CN220983845U

CN220983845U - Heat abstractor and server

Info

Publication number: CN220983845U
Application number: CN202322835166.2U
Authority: CN
Inventors: 钟红强; 白少昀; 李中南; 高会武; 王冬明; 金明星; 倪健斌; 查国栋
Original assignee: Zhongke Controllable Information Industry Co Ltd
Current assignee: Zhongke Controllable Information Industry Co Ltd
Priority date: 2023-10-23
Filing date: 2023-10-23
Publication date: 2024-05-17
Anticipated expiration: 2033-10-23

Abstract

The utility model relates to the technical field of servers, and discloses a heat dissipation device and a server. The heat dissipation device comprises a base and a heat dissipation module, wherein the base comprises a bottom plate; the heat radiation module comprises a power panel, a rubber mounting seat and a fan; the rubber mounting seat comprises a wind scooper and a mounting bin which are integrally arranged, and the wind scooper and the mounting bin extend along the length direction of the bottom plate; the fan is arranged in the mounting bin and faces the air guide cover; the power panel is connected with the rubber mounting seat, and can be spliced with the power panel when the fan is arranged in the mounting bin; the rubber mount pad is connected with the base can be dismantled. According to the utility model, the heat radiation module is arranged on the bottom plate of the base, and is integrated with the power panel, the rubber mounting seat and the fan, so that the modularization degree of the heat radiation device is effectively improved; the disassembly is more efficient, quick and convenient; meanwhile, the light weight degree is higher, and the cost is lower; in addition, the structure is simpler, the air tightness is better, and then the radiating effect is better.

Description

Heat abstractor and server

Technical Field

The present utility model relates to the field of servers, and in particular, to a heat dissipation device and a server.

Background

In order to meet the requirement of the working stability of the server, the server generally has a certain requirement for heat dissipation in the chassis. Especially under the condition that a working hard disk and a main board CPU are fully loaded in a chassis, the factors such as industrial cost, reliability and the like are considered, a fan module is required to be arranged in the system for blowing or sucking air, and meanwhile, the air flow of the system is changed through a plastic part air guide cover, so that the purpose of reducing the internal temperature of the system more efficiently is achieved. Therefore, it is necessary to install the fan module and the fan housing in the server.

In the prior art, a server is generally composed of a main board, a fan, a wind scooper, a fan cabin and other key modules, and the components are various. The degree of modularization is not high in the process of assembling and maintaining the server at present, all components in the server are disassembled and assembled respectively and sequentially through all modules, and the production efficiency of multiple steps and production lines is low; meanwhile, the air guide cover and the fan bin of the fan are made of different materials, and are respectively required to be designed independently and manufactured by respectively opening the mould, so that the cost is high and the weight is high; in addition, a gap exists between the wind scooper and the fan, so that the air tightness of the wind scooper is larger, and the heat dissipation effect is further affected.

Therefore, a heat dissipating device and a server are needed to solve the above-mentioned problems.

Disclosure of utility model

Based on the above, the utility model aims to provide the heat dissipating device and the server, which have higher modularization degree and are more efficient, rapid and convenient to detach; meanwhile, the light weight degree is higher, and the cost is lower; in addition, the structure is simpler, the air tightness is better, and then the radiating effect is better.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat sink, comprising:

A base including a bottom plate;

The heat radiation module comprises a power panel, a rubber mounting seat and a fan; the rubber mounting seat comprises a wind scooper and a mounting bin which are integrally arranged, and the wind scooper and the mounting bin extend along the length direction of the bottom plate; the fan is arranged in the mounting bin and faces the air guide cover; the power panel is connected with the rubber mounting seat, and can be spliced with the power panel when the fan is arranged in the mounting bin; the rubber mounting seat is detachably connected with the base.

As a preferable scheme of the heat dissipation device, the installation bin is U-shaped, an opening of the U-shaped installation bin is far away from the bottom plate, and the fan can be arranged in the installation bin from the opening.

As a preferable scheme of the heat dissipating device, the air guide cover comprises a top plate, an air guide inclined surface and a heat dissipating groove, wherein the top plate is connected with the top of the installation bin, one end of the air guide inclined surface is connected with the top plate, and the other end of the air guide inclined surface extends towards the direction far away from the installation bin and close to the bottom of the installation bin and is connected with the bottom of the heat dissipating groove; the side wall of the installation bin is provided with an air guide hole, and the heat dissipation groove is used for installing a module to be cooled.

As a preferred scheme of the heat dissipating device, the power panel comprises a power connector and a fan connector which are electrically connected with each other, the base is further provided with a power supply piece, the power connector can be plugged with the power supply piece to be electrically connected, and the fan is plugged with the fan connector to be electrically connected.

As a preferred scheme of the heat dissipation device, the power panel is arranged between the bottom plate and the bin bottom of the installation bin, a first avoidance hole is formed in the bin bottom of the installation bin, and the fan connector can penetrate through the first avoidance hole and be connected with the fan in an inserting mode.

As a preferred scheme of the heat dissipation device, the power panel is arranged between the bottom of the installation bin and the fan, a second avoidance hole is formed in the side wall or the bottom of the installation bin, and the power connector can penetrate through the second avoidance hole and is connected with the power supply piece in an inserting mode.

As a preferred scheme of the heat dissipating device, the base further comprises side plates arranged on two sides of the bottom plate along the length direction of the bottom plate, and the mounting seat is detachably connected with the side plates.

As a preferred scheme of the heat dissipating device, the side wall of the installation bin is provided with an installation flanging, the installation flanging is provided with a first installation hole, the side plate is correspondingly provided with a second installation hole, and the installation bolt can penetrate through the second installation hole and the first installation hole to be in threaded connection.

As a preferable scheme of the heat dissipating device, one of the rubber mounting seat and the bottom plate is provided with a positioning notch, and the other is provided with a positioning sheet, wherein the positioning sheet can be placed in the positioning notch so that the first mounting hole is opposite to the second mounting hole;

and/or one of the rubber mounting seat and the bottom plate is provided with a positioning column, and the other is provided with a positioning hole, and the positioning column can be placed in the positioning hole so that the first mounting hole is opposite to the second mounting hole.

The server comprises a module to be cooled and the cooling device according to any scheme, wherein the wind scooper is arranged towards the module to be cooled.

The beneficial effects of the utility model are as follows:

According to the utility model, the heat radiation module is arranged on the bottom plate of the base, and is integrated with the power panel, the rubber mounting seat and the fan, so that the modularization degree of the heat radiation device is effectively improved; wherein, rubber mount pad an organic whole is provided with wind scooper and installation storehouse, and the installation storehouse is used for installing the fan, and the fan sets up towards the wind scooper, and the wind scooper is used for reposition of redundant personnel to improve the radiating effect of fan. And the power panel is connected with the rubber tube mounting seat and can be inserted with the fan, so that the use of wires is reduced, and the structure of the heat dissipation device is simplified. Through all setting up power strip and fan in rubber mount pad for heat dissipation module can wholly dismantle for the base, has simplified equipment and maintenance steps, has improved efficiency. The cost of separately designing the wind scooper and the mounting bin and respectively opening the mould is reduced, thereby being beneficial to reducing the cost; meanwhile, the rubber material is adopted, so that the weight is lighter; in addition, because the wind scooper and the installation bin are integrally arranged, the air tightness between the wind scooper and the installation bin is better, and the heat dissipation effect is further guaranteed.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following description will briefly explain the drawings needed in the description of the embodiments of the present utility model, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the contents of the embodiments of the present utility model and these drawings without inventive effort for those skilled in the art.

FIG. 1 is a schematic view of a heat dissipating device according to an embodiment of the present utility model;

FIG. 2 is an exploded view of a heat sink according to an embodiment of the present utility model;

Fig. 3 is a schematic view of a rubber mounting seat of a heat dissipating device according to an embodiment of the present utility model.

In the figure:

100. a base; 110. a bottom plate; 120. a side plate; 121. a second mounting hole; 122. positioning the notch;

200. A heat dissipation module; 210. a power panel; 211. a power supply connector; 212. a fan connector; 220. a rubber mounting seat; 221. a wind scooper; 2211. a top plate; 2212. an air guiding inclined plane; 2213. a heat sink; 2214. an air guide hole; 2215. a positioning sheet; 222. a mounting bin; 2221. installing a flanging; 2222. a first mounting hole; 230. a fan;

300. And a module to be cooled.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "fixed" are to be construed broadly, and may be, for example, either fixed or removable; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.

As shown in fig. 1 to 3, the present embodiment provides a heat dissipating device, which includes a base 100 and a heat dissipating module 200, wherein the base 100 includes a bottom plate 110; the heat dissipation module 200 includes a power panel 210, a rubber mount 220, and a fan 230; the rubber mount 220 includes a wind scooper 221 and a mounting bin 222 integrally provided, and the wind scooper 221 and the mounting bin 222 extend along a length direction of the base plate 110; the fan 230 is arranged in the installation bin 222 and faces the air guide cover 221; the power panel 210 is connected with the rubber mounting seat 220, and can be plugged with the power panel 210 when the fan 230 is arranged in the mounting bin 222; the rubber mount 220 is detachably connected to the base 100.

By providing the heat dissipation module on the bottom plate 110 of the base 100 and integrating the power panel 210, the rubber mount 220 and the fan 230, the modularization degree of the heat dissipation device is effectively improved. Wherein, rubber mount pad 220 is provided with wind scooper 221 and installation storehouse 222 an organic whole, and installation storehouse 222 is used for installing fan 230, and fan 230 sets up towards wind scooper 221, and wind scooper 221 is used for the reposition of redundant personnel to improve the radiating effect of fan 230. And the power panel 210 is connected with the rubber mounting seat 220 and can be inserted with the fan 230, so that the use of wires is reduced, and the structure of the heat dissipation device is simplified. Through all setting up power strip 210 and fan 230 in rubber mount 220 for the heat dissipation module can wholly be dismantled for base 100, has simplified equipment and maintenance steps, has improved efficiency. The cost of separately designing the wind scooper 221 and the mounting bin 222 and respectively opening the mould is reduced, thereby being beneficial to reducing the cost; meanwhile, the rubber material is adopted, so that the weight is lighter. In addition, the air guide cover 221 and the installation bin 222 are integrally arranged, so that the air tightness between the air guide cover 221 and the installation bin 222 is better, and the heat dissipation effect is further ensured.

Specifically, to facilitate installation of the fan 230 within the mounting bin 222, the mounting bin 222 is configured in a U-shape, and the opening of the U-shaped mounting bin 222 is disposed away from the base plate 110, such that the fan 230 can be placed within the mounting bin 222 from the opening when the fan 230 is installed.

Optionally, the U-shaped mounting bin 222 extends along the width direction of the bottom plate 110, and a plurality of mounting positions are provided in the mounting bin 222, each of the mounting positions is used for mounting one fan 230, and by providing a plurality of fans 230, on one hand, different fans 230 can be utilized to dissipate heat of different modules 300 to be cooled, and on the other hand, the heat dissipation efficiency of the heat dissipation device is also improved.

Further, the air guiding cover 221 includes a top plate 2211, an air guiding inclined plane 2212 and a heat dissipating groove 2213, wherein the heat dissipating groove 2213 is used for installing the module to be heat-dissipated 300; top plate 2211 is integrally provided with the roof of mounting bin 222; one end of the air guiding inclined plane 2212 is connected with the top plate 2211, and the other end extends towards the direction away from the installation bin 222 and close to the bin bottom of the installation bin 222 and is connected with the bottom of the heat dissipation groove 2213. It can be appreciated that, in order to enable the wind energy generated by the fan 230 to be used for heat dissipation of the module 300 to be dissipated, which is disposed in the heat dissipation groove 2213, the air guiding inclined plane 2212 and the side wall of the mounting bin 222 are both provided with air guiding holes 2214.

It should be noted that, to increase the heat dissipation effect, the fan 230 may be disposed opposite to the heat sink 2213. Alternatively, in other embodiments, a portion of the module to be cooled 300 may be disposed directly between the top plate 2211 and the bottom plate 110, and the positions and numbers of the cooling slots 2213 and the fans 230 may be set by those skilled in the art according to the needs, which is not limited herein. The module to be cooled 300 may be a hard disk module, an m.2 back plate module or a super capacitor module.

In this embodiment, the power panel 210 includes a power connector 211 and a fan connector 212, and a power supply member is further disposed on the base 100, where the power connector 211 is used to be plugged into and electrically connected with the power supply member to obtain electric energy at the power supply member; since the power connector 211 and the fan connector 212 are electrically connected to each other, the electrical connection is achieved after the fan 230 and the fan connector 212 are plugged. Illustratively, the number of fan connectors 212 on the power panel 210 is arranged in a one-to-one correspondence with the number of fans 230.

In one embodiment, the power panel 210 is disposed between the bottom plate 110 and the bottom of the mounting bin 222, at this time, in order to enable the fan 230 to be plugged with the fan connector 212 on the power panel 210, the bottom of the mounting bin 222 is provided with a first avoidance hole, and the fan connector 212 can be plugged with the fan 230 through the first avoidance hole.

In another alternative embodiment, the power board 210 is disposed between the bottom of the mounting bin 222 and the fan 230, at this time, in order to connect the power connector 211 on the power board 210 with the power supply element, a second avoidance hole is disposed on the side wall or the bottom of the mounting bin 222, and the power connector 211 can be inserted into the second avoidance hole and the power supply element.

It should be noted that, a person skilled in the art may select the installation manner of the two power boards 210 according to actual needs. Specifically, the connection between the power panel 210 and the bottom plate 110 may be through a bolt connection, the connection is more reliable, and the disassembly is convenient.

Further, to realize the connection between the base 100 and the heat dissipation module 200, the base 100 further includes side plates 120 disposed on two sides of the bottom plate 110 along the length direction thereof, and the mounting base is detachably connected with the side plates 120 to realize the modularized connection with the base 100.

In the prior art, when the wind scooper 221 is separately installed in the chassis, a quick-dismantling manner is generally adopted. The quick-release mode is convenient to connect, but to the case various power cables, the more condition of signal cable, if various power cables, signal cable are not neatly good, then easily appear that wind scooper 221 is jacked up, and then the upper cover of the case can be withstood to the high probability, influences the switch of upper cover on the one hand, on the other hand wearing and tearing wind scooper 221. In order to solve the above problem, the side wall of the mounting bin 222 is provided with a mounting flange 2221, the mounting flange 2221 is provided with a first mounting hole 2222, the side plate 120 is correspondingly provided with a second mounting hole 121, and the mounting bolt can be threaded through the second mounting hole 121 and the first mounting hole 2222. Namely, the connection between the rubber mounting seat 220 and the base 100 is realized by the mode of mounting bolts, so that the connection reliability between the rubber mounting seat 220 and the base 100 is effectively ensured, and the abrasion and potential safety hazards caused by connection failure are effectively reduced; in addition, the stability of the fan 230 during operation is improved, and the system noise is reduced.

Preferably, one of the rubber mount 220 and the bottom plate 110 is provided with a positioning notch 122, and the other is provided with a positioning piece 2215, and the positioning piece 2215 can be placed in the positioning notch 122 so that the first mounting hole 2222 is opposite to the second mounting hole 121; through setting up location opening 122 and spacer 2215 that can mutually support for realize the location between heat dissipation module 200 and the base 100, when guaranteeing the mounted position accurate, still be convenient for the installation of follow-up mounting bolt. Optionally, the positioning notch 122 is disposed on the side plate 120, and the positioning piece 2215 is disposed on the top plate 2211.

In other embodiments, a positioning column may be disposed in one of the rubber mount 220 and the bottom plate 110, and the other is disposed with a positioning hole, so that the positioning column can be disposed in the positioning hole, and the first mounting hole 2222 is opposite to the second mounting hole 121. Alternatively, the power board 210 is disposed between the rubber mounting base 220 and the bottom board 110, the positioning posts are disposed on the power board 210, and the positioning holes are disposed on the bottom board 110. It is worth to say that the locating hole can also set up to the lockhole, and correspondingly, the reference column sets up to the I-shaped nail, realizes the location through the joint of I-shaped nail and lockhole, realizes the preinstallation simultaneously. Or the positioning notch 122 and the positioning piece 2215, and the positioning column and the positioning hole may be simultaneously provided, and those skilled in the art may set the positioning hole according to actual needs, which are not limited herein.

The mounting and dismounting processes of the heat dissipating device are as follows: firstly, the power panel 210 and the fan 230 are respectively arranged on the rubber mounting seat 220, so that the fan 230 is spliced with the power panel 210; then, the module to be heat-dissipated 300 is arranged in the heat dissipation groove 2213 or the base 100; the heat dissipation module 200 is then integrally connected to the base 100. When the heat radiation module 200 needs to be replaced, only the whole heat radiation module 200 is required to be detached from the lower base 100, and the assembly and disassembly efficiency is higher.

The present embodiment also discloses a server, which includes a module to be cooled 300 and a cooling device according to any of the above schemes, and the air guide cover 221 is disposed towards the module to be cooled 300. The server provided with the heat dissipation device is higher in modularization degree, and time and labor are saved in the disassembly and assembly process; meanwhile, the heat dissipation effect is better, the use process is safer, and the service life is longer.

The foregoing is merely exemplary of the present utility model, and those skilled in the art should not be considered as limiting the utility model, since modifications may be made in the specific embodiments and application scope of the utility model in light of the teachings of the present utility model.

Claims

1. Heat abstractor, its characterized in that includes:

A base (100) comprising a floor (110);

The heat radiation module (200) comprises a power panel (210), a rubber mounting seat (220) and a fan (230); the rubber mounting seat (220) comprises a wind scooper (221) and a mounting bin (222) which are integrally arranged, and the wind scooper (221) and the mounting bin (222) extend along the length direction of the bottom plate (110); the fan (230) is arranged in the installation bin (222) and faces the air guide cover (221); the power panel (210) is connected with the rubber mounting seat (220), and can be spliced with the power panel (210) when the fan (230) is arranged in the mounting bin (222); the rubber mounting seat (220) is detachably connected with the base (100).

2. The heat dissipating device according to claim 1, wherein the mounting compartment (222) is provided in a U-shape, an opening of the U-shape of the mounting compartment (222) being provided away from the base plate (110), the fan (230) being capable of being placed in the mounting compartment (222) from the opening.

3. The heat dissipating device according to claim 2, wherein the air guiding cover (221) comprises a top plate (2211), an air guiding inclined surface (2212) and a heat dissipating groove (2213), the top plate (2211) is connected with the cabin top of the installation cabin (222), one end of the air guiding inclined surface (2212) is connected with the top plate (2211), and the other end extends towards the cabin bottom direction far from the installation cabin (222) and close to the installation cabin (222) and is connected with the groove bottom of the heat dissipating groove (2213); the side walls of the air guide inclined plane (2212) and the installation bin (222) are respectively provided with an air guide hole (2214), and the heat dissipation groove (2213) is used for installing the module (300) to be cooled.

4. The heat dissipating device according to claim 1, wherein the power board (210) comprises a power connector (211) and a fan connector (212) electrically connected to each other, a power supply member is further provided on the base (100), the power connector (211) is capable of being plugged with the power supply member to be electrically connected, and the fan (230) is plugged with the fan connector (212) to be electrically connected.

5. The heat dissipation device according to claim 4, wherein the power panel (210) is disposed between the bottom plate (110) and a bottom of the installation bin (222), a first avoidance hole is formed in the bottom of the installation bin (222), and the fan connector (212) can be inserted into the first avoidance hole and the fan (230).

6. The heat dissipating device according to claim 4, wherein the power board (210) is disposed between a bottom of the mounting bin (222) and the fan (230), a second avoidance hole is formed in a side wall or a bottom of the mounting bin (222), and the power connector (211) can be inserted into the second avoidance hole and the power supply member.

7. The heat dissipating device according to claim 1, wherein the base (100) further comprises side plates (120) provided on both sides of the bottom plate (110) in a length direction thereof, and the mount is detachably connected to the side plates (120).

8. The heat dissipating device according to claim 7, wherein a mounting flange (2221) is provided on a side wall of the mounting bin (222), a first mounting hole (2222) is provided on the mounting flange (2221), a second mounting hole (121) is correspondingly provided on the side plate (120), and a mounting bolt can be threaded through the second mounting hole (121) and the first mounting hole (2222).

9. The heat dissipating device according to claim 8, wherein one of the rubber mount (220) and the bottom plate (110) is provided with a positioning notch (122), and the other is provided with a positioning piece (2215), the positioning piece (2215) being capable of being placed in the positioning notch (122) so that the first mounting hole (2222) is opposite to the second mounting hole (121);

And/or, one of the rubber mounting seat (220) and the bottom plate (110) is provided with a positioning column, and the other is provided with a positioning hole, and the positioning column can be placed in the positioning hole, so that the first mounting hole (2222) is opposite to the second mounting hole (121).

10. The server, characterized by comprising a module to be cooled (300) and a cooling device according to any of claims 1-9, wherein the air guiding cover (221) is arranged towards the module to be cooled (300).