CN220937809U - Low-noise food processor driven by brushless motor - Google Patents

Abstract

The utility model provides a low-noise food processor driven by a brushless motor, which comprises a main machine, a crushing assembly and a heating assembly; the PCB comprises an integrated power module, an MCU module, a heating driving module and a switching power supply module; the integrated power module comprises a lead frame, wherein the lead frame comprises a first side edge and a second side edge which are oppositely arranged, the first side edge and the second side edge are arranged along the long side of the integrated power module, three-phase IGBT is integrated in the integrated power module, and the long side of the integrated power module is not more than 50mm; the three-phase bootstrap capacitor is arranged on the PCB independently of the integrated power module and is used for driving an upper bridge arm of the three-phase IGBT respectively; the first side is provided with three multiplexing pins, the three multiplexing pins are respectively connected between an upper bridge arm and a lower bridge arm of the three-phase IGBT, and one ends of the three phases of brushless motor stators and the three-phase bootstrap capacitor are respectively connected with the three multiplexing pins, so that space is saved.

Description

Low-noise food processor driven by brushless motor

Technical Field

The utility model belongs to the field of food processors, and particularly relates to a food processor driven by a brushless motor, which has stable performance and low cost.

Background

The existing food processor is generally driven by a series excited motor, and because the series excited motor is provided with carbon brushes, the working noise is large, and carbon powder is easy to be dispersed into the air, so that the use environment is influenced. In addition, the series excited motor generally has only a unidirectional drive function, otherwise, the service life loss of the series excited motor is larger. Along with the continual development innovation of food processor technology, patent application number CN202120355518.2 discloses a flattened food processor, is provided with the motor in the frame and flows through the wind channel of motor, the wind channel is including forming in the inside heat dissipation chamber of motor, the motor includes the motor shaft, wraps up the rotor of motor shaft, wraps up the stator of rotor and forms the support of motor axial terminal surface, the support is located stator top and/or stator below. The permanent magnet brushless motor with small flattened volume is applied to the field of food processors, so that the height of a host machine and running noise of the food processor are greatly reduced. Because the power driving module for driving the brushless motor has larger volume and higher demand on heat dissipation performance, special heat dissipation is needed to be carried out on the power driving module so as to solve the heat dissipation problem of the power driving module.

Because power drive module is used generally and the technique is comparatively mature in white household electrical appliances fields such as air conditioner, washing machine and fan, consequently, the food processor that has brushless motor for the first time has general power drive module in white household electrical appliances field, however the operating mode of white household electrical appliances such as food processor and air conditioner, washing machine is different, the performance requirement is also completely different, this just leads to power drive module function module design unreasonable, power drive module's function pin distribution, interval all can not adapt to food processor completely, more cost has to be paid for general white household electrical appliances field's drive module and satisfy food processor's user demand, thereby make power drive module's occupation space big, the chip is bulky, the cost of manufacture is high, and electronic components is more, the wiring is more complicated, the heat dissipation demand is also higher. The chip of the power driving module has large volume, which further causes large occupied space on the PCB driving board, and the problems that the space requirements among the control module, the rectifying module, the switching power supply module, the filtering module, the heating control module, the power driving module and the like and the related electronic components are more, the wiring and the space layout are complex, and the electromagnetic signal interference and the strong and weak electricity creepage distance do not meet the safety rule requirements are easy to occur. Furthermore, because the host computer compact structure is small, all need compromise to PCB board and brushless motor's heat dispersion. The existing power driving module is high in manufacturing cost, the service lives of the power driving module and the brushless motor, the crushing performance of driving crushing cutters to process materials, and the heat dissipation performance requirement of the power driving module are not matched with that of a food processor, and the problems of high performance reliability and large design allowance deviation of the power driving module are caused. Therefore, how to design a power driving module which meets the attribute requirements of a food processor and has low manufacturing cost, and design the installation and heat dissipation of a PCB in a limited host space, so that high heat dissipation requirement components such as the power driving module can effectively dissipate heat and ensure the service life, and the power driving module is a technical problem to be solved urgently for the food processor.

Patent application number CN202223486858.2 discloses an intelligent power module, in a power conversion device using high voltage, it is generally necessary to make high voltage pins and low voltage pins satisfy electric gaps, and according to safety regulations, reasonable electric gaps (distance between edges of copper foil around two pads) range from 3.05mm and above, so that in order to satisfy electric gaps in the prior art, the volume of an in-line IPM module is increased, which leads to an increase in module cost. In order to overcome the problem, the three-phase direct current power supply negative terminal is connected to one pin through the first conductive structure, the pin number of the intelligent power module is reduced, the volume of the intelligent power module is reduced, a specific IPM internal schematic diagram is given in the embodiment of the specification, the intelligent power module comprises a plurality of pins, pin names and corresponding function descriptions, the intelligent power module comprises a V-phase gate driving chip, a U-phase gate driving chip and a W-phase gate driving chip, one side of the V-phase gate driving chip is provided with a pin shared by a V-phase output end and a V-phase high-side driving floating power supply ground end, a second direct current power supply positive terminal connected with the first direct current power supply positive terminal is respectively arranged on the same side of the V-phase gate driving chip and the U-phase gate driving chip, and the same side is also provided with a V-phase high-side driving floating power supply terminal connected with a V-phase power supply end on the other side of the V-phase gate driving chip. In addition, the other side of the V-phase gate driving chip is also provided with a V-phase high-side signal input end and a V-phase low-side signal input end which are adjacently arranged. The arrangement reduces the pin number of the intelligent power module, but the pins of the V-phase high-side driving suspension power supply end are arranged on the same side as the V-phase high-side driving suspension power supply ground end, so that the pin number of the chip high side is increased, the space requirement of the high-side pins is larger, the volume, especially the length, of the intelligent power module is not reduced, the arrangement of the double pins of the first direct current power supply positive end and the second direct current power supply positive end is not suitable for a food processor, the problem of pin redundancy is easy to occur, the problem of new pin space increase is brought by redundant pins, and the problem of electromagnetic interference is solved, therefore, the intelligent power module does not meet the use requirement of the food processor, especially the requirement of processing high-protein hard food materials such as five-cereal beans and the like to manufacture products by driving a grinding cutter to rotate at a high speed through a brushless motor, and the wide rotating speed is between 200RPM and 20000 RPM.

Patent application number is CN201220739541.2 discloses a brushless DC motor drive circuit, through adding the electric bootstrap circuit, makes brushless DC motor when last electricity does not rotate or locked-rotor does not rotate, locked-rotor protection module output locked-rotor signal extremely rotatory monitoring instruction node, the electric bootstrap circuit pulls up the level of the low side input of drive unit, the low side output control of drive unit switches on lower MOS pipe makes bootstrap capacitor obtains charging, makes after charging the high side output of drive unit is in preparation switch on go up MOS tubular state, when drive unit received a motor rotation signal, the high side output of drive unit switches on go up MOS pipe, so that three-phase brushless DC motor is driven to the drive signal of bridge arm unit output. The arrangement is equivalent to that a bootstrap circuit is arranged on the upper bridge arm of the three-phase bridge arm unit and used for conducting the upper bridge arm, so that the direct-current brushless motor is driven to run smoothly. Because each phase upper bridge arm needs to be provided with an independent bootstrap circuit, each phase bootstrap circuit needs to be connected with pins of the power driving module, so that the pins of the power driving module are more and the safety distance needs to be met, and the long side and the short side are too long to influence the layout space of the power driving module on a PCB, therefore, how to integrate and optimize the self space of the power driving module, the occupation space and the heat dissipation space of the power driving module on a PCB board and the heat dissipation space of the PCB relative to a host machine and reduce the use noise under the condition of being suitable for a food processor, and ensuring the service life is a problem to be solved urgently.

Disclosure of utility model

The utility model aims to provide a food processor driven by a brushless motor, which has high space utilization rate, good heat dissipation performance of an integrated power module, high heat dissipation efficiency of a PCB in a host machine, high processing efficiency and low noise.

In order to solve the above technical problem, the present utility model provides a low noise food processor driven by a brushless motor, comprising: a host; the crushing assembly comprises a cup body and a crushing device driven by a brushless motor; the heating component is used for heating the materials in the cup body; the PCB comprises an integrated power module, an MCU module, a heating driving module and a switching power supply module, and is arranged in the host; the integrated power module comprises a lead frame, wherein the lead frame comprises a first side edge and a second side edge which are oppositely arranged, the first side edge and the second side edge are arranged along the long side of the integrated power module, three-phase IGBT is integrated in the integrated power module, and the long side of the integrated power module is not more than 50mm; the three-phase bootstrap capacitor is arranged on the PCB independently of the integrated power module and is used for driving an upper bridge arm of the three-phase IGBT respectively; three multiplexing pins are arranged on the first side and are respectively connected between an upper bridge arm and a lower bridge arm of the three-phase IGBT, and one end of a three-phase bootstrap capacitor of a brushless motor stator is connected with the three multiplexing pins respectively; the second side is provided with three high-side driving suspension power supply end pins, and the other ends of the three-phase bootstrap capacitors are respectively connected with the three high-side driving suspension power supply end pins.

Further, the integrated power module is arranged on a first side surface of the PCB, and the three-phase bootstrap capacitor is arranged on a second side surface of the PCB.

Further, the three-phase bootstrap capacitor is arranged between the pins of the first side and the pins of the second side, and is in projection of the integrated power module on the PCB.

Further, the second side is provided with three-phase low-side driving power supply end pins, and the low-side driving power supply end pins and the high-side driving levitation power supply end pins are adjacently arranged; and a diode is arranged in the integrated power module, the anode of the diode is connected with a low-side driving power supply end pin, and the cathode of the diode is connected with a high-side driving levitation power supply end pin.

Further, the second side is provided with three input closing pins corresponding to the three-phase IGBTs respectively, the integrated power module further comprises a fault output end and a temperature output end, the fault output end and the temperature output end are both connected to one of the input closing pins, the temperature output end is connected with a pull-up resistor, and the resistance value of the pull-up resistor is R, and R is more than or equal to 4k omega and less than or equal to 7k omega.

Further, the first side is further provided with three direct current negative terminal pins corresponding to the three-phase IGBT respectively, the three direct current negative terminal pins and the corresponding phases of the three multiplexing pins are arranged in pairs, and the direct current negative terminal pins are externally connected with sampling resistors.

Further, the side of integrated power module is along the minor face setting of PCB board, motor drive module includes the PCB board and covers the radiating piece of integrated power module, the radiating piece includes a plurality of radiating fins, forms the heat dissipation runner between a plurality of radiating fins, the heat dissipation runner is followed the minor face orientation setting of PCB board, be equipped with the wind channel in the host computer, the wind channel is through the PCB board the upper reaches and the low reaches of heat dissipation runner do not set up PCB board components and parts.

Further, the casing of host computer is equipped with first air intake and first air outlet, brushless motor includes upper end cover and lower end cover, forms brushless motor heat dissipation chamber between upper end cover and the lower end cover, and the heat dissipation chamber is equipped with second air intake and second air outlet, the wind channel is discharged through first air intake, heat dissipation runner, second air intake, heat dissipation chamber, second air outlet and first air outlet in proper order.

Further, the host is provided with an operation panel and a control panel below the operation panel, the PCB is horizontally arranged below the control panel, a wind scooper is arranged between the first air inlet and the second air inlet, and the wind scooper is at least provided with an integrated power module of the PCB and separates the integrated power module from the control panel.

Further, the PCB board still includes EMC module, brushless motor stator three-phase output is equipped with first magnetic ring, food processor includes the output power cord, is equipped with the second magnetic ring on the power cord.

The beneficial effects of the utility model are as follows:

1. The food processor is driven by the brushless motor, the PCB board electrically connected with the brushless motor comprises an integrated power module, the integrated power module is used for driving the brushless motor, the integrated power module comprises a first side and a second side which are used for setting pins, two connecting ends of the three-phase bootstrap capacitor are spanned on the pins of the first side and the pins of the second side, the first side is provided with a multiplexing pin, the multiplexing pin is used for connecting between an upper bridge arm and a lower bridge arm of the IGBT, so that the three-phase bootstrap capacitor is respectively connected to an emitter of the upper bridge arm of the IGBT and is respectively used for conducting the three-phase upper bridge arm of the IGBT. And three multiplexing pins are also used for connecting the output end of each phase and the high-side driving suspension power supply ground end, thereby fully utilizing the space of the multiplexing pins, not only saving manufacturing materials, but also intensifying the internal space of the integrated power module, reducing the wiring layout inside the chip and the dimension specification outside the chip, thereby greatly reducing the occupied area on the PCB board, the PCB board is arranged in the host, and the reduction of the occupied area correspondingly reduces the heat dissipation requirement, so as to reduce the manufacturing cost, the processing cost and the heat dissipation cost in the host of the integrated power module. And three multiplexing pins are connected respectively to the one end of three-phase bootstrap capacitor, and three high side drive suspension power supply end pins are connected respectively to the other end for bootstrap capacitor can be more reasonable independent of integrated power module setting on the PCB board, has practiced thrift bootstrap capacitor's installation space greatly, avoids high side drive pin to install at first side entirely simultaneously, and needs very big safety gap between the high side pin, thereby leads to first side and contralateral second side apart from too big, occupy the too big problem of PCB board. And will three high side drive suspension power supply end pin sets up in the second side, still makes the space utilization of second side higher, and the setting space of three-phase bootstrap capacitor multiplexes with integrated power module on the PCB board moreover to intensive PCB board space greatly, reduced the area of whole PCB board and the area of the duty cycle volume and the heat dissipation wind channel in the host computer.

2. The integrated power module is arranged on the first side face of the PCB, the three-phase bootstrap capacitor is arranged on the second side face of the PCB, and the bootstrap capacitor can have enough space and the integrated power module multiplexes the position of the second side face, corresponding to the first side face, on the PCB, so that the wiring distance between the bootstrap capacitor and the connecting pins of the integrated power module is reduced.

3. The three-phase bootstrap capacitor is arranged between the pins of the first side and the pins of the second side, and is in the projection of the integrated power module on the PCB board, so that the connection distance between the bootstrap capacitor and the multiplexing pins and the high-side driving suspension power supply end pins on the integrated power module is shortened to the greatest extent, the three-phase bootstrap capacitor is arranged along the longitudinal columns of the direction of the first side and the direction of the second side of the integrated power module, the long axis center line of the bootstrap capacitor is parallel to the short side of the integrated power module, the space layout between the first side and the second side is fully utilized, the occupied space of the bootstrap capacitor on the PCB board is reduced, and the requirements of the safe spacing of the pins of the first side and the second side are completely met.

4. The second side is equipped with three-phase low side drive power supply end pin, low side drive power supply end pin with high side drive suspension power supply end pin is adjacent to be set up for the pin space distribution of second side suits with the inside wiring of integrated power module, saves outside pin space, interval, does benefit to the inside overall arrangement of integrated power module simultaneously, makes the inside temperature interval of integrated power module tend to be stable in the food processor working process, is unlikely to the jump upper and lower extreme temperature, makes the heat dissipation of integrated power module more high-efficient simultaneously. The diode is arranged in the integrated power module, the anode and the cathode of the diode are connected to the second side edge, the wiring distance of the diode is shortened, and wiring and space layout in the integrated power module are further optimized.

5. The second side is also provided with three input closing pins corresponding to the three-phase IGBT respectively, and the fault output end and the temperature output end are both connected to one of the input closing pins, so that the pin multiplexing is further realized, the number of pins on the second side is reduced, and the long-side distance of the integrated power module is further reduced.

6. The integrated power module is arranged along the short side of the PCB, and the heat dissipation flow channel is also arranged along the short side of the PCB, so that wind can effectively dissipate heat of the integrated power module in a maximum covering manner when passing through the heat dissipation flow channel, the PCB components are not arranged on the upstream and the downstream of the heat dissipation flow channel of the PCB, the heat dissipation effect on the integrated power module is prevented from being influenced by the interference on the temperature of an air medium, and the heat dissipation flow channel is fast in flow velocity and high in heat exchange efficiency when passing through the upper part of the integrated power module.

7. The air medium enters the host machine through the first air inlet, intensively dissipates heat of the integrated power module through the heat dissipation flow channel, enters the heat dissipation cavity through the second air inlet, dissipates heat of the brushless motor, brings hot air out through the second air outlet, and finally is discharged out of the heat dissipation cavity from the second air outlet and is discharged to the outside of the host machine from the first air outlet.

8. The air guide cover separates the control panel and the PCB, avoids upward temperature transfer, and is also more beneficial to focusing of the heat dissipation flow channel and stability of an air medium flowing path. In addition, the first magnetic ring and the second magnetic ring can further reduce the electromagnetic interference resistance, so that the area of the PCB is reduced to the greatest extent and the occupied space in the host is reduced when the PCB meets the safety requirements, the performance of the food processor and the applicability of various foods to be processed, the whole machine of the food processor is miniaturized, the structure is compact in the kitchen use environment, and the occupied space is small and easy to store.

9. The three-phase line and the power line of the brushless motor are also provided with magnetic rings, the three-level space optimization of the food processor is performed, the integrated power module space is reduced by the one-level space optimization, the redundant space is not used for integrating bootstrap capacitors, other lead-out pins are not distributed, the pin spacing is reduced, the quantity is less, and the heat dissipation air performance is further optimized under the conditions that the pins are multiplexed and the chip size of the integrated driving module is reduced. The space of the PCB is optimized by the secondary space, and as the number of components on the PCB for the food processor is large, the insufficient space distance meets the electromagnetic interference resistance requirement, and the magnetic rings are arranged on the three-phase lead-out wire and the power wire of the brushless motor, so that the electromagnetic interference resistance standard is met under the condition that the area of the PCB is reduced. The three-level space optimizes the host computer inner space of the food processor, the host computer inner space is limited, a brushless motor, a motor heat dissipation cavity, an air duct, a control panel corresponding to an operation panel and a PCB (printed circuit board) are arranged, so that the heat dissipation space of the PCB is reduced, the PCB is required to be transversely arranged in a small space, and an integrated power module is required to be arranged on the path of the air duct, so that the use of the host computer inner space is optimized.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of the whole structure of the food processor according to the present utility model.

Fig. 2 is a schematic diagram of an integrated power module of a food processor according to the present utility model.

Fig. 3 is a schematic diagram of the peripheral circuit connection of the integrated power module of the food processor according to the present utility model.

Fig. 4 is a schematic diagram of an air duct structure in a main machine of a food processor according to the present utility model.

Fig. 5 is a schematic view of the structure of the PCB board and the air guide cover of the food processor according to the present utility model.

The names of the components marked in the figure are as follows: 100. a host; 101. a first air inlet; 102. a first air outlet; 103. a control board; 200. a crushing assembly; 201. a cup body; 202. a pulverizing device; 300. a heating assembly; 400. a PCB board; 500. an integrated power module; 501. a first side; 502. a second side; 503. a heat radiation fin; 504. a heat dissipation flow channel; 505. a first multiplexing pin; 506. a second multiplexing pin; 507. a third multiplexing pin; 600. a wind scooper; 700. a second air inlet; 800. a second air outlet; 900. brushless motor.

Detailed Description

The present utility model will be described in further detail with reference to the accompanying drawings and examples.

As shown in fig. 1 to 5, the present embodiment provides a low noise food processor driven by a brushless motor 900, comprising: a host 100; a pulverizing assembly 200 comprising a cup 201 and a pulverizing device 202 driven by a brushless motor 900; a heating assembly 300 for heating the material in the cup 201; the PCB 400 comprises an integrated power module 500, an MCU module, a heating driving module and a switching power supply module; the integrated power module 500 comprises a lead frame, wherein the lead frame comprises a first side 501 and a second side 502 which are oppositely arranged, the first side 501 and the second side 502 are arranged along the long side of the integrated power module 500, a three-phase IGBT is integrated in the integrated power module 500, and the long side of the integrated power module 500 is not more than 50mm; the three-phase bootstrap capacitor is arranged on the PCB 400 independently of the integrated power module 500, and the PCB is arranged in the host and is respectively used for driving the upper bridge arm of the three-phase IGBT; the first side 501 is provided with three multiplexing pins, the three multiplexing pins are respectively connected between the upper bridge arm and the lower bridge arm of the three-phase IGBT, and one end of the three-phase bootstrap capacitor of the brushless motor 900 stator is connected with the three multiplexing pins; the second side 502 is provided with three high-side driving levitation power supply end pins, and the other ends of the three-phase bootstrap capacitors are respectively connected with the three high-side driving levitation power supply end pins.

The pulverizing device 202 of the food processor has a pulverizing blade driven by a brushless motor 900, preferably, the brushless motor 900 is disposed in the main unit 100, the cup 201 is detachably connected to the main unit 100, and the heating device is preferably a heating plate having a heating tube. The PCB 400 electrically connected with the brushless motor 900 comprises an integrated power module 500, the integrated power module 500 is used for driving the brushless motor 900, the integrated power module 500 comprises a first side 501 and a second side 502 which are used for setting pins, two connecting ends of a three-phase bootstrap capacitor are spanned on the pins of the first side 501 and the pins of the second side 502, the first side 501 is provided with a multiplexing pin, the multiplexing pin is used for connecting between an upper bridge arm and a lower bridge arm of an IGBT, so that the three-phase bootstrap capacitor is respectively connected to an emitter of the upper bridge arm of the IGBT and is respectively used for conducting the three-phase upper bridge arm of the IGBT. The three multiplexing pins are also used for connecting the output end of each phase with the high-side driving suspension power supply ground end, so that the space of the multiplexing pins is fully utilized, not only is the manufacturing material saved, but also the internal space of the integrated power module 500 is intensified, the wiring layout inside the chip and the size specification outside the chip are reduced, thereby greatly reducing the occupied area on the PCB 400, and the reduction of the occupied area correspondingly reduces the heat dissipation requirement, so that the manufacturing cost, the processing cost and the heat dissipation cost of the integrated power module 500 are reduced. And three multiplexing pins are connected respectively to the one end of three-phase bootstrap capacitor, and three high side drive suspension power supply end pins are connected respectively to the other end for bootstrap capacitor can more reasonable independent of integrated power module 500 setting on PCB board 400, has practiced thrift bootstrap capacitor's installation space greatly, avoids high side drive pin to install at first side 501 entirely simultaneously, and needs very big safety clearance between the high side pin, thereby leads to first side 501 and contralateral second side 502 too big, occupies the too big problem of PCB board 400. And will three high side drive suspension power supply end pin sets up in second side 502, still makes the space utilization of second side 502 higher, and the setting space of three-phase bootstrap capacitor multiplexes with integrated power module 500 on PCB board 400 moreover to intensive PCB board 400 space greatly, reduced the area of whole PCB board 400 and the area of the duty cycle volume and the heat dissipation wind channel in host computer 100.

The integrated power module 500 is disposed on a first side of the PCB 400, the three-phase bootstrap capacitor is disposed on a second side of the PCB 400, and the three-phase bootstrap capacitor is disposed between pins of the first side 501 and pins of the second side 502, and in the projection of the integrated power module 500 on the PCB 400, so that the bootstrap capacitor may have enough space and the integrated power module 500 multiplexes the position of the second side of the PCB 400 corresponding to the first side, thereby reducing the routing distance between the bootstrap capacitor and the connection pins of the integrated power module 500. Preferably, the bootstrap capacitor is a patch capacitor, and has a small volume and a low height, and is suitable for being disposed on the second side surface. In addition, the three-phase bootstrap capacitor is disposed between the pins of the first side 501 and the pins of the second side 502, and in the projection of the integrated power module 500 on the PCB board 400, the connection distance between the bootstrap capacitor and the multiplexing pins and the high-side driving levitation power supply end pins on the integrated power module 500 can be shortened to the greatest extent, and the three-phase bootstrap capacitor is disposed along the longitudinal columns of the integrated power module 500 in the direction of the first side 501 and the second side 502, and the long axis center line of the bootstrap capacitor is parallel or approximately parallel to the short edges of the integrated power module 500, so that the space layout between the first side 501 and the second side 502 is fully utilized, the occupied space of the bootstrap capacitor on the PCB board 400 is reduced, and the requirements of the safe spacing between the pins of the first side 501 and the second side 502 are completely satisfied.

The second side 502 is provided with three-phase low-side driving power supply end pins, the low-side driving power supply end pins and the high-side driving suspension power supply end pins are arranged adjacently, so that the pin space distribution of the second side 502 is adapted to the wiring inside the integrated power module 500, the space and the space between the external pins are saved, the layout inside the integrated power module 500 is facilitated, the temperature interval inside the integrated power module 500 tends to be stable in the working process of the food processor, the upper limit temperature and the lower limit temperature are not suddenly jumped, and the heat dissipation of the integrated power module 500 is more efficient. A diode is arranged in the integrated power module 500, and a positive electrode of the diode is connected with a low-side driving power supply end pin, and a negative electrode of the diode is connected with a high-side driving levitation power supply end pin. That is to say, the diode is disposed in the integrated power module 500, and the anode and cathode of the diode are both connected to the second side 502, so as to shorten the wiring distance of the diode, and further optimize the wiring and the space layout in the integrated power module 500.

As shown in fig. 2 and 3, the second side 502 is provided with three input shutdown pins (/ SDW,/SDV,/SDU) corresponding to the three-phase IGBTs, and the integrated power module 500 further includes a fault output terminal (/ FO) and a temperature output terminal (/ VTS), where the fault output terminal and the temperature output terminal are both connected to one of the input shutdown pins, and in this embodiment, are multiplexed with the W-phase input shutdown pins/SDW. Therefore, the pin multiplexing is further realized, the number of pins on the second side 502 is reduced, the distance between the long sides of the integrated power module 500 is further reduced, specifically, the three input closing pins include a U-phase input closing pin, a V-phase input closing pin, and a W-phase input closing pin. The first side 501 is further provided with three dc negative terminal pins corresponding to the three-phase IGBTs respectively, the three dc negative terminal pins and the three multiplexing pins are correspondingly arranged in two pairs, the dc negative terminal pins are externally connected with a sampling resistor, the working state of the brushless motor 900 is detected, such as rotation speed, steering, current and voltage, and the abnormal problems of the brushless motor 900 such as locked-rotor, load, overcurrent and phase failure are timely identified and fed back to the MCU, so that the brushless motor 900 is detected and protected.

The integrated power module 500 includes a W-phase upper arm IGBT, a V-phase upper arm IGBT, and a U-phase upper arm IGBT, a W-phase lower arm IGBT, a V-phase lower arm IGBT, and a U-phase lower arm IGBT, a node electrically connected to the brushless motor 900 is provided between each of the upper arm IGBT and the lower arm IGBT, the node between each of the upper arm IGBT and the lower arm IGBT is provided with only one multiplexing pin on the integrated power module 500, the node includes a first node between the W-phase upper arm IGBT and the W-phase lower arm IGBT, a second node between the V-phase upper arm IGBT and the V-phase lower arm IGBT, and a third node between the U-phase upper arm IGBT and the U-phase lower arm IGBT, and the multiplexing pin includes a first multiplexing pin 505 connected to the first node, a second multiplexing pin connected to the second node, and a third multiplexing pin connected to the third node. Three multiplexing pins are disposed on the first side 501.

As shown in fig. 3, the three-phase bootstrap capacitor includes a W-phase bootstrap capacitor C412, a V-phase bootstrap capacitor C407, and a U-phase bootstrap capacitor C402 for driving a U-phase upper bridge arm of the IGBT, the three phases of the stator of the brushless motor 900 include a W-phase output terminal connected to a first node, a V-phase output terminal connected to a second node, and a U-phase output terminal connected to a third node, the first terminal and the W-phase output terminal of the W-phase bootstrap capacitor are both connected to the first multiplexing pin 505, the first terminal and the V-phase output terminal of the V-phase bootstrap capacitor are both connected to the second multiplexing pin, and the first terminal and the U-phase output terminal of the U-phase bootstrap capacitor are both connected to the third multiplexing pin. The second end of the W-phase bootstrap capacitor is connected to the W-phase high-side driving levitation power supply terminal pin of the second side 502, the second end of the V-phase bootstrap capacitor is connected to the V-phase high-side driving levitation power supply terminal pin of the second side 502, the second end of the U-phase bootstrap capacitor is connected to the U-phase high-side driving levitation power supply terminal pin of the second side 502, and the three high-side driving levitation power supply terminal pins respectively provide 15V for the three-phase bootstrap capacitor.

Specifically, as shown in fig. 2, the three phases of the stator of the brushless motor 900 are specifically a W phase, a V phase, and a U phase, which are respectively connected to the first multiplexing pin 505, the second multiplexing pin 506, and the third multiplexing pin 507.

The bootstrap capacitor comprises a W-phase bootstrap capacitor for driving a W-phase upper bridge arm of the IGBT, one end of the W-phase bootstrap capacitor is connected to a W-phase high-side driving levitation power supply ground end VSW, the other end of the W-phase bootstrap capacitor is connected to a W-phase high-side driving levitation power supply end VBW, the W-phase high-side driving levitation power supply ground end VSW and the W-phase output end are connected to the first multiplexing pin, and pins of the W-phase high-side driving levitation power supply end VBW are arranged on the second side 502. The second side 502 is further provided with a W-phase low-side driving power supply end VCCW pin, a diode is connected between the W-phase low-side driving power supply end VCCW pin and the W-phase high-side driving levitation power supply end VBW, and the W-phase low-side driving power supply end VCCW pin is adjacent to the first multiplexing pin, that is, the W-phase high-side driving levitation power supply end VBW pin. The first side 501 is further provided with a dc negative terminal pin NW, the dc negative terminal pin NW is disposed adjacent to the W-phase output pin, and the dc negative terminal pin NW is externally connected to the sampling resistor R409. The second side 502 is provided with a W-phase low-side signal input pin INWL and an adjacently disposed W-phase high-side signal input pin INWH.

The bootstrap capacitor comprises a V-phase bootstrap capacitor for driving a V-phase upper bridge arm of the IGBT, one end of the V-phase bootstrap capacitor is connected with a V-phase high-side driving levitation power supply ground end VSV, the other end of the V-phase bootstrap capacitor is connected with a V-phase high-side driving levitation power supply end VBV, the V-phase high-side driving levitation power supply ground end VSV and the V-phase output end are connected to the second pin for multiplexing, and the V-phase high-side driving levitation power supply end VBV pin is arranged on the second side 502. The second side 502 is further provided with a V-phase low-side driving power supply end pin VCCV, a diode is connected between the V-phase low-side driving power supply end pin VCCV and the V-phase high-side driving levitation power supply end VBV, and the V-phase high-side driving levitation power supply end VBV pin is adjacent to the second multiplexing pin, that is, the V-phase low-side driving power supply end pin VCCV pin. The first side 501 is further provided with a dc negative terminal pin NV, the dc negative terminal pin NV is disposed adjacent to the V-phase output pin, and the dc negative terminal pin NV is externally connected to the sampling resistor R409. The second side 502 is provided with a V-phase low-side signal input pin INVL and an adjacently disposed V-phase high-side signal input pin INVH.

The bootstrap capacitor comprises a U-phase bootstrap capacitor for driving a U-phase upper bridge arm of the IGBT, one end of the U-phase bootstrap capacitor is connected with a U-phase high-side driving levitation power supply ground end VSU, the other end of the U-phase bootstrap capacitor is connected with a U-phase high-side driving levitation power supply end VBU pin, the U-phase high-side driving levitation power supply ground end VSU and a U-phase output end are connected with the third multiplexing pin, and the U-phase high-side driving levitation power supply end VBU pin is arranged on the second side 502. The second side 502 is further provided with a U-phase low-side driving power supply terminal pin VCCU, a diode is connected between the U-phase low-side driving power supply terminal pin VCCU and the U-phase high-side driving levitation power supply terminal VBU, and the U-phase high-side driving levitation power supply terminal VBU pin is adjacent to the second multiplexing pin, that is, the U-phase low-side driving power supply terminal pin VCCU pin. The first side 501 is further provided with a dc negative terminal pin NU, the dc negative terminal pin NU is disposed adjacent to the U-phase output pin, and the dc negative terminal pin NU is externally connected to the sampling resistor R409. The second side 502 is provided with a U-phase low side signal input pin INUL and an adjacently disposed U-phase high side signal input pin INUH. Other pins not shown may be referred to in the art.

As shown in fig. 4 and 5, the side edges of the integrated power module 500 are disposed along the short sides of the PCB 400, the motor driving module includes the PCB 400 and a heat dissipation member covering the integrated power module 500, the heat dissipation member includes a plurality of heat dissipation fins 503, a heat dissipation flow channel 504 is formed between the plurality of heat dissipation fins 503, the heat dissipation flow channel 504 is disposed along the short sides of the PCB 400, and an air duct is disposed in the host 100, and the air duct is not disposed with components of the PCB 400 upstream and downstream of the heat dissipation flow channel 504 via the PCB 400. The integrated power module 500 is arranged along the short side of the PCB 400, and the heat dissipation runner 504 is also arranged along the short side of the PCB 400, so that the integrated power module 500 can be effectively dissipated by the wind in a covering manner to the greatest extent when passing through the heat dissipation runner 504, the PCB 400 components are not arranged on the upstream and downstream of the heat dissipation runner 504 of the PCB 400, the heat dissipation effect on the integrated power module 500 is prevented from being influenced by the interference on the temperature of the air medium, and the heat dissipation runner 504 flows through the upper side of the integrated power module 500 at a fast flow speed, a fast heat interaction and a high heat dissipation efficiency are achieved.

The casing of host computer 100 is equipped with first air intake 101 and first air outlet 102, brushless motor 900 includes upper end cover and lower end cover, forms brushless motor 900 heat dissipation chamber between upper end cover and the lower end cover, is equipped with brushless motor 900 and fan in the heat dissipation chamber, is equipped with second air intake 700 and second air outlet 800 on the chamber wall in heat dissipation chamber, the wind channel is in proper order via first air intake 101, heat dissipation runner 504, second air intake 700, heat dissipation chamber, second air outlet 800 and first air outlet 102. Specifically, under the negative pressure of the fan, the air medium enters the host 100 from the first air inlet 101, intensively dissipates heat of the integrated power module 500 through the heat dissipation runner 504, dissipates heat of the brushless motor 900 through the second air inlet 700, brings hot air out through the second air outlet 800, finally discharges the heat dissipation cavity from the second air outlet, and discharges the air out of the host 100 from the first air outlet 102, so that the air channel flow direction is stable and the air flow speed is high, and heat in the heat dissipation fins 503 and the heat dissipation cavity can be taken away rapidly.

The host 100 is provided with an operation panel and a control board 103 below the operation panel, the PCB 400 is horizontally disposed below the control board 103, a wind scooper 600 is disposed between the first air inlet 101 and the second air inlet 700, and the wind scooper 600 covers at least the integrated power module 500 of the PCB 400 and separates the integrated power module 500 from the control board 103. The air guide cover 600 separates the control board 103 from the PCB 400, thereby avoiding upward temperature transfer, and further facilitating focusing of the heat dissipation channels 504 and stability of the air medium flowing path.

The PCB 400 further comprises an EMC module, the three-phase output end of the stator of the brushless motor 900 is provided with a first magnetic ring, the food processing machine comprises an output power line, the power line is provided with a second magnetic ring, and the first magnetic ring and the second magnetic ring can further reduce electromagnetic interference resistance, so that the area of the PCB 400 is reduced to the greatest extent and the occupied space in the host 100 is reduced when the PCB 400 meets the safety requirements and the performance of the food processing machine and the applicability of various foods to be processed, and the whole machine of the food processing machine is miniaturized, has a compact structure in the kitchen use environment and is small in occupied space and easy to store. In addition, the brushless motor 900 driven by the optimized integrated power module 500 also enables the food processor to have wide rotation speed and large starting torque, has low operation noise, stable operation, long service life, good anti-electromagnetic interference effect and continuous temperature rise of the power device in a controllable range.

The three-stage space optimization of the food processor is equivalent to the three-stage space optimization of the food processor, the space of the integrated power module 500 is reduced by the one-stage space optimization, the integrated bootstrap capacitor is not formed in the redundant space, other lead pins are not distributed in the redundant space, the pin spacing is reduced, the quantity is small, and the performance of the heat dissipation air is further optimized under the conditions that the pins are multiplexed and the chip size of the integrated driving module is reduced. The space of the PCB 400 is optimized by the secondary space, and as the PCB 400 for the food processor has more components and does not have enough space distance to meet the electromagnetic interference resistance requirement, the magnetic rings are arranged on the three-phase lead-out wire and the power wire of the brushless motor 900, and the problem of meeting the electromagnetic interference resistance standard is solved under the condition that the area of the PCB 400 is reduced. The three-stage space optimizes the internal space of the host 100 of the food processor, the internal space of the host 100 is limited, and the brushless motor 900, the motor heat dissipation chamber, the air duct, the control board 103 corresponding to the operation panel, and the PCB 400 are provided, so that the heat dissipation space of the PCB 400 is reduced, the PCB 400 needs to be horizontally arranged in a small space, and the integrated power module 500 must be arranged on the path of the air duct, thereby optimizing the use of the internal space of the host 100.

It may be appreciated that the cup 201 may be further integrally provided with the main machine 100, the main machine 100 may further be configured to include a water tank, the pulverizing device 202 is disposed at an upper end of an output shaft of the brushless motor 900, and the pulverizing device 202 is directly driven by the brushless motor 900 to rotate and process without a connector.

It will be appreciated that the heating means may also be provided as a heating film or a steam generator or the like.

In addition to the above preferred embodiments, the technical solutions protected by the present utility model are not limited to the above embodiments, and it should be noted that the combination of the technical solutions in any one embodiment and the technical solutions in other one or more embodiments are within the scope of the present utility model. While the utility model has been described in detail in the foregoing general description and specific examples, it will be apparent to those skilled in the art that modifications and improvements can be made thereto. Accordingly, such modifications or improvements may be made without departing from the spirit of the utility model and are intended to be within the scope of the utility model as claimed.

Claims (10)

1. A low noise food processor driven by a brushless motor, comprising:

a host;

The crushing assembly comprises a cup body and a crushing device driven by a brushless motor;

the heating component is used for heating the materials in the cup body;

The PCB comprises an integrated power module, an MCU module, a heating driving module and a switching power supply module, and is arranged in the host;

The integrated power module comprises a lead frame, wherein the lead frame comprises a first side edge and a second side edge which are oppositely arranged, the first side edge and the second side edge are arranged along the long side of the integrated power module, three-phase IGBT is integrated in the integrated power module, and the long side of the integrated power module is not more than 50mm;

The three-phase bootstrap capacitor is arranged on the PCB independently of the integrated power module and is used for driving an upper bridge arm of the three-phase IGBT respectively;

three multiplexing pins are arranged on the first side and are respectively connected between an upper bridge arm and a lower bridge arm of the three-phase IGBT, and one end of a three-phase bootstrap capacitor of a brushless motor stator is connected with the three multiplexing pins respectively;

The second side is provided with three high-side driving suspension power supply end pins, and the other ends of the three-phase bootstrap capacitors are respectively connected with the three high-side driving suspension power supply end pins.

2. The food processor of claim 1, wherein the integrated power module is disposed on a first side of the PCB and the three-phase bootstrap capacitor is disposed on a second side of the PCB.

3. The food processor of claim 1, wherein the three-phase bootstrap capacitor is disposed between pins of the first side and pins of the second side and within a projection of the integrated power module on the PCB.

4. The food processor of claim 1, wherein the second side is provided with a three-phase low-side drive power supply terminal pin, the low-side drive power supply terminal pin and the high-side drive levitation power supply terminal pin being disposed adjacent;

And a diode is arranged in the integrated power module, the anode of the diode is connected with a low-side driving power supply end pin, and the cathode of the diode is connected with a high-side driving levitation power supply end pin.

5. The food processor of claim 1, wherein the second side is provided with three input shutdown pins corresponding to the three-phase IGBTs, the integrated power module further comprises a fault output end and a temperature output end, the fault output end and the temperature output end are both connected to one of the input shutdown pins, the temperature output end is connected to a pull-up resistor, and the pull-up resistor has a resistance value of R,4kΩ, R, 7kΩ, or less.

6. The food processor of claim 1, wherein the first side is further provided with three dc negative terminal pins corresponding to the three-phase IGBTs, respectively, the three dc negative terminal pins being disposed in two-to-two correspondence with corresponding ones of the three multiplexing pins, the dc negative terminal pins being externally connected with a sampling resistor.

7. The food processor of claim 1, wherein the side edges of the integrated power module are arranged along the short sides of the PCB, the motor driving module comprises the PCB and a heat sink covering the integrated power module, the heat sink comprises a plurality of heat dissipation fins, heat dissipation channels are formed between the plurality of heat dissipation fins, the heat dissipation channels are arranged along the short sides of the PCB, air channels are arranged in the host, and no PCB components are arranged on the upstream and downstream of the heat dissipation channels through the PCB.

8. The food processor of claim 7, wherein the housing of the main machine is provided with a first air inlet and a first air outlet, the brushless motor comprises an upper end cover and a lower end cover, a brushless motor heat dissipation cavity is formed between the upper end cover and the lower end cover, the heat dissipation cavity is provided with a second air inlet and a second air outlet, and the air duct is sequentially discharged through the first air inlet, the heat dissipation runner, the second air inlet, the heat dissipation cavity, the second air outlet and the first air outlet.

9. The food processor of claim 8, wherein the host is provided with an operation panel and a control panel below the operation panel, the PCB is horizontally disposed below the control panel, a wind scooper is disposed between the first air inlet and the second air inlet, and the wind scooper is at least used for housing an integrated power module of the PCB and separating the integrated power module from the control panel.

10. The food processor of claim 1, wherein the PCB further comprises an EMC module, wherein the brushless motor stator three-phase output is provided with a first magnetic ring, wherein the food processor comprises a power cord electrically connected to the PCB, and wherein the power cord is provided with a second magnetic ring.