CN220981666U - Cooling equipment for semiconductor laser power supply production and processing - Google Patents

Cooling equipment for semiconductor laser power supply production and processing Download PDF

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Publication number
CN220981666U
CN220981666U CN202322517775.3U CN202322517775U CN220981666U CN 220981666 U CN220981666 U CN 220981666U CN 202322517775 U CN202322517775 U CN 202322517775U CN 220981666 U CN220981666 U CN 220981666U
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semiconductor laser
laser power
power supply
workbench
cooling
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CN202322517775.3U
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Chinese (zh)
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朱中林
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Linyi Zhaori Electronics Co ltd
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Linyi Zhaori Electronics Co ltd
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Abstract

The utility model discloses cooling equipment for production and processing of a semiconductor laser power supply, which relates to the technical field of production of semiconductor laser power supplies and is suitable for production and cooling of a semiconductor laser power supply shell, and comprises a workbench; the conveying unit is arranged on the upper surface of the workbench and used for conveying; the water absorbing unit is arranged on the upper surface of the workbench and used for absorbing water; the drying unit is arranged on the upper surface of the workbench and used for drying; and a cooling box arranged on the upper surface of the workbench for cooling. According to the utility model, the cooling box, the conveying component and the clamping component are matched, so that the shell of the semiconductor laser power supply can be cooled in an auxiliary manner, the functionality of the cooling equipment is further increased, and the support plate, the pneumatic cylinder II, the fixing plate and the water-absorbing sponge are matched to assist in driving the water-absorbing sponge to lift, so that the cooling liquid attached to the shell of the semiconductor laser power supply is adsorbed, and the drying of the shell of the semiconductor laser power supply is assisted.

Description

Cooling equipment for semiconductor laser power supply production and processing
Technical Field
The utility model relates to the technical field of semiconductor laser power supply production, in particular to cooling equipment for semiconductor laser power supply production and processing.
Background
The semiconductor laser power supply is composed of a metal shell and a circuit part, wherein the circuit part is composed of: the laser power supply pulse control circuit comprises a voltage stabilizing circuit, a laser power supply pulse control circuit, a pulse generating circuit and a protection circuit. The digital semiconductor laser power supply takes a digital integrated circuit as a core, and a semiconductor laser power supply capable of realizing intelligent control is designed, so that the semiconductor laser power supply shell is required to be quenched in the production and processing process of the semiconductor laser power supply, the stability of the semiconductor laser power supply shell is improved, and the shell of the semiconductor laser power supply is required to be cooled after the semiconductor laser power supply shell is quenched, so that the shell is convenient to further process.
In the prior art, in the patent document with the publication number of CN216388869, a high-efficiency cooling device for producing and processing a power line is proposed, which comprises a cooling tank; the cooling device comprises a cooling tank, a cleaning assembly, a filter assembly, a blowing-drying assembly, a conveying wheel, a discharging pipe, a cleaning assembly, a filter assembly and a drying assembly, wherein the conveying wheel is arranged on the cooling tank; through being provided with clearance subassembly and filter unit, when using, can drive the lead screw rotation through the driving motor of clearance subassembly, rotatory lead screw accessible movable rod drives U type seat and first brush silk horizontal migration.
In order to solve the problem that the existing efficient cooling equipment is mostly cooled by water cooling, the prior art adopts a mode of being provided with a cleaning component and a filtering component to treat, but the device can also inconvenient drive a workpiece needing cooling to move in the use process, so that the condition of inconvenient removal of attached cooling liquid on the outer surface of the workpiece is caused when the workpiece is cooled, and the practicality problem of the cooling equipment is reduced.
Disclosure of utility model
The utility model aims to provide cooling equipment for semiconductor laser power supply production and processing, so as to solve the problems in the background technology.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the cooling equipment for the production and processing of the semiconductor laser power supply is suitable for the production and cooling of the semiconductor laser power supply shell and comprises a workbench; the conveying unit is arranged on the upper surface of the workbench and used for conveying; the water absorbing unit is arranged on the upper surface of the workbench and used for absorbing water; the drying unit is arranged on the upper surface of the workbench and used for drying; and the cooling box is arranged on the upper surface of the workbench and used for cooling, the conveying unit comprises a conveying component arranged on the upper surface of the workbench and a clamping component arranged on the outer surface of the conveying component, the water absorbing unit comprises a mounting component arranged on the upper surface of the workbench and an absorbing component arranged on the outer surface of the mounting component, and the drying unit comprises a blowing component arranged on the upper surface of the workbench and a drying component arranged on the outer surface of the blowing component.
The technical scheme of the utility model is further improved as follows: the conveying assembly comprises a plurality of supporting plates, the supporting plates are fixedly connected with the bottom surfaces of the supporting plates and the upper surface of the workbench, one side of each supporting plate is detachably connected with a driving motor, the output end of each driving motor is fixedly connected with a screw rod, and the inner wall of each supporting plate is detachably connected with a first limiting slide rod.
By adopting the technical scheme, the support plate, the driving motor, the screw rod and the first limit sliding rod can assist in driving the moving plate to move in the horizontal direction, so that the semiconductor laser power supply shell can be conveniently driven to move in the horizontal direction.
The technical scheme of the utility model is further improved as follows: the clamping assembly comprises a moving plate, one side inner wall of the moving plate is in threaded connection with the outer surface of the screw rod, the other side inner wall of the moving plate is in sliding connection with the outer surface of the first limiting slide rod, the upper surface of the moving plate is detachably connected with a hydraulic cylinder and a telescopic limiting rod, the telescopic ends of the hydraulic cylinder and the telescopic limiting rod are detachably connected with a U-shaped plate, the outer surface of the U-shaped plate is detachably connected with a first pneumatic cylinder, the telescopic end of the first pneumatic cylinder is detachably connected with a clamping plate, and the inner wall of the clamping plate is in sliding connection with a second limiting slide rod detachably connected with the inner wall of the U-shaped plate.
By adopting the technical scheme, the movable plate, the hydraulic cylinder and the telescopic limiting rod are matched with each other to assist in driving the U-shaped plate to move in the vertical direction, and the U-shaped plate, the first pneumatic cylinder, the second limiting slide rod and the clamping plate are matched with each other to assist in clamping the semiconductor laser power supply shell.
The technical scheme of the utility model is further improved as follows: the mounting assembly comprises a support plate, the bottom surface of the support plate is fixedly connected with the upper surface of the workbench, and the upper surface of the support plate is detachably connected with a pneumatic cylinder II.
The technical scheme of the utility model is further improved as follows: the absorption assembly comprises a fixing plate and a water absorption sponge, wherein the upper surface of the fixing plate is detachably connected with the telescopic end of the pneumatic cylinder II, and the bottom surface of the fixing plate is fixedly connected with the upper surface of the water absorption sponge.
By adopting the technical scheme, the supporting plate, the pneumatic cylinder II, the fixing plate and the water absorbing sponge are matched to assist in driving the water absorbing sponge to lift, so that the cooling liquid attached to the semiconductor laser power supply shell is adsorbed.
The technical scheme of the utility model is further improved as follows: the blowing assembly comprises a blowing box, the inside of the blowing box is hollow, a blower is detachably connected to one side of the blowing box, and the output end of the blower is communicated with the inside of the blowing box.
The technical scheme of the utility model is further improved as follows: the drying assembly comprises a wind dispersing plate, one side of the wind dispersing plate is fixedly connected with the inner wall of the blowing box, and a spray head is fixedly connected with the outer surface of the wind dispersing plate.
By adopting the technical scheme, the shell of the semiconductor laser power supply can be further dried by adopting the cooperation of the blow box, the blower, the air dispersing plate and the spray head, so that the practicability of the cooling equipment for producing the semiconductor laser power supply is improved.
By adopting the technical scheme, compared with the prior art, the utility model has the following technical progress:
1. The utility model provides cooling equipment for producing and processing a semiconductor laser power supply, which adopts the cooperation of a cooling box, a conveying assembly and a clamping assembly to assist in cooling a shell of the semiconductor laser power supply, thereby increasing the functionality of the cooling equipment.
2. The utility model provides cooling equipment for producing and processing a semiconductor laser power supply, which adopts a support plate, a pneumatic cylinder II, a fixing plate and a water absorbing sponge to assist in driving the water absorbing sponge to lift, so that cooling liquid attached to a semiconductor laser power supply shell is adsorbed, and drying of the semiconductor laser power supply shell is assisted.
3. The utility model provides cooling equipment for the production and processing of a semiconductor laser power supply, which can assist the shell of the semiconductor laser power supply to be further dried by adopting the cooperation of a blow box, a blower, a wind dispersing plate and a spray head, thereby increasing the practicability of the cooling equipment for the production of the semiconductor laser power supply.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of the front structure of the present utility model;
FIG. 3 is a schematic side view of the present utility model;
FIG. 4 is a schematic view of a clamping assembly according to the present utility model;
FIG. 5 is a schematic view of the water absorbing unit structure of the present utility model;
fig. 6 is a schematic diagram of a drying unit according to the present utility model.
In the figure: 1. a work table; 2. a transfer unit; 21. a transfer assembly; 211. a support plate; 212. a driving motor; 213. a screw rod; 214. the first limiting slide rod is arranged; 22. a clamping assembly; 221. a moving plate; 222. a hydraulic cylinder; 223. a telescopic limit rod; 224. a U-shaped plate; 225. a first pneumatic cylinder; 226. a second limiting slide bar; 227. a clamping plate; 3. a water absorbing unit; 31. a support plate; 32. a pneumatic cylinder II; 33. a fixing plate; 34. a water absorbing sponge; 4. a drying unit; 41. a blow box; 42. a blower; 43. a wind dispersing plate; 44. a spray head; 5. and a cooling box.
Detailed Description
The utility model is further illustrated by the following examples:
Example 1
As shown in fig. 1 to 6, the utility model provides a cooling device for semiconductor laser power supply production and processing, which comprises a workbench 1; a conveying unit 2 provided on the upper surface of the table 1 for conveying; a water absorbing unit 3 arranged on the upper surface of the workbench 1 for absorbing water; a drying unit 4 disposed on the upper surface of the table 1 for drying; and a cooling box 5 arranged on the upper surface of the workbench 1 for cooling, the conveying unit 2 comprises a conveying component 21 arranged on the upper surface of the workbench 1 and a clamping component 22 arranged on the outer surface of the conveying component 21, the water absorbing unit 3 comprises a mounting component arranged on the upper surface of the workbench 1 and an absorbing component arranged on the outer surface of the mounting component, the drying unit 4 comprises a blowing component arranged on the upper surface of the workbench 1 and a drying component arranged on the outer surface of the blowing component, the conveying component 21 comprises a supporting plate 211, the supporting plate 211 is provided with a plurality of supporting plates, the bottom surface of the supporting plate 211 is fixedly connected with the upper surface of the workbench 1, one side of the supporting plate 211 is detachably connected with a driving motor 212, the output end of the driving motor 212 is fixedly connected with a screw 213, the inner wall of the supporting plate 211 is detachably connected with a limiting slide bar I214, the clamping component 22 comprises a moving plate 221, the inner wall of one side of the movable plate 221 is in threaded connection with the outer surface of the screw rod 213, the inner wall of the other side of the movable plate 221 is in sliding connection with the outer surface of the first limit slide rod 214, the upper surface of the movable plate 221 is detachably connected with a hydraulic cylinder 222 and a telescopic limit rod 223, the telescopic ends of the hydraulic cylinder 222 and the telescopic limit rod 223 are detachably connected with a U-shaped plate 224, the outer surface of the U-shaped plate 224 is detachably connected with a first pneumatic cylinder 225, the telescopic end of the first pneumatic cylinder 225 is detachably connected with a clamping plate 227, the inner wall of the clamping plate 227 is in sliding connection with a second limit slide rod 226 which is detachably connected with the inner wall of the U-shaped plate 224, when the semiconductor laser power supply is used for producing and processing and cooling equipment, the screw rod 213 is driven to rotate by the driving end of the driving motor 212 through placing the semiconductor laser power supply shell which needs to be cooled on one side of the workbench 1, thereby drive movable plate 221 and remove in the horizontal direction under spacing of spacing slide bar one 214, wait that movable plate 221 removes into the suitable position, through starting hydraulic cylinder 222, drive U template 224 in flexible gag lever post 223 in vertical direction by the flexible end of hydraulic cylinder 222 and go up and down, make grip block 227 remove to the outside of semiconductor laser power shell, rethread pneumatic cylinder one 225, drive grip block 227 and remove under spacing slide bar two 226 by the flexible end of pneumatic cylinder one 225, thereby semiconductor laser power shell centre gripping, then start hydraulic cylinder 222 cooperation hydraulic cylinder 222 submerges semiconductor laser power shell in the coolant liquid in cooling box 5, thereby semiconductor laser power shell cooling, place semiconductor laser power shell on the conveyer belt device surface of workstation 1 upper surface after cooling is accomplished again.
Example 2
As shown in fig. 1-6, on the basis of embodiment 1, the present utility model provides a technical solution: preferably, the installation component is including mounting panel 31, mounting panel 31's bottom surface and workstation 1's upper surface fixed connection, mounting panel 31's upper surface detachable is connected with pneumatic cylinder two 32, the absorption component is including fixed plate 33 and water absorption sponge 34, the upper surface of fixed plate 33 is connected with pneumatic cylinder two 32's flexible end is detachable, the bottom surface of fixed plate 33 and water absorption sponge 34's upper surface fixed connection, when the semiconductor laser power supply shell is carried under the water absorption sponge 34 through the conveyer belt device, through starting pneumatic cylinder two 32, drive fixed plate 33 by pneumatic cylinder two 32's flexible end and rise and fall, and then supplementary drive water absorption sponge 34 goes up and down, and then the supplementary coolant liquid of semiconductor laser power supply shell adsorbs.
Example 3
As shown in fig. 1-6, on the basis of embodiment 1, the present utility model provides a technical solution: preferably, the blowing component comprises a blowing box 41, the inside of the blowing box 41 is hollow, one side of the blowing box 41 is detachably connected with a blower 42, the output end of the blower 42 is communicated with the inside of the blowing box 41, the drying component comprises a wind dispersing plate 43, one side of the wind dispersing plate 43 is fixedly connected with the inner wall of the blowing box 41, a spray nozzle 44 is fixedly connected with the outer surface of the wind dispersing plate 43, when the semiconductor laser power supply shell is conveyed to the inside of the blowing box 41 by a conveyor belt, air is conveyed to the inside of the blowing box 41 in a compressed mode by starting the blower 42, air is dispersed to the spray nozzles 44 everywhere by matching with the wind dispersing plate 43, and then the spray nozzle 44 sprays out, so that the surface air flow rate of the semiconductor laser power supply shell is increased, and the semiconductor laser power supply shell is dried.
The working principle of the cooling device for the production and processing of the semiconductor laser power supply is specifically described below.
As shown in fig. 1 to 6, when the semiconductor laser power supply is used for manufacturing the processing and cooling equipment, the semiconductor laser power supply shell to be cooled is placed on one side of the workbench 1, the driving motor 212 is started, the driving end of the driving motor 212 drives the screw rod 213 to rotate, so that the moving plate 221 is driven to move in the horizontal direction under the limit of the first limit slide rod 214, when the moving plate 221 moves to a proper position, the telescopic end of the hydraulic cylinder 222 drives the U-shaped plate 224 to lift and lower in the vertical direction on the telescopic limit slide rod 223 through starting the hydraulic cylinder 222, so that the clamping plate 227 moves to the outer side of the semiconductor laser power supply shell, then the first pneumatic cylinder 225 is started, the telescopic end of the first pneumatic cylinder 225 drives the clamping plate 227 to move under the limit of the second limit slide rod 226, so that the semiconductor laser power supply shell is clamped, then, the hydraulic cylinder 222 is started again to be matched with the hydraulic cylinder 222 to immerse the semiconductor laser power supply shell in the cooling liquid in the cooling box 5, so that the semiconductor laser power supply shell is cooled, the semiconductor laser power supply shell is placed on the surface of the conveying belt device on the upper surface of the workbench 1 after the cooling is finished, when the semiconductor laser power supply shell is conveyed to the position right below the water absorbing sponge 34 through the conveying belt device, the telescopic end of the pneumatic cylinder 32 drives the fixing plate 33 to lift by starting the pneumatic cylinder 32, the water absorbing sponge 34 is driven to be driven to lift in an auxiliary mode, the cooling liquid assisted by the semiconductor laser power supply shell is absorbed, when the semiconductor laser power supply shell is conveyed to the inside of the blowing box 41 through the conveying belt, air is conveyed to the inside of the blowing box 41 in a compressed mode through starting the blowing box 42, meanwhile, gas is dispersed to the spray heads 44 through the matched with the air dispersing plates 43, and then sprayed out through the spray heads 44, thereby increasing the gas flow rate at the surface of the semiconductor laser power supply housing and drying the semiconductor laser power supply housing.
The foregoing utility model has been generally described in great detail, but it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, it is intended to cover modifications or improvements within the spirit of the inventive concepts.

Claims (7)

1. The cooling equipment for the production and processing of the semiconductor laser power supply is suitable for the production and cooling of a semiconductor laser power supply shell and comprises a workbench (1);
a conveying unit (2) arranged on the upper surface of the workbench (1) and used for conveying;
the water absorbing unit (3) is arranged on the upper surface of the workbench (1) and used for absorbing water;
A drying unit (4) arranged on the upper surface of the workbench (1) for drying;
And a cooling box (5) arranged on the upper surface of the workbench (1) and used for cooling, which is characterized in that: the conveying unit (2) comprises a conveying component (21) arranged on the upper surface of the workbench (1) and a clamping component (22) arranged on the outer surface of the conveying component (21), the water absorbing unit (3) comprises a mounting component arranged on the upper surface of the workbench (1) and an absorbing component arranged on the outer surface of the mounting component, and the drying unit (4) comprises a blowing component arranged on the upper surface of the workbench (1) and a drying component arranged on the outer surface of the blowing component.
2. The cooling apparatus for semiconductor laser power supply production process according to claim 1, wherein: the conveying assembly (21) comprises a plurality of supporting plates (211), the supporting plates (211) are arranged, the bottom surfaces of the supporting plates (211) are fixedly connected with the upper surface of the workbench (1), one side of each supporting plate (211) is detachably connected with a driving motor (212), the output end of each driving motor (212) is fixedly connected with a screw rod (213), and the inner wall of each supporting plate (211) is detachably connected with a limiting slide rod I (214).
3. The cooling apparatus for semiconductor laser power supply production process according to claim 1, wherein: clamping component (22) is including movable plate (221), the surface threaded connection of one side inner wall and lead screw (213) of movable plate (221), the opposite side inner wall and the surface sliding connection of spacing slide bar one (214) of movable plate (221), the upper surface detachable of movable plate (221) is connected with hydraulic cylinder (222) and flexible gag lever post (223), the flexible end of hydraulic cylinder (222) and flexible gag lever post (223) is all detachable to be connected with U template (224), the surface detachable of U template (224) is connected with pneumatic cylinder one (225), the flexible end detachable of pneumatic cylinder one (225) is connected with grip block (227), the inner wall sliding connection of grip block (227) has spacing slide bar two (226) with U template (224) inner wall detachable to be connected.
4. The cooling apparatus for semiconductor laser power supply production process according to claim 1, wherein: the mounting assembly comprises a support plate (31), the bottom surface of the support plate (31) is fixedly connected with the upper surface of the workbench (1), and the upper surface of the support plate (31) is detachably connected with a pneumatic cylinder II (32).
5. The cooling apparatus for semiconductor laser power supply production and processing according to claim 4, wherein: the absorbing assembly comprises a fixing plate (33) and a water absorbing sponge (34), wherein the upper surface of the fixing plate (33) is detachably connected with the telescopic end of the pneumatic cylinder II (32), and the bottom surface of the fixing plate (33) is fixedly connected with the upper surface of the water absorbing sponge (34).
6. The cooling apparatus for semiconductor laser power supply production process according to claim 1, wherein: the air blowing assembly comprises an air blowing box (41), the air blowing box (41) is hollow, an air blower (42) is detachably connected to one side of the air blowing box (41), and the output end of the air blower (42) is communicated with the inside of the air blowing box (41).
7. The cooling apparatus for semiconductor laser power supply production and processing according to claim 6, wherein: the drying assembly comprises a wind dispersing plate (43), one side of the wind dispersing plate (43) is fixedly connected with the inner wall of the blowing box (41), and a spray head (44) is fixedly connected with the outer surface of the wind dispersing plate (43).
CN202322517775.3U 2023-09-17 2023-09-17 Cooling equipment for semiconductor laser power supply production and processing Active CN220981666U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322517775.3U CN220981666U (en) 2023-09-17 2023-09-17 Cooling equipment for semiconductor laser power supply production and processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322517775.3U CN220981666U (en) 2023-09-17 2023-09-17 Cooling equipment for semiconductor laser power supply production and processing

Publications (1)

Publication Number Publication Date
CN220981666U true CN220981666U (en) 2024-05-17

Family

ID=91043518

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322517775.3U Active CN220981666U (en) 2023-09-17 2023-09-17 Cooling equipment for semiconductor laser power supply production and processing

Country Status (1)

Country Link
CN (1) CN220981666U (en)

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