CN220942109U - Germanium wafer photoresist removing and cleaning device - Google Patents

Abstract

The utility model discloses a germanium wafer photoresist removing and cleaning device which comprises a device box, wherein a mounting cover is fixed at the top end of the device box. When the germanium wafer photoresist-removing cleaning device is used, a wafer workpiece is placed at the top end of an operating platform, a second cylinder is controlled to start, three groups of arc clamping plates simultaneously move inwards, a wafer is fixed at the top end of the operating platform, a driving motor is controlled to start to drive a sponge disc to rotate by using a meshed driving gear and a gear ring, a water pump is controlled to start at the same time, a cleaning agent in the device box is pumped out and conveyed to the inside of a water collecting pipe by using a liquid outlet pipe, then a spraying head in the water collecting pipe is sprayed on the germanium wafer, then a first cylinder is controlled to start an output end to extend downwards, a sponge disc is driven to move downwards to the top end of the wafer workpiece, and the rotating sponge disc is matched with a cleaning agent to wet and wash photoresist on the wafer, so that residual photoresist is not easy to solve the problem that photoresist-removing cleaning operation is inconvenient to the outside of the germanium wafer.

Description

Germanium wafer photoresist removing and cleaning device

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a germanium wafer photoresist removing and cleaning device.

Background

Germanium is an important semiconductor material and has wide and important application in the fields of semiconductors, aerospace measurement and control, nuclear physical detection, optical fiber communication, infrared optics, solar cells and the like. The germanium wafer is precisely processed from a germanium single crystal, and a paste remains outside the wafer during dicing, and when the paste outside the germanium wafer is processed, the germanium wafer is required to be cleaned outside the germanium wafer by a cleaning agent using a germanium wafer paste removal cleaning device.

However, in the actual use process, when the photoresist removing and cleaning device for the germanium wafer is used for removing photoresist from the outer part of the germanium wafer, the cleaning agent is generally used for directly and simply manually washing and cleaning the outer part of the germanium wafer, and the photoresist on the outer part of the germanium wafer is difficult to sufficiently remove during cleaning, so that the quality qualification rate of wafer products is affected.

At present, a novel germanium wafer photoresist removing and cleaning device is provided to solve the defects.

Disclosure of utility model

The utility model aims to provide a photoresist stripping and cleaning device for a germanium wafer, which is used for solving the problem that the photoresist stripping and cleaning operation on the outer part of the germanium wafer is inconvenient in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a germanium wafer photoresist stripping and cleaning device, includes the device case, the top of device case is fixed with the installation cover, and the inside bottom mounting of installation cover has the mount, the intermediate position department of mount is fixed with the operation panel, and both sides and the rear end at operation panel top are provided with arc splint respectively, the inside of both sides and the rear end at operation panel top is provided with the inner chamber respectively, and the inside of inner chamber is provided with the push pedal, both sides and the rear end at operation panel top are run through respectively and are provided with the spout, the top of push pedal runs through the inside of spout and with the bottom fixed connection of arc splint, both sides and the rear end of operation panel are fixed with the second cylinder respectively, and the output shaft of second cylinder runs through the inside of operation panel and with one side fixed connection of push pedal;

The inside top of installing cover is provided with the mounting bracket, and the inside swing joint of mounting bracket bottom has the sponge dish, the outside of sponge dish is fixed with the ring gear, the left side on mounting bracket top is fixed with driving motor, and driving motor's output shaft is fixed with drive gear, the top of installing cover is fixed with first cylinder.

Preferably, the bottom output end of the first cylinder penetrates through the inside of the top end of the mounting cover and is fixedly connected with the top end of the mounting frame.

Preferably, the right side of the driving gear penetrates through the inside of the left side of the mounting frame, and the driving gear is in meshed connection with the gear ring.

Preferably, the rear end inside the installation cover is fixed with the collector pipe, and the inboard of collector pipe is fixed with the sprinkler head, the bottom mounting on device case right side has the water pump, and the input of drawing liquid pipe is fixed with the drawing liquid pipe, the right side of device case is run through in the left side of drawing liquid pipe, the output of water pump is fixed with the drain pipe, and the right side of installation cover is run through in the left side of drain pipe and with the right side fixed connection of collector pipe.

Preferably, the spray heads are arranged at equal intervals on the inner side of the water collecting pipe.

Preferably, the liquid outlet pipe is communicated with the inside of the water collecting pipe.

Preferably, the inside of mount top and bottom is run through respectively and is provided with the leak, the inside of mount is provided with the slot, and the front end of slot runs through the front end of mount, peg graft in the inside of slot has the frame, and the front end of frame is fixed with the handle, the inside of frame is fixed with the filter screen.

Preferably, the fixing frame (2) is communicated with the inside of the device box (1).

Compared with the prior art, the utility model has the beneficial effects that: the germanium wafer photoresist removing and cleaning device not only realizes the convenience of photoresist removing and cleaning operation on the outer part of the germanium wafer, realizes the convenience of uniform washing and cleaning on the outer part of the wafer, but also realizes the convenience of auxiliary filtering and reuse of cleaning agents in the device;

(1) The device comprises a device box, a mounting cover, a first cylinder, a mounting rack, a sponge disc, an operation table, a push plate, a second cylinder, an inner cavity, an arc clamping plate, a sliding groove, a driving motor, a driving gear and a gear ring, wherein when the device is used for photoresist stripping and cleaning of a germanium wafer, a wafer workpiece can be placed at the top end of the operation table, then the second cylinder is controlled to start, three groups of arc clamping plates simultaneously move inwards, the wafer is fixed at the top end of the operation table, then the driving motor is controlled to start to drive the sponge disc to rotate by using the meshed driving gear and the engaged gear ring, meanwhile, a water pump is controlled to start, a cleaning agent in the device box is pumped out and is conveyed into a water collecting pipe by using a liquid outlet pipe, then the cleaning agent is sprayed out on the germanium wafer by using a spray head on the inner side of the water collecting pipe, then the starting output end of the first cylinder is controlled to extend downwards, the sponge disc is driven to move downwards to the top end of the wafer workpiece, photoresist on the wafer is matched with a cleaning agent through the rotating sponge disc, the photoresist is wetted and washed off, the cleaning effect is better, residual photoresist is not easy to exist, photoresist stripping and cleaning operation is convenient to carry out on the outside the germanium wafer, and the cleaning effect is improved;

(2) The device comprises a device box, a mounting cover, a liquid outlet pipe, a water pump, a liquid suction pipe, a water collecting pipe and spray heads, wherein when the germanium wafer is cleaned by the device, the water pump is controlled to be started, when the cleaning agent is conveyed into the water collecting pipe, a plurality of groups of spray heads are fixed on the inner side of the water collecting pipe at equal intervals, and the cleaning agent can be uniformly guided out and sprayed out at different positions on the surface of the wafer in the cleaning process and after the cleaning process, so that the outer part of the wafer is conveniently and uniformly washed and cleaned;

(3) Through being provided with device case, mount, installation cover, leak, slot, frame, handle and filter screen, when the device was used, inside cleaner blowout was in the outside washing of wafer behind the use, can flow into the inside on mount top to leak into the bottom at the filter screen downwards through the leak, the filter screen that sets up can carry out supplementary filtration to some impurity etc. in the cleaner after the use and get rid of, and the cleaner after the filtration flows back again to the inside of device case and stores, improves the purity of cleaner, conveniently circulates repeatedly used to the wafer cleaner.

Drawings

FIG. 1 is a schematic cross-sectional elevation view of the present utility model;

FIG. 2 is an enlarged schematic top view of the console of the present utility model;

FIG. 3 is an enlarged schematic view of the structure of the utility model at A in FIG. 1;

FIG. 4 is an enlarged schematic top view of the header of the present utility model;

fig. 5 is an enlarged partial sectional view of the filter screen according to the present utility model.

In the figure: 1. an apparatus box; 2. a fixing frame; 3. a mounting cover; 4. a push plate; 5. a water collecting pipe; 6. a first cylinder; 7. a mounting frame; 8. a sponge tray; 9. an inner cavity; 10. an operation table; 11. a second cylinder; 12. a liquid outlet pipe; 13. a water pump; 14. a liquid suction pipe; 15. an arc clamping plate; 16. a chute; 17. a driving motor; 18. a drive gear; 19. a gear ring; 20. a leak hole; 21. a spray head; 22. a slot; 23. an outer frame; 24. a handle; 25. and (3) a filter screen.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1: referring to fig. 1-4, a germanium wafer photoresist stripping and cleaning device comprises a device box 1, wherein a mounting cover 3 is fixed at the top end of the device box 1, a fixing frame 2 is fixed at the bottom end inside the mounting cover 3, an operation table 10 is fixed at the middle position of the fixing frame 2, arc clamping plates 15 are respectively arranged at two sides and the rear end of the top of the operation table 10, an inner cavity 9 is respectively arranged at the two sides and the rear end of the top of the operation table 10, a push plate 4 is arranged in the inner cavity 9, sliding grooves 16 are respectively arranged at the two sides and the rear end of the top of the operation table 10 in a penetrating manner, the top end of the push plate 4 penetrates through the inner part of the sliding grooves 16 and is fixedly connected with the bottom end of the arc clamping plates 15, second air cylinders 11 are respectively fixed at the two sides and the rear end of the operation table 10, and an output shaft of each second air cylinder 11 penetrates through the inner part of the operation table 10 and is fixedly connected with one side of the push plate 4;

The top of the inside of the installation cover 3 is provided with an installation frame 7, the inside of the bottom end of the installation frame 7 is movably connected with a sponge disc 8, the outside of the sponge disc 8 is fixedly provided with a gear ring 19, the left side of the top end of the installation frame 7 is fixedly provided with a driving motor 17, the output shaft of the driving motor 17 is fixedly provided with a driving gear 18, the top end of the installation cover 3 is fixedly provided with a first air cylinder 6, the bottom output end of the first air cylinder 6 penetrates through the inside of the top end of the installation cover 3 and is fixedly connected with the top end of the installation frame 7, the right side of the driving gear 18 penetrates through the inside of the left side of the installation frame 7, and the driving gear 18 is meshed and connected with the gear ring 19;

Specifically, as shown in fig. 1 and 2, a wafer workpiece is placed at the top end of the operation table 10, then the second cylinder 11 is controlled to start, three groups of arc clamping plates 15 simultaneously move inwards, after the wafer is fixed at the top end of the operation table 10, the driving motor 17 is controlled to start to drive the sponge disc 8 to rotate by using the meshed driving gear 18 and the gear ring 19, meanwhile, the water pump 13 is controlled to start, the cleaning agent in the device box 1 is pumped out and conveyed to the water collecting pipe 5 by using the liquid outlet pipe 12, the cleaning agent is sprayed on the germanium wafer by the spraying head 21 at the inner side of the water collecting pipe 5, then the first cylinder 6 is controlled to start the output end to extend downwards, the sponge disc 8 is driven to move downwards to the top end of the wafer workpiece, the glue on the wafer is washed off by the rotating sponge disc 8 in a matched with the cleaning agent, the cleaning effect is better, and residual glue is not easy to exist.

Example 2: the rear end inside the installation cover 3 is fixedly provided with a water collecting pipe 5, the inner side of the water collecting pipe 5 is fixedly provided with a spray head 21, the bottom end on the right side of the device box 1 is fixedly provided with a water pump 13, the input end of the water pump 14 is fixedly provided with a water pump 14, the left side of the water pump 14 penetrates through the right side of the device box 1, the output end of the water pump 13 is fixedly provided with a liquid outlet pipe 12, the left side of the liquid outlet pipe 12 penetrates through the right side of the installation cover 3 and is fixedly connected with the right side of the water collecting pipe 5, the spray head 21 is arranged at equal intervals on the inner side of the water collecting pipe 5, and the liquid outlet pipe 12 is communicated with the inner side of the water collecting pipe 5;

Specifically, as shown in fig. 1 and 3, when the water pump 13 is started to convey the cleaning agent into the water collecting pipe 5, a plurality of groups of spray heads 21 are fixed at equal intervals on the inner side of the water collecting pipe 5, so that the cleaning agent can be uniformly guided out and sprayed out at different positions on the surface of the wafer during and after the cleaning process, and the outer part of the wafer is uniformly washed and cleaned.

Example 3: the inside of the top end and the bottom end of the fixing frame 2 are respectively penetrated and provided with a leak hole 20, the inside of the fixing frame 2 is provided with a slot 22, the front end of the slot 22 penetrates through the front end of the fixing frame 2, an outer frame 23 is inserted into the inside of the slot 22, the front end of the outer frame 23 is fixedly provided with a handle 24, and a filter screen 25 is fixedly arranged in the outer frame 23;

Specifically, as shown in fig. 1 and fig. 4, after the cleaning agent in the interior is sprayed out of the wafer for cleaning, the cleaning agent can flow into the interior at the top end of the fixing frame 2 and leak downwards into the bottom end of the filter screen 25 through the leak holes 20, the filter screen 25 can perform auxiliary filtration and removal on some impurities and the like in the cleaning agent after use, and the filtered cleaning agent flows back into the interior of the device box 1 for storage and use.

Working principle: when the device is used, a wafer workpiece can be placed at the top end of the operation table 10 when the device is used for photoresist stripping and cleaning of germanium wafers, then the second cylinder 11 is controlled to start, the three groups of arc clamping plates 15 simultaneously move inwards, after the wafers are fixed at the top end of the operation table 10, the sponge disk 8 is driven to rotate by the meshed driving gear 18 and gear ring 19 through the control of the driving motor 17, the water pump 13 is controlled to start, the cleaning agent in the device box 1 is pumped out and conveyed into the water collecting pipe 5 through the liquid outlet pipe 12, the cleaning agent is sprayed on the germanium wafers through the spraying heads 21 at the inner side of the water collecting pipe 5, the starting output end of the first cylinder 6 is controlled to extend downwards and drive the sponge disk 8 to move downwards to the top end of the wafer workpiece, the glue on the wafers is wetted and washed off through the rotating sponge disk 8 matched with the cleaning agent, residual glue is not easy to exist, when the device is used for cleaning a germanium wafer, the water pump 13 is controlled to be started, when cleaning agent is conveyed into the water collecting pipe 5, a plurality of groups of spray heads 21 are fixed on the inner side of the water collecting pipe 5 at equal intervals, the cleaning agent can be evenly guided out and sprayed out at different positions on the surface of the wafer during and after cleaning, the outer part of the wafer is evenly washed and cleaned, when the device is used, the cleaning agent sprayed out from the inner part can flow into the inner part of the top end of the fixed frame 2 after being used for cleaning the outer part of the wafer, and can leak downwards into the bottom end of the filter screen 25 through the leak holes 20, the arranged filter screen 25 can carry out auxiliary filtration and removal on impurities and the like in the cleaning agent after being used, the cleaning agent after filtration flows back into the inner part of the device box 1 again to be stored, and the purity of the cleaning agent is improved, and recycling the wafer cleaning agent.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (8)

1. The utility model provides a germanium wafer photoresist removing and cleaning device, includes device case (1), its characterized in that: the device comprises a device box (1), wherein a mounting cover (3) is fixed at the top end of the device box (1), a fixing frame (2) is fixed at the bottom end of the inside of the mounting cover (3), an operation table (10) is fixed at the middle position of the fixing frame (2), arc clamping plates (15) are respectively arranged at the two sides and the rear end of the top of the operation table (10), an inner cavity (9) is respectively arranged at the two sides and the rear end of the top of the operation table (10), a push plate (4) is arranged in the inner cavity (9), sliding grooves (16) are respectively formed in the two sides and the rear end of the top of the operation table (10) in a penetrating mode, the top end of the push plate (4) penetrates through the inner parts of the sliding grooves (16) and is fixedly connected with the bottom ends of the arc clamping plates (15), second air cylinders (11) are respectively fixed at the two sides and the rear end of the operation table (10), and output shafts of the second air cylinders (11) penetrate through the inner parts of the operation table (10) and are fixedly connected with one sides of the push plate (4);

The novel air conditioner is characterized in that the top end inside the mounting cover (3) is provided with a mounting frame (7), the inside of the bottom end of the mounting frame (7) is movably connected with a sponge disc (8), a gear ring (19) is fixed on the outer portion of the sponge disc (8), a driving motor (17) is fixed on the left side of the top end of the mounting frame (7), a driving gear (18) is fixed on an output shaft of the driving motor (17), and a first air cylinder (6) is fixed on the top end of the mounting cover (3).

2. The germanium wafer photoresist removing and cleaning device according to claim 1, wherein: the bottom output end of the first air cylinder (6) penetrates through the inside of the top end of the mounting cover (3) and is fixedly connected with the top end of the mounting frame (7).

3. The germanium wafer photoresist removing and cleaning device according to claim 1, wherein: the right side of the driving gear (18) penetrates through the inside of the left side of the mounting frame (7), and the driving gear (18) is in meshed connection with the gear ring (19).

4. The germanium wafer photoresist removing and cleaning device according to claim 1, wherein: the inside rear end of installation cover (3) is fixed with collector pipe (5), and the inboard of collector pipe (5) is fixed with sprinkler head (21), the bottom mounting on device case (1) right side has water pump (13), and the input of drawing liquid pipe (14) is fixed with drawing liquid pipe (14), the right side of device case (1) is run through in the left side of drawing liquid pipe (14), the output of water pump (13) is fixed with drain pipe (12), and the right side of installation cover (3) is run through in the left side of drain pipe (12) and with the right side fixed connection of collector pipe (5).

5. The germanium wafer photoresist removing and cleaning device according to claim 4, wherein: the spray heads (21) are arranged at equal intervals on the inner side of the water collecting pipe (5).

6. The germanium wafer photoresist removing and cleaning device according to claim 4, wherein: the liquid outlet pipe (12) is communicated with the inside of the water collecting pipe (5).

7. The germanium wafer photoresist removing and cleaning device according to claim 1, wherein: the inside of mount (2) top and bottom is run through respectively and is provided with leak (20), the inside of mount (2) is provided with slot (22), and the front end of slot (22) runs through the front end of mount (2), peg graft in the inside of slot (22) has frame (23), and the front end of frame (23) is fixed with handle (24), the inside of frame (23) is fixed with filter screen (25).

8. The germanium wafer photoresist removing and cleaning device according to claim 1, wherein: the fixing frame (2) is communicated with the inside of the device box (1).