sheet (61) is mounted in the mounting grooves, the refrigerating end of the semiconductor refrigerating sheet (61) is located in the mounting grooves, the radiating end of the semiconductor refrigerating sheet (61) is located outside the mounting grooves, the temperature sensor (62) is mounted in the upper die box (2), the temperature sensor (62) is electrically connected with an external PLC (programmable logic controller) in a bidirectional mode, and the input end of the semiconductor refrigerating sheet (61) is electrically connected with the output end of the external PLC.
4. The die for processing a junction box cover according to claim 1, wherein: the die assembly (7) comprises a fixed block (71), a mounting seat (72) and a second electric telescopic rod (73), two corresponding fixed blocks (71) are fixed on the front side and the rear side of the connecting frame (3), two corresponding mounting seats (72) are fixed on the front side and the rear side of the lower die box (1), the second electric telescopic rod (73) is mounted on the upper side of the mounting seat (72), a telescopic arm of the second electric telescopic rod (73) is fixed on the lower side of the corresponding fixed block (71), and the input end of the second electric telescopic rod (73) is electrically connected with the output end of an external PLC (programmable logic controller).
5. The die for processing a junction box cover according to claim 1, wherein: four corresponding supporting legs (9) are fixed on the lower side of the lower die box (1), and a bottom plate (10) is fixed on the lower side of the four supporting legs (9).
6. The die for processing a junction box cover according to claim 1, wherein: the inside of the water filling port that upper mould case (2) upside set up is fixed with water injection pipe (11), the upper end lock joint of water injection pipe (11) has block (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322673984.7U CN221022120U (en) | 2023-10-07 | 2023-10-07 | Mould for processing junction box cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322673984.7U CN221022120U (en) | 2023-10-07 | 2023-10-07 | Mould for processing junction box cover |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221022120U true CN221022120U (en) | 2024-05-28 |
Family
ID=91175020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322673984.7U Active CN221022120U (en) | 2023-10-07 | 2023-10-07 | Mould for processing junction box cover |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221022120U (en) |
-
2023
- 2023-10-07 CN CN202322673984.7U patent/CN221022120U/en active Active
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