CN220956485U - Spindle mounting structure of semiconductor device processing apparatus and semiconductor device processing apparatus - Google Patents
Spindle mounting structure of semiconductor device processing apparatus and semiconductor device processing apparatus Download PDFInfo
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- CN220956485U CN220956485U CN202323158001.2U CN202323158001U CN220956485U CN 220956485 U CN220956485 U CN 220956485U CN 202323158001 U CN202323158001 U CN 202323158001U CN 220956485 U CN220956485 U CN 220956485U
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- semiconductor device
- main shaft
- spindle
- device processing
- mounting structure
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000009434 installation Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract description 2
- 230000009466 transformation Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a main shaft mounting structure of semiconductor device processing equipment and the semiconductor device processing equipment, wherein the main shaft mounting structure of the semiconductor device processing equipment comprises a mounting seat, a connecting seat is arranged on the mounting seat, a main shaft is arranged on the connecting seat, a group of first connecting holes extending along the axial direction of the main shaft are arranged on the connecting seat, a connecting disc is welded or integrally formed on the outer wall of a shell of the main shaft, and a second connecting hole matched with the first connecting hole is arranged on the connecting disc. According to the utility model, the connecting disc is arranged on the shell of the main shaft in an integrated forming or welding mode, so that the main shaft can be installed in a flange connection mode, the damage to the main shaft caused by a clasping mode is effectively avoided, the problem of deformation and inclination of the main shaft is avoided, the installation quality of the main shaft is guaranteed, and the processing quality is improved.
Description
Technical Field
The utility model relates to the field of semiconductor device processing, in particular to a main shaft mounting structure of semiconductor device processing equipment and the semiconductor device processing equipment.
Background
In various semiconductor device processing apparatuses such as dicing machines and thinning machines, a main shaft is required to drive a cutter or a grinding table to perform processing.
Therefore, the main shaft needs to be fixed to a certain structure to perform the machining, and since the housing of the main shaft is generally cylindrical, when the main shaft is fixed, the main shaft and other structures need to be fixed by a main shaft connector of a clasping manner, and the utility model patent with the publication number CN208913820U is such a structure.
However, in this structure, the spindle mounting rack needs a large holding force, and the excessive holding force easily causes deformation of the housing of the spindle, and the spindle deformation easily causes that the axis of the spindle cannot be kept in the horizontal or vertical direction, so that the processing quality is poor.
Disclosure of utility model
The present utility model has been made to solve the above-mentioned problems occurring in the prior art, and an object of the present utility model is to provide a spindle mounting structure of a semiconductor device processing apparatus and a semiconductor device processing apparatus.
The aim of the utility model is achieved by the following technical scheme:
The main shaft mounting structure of the semiconductor device processing equipment comprises a mounting seat, wherein a connecting seat is arranged on the mounting seat, a main shaft is arranged on the connecting seat, a group of first connecting holes extending along the axial direction of the main shaft are arranged on the connecting seat, a connecting disc is welded or integrally formed on the outer wall of a shell of the main shaft, and a second connecting hole matched with the first connecting hole is arranged on the connecting disc.
Preferably, in the spindle mounting structure of the semiconductor device processing apparatus, the connection base is formed with a through hole through which the spindle passes, the connection pad is biased toward an inner end of the spindle, and the inner end of the spindle is close to the mounting base.
Preferably, in the spindle mounting structure of the semiconductor device processing apparatus, the second connection hole includes a notch and a circular hole coaxial with the notch, the notch is located at a side of the connection pad facing an outer end of the spindle, and the notch extends to a side wall of the connection pad.
Preferably, in the spindle mounting structure of the semiconductor device processing apparatus, a foolproof plane located inside the connection pad is provided at a top of a housing of the spindle.
Preferably, in the spindle mounting structure of the semiconductor device processing apparatus, a third connection hole located inside the connection pad is provided on a housing of the spindle, an extension direction of the third connection hole is perpendicular to an axial direction of the spindle, and a fourth connection hole matched with the third connection hole is provided on the connection base.
Preferably, in the spindle mounting structure of the semiconductor device processing apparatus, a bottom of a housing of the spindle is a plane.
Preferably, in the spindle mounting structure of the semiconductor device processing apparatus, the connection pad is provided with a supporting portion below the connection pad to support the connection pad.
Preferably, in the spindle mounting structure of the semiconductor device processing apparatus, the connection base is connected with the mounting base through a set of fastening components, each fastening component includes an adjusting bolt and a locking bolt screwed into an inner hole of the adjusting bolt, a first screw hole matched with an external thread of each adjusting bolt is formed in the connection base, and a second screw hole corresponding to the locking bolt one to one is formed in the mounting base.
Preferably, in the spindle mounting structure of the semiconductor device processing apparatus, the number of the fastening components is three, and the fastening components are distributed in an equilateral triangle.
A semiconductor device processing apparatus comprising the spindle mounting structure of any one of the semiconductor device processing apparatuses described above.
The technical scheme of the utility model has the advantages that:
According to the utility model, the connecting disc is arranged on the shell of the main shaft in an integrated forming or welding mode, so that the main shaft can be installed in a flange connection mode, the damage to the main shaft caused by a clasping mode is effectively avoided, the problem of deformation and inclination of the main shaft is avoided, the installation quality of the main shaft is guaranteed, and the processing quality is improved.
The utility model ensures that the main shaft is spliced on the connecting seat, and can effectively limit the main shaft by means of the perforation, thereby reducing the possibility of downward inclination of the main shaft under the action of gravity and improving the stability of installation of the main shaft.
According to the utility model, the fool-proof screen is arranged at the top of the main shaft, so that the position matching of the first connecting hole and the second connecting hole can be better realized, and the assembly is convenient.
According to the utility model, the third connecting hole is formed in the shell of the main shaft, and the fourth connecting hole is formed in the connecting seat, so that the connection stability of the main shaft and the connecting seat can be effectively improved.
According to the utility model, the supporting part is formed on the connecting seat to better support the connecting disc, so that the shearing force applied to the bolts for fastening the connecting seat and the connecting disc is reduced, and the stability of the structure is improved.
The connecting seat and the mounting seat are connected through the plurality of adjustable fastening components, so that the mounting position of the connecting seat can be conveniently adjusted, and the requirement of flexible equipment assembly can be better met.
Drawings
FIG. 1 is an end view of the spindle mounting structure of the present utility model;
FIG. 2 is a partial cross-sectional view of the mount and connection mount of the present utility model connected by a fastening assembly;
FIG. 3 is a perspective view of the spindle of the present utility model;
fig. 4 is a side view of the spindle mounting structure of the present utility model.
Detailed Description
The objects, advantages and features of the present utility model are illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are only typical examples of the technical scheme of the utility model, and all technical schemes formed by adopting equivalent substitution or equivalent transformation fall within the scope of the utility model.
In the description of the embodiments, it should be noted that the positional or positional relationship indicated by the terms such as "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in the specific orientation, and thus are not to be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
The spindle mounting structure of the semiconductor device processing apparatus disclosed by the utility model is described below with reference to the accompanying drawings, as shown in fig. 1, the spindle mounting structure comprises a mounting seat 100, the mounting seat 100 can be designed according to requirements, details are not repeated here, a connecting seat 300 is arranged on the mounting seat 100, and the connecting seat 300 can be directly fixedly connected with the mounting seat 100 through bolts.
As shown in fig. 1 and fig. 2, in order to adjust the position of the connection seat 300 conveniently, the connection seat 300 is connected by a set of fastening assemblies 700, each fastening assembly 700 includes an adjusting bolt 710 and a locking bolt 720 screwed in an inner hole of the adjusting bolt 710, a first screw hole matched with an external thread of each adjusting bolt 710 is provided on the connection seat 300, and a second screw hole corresponding to the locking bolt 720 one by one is provided on the installation seat 100. The number of the fastening components 700 can be designed according to the requirement, preferably, three fastening components 700 are distributed in an equilateral triangle shape. Two of which are disposed above the other. This can better ensure structural stability.
As shown in fig. 1 and 3, the connection base 300 is provided with a main shaft 500, the connection base 300 is provided with a set of first connection holes (not shown) extending along the axial direction of the main shaft 500, the outer wall of the housing 510 of the main shaft 500 is welded or integrally formed with a connection disc 520, and the connection disc 520 is provided with a second connection hole 521 matching with the first connection hole.
The position of the connection disc 520 in the axial direction of the main shaft 500 may be designed as required, for example, the connection disc 520 may be provided at the inner end of the main shaft 500. Preferably, as shown in fig. 3, the connection base 300 is formed with a through hole through which the spindle 500 passes, the connection plate 520 is biased toward the inner end of the spindle 500, and the inner end of the spindle 500 is adjacent to the mounting base 100.
As shown in fig. 3, in order to avoid the head of the bolt connecting the connection disc 520 and the connection pad 300 from being exposed, the second connection hole 521 includes a notch 522 and a circular hole 523 coaxial with the notch 522, the notch 522 is located at a side of the connection disc 520 toward the outer end of the spindle 500, and the notch 522 extends to a side wall of the connection disc.
As shown in fig. 3, for convenience of assembly, a fool-proof plane 511 inside the connection pad is provided at the top of the housing 510 of the spindle 500. Meanwhile, a third connection hole 512 is formed in the housing of the spindle 500 and located at the inner side of the connection disc, the extension direction of the third connection hole 512 is perpendicular to the axial direction of the spindle 500 and is a screw hole, and a fourth connection hole matched with the third connection hole 512 is formed in the connection seat. Preferably, the third connecting hole 512 is located on the step surface at two sides of the fool-proof plane 511 and extends in the vertical direction, and the step surface is lower than the fool-proof plane 511. Accordingly, the connection of the main shaft 500 with the connection socket may be reinforced by being coupled into the third coupling hole 512 by a bolt passing through the fourth coupling hole.
As shown in fig. 3, the bottom 513 of the housing of the spindle 500 is a plane that is spaced from the axis of the spindle 500 by a distance less than the radius of the circumference of the housing of the spindle 500 where the side arms are located, so that a smaller blade can be used for cutting.
Finally, as shown in fig. 1 and 4, the connection pad 300 is provided with a supporting portion 310 below the connection pad 520 to support the connection pad, the connection pad is preferably C-shaped, and the supporting portion 310 is matched with end surfaces of two ends of the connection pad.
Example 2
The present embodiment discloses a semiconductor device processing apparatus including the spindle mounting structure of the semiconductor device processing apparatus as described above.
The utility model has various embodiments, and all technical schemes formed by equivalent transformation or equivalent transformation fall within the protection scope of the utility model.
Claims (10)
1. The utility model provides a main shaft mounting structure of semiconductor device processing equipment, includes mount pad (100), be provided with connecting seat (300) on mount pad (100), be provided with main shaft (500), its characterized in that on connecting seat (300): the connecting seat (300) is provided with a group of first connecting holes extending along the axial direction of the main shaft (500), the outer wall of the shell (510) of the main shaft (500) is welded or integrally formed with a connecting disc (520), and the connecting disc (520) is provided with a second connecting hole (521) matched with the first connecting hole.
2. The spindle mounting structure of a semiconductor device processing apparatus according to claim 1, wherein: the connecting seat (300) is provided with a through hole for the spindle to pass through, the connecting disc (520) is biased to the inner end of the spindle (500), and the inner end of the spindle (500) is close to the mounting seat (100).
3. The spindle mounting structure of a semiconductor device processing apparatus according to claim 1, wherein: the second connection hole (521) comprises a notch (522) and a round hole (523) coaxial with the notch (522), the notch (522) is positioned on one side of the connecting disc (520) towards the outer end of the main shaft (500), and the notch (522) extends to the side wall of the connecting disc.
4. The spindle mounting structure of a semiconductor device processing apparatus according to claim 1, wherein: a fool-proof plane (512) positioned on the inner side of the connecting disc is arranged at the top of a shell (510) of the main shaft (500).
5. The spindle mounting structure of a semiconductor device processing apparatus according to claim 1, wherein: the novel spindle comprises a spindle body and is characterized in that a third connecting hole (524) located at the inner side of the connecting disc is formed in a shell of the spindle body (500), the extending direction of the third connecting hole (524) is perpendicular to the axial direction of the spindle body (500), and a fourth connecting hole matched with the third connecting hole (524) is formed in a connecting seat.
6. The spindle mounting structure of a semiconductor device processing apparatus according to claim 1, wherein: the bottom of the shell of the main shaft (500) is a plane.
7. The spindle mounting structure of a semiconductor device processing apparatus according to claim 1, wherein: the connection base (300) is provided with a support part positioned below the connection disc to support the connection disc.
8. A spindle mounting structure of a semiconductor device processing apparatus according to any one of claims 1 to 7, wherein: the connecting seat (300) is connected with the mounting seat (100) through a group of fastening components (700), each fastening component (700) comprises an adjusting bolt (710) and a locking bolt (720) which is in threaded connection with an inner hole of the adjusting bolt (710), a first screw hole matched with the external thread of each adjusting bolt (710) is formed in the connecting seat (300), and a second screw hole corresponding to the locking bolt (720) one by one is formed in the mounting seat (100).
9. The spindle mounting structure of a semiconductor device processing apparatus according to claim 8, wherein: the number of the fastening components (700) is three, and the fastening components are distributed in an equilateral triangle shape.
10. Semiconductor device processing equipment, its characterized in that: a spindle mounting structure comprising the semiconductor device processing apparatus according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323158001.2U CN220956485U (en) | 2023-11-22 | 2023-11-22 | Spindle mounting structure of semiconductor device processing apparatus and semiconductor device processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323158001.2U CN220956485U (en) | 2023-11-22 | 2023-11-22 | Spindle mounting structure of semiconductor device processing apparatus and semiconductor device processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220956485U true CN220956485U (en) | 2024-05-14 |
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ID=91006165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323158001.2U Active CN220956485U (en) | 2023-11-22 | 2023-11-22 | Spindle mounting structure of semiconductor device processing apparatus and semiconductor device processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220956485U (en) |
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2023
- 2023-11-22 CN CN202323158001.2U patent/CN220956485U/en active Active
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