CN221008944U - Chip packaging unit and chip unit - Google Patents
Chip packaging unit and chip unit Download PDFInfo
- Publication number
- CN221008944U CN221008944U CN202322427690.6U CN202322427690U CN221008944U CN 221008944 U CN221008944 U CN 221008944U CN 202322427690 U CN202322427690 U CN 202322427690U CN 221008944 U CN221008944 U CN 221008944U
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- Prior art keywords
- transition
- chip
- base island
- transition portion
- pin
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 230000007704 transition Effects 0.000 claims abstract description 175
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model belongs to the technical field of chips, and particularly relates to a chip packaging unit and a chip unit, wherein the chip packaging unit comprises a base island, a transition part and pins; the base island is rectangular, and a mounting surface for mounting a chip is arranged on the base island; the plurality of the transition parts are arranged, the plurality of the pins are arranged, and the plurality of the pins and the plurality of the transition parts are in one-to-one correspondence; the transition parts are arranged around the base island, and each pin is connected with one side, far away from the base island, of the corresponding transition part; the transition part is provided with a connecting surface for connecting leads of the chip, and the mounting surface and the connecting surface are positioned on the same plane. According to the chip packaging unit and the chip unit provided by the embodiment of the utility model, as the base island and the transition part are not included, the base island and the transition part are co-located on the same plane, and after the chip is directly arranged on the surface of the base island, the two ends of the lead are not required to be excessively bent, so that the lead is convenient to install.
Description
Technical Field
The utility model belongs to the technical field of chips, and particularly relates to a chip packaging unit and a chip unit.
Background
In the prior art, the front face of the base island and the front face of the pin are obliquely arranged, and the chip is mounted on the base island. In this way, the mounted base island is inclined relative to the pins, so that not only is the length of part of the leads on the chip required to be increased, but also the leads need to be bent to adapt to the mounting environment, so that the connection operation of the chip is relatively complex.
Disclosure of utility model
The technical problems to be solved by the utility model are as follows: aiming at the problem that the connection operation of chips is relatively complex in the prior art, the chip packaging unit and the chip unit are provided.
In order to solve the technical problems, an embodiment of the present utility model provides a chip packaging unit, including a base island, a transition portion and a pin;
The base island is provided with a mounting surface for mounting a chip;
The plurality of the transition parts are arranged, the plurality of the pins are arranged, and the plurality of the pins and the plurality of the transition parts are arranged in a one-to-one correspondence manner;
The plurality of transition parts are arranged around the base island, and each pin is connected with one side, far away from the base island, of the corresponding transition part;
The transition part is provided with a connecting surface for connecting leads of the chip, and the mounting surface is parallel to the connecting surface.
Optionally, the area of the mounting surface is greater than or equal to the area of the contact surface of the chip with the mounting surface.
Optionally, four transition portions are provided, and the four transition portions are a first transition portion, a second transition portion, a third transition portion and a fourth transition portion respectively; the base island is rectangular and is provided with a first side edge and a second side edge which are opposite;
The first transition part and the second transition part are arranged on the first side edge of the base island;
the third transition part and the fourth transition part are arranged on the second side edge of the base island;
the first transition portion and the third transition portion are diagonally disposed.
Optionally, the first transition portion and the second transition portion are respectively located at two ends of the first side edge;
the third transition part and the fourth transition part are respectively arranged at two ends of the second side edge.
Optionally, one side edge of the first transition part is connected with the base island, and the edge of the first transition part far away from the base island is connected with the corresponding pin;
one side edge of the third transition part is connected with the base island, and the edge of the third transition part far away from the base island is connected with the corresponding pin;
The edge of the second transition part, which is close to the base island, is arranged at intervals with the base island, and the edge of the second transition part, which is far away from the base island, is connected with the corresponding pin;
The edge of the fourth transition part, which is close to the base island, is arranged at intervals with the base island, and the edge of the fourth transition part, which is far away from the base island, is connected with the corresponding pin.
Optionally, the first transition portion and the island are of unitary construction;
The third transition part and the base island are of an integrated structure.
Optionally, four pins are provided, and the four pins are a first pin, a second pin, a third pin and a fourth pin respectively;
The first pin corresponds to the first transition, the second pin corresponds to the second transition, the third pin corresponds to the third transition, and the fourth pin corresponds to the fourth transition;
the first pins and the second pins are arranged at intervals, and the third pins and the fourth pins are arranged at intervals.
Optionally, the second transition portion extends towards the first transition portion, so that the second transition portion protrudes from a side edge of the second pin, which is close to the first pin, and opposite sides of the second transition portion and the first transition portion are arranged at intervals;
The fourth transition portion extends towards the third transition portion, so that the fourth transition portion protrudes out of one side edge of the fourth pin, which is close to the first pin, and the opposite sides of the fourth transition portion and the third transition portion are arranged at intervals.
On the other hand, the embodiment of the utility model also provides a chip unit, which comprises a chip and the chip packaging unit;
One end of the lead wire is connected with the chip, the other end of the lead wire is connected with the connecting surface, and the chip is mounted on the mounting surface.
Optionally, the outer contour of the chip is located inside the outer edge of the mounting surface.
According to the chip packaging unit and the chip unit provided by the embodiment of the utility model, as the base island and the transition part are not included, the base island and the transition part are co-located on the same plane, and after the chip is directly arranged on the surface of the base island, the two ends of the lead are not required to be excessively bent, so that the lead is convenient to install.
Drawings
Fig. 1 is an overall schematic diagram of a chip unit provided by the present utility model.
Reference numerals in the specification are as follows:
1. A chip; 11. a lead wire; 21. a base island; 211. a first side; 212. a second side; 221. a first transition portion; 222. a second transition portion; 223. a third transition portion; 224. a fourth transition portion; 231. a first pin; 232. a second pin; 233. a third pin; 234. and a fourth pin.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
First embodiment
As shown in fig. 1, a chip 1 packaging unit provided in a first embodiment of the present utility model includes a base island 21, a transition portion, and a pin. The base island 21 has a rectangular shape, the base island 21 may have a rectangular shape or a square shape, and a mounting surface for mounting the chip 1 is provided on the base island 21. The transition portion is provided with a plurality of, and the pin is provided with a plurality of, and a plurality of pins and a plurality of transition portion one-to-one. The plurality of transition portions are arranged around the base island 21, and one side of each transition portion, which is far away from the base island 21, is connected with a corresponding pin. The transition portion is provided with a connection surface for connection of the leads 11 of the chip 1, and the mounting surface and the connection surface are in the same plane.
The chip 1 is mounted on the mounting surface of the base island 21, the lead 11 on the chip 1 is welded with the transition part, and the transition part is connected with the pin, so that the connection between the chip 1 and the pin is realized. While the mounting surface of the base island 21 and the connecting surface of the transition portion in this embodiment are located on the same plane, it is convenient for the chip 1 to be soldered on the transition portion through the lead 11, specifically, one end of the lead 11 is soldered on the chip 1, and the other end is directly soldered on the transition portion. The lead 11 in the prior art needs to be bent corresponding to the base island 21 and the pin, and the requirement on the bending process of the lead 11 is high, so that the production cost of the lead 11 is increased, otherwise, the lead 11 is easy to break or cannot match the mounting environment, and the situation cannot occur in the application.
In this embodiment, the area of the mounting surface on the base island 21 is larger than the area of the contact surface of the chip 1 with the mounting surface, or the relationship between the two may be equal, that is, the outer contour of the chip 1 is located inside the outer edge of the mounting surface after the chip 1 is mounted on the mounting surface. And selecting according to design requirements.
In the present embodiment, the base island 21 has a first side 211 and a second side 212, four transition portions are provided, and the four transition portions are a first transition portion 221, a second transition portion 222, a third transition portion 223, and a fourth transition portion 224, respectively. The first transition portion 221 and the second transition portion 222 are disposed on the first side 211 of the base island 21; the third transition portion 223 and the fourth transition portion 224 are disposed on the second side 212 of the base island 21; the first side 211 and the second side 212 are disposed opposite. The first transition 221 and the third transition 223 are distributed on the diagonal of the island.
Correspondingly, referring to fig. 1, four pins are provided in the present embodiment, and the four pins are referred to as a first pin 231, a second pin 232, a third pin 233, and a fourth pin 234, respectively. Wherein the first pin 231 corresponds to the first transition 221, the second pin 232 corresponds to the second transition 222, the third pin 233 corresponds to the third transition 223, and the fourth pin 234 corresponds to the fourth transition 224. The first pins 231 and the second pins 232 are arranged at intervals, so that the first transition portion 221 and the second transition portion 222 are respectively located at two ends of the first side 211, and the third pins 233 and the fourth pins 234 are arranged at intervals, so that the third transition portion 223 and the fourth transition portion 224 are respectively located at two ends of the second side 212.
In this embodiment, one side edge of the first transition portion 221 is connected to the base island 21, and the edge of the first transition portion 221 away from the base island 21 is connected to the corresponding pin. Similarly, one side edge of the third transition portion 223 is connected to the base island 21, and the edge of the third transition portion 223 away from the base island 21 is connected to the corresponding pin.
Unlike the above, the edge of the second transition portion 222 close to the base island 21 is spaced apart from the base island 21, and the edge of the second transition portion 222 far from the base island 21 is connected to the corresponding pin. The edge of the fourth transition portion 224, which is close to the base island 21, is spaced from the base island 21, and the edge of the fourth transition portion 224, which is far from the base island 21, is connected to the corresponding pin.
The first transition portion 221 and the third transition portion 223 are respectively bordered and connected to the island 21, and the second transition portion 222 and the fourth transition portion 224 are not bordered and directly connected to the island 21. This arrangement is determined by the functional differences of the four transitions. Thus, in other embodiments, four transitions are functionally designed to determine whether or not a transition therein borders and connects with the island 21.
Specifically, the first transition portion 221 and the base island 21 in this embodiment are integrally formed, and may be integrally formed by casting. Similarly, the third transition portion 223 and the island 21 are integrally formed.
In the present embodiment, the second transition portion 222 extends toward the first transition portion 221, such that the second transition portion 222 protrudes from a side edge of the second lead 232 near the first lead 231, and opposite sides of the second transition portion 222 and the first transition portion 221 are disposed at intervals.
The fourth transition portion 224 extends toward the third transition portion 223 such that the fourth transition portion 224 protrudes from a side edge of the fourth pin 234 near the first pin 231, and opposite sides of the fourth transition portion 224 and the third transition portion 223 are disposed at intervals.
In this embodiment, by extending the second transition portion 222 and the fourth transition portion 224, particularly by extending the second transition portion 222 along the length of the first side 211 and the fourth transition portion 224 along the length of the second side 212, the area of the second transition portion 222 and the fourth transition portion 224 is increased. The length of the lead 11 near one of the corners of the chip 1 can be shortened to facilitate the connection of the lead 11 far from the second transition 222 or the fourth transition 224 to the transition.
Second embodiment
A second embodiment of the present utility model provides a chip unit, including the chip 1 and the chip 1 packaging unit described above. The edges of the chip 1 near the first side 211 or the second side 212 are respectively provided with a plurality of leads 11, one end of each lead 11 is connected to the chip 1, the other end is connected to the nearest one of the second transition portion 222 and the fourth transition portion 224, and the chip 1 is mounted on the mounting surface.
Referring to fig. 1, in the present embodiment, the outer contour of the chip 1 is located inside the outer edge of the mounting surface, so that the outer contour of the chip 1 is located inside the mounting surface.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. The chip packaging unit is characterized by comprising a base island, a transition part and pins;
The base island is provided with a mounting surface for mounting a chip;
The plurality of the transition parts are arranged, the plurality of the pins are arranged, and the plurality of the pins and the plurality of the transition parts are arranged in a one-to-one correspondence manner;
The plurality of transition parts are arranged around the base island, and each pin is connected with one side, far away from the base island, of the corresponding transition part;
The transition part is provided with a connecting surface for connecting leads of the chip, and the mounting surface and the connecting surface are positioned on the same plane.
2. The chip packaging unit according to claim 1, wherein an area of the mounting surface is greater than or equal to an area of a contact surface of the chip with the mounting surface.
3. The chip packaging unit according to claim 1, wherein four transition portions are provided, the four transition portions being a first transition portion, a second transition portion, a third transition portion, and a fourth transition portion, respectively; the base island is rectangular and is provided with a first side edge and a second side edge which are opposite;
The first transition part and the second transition part are arranged on the first side edge of the base island;
the third transition part and the fourth transition part are arranged on the second side edge of the base island;
the first transition portion and the third transition portion are diagonally disposed.
4. The chip packaging unit according to claim 3, wherein the first transition portion and the second transition portion are located at two ends of the first side edge, respectively;
the third transition part and the fourth transition part are respectively arranged at two ends of the second side edge.
5. The chip packaging unit according to claim 3, wherein one side edge of the first transition part is connected with the base island, and an edge of the first transition part far away from the base island is connected with the corresponding pin;
one side edge of the third transition part is connected with the base island, and the edge of the third transition part far away from the base island is connected with the corresponding pin;
The edge of the second transition part, which is close to the base island, is arranged at intervals with the base island, and the edge of the second transition part, which is far away from the base island, is connected with the corresponding pin;
The edge of the fourth transition part, which is close to the base island, is arranged at intervals with the base island, and the edge of the fourth transition part, which is far away from the base island, is connected with the corresponding pin.
6. The chip packaging unit according to claim 3, wherein the first transition portion and the island are of unitary construction;
The third transition part and the base island are of an integrated structure.
7. The chip packaging unit according to claim 3, wherein four pins are provided, the four pins being a first pin, a second pin, a third pin, and a fourth pin, respectively;
The first pin corresponds to the first transition, the second pin corresponds to the second transition, the third pin corresponds to the third transition, and the fourth pin corresponds to the fourth transition;
the first pins and the second pins are arranged at intervals, and the third pins and the fourth pins are arranged at intervals.
8. The chip packaging unit according to claim 7, wherein the second transition portion extends toward the first transition portion such that the second transition portion protrudes from a side edge of the second lead near the first lead, the second transition portion and the first transition portion being disposed at an opposite side interval;
The fourth transition portion extends towards the third transition portion, so that the fourth transition portion protrudes out of one side edge of the fourth pin, which is close to the first pin, and the opposite sides of the fourth transition portion and the third transition portion are arranged at intervals.
9. A chip unit comprising a chip, leads and the chip packaging unit of any one of claims 1-8;
One end of the lead wire is connected with the chip, the other end of the lead wire is connected with the connecting surface, and the chip is mounted on the mounting surface.
10. The chip unit of claim 9, wherein an outer contour of the chip is located inside an outer edge of the mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322427690.6U CN221008944U (en) | 2023-09-06 | 2023-09-06 | Chip packaging unit and chip unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322427690.6U CN221008944U (en) | 2023-09-06 | 2023-09-06 | Chip packaging unit and chip unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221008944U true CN221008944U (en) | 2024-05-24 |
Family
ID=91126076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322427690.6U Active CN221008944U (en) | 2023-09-06 | 2023-09-06 | Chip packaging unit and chip unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221008944U (en) |
-
2023
- 2023-09-06 CN CN202322427690.6U patent/CN221008944U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |