CN220962396U - Dual-purpose mainboard with two screens that connect - Google Patents

Abstract

The utility model discloses a dual-purpose motherboard with double screens, which belongs to the technical field of motherboards, and comprises a substrate, wherein a first chip and a second chip are embedded on the substrate, the first chip is positioned on one side of the second chip, and an LVDS-16 PIN interface and an LVDS-10 PIN interface are arranged at the side end of the substrate. According to the utility model, the output of the eDP screen interface is driven by the first chip to be in butt joint with the eDP screen, and the output of the LVDS_16PIN interface and the LVDS_10PIN interface is driven by the second chip to be in butt joint with the LVDS screen, so that one main board is compatible and suitable for connection use of single screen and double screen, and the application range is wider.

Description

Dual-purpose mainboard with two screens that connect

Technical Field

The utility model belongs to the technical field of mainboards, and relates to a dual-purpose mainboard with double screens.

Background

Along with the rapid development of electronic technology, the requirements on the main board used in the product are also improved, and the existing product also has certain requirements on the aspect of screen display driving, for example, the structural and functional design of some main boards is only suitable for small-size LCDS screens, and the structural and functional design of some main boards is only suitable for large-size LCDS screens, and the increasing use requirements cannot be met, so that the main board with dual-screen connection and dual-purpose is necessary to be designed, and the main board is compatible with the use requirements of high and low split screens.

Disclosure of utility model

The utility model provides a dual-purpose motherboard with double screens, which aims to solve the problems in the background technology.

In order to achieve the above purpose, the utility model provides a dual-purpose motherboard with double screens, which comprises a substrate, a first chip, a second chip, an LVDS_16PIN interface, an LVDS_10PIN interface and an eDP screen interface, wherein the first chip and the second chip are embedded on the substrate, the first chip is positioned on one side of the second chip, the LVDS_16PIN interface and the LVDS_10PIN interface are arranged at the side end of the substrate, the LVDS_16PIN interface is positioned above the LVDS_10PIN interface, the eDP screen interface is arranged at the other side end of the substrate, the first chip is connected with and drives the output of the eDP screen interface, and the second chip is connected with and drives the output of the LVDS_16PIN interface and the LVDS_10PIN interface.

Preferably, the substrate is provided with a split screen access part, the split screen access part comprises a single screen line access position and a double screen line access position, the single screen line access position is used for connection of eDP screen interface output, and the double screen line access position is used for connection of LVDS_16PIN interface and LVDS_10PIN interface output.

Preferably, the back side of the substrate is provided with a horn interface group, a power interface and a wifi antenna respectively, the power interface is located between the horn interface group and the wifi antenna, and the first chip is connected with the horn interface group, the power interface and the wifi antenna.

Preferably, the horn interface group includes a horn output R interface and a horn output L interface, and the horn output R interface is located at one side of the horn output L interface.

Preferably, the front side end of the substrate is respectively provided with a key group, a charging indicator lamp, a TF card and an interface group, the charging indicator lamp is positioned between the key groups and the TF card, the other side of the substrate, which is provided with the interface group, is connected with the key groups, the charging indicator lamp, the TF card and the interface group.

Preferably, the key inserting group comprises a capacitance microphone socket, an earphone socket, a line_in socket and a live broadcast socket, and the capacitance microphone socket, the earphone socket, the line_in socket and the live broadcast socket are sequentially distributed and arranged on the substrate.

Preferably, the interface group includes a USB interface, an hdmi_out interface, and an hdmi_arc interface, and the hdmi_out interface is located between the USB interface and the hdmi_arc interface.

Preferably, the left side end of the substrate is respectively provided with a bluetooth antenna, a microphone interface group and a button board interface, the microphone interface group is positioned between the bluetooth antenna and the button board interface, and the first chip is connected with the bluetooth antenna, the microphone interface group and the button board interface.

Preferably, the microphone interface group includes a wired microphone interface and a wireless microphone interface, and the wired microphone interface is located between the button board interface and the wireless microphone interface.

Preferably, the first chip is a RK3568 chip, and the second chip is a RK628D chip.

Compared with the prior art, the utility model has the beneficial effects that:

The utility model provides a dual-purpose mainboard with double screens, which is characterized in that the output of an eDP screen interface is driven by a first chip to be in butt joint with the eDP screen, and the output of an LVDS_16PIN interface and an LVDS_10PIN interface is driven by a second chip to be in butt joint with the LVDS screen, so that one mainboard is compatible and suitable for connection use of single screen and double screen, and the application is wider.

In order to more clearly illustrate the structural features and efficacy of the present utility model, the present utility model will be described in detail below with reference to the accompanying drawings and examples.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of a partial enlarged structure of a split screen access part in the present utility model;

FIG. 3 is a schematic diagram of a first chip according to the present utility model;

FIG. 4 is a schematic diagram of a second chip according to the present utility model;

Reference numerals:

1. A substrate; 2. a first chip; 3. a second chip; 4. lvds_16PIN interface; 5. lvds_10PIN interface; 6. a split screen access part; 7. a single screen line access position; 8. a double-screen line access position; 9. a horn interface group; 10. a power interface; 12. a wifi antenna; 13. the loudspeaker outputs an R interface; 14. the loudspeaker outputs an L interface; 15. an eDP screen interface; 17. a key group; 18. a charge indicator light; 19. an interface group; 20. a capacitance microphone socket; 21. earphone jack; 22. line_in socket; 23. a direct broadcast jack; 24. a USB interface; 25. HDMI_OUT interface; 26. HDMI_ARC interface; 27. a Bluetooth antenna; 28. a microphone interface group; 29. a button plate interface; 30. a wired microphone interface; 31. a wireless microphone interface; 32. TF card.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

To achieve the above objective, an embodiment of the present utility model provides a dual-purpose motherboard with dual-screen, as shown in fig. 1-4, including a substrate 1, a first chip 2, a second chip 3, an lvds_16PIN interface 4, an lvds_10PIN interface 5, and an eDP screen interface 15, where the first chip 2 and the second chip 3 are embedded on the substrate 1, the first chip 2 is located at one side of the second chip 3, the side end of the substrate 1 is provided with the lvds_16PIN interface 4 and the lvds_10PIN interface 5, the lvds_16PIN interface 4 is located above the lvds_10PIN interface 5, the other side end of the substrate 1 is provided with the eDP screen interface 15, the first chip 2 is connected to drive the output of the eDP screen interface 15, and the second chip 3 is connected to drive the output of the lvds_16PIN interface 4 and the lvds_10PIN interface 5.

The split screen access part 6 is arranged on the substrate 1, the split screen access part 6 comprises a single screen line access position 7 and a double screen line access position 8, the single screen line access position 7 is used for the connection of the output of the eDP screen interface 15, and the double screen line access position 8 is used for the connection of the output of the LVDS_16PIN interface 4 and the output of the LVDS_10PIN interface 5.

In this embodiment, the split-screen access portion 6 is a solder level with 3.3V, 5V and 12V reserved on the substrate 1, the single-screen line access portion 7 corresponds to the solder level with 3.3V, and the dual-screen line access portion 8 corresponds to the solder level with 5V or 12V, and it should be noted that the solder level with 3.3V, 5V and 12V can only be accessed into one or be switched, for example, by switching of a switch operation. The first chip 2 can directly drive the eDP screen in butt joint of the eDP screen interface 15, the second chip 3 can expand and drive the LVDS screen in butt joint of the LVDS_16PIN interface 4 and the LVDS_10PIN interface 5, a plurality of display screens can be connected, the device is suitable for being used by high and low split screens with different resolutions, the single-screen line access bit 7 supports 1280x800, the device is suitable for being used by small-size LVDS screens, the double-screen line access bit 8 supports 1920x1080, the device is suitable for being used by large-size LVDS screens, and the use requirement of users is met, wherein the resolution of the eDP screen connected by the eDP screen interface 15 can reach 2560x1600@60Hz.

The model of the first chip 2 is an RK3568 chip, the RK3568 chip is a general SoC with middle and high ends in positioning, and the RK3568 drives a screen capable of realizing MIPI/LVDS/HDMI connection to simultaneously play the same video; the expansion chip of the second chip 3 with the model of RK628D chip can be expanded into high-resolution screen display on the basis of low-resolution screen display.

Further, be equipped with loudspeaker interface group 9, power source 10, wifi antenna 12 on the base plate 1 rear side end respectively, power source 10 is located between loudspeaker interface group 9, the wifi antenna 12, first chip 2, second chip 3 all are connected with loudspeaker interface group 9, power source 10, wifi antenna 12, loudspeaker interface group 9 includes loudspeaker output R interface 13, loudspeaker output L interface 14, loudspeaker output R interface 13 is located one side of loudspeaker output L interface 14, and loudspeaker output R interface 13 and loudspeaker output L interface 14 correspond the connection of outside loudspeaker equipment respectively, but wifi antenna 12 matchable connection.

Further, the front side end of the substrate 1 is provided with an inserting key set 17, a charging indicator 18, a TF card 32 and an interface set 19, the charging indicator 18 is located between the inserting key set 17 and the TF card 32, the other side of the TF card 32 of the substrate 1 is provided with an interface set 19, the first chip 2 and the second chip 3 are connected with the inserting key set 17, the charging indicator 18, the TF card 32 and the interface set 19, the inserting key set 17 comprises a capacitance microphone jack 20, an earphone jack 21, a line_in jack 22 and a live broadcast jack 23, the capacitance microphone jack 20, the earphone jack 21, the line_in jack 22 and the live broadcast jack 23 are sequentially distributed on the substrate 1, the interface set 19 comprises a USB interface 24, an HDMI_OUT interface 25 and an HDMI_ARC interface 26, and the HDMI_OUT interface 25 is located between the USB interface 24 and the HDMI_ARC interface 26.

Further, the left side end of the substrate 1 is provided with a bluetooth antenna 27, a microphone interface group 28 and a button board interface 29, the microphone interface group 28 is located between the bluetooth antenna 27 and the button board interface 29, the first chip 2 and the second chip 3 are connected with the bluetooth antenna 27, the microphone interface group 28 and the button board interface 29, the microphone interface group 28 includes a wired microphone interface 30 and a wireless microphone interface 31, and the wired microphone interface 30 is located between the button board interface 29 and the wireless microphone interface 31.

In summary, the utility model provides a dual-purpose motherboard with dual screens, wherein the output of the eDP screen interface 15 is driven by the first chip 2 to butt against the eDP screen, and the output of the lvds_16PIN interface 4 and the lvds_10PIN interface 5 is driven by the second chip 3 to butt against the LVDS screen, so that one motherboard is compatible and suitable for connection of single and dual screens, and has wider application range.

The technical principle of the present utility model has been described above in connection with specific embodiments, but is only the preferred embodiment of the present utility model. The protection scope of the present utility model is not limited to the above embodiments, and all technical solutions belonging to the concept of the present utility model belong to the protection scope of the present utility model. Those skilled in the art will recognize that other embodiments of the utility model are within the scope of the utility model without undue burden.

Claims (10)

1. The utility model provides a dual-purpose mainboard with two screen, its characterized in that includes base plate, first chip, second chip, LVDS_16PIN interface, LVDS_10PIN interface and eDP screen interface, inlay on the base plate and be equipped with first chip, second chip, first chip is located one side of second chip, the base plate side is equipped with LVDS_16PIN interface and LVDS_10PIN interface, LVDS_16PIN interface is located the top of LVDS_10PIN interface, the opposite side end of base plate is equipped with eDP screen interface, the output of drive eDP screen interface is connected to first chip, the output of drive LVDS_16PIN interface and LVDS_10PIN interface is connected to the second chip.

2. The dual-purpose motherboard with double screens according to claim 1, wherein the substrate is provided with a split screen access part, the split screen access part comprises a single screen line access position and a double screen line access position, the single screen line access position is used for connection of eDP screen interface output, and the double screen line access position is used for connection of lvds_16PIN interface and lvds_10PIN interface output.

3. The dual-purpose motherboard with double screens according to claim 1, wherein the rear side end of the substrate is respectively provided with a horn interface group, a power interface and a wifi antenna, the power interface is located between the horn interface group and the wifi antenna, and the first chip is connected with the horn interface group, the power interface and the wifi antenna.

4. The motherboard of claim 3, wherein said horn interface group comprises a horn output R interface and a horn output L interface, said horn output R interface being located on one side of said horn output L interface.

5. The dual-purpose motherboard with double screens according to claim 1, wherein the front side end of the substrate is respectively provided with a key group, a charging indicator lamp, a TF card and an interface group, the charging indicator lamp is positioned between the key group and the TF card, the other side of the TF card is provided with the interface group, and the first chip is connected with the key group, the charging indicator lamp, the TF card and the interface group.

6. The dual-purpose motherboard with dual-screen as recited in claim 5, wherein the key insertion set comprises a capacitance microphone socket, an earphone socket, a line_in socket and a live broadcast socket, and the capacitance microphone socket, the earphone socket, the line_in socket and the live broadcast socket are sequentially distributed on the substrate.

7. The dual-purpose motherboard of claim 5, wherein the interface group comprises a USB interface, an hdmi_out interface, and an hdmi_arc interface, the hdmi_out interface being located between the USB interface and the hdmi_arc interface.

8. The dual-purpose motherboard with double screens according to claim 1, wherein a bluetooth antenna, a microphone interface group and a button board interface are respectively arranged at the left side end of the substrate, the microphone interface group is positioned between the bluetooth antenna and the button board interface, and the first chip is connected with the bluetooth antenna, the microphone interface group and the button board interface.

9. The dual-purpose motherboard with dual-screen as recited in claim 8, wherein the microphone interface group comprises a wired microphone interface and a wireless microphone interface, the wired microphone interface being located between the button board interface and the wireless microphone interface.

10. The dual-purpose motherboard of claim 1, wherein the first chip is a RK3568 chip and the second chip is a RK628D chip.