CN220933409U - Temperature control system - Google Patents
Temperature control system Download PDFInfo
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- CN220933409U CN220933409U CN202322304548.2U CN202322304548U CN220933409U CN 220933409 U CN220933409 U CN 220933409U CN 202322304548 U CN202322304548 U CN 202322304548U CN 220933409 U CN220933409 U CN 220933409U
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Abstract
The present utility model provides a temperature control system, comprising: for controlling the temperature of a device to be heat-dissipated, comprising: the device comprises a heat dissipation module, a temperature sensing module and a heating module, wherein the heat dissipation module is configured to conduct heat dissipation and cooling on the device to be heat-dissipated, and the heat dissipation and cooling speed of the heat dissipation module is greater than the heating speed of the heat dissipation module caused by heating of the device to be heat-dissipated; the temperature sensing module is configured to detect a temperature of the heat dissipation module; the heating module is configured to heat the heat dissipation module according to the detection result of the temperature sensing module. The heat radiation module is directly heated by the heating module, so that the heat radiation module and the heat radiation device such as the current detection resistor can be continuously stabilized in a certain interval near the set temperature.
Description
Technical Field
The utility model relates to the field of electronic devices, in particular to a temperature control system.
Background
When the current detection resistor pair is adopted for current detection, the current detection resistor can generate heat to influence the measurement accuracy. In the prior art, a method of directly applying a radiating fin or adopting a TEC semiconductor to control the temperature is generally adopted. When the radiating fin is directly attached to the current detection resistor, the temperature rises in an exponential curve rapidly in the process of testing large current, the fluctuation of a current test value cannot be eliminated in a period of time due to the temperature drift effect of the current detection resistor, and the current value actually detected is reduced along with the temperature rise of the resistor, so that the design requirement is not met. The TEC semiconductor temperature control mode is adopted, so that the temperature can be bidirectionally regulated, a more accurate control mode is realized, but the cost increase caused by excessively occupying the limited internal space of the equipment, complex peripheral circuit design and corresponding software design is brought about, and the problem of condensation is caused by introducing a cooling function, and the fan is required to be used for ventilation, so that the derivative problems of noise, electromagnetic noise and the like are brought about.
Disclosure of utility model
The utility model aims to provide a temperature control system.
The utility model provides a temperature control system for controlling the temperature of a device to be cooled, which comprises: a heat radiation module, a temperature sensing module and a heating module,
The heat dissipation module is configured to conduct heat dissipation and cooling on the device to be heat-dissipated, and the heat dissipation and cooling speed of the heat dissipation module is larger than the heating speed of the heat dissipation module caused by heating of the device to be heat-dissipated;
the temperature sensing module is configured to detect a temperature of the heat dissipation module;
The heating module is configured to heat the heat dissipation module according to the detection result of the temperature sensing module.
As a further improvement of the present utility model, the temperature control system further includes a target temperature generation module including a reference voltage generation circuit configured to generate a corresponding reference voltage value based on a preset temperature and a voltage division follower circuit connected thereto.
As a further improvement of the present utility model, the temperature sensing module includes a temperature sensing circuit configured to detect a temperature of the heat dissipating module and output a corresponding voltage, and a feedback control circuit configured to adjust and amplify a difference between the voltage output from the temperature sensing circuit and the reference voltage value.
As a further improvement of the utility model, the temperature sensing module further comprises a follower circuit connected with the temperature sensing circuit.
As a further improvement of the utility model, the reference voltage generating circuit is configured for generating the corresponding reference voltage value based on 60 ℃.
As a further improvement of the utility model, the heating module comprises a power amplifying circuit, and the power amplifying circuit is configured to receive the driving voltage output by the temperature sensing module to heat the power amplifier, so as to heat the heat dissipation module.
As a further improvement of the utility model, the heating module further comprises a current limiting protection circuit connected with the power amplifying circuit.
As a further improvement of the utility model, the power amplifier is a power MOSFET.
As a further improvement of the utility model, the heat dissipation module is a metal heat sink.
As a further improvement of the utility model, the device to be cooled is attached to the surface of the metal cooling fin, and the power amplifier is attached to the surface of the metal cooling fin.
The beneficial effects of the utility model are as follows: the utility model provides a temperature control system, which directly heats a heat dissipation module through a heating module, so that the heat dissipation module and a heat dissipation device such as a current detection resistor can be continuously stabilized in a certain interval near a set temperature, and the temperature of the current detection resistor can not obviously fluctuate even under a high current condition, thereby effectively avoiding the temperature drift effect of the current detection resistor when testing high current and improving the measurement precision. When the preset temperature is set to 60 ℃, the temperature of the current detection resistor can be kept at about 60+/-2 ℃, and the current detection precision is controlled within 0.1%. In addition, the temperature control system provided by the utility model has the advantages of simple structure and low cost, and other interference sources are not introduced, so that the detection precision is further improved.
Drawings
Fig. 1 is a schematic block diagram of a temperature control system in an embodiment of the utility model.
Fig. 2 is a schematic block diagram of a target temperature generation module in an embodiment of the utility model.
FIG. 3 is a schematic block diagram of a target temperature generation module in an embodiment of the utility model.
Fig. 4 is a schematic block diagram of a heating module in an embodiment of the utility model.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below in conjunction with the detailed description of the present utility model and the corresponding drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, are intended to fall within the scope of the present utility model.
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present utility model and are not to be construed as limiting the present utility model.
The utility model provides a temperature control system, which can enable a heat radiating device such as a current detection resistor to be continuously stabilized in a certain interval near a set temperature by directly heating a heat radiating module, and the temperature of the current detection resistor can not generate obvious fluctuation even under a high current condition, so that the temperature drift effect of the current detection resistor during the high current test can be effectively avoided, and the accuracy is improved. In addition, the temperature control system provided by the utility model has the advantages of simple structure and low cost, and other interference sources are not introduced, so that the detection precision is further improved.
As shown in fig. 1, the present embodiment provides a temperature control system for controlling a temperature of a device 1 to be heat-dissipated, which includes: a heat radiation module 2, a temperature sensing module 3 and a heating module 4.
The heat dissipation module 2 is configured to dissipate heat of the device 1 to be cooled, and the heat dissipation cooling speed of the heat dissipation module 2 is greater than the heating speed of the heat dissipation module 2 caused by heat generation of the device 1 to be cooled. The temperature sensing module 3 is configured to detect the temperature of the heat dissipating module 2, and the heating module 4 is configured to heat the heat dissipating module 2 according to the detection result of the temperature sensing module 3.
In this embodiment, the device 1 to be cooled is a current detection resistor 1a, the current detection resistor 1a is used for testing current, the current test is generally an interval test, a period of time exists between each test, during the interval, due to the heat dissipation and cooling effects of the cooling module 2, the current detection resistor 1a can generate a significant temperature drop, so that the current detection resistor 1a can generate a significant temperature climbing process at the beginning of each test, thereby causing the problem of inaccurate measurement. In the present embodiment, by providing the temperature sensing module 3 and the heating module 4, temperature stabilization can be achieved in the entire flow of current detection.
In other embodiments of the present utility model, the temperature control system may also be used to control the temperature of other devices or apparatuses having higher temperature accuracy requirements.
In addition, the heat dissipation module 2 commonly used in the current circuit structure, such as a metal heat sink, has a heat dissipation speed for the current detection resistor 1a that is far higher than the temperature rising speed after the current detection resistor 1a heats the current detection resistor, so in the present embodiment, the heating module 4 only having the heating function is used to heat the heat dissipation module 2 to keep the temperature stable. The heating module 4 having only the heating function can employ a circuit element having a simple structure such as a power device, which has high controllability without introducing other noise or infection sources, so that the detection accuracy and reliability of the temperature control system can be further improved.
Specifically, in the present embodiment, the heat dissipation module 2 is a metal heat sink, and may be a metal sheet with excellent heat conduction performance, such as a copper sheet, an aluminum sheet, or the like, and the current detection resistor 1a may be directly attached to the surface of the metal heat sink. In other embodiments of the present utility model, the heat dissipation module 2 may also use other commonly used heat dissipation structures, such as a heat dissipation tube, a fan, and the like.
As shown in fig. 2, further, the temperature control system further includes a target temperature generating module 5, and the target temperature generating module 5 includes a reference voltage generating circuit 51 and a voltage dividing follower circuit 52 connected thereto, and the reference voltage generating circuit 51 is configured to generate a corresponding reference voltage value based on a preset temperature. When current detection is performed, target temperature setting is performed first, and the reference voltage generation circuit 51 generates a corresponding reference voltage as a reference voltage for subsequent comparison. The voltage division follower circuit 52 divides the voltage input by the reference voltage generating circuit 51, and then outputs the divided voltage signal through an amplifying method by an amplifier, so as to realize the following and amplifying of the input voltage signal, and amplify the smaller voltage signal to a larger range so as to adapt to the requirements of the subsequent circuits.
Preferably, in the present embodiment, the reference voltage generating circuit 51 is configured to generate the corresponding reference voltage value based on 60 ℃. In the temperature rising process of the current detection resistor 1a, the temperature rises exponentially, and after the temperature rises to a certain temperature, the temperature reaches the temperature balance, and at this time, even if the current detection resistor 1a passes through a large current again, the obvious temperature rise is not caused. Therefore, in the present embodiment, the reference voltage corresponding to 60 ℃ is generated, that is, the temperature of the current detection resistor 1a is controlled to be about 60 ℃, and at this time, the temperature of the current detection resistor 1a reaches a good equilibrium state, and the accuracy and precision of measurement are higher.
As shown in fig. 3, further, the temperature sensing module 3 includes a temperature sensing circuit 31 and a feedback control circuit 32, the temperature sensing circuit 31 is configured to detect the temperature of the heat dissipation module 2 and output a corresponding voltage, and the feedback control circuit 32 is configured to adjust and amplify a difference between the voltage output by the temperature sensing circuit 31 and a reference voltage value. The temperature sensing circuit 31 measures the temperature of the surface of the heat dissipation module 2 by a temperature sensor, which may be a thermistor, a thermocouple, a digital temperature sensor chip, or the like, and converts the temperature value into a corresponding voltage signal. The feedback control circuit 32 adjusts and amplifies the voltage signal according to the difference between the voltage output from the temperature sensing circuit 31 and the reference voltage value by a controller, an amplifier, or the like, and outputs a driving voltage. It can be understood that the temperature sensing module 3 outputs the driving voltage according to the temperature difference, and stops outputting when detecting that the temperature of the heat dissipating module 2 reaches the preset temperature, so as to avoid the driving the power amplifying circuit 41 to continue heating the heat dissipating module 2.
Further, the temperature sensing module 3 further comprises a follower circuit connected to the temperature sensing circuit 31. The follower circuit can ensure that the temperature sensing circuit 31 is in a low load state and provide a stable voltage output. The follower circuit is a voltage follower implemented by an operational amplifier, for example, which replicates and outputs the voltage signal output from the temperature sensing circuit 31 to the feedback control circuit 32 while maintaining a low input impedance and a high output impedance to ensure accuracy and stability of the output signal of the temperature sensing circuit 31.
Further, the heating module 4 includes a power amplifying circuit 41, and the power amplifying circuit 41 is configured to receive the driving voltage output from the temperature sensing module 3 to heat the power amplifier and heat the heat dissipating module 2. The power amplifying circuit 41 adopts a power amplifier such as a power MOSFET or a power BJT, and has a simple structure and low cost, and does not cause a significant increase in the cost of the temperature control system.
Furthermore, the power amplifier can be adhered to the surface of the metal radiating fin to directly heat the metal radiating fin.
Further, the heating module 4 further includes a current limiting protection circuit 42 connected to the power amplifying circuit 41. After the power amplification circuit 41 realizes constant current driving, the current limiting protection circuit 42 can protect the power amplification circuit 41 from the current overload, and prevent the current from being too large so as to heat up too quickly or too large. The current limiting protection circuit 42 monitors the current output by the power amplifying circuit 41 and compares the current with a preset maximum allowable current value, and if the current exceeds the preset maximum allowable value, the current limiting protection circuit 42 triggers a corresponding protection action.
In the use process, the preset temperature that the heat dissipation module 2 needs to keep in the current detection is set first, after the detection is started, the current detection is carried out on the current detection resistor 1a according to the periodic interval, the heat dissipation module 2 carries out heat dissipation and temperature reduction on the current detection resistor 1a, the temperature sensing module 3 keeps the temperature detection on the heat dissipation module 2 in the whole flow, and when the temperature of the heat dissipation module 2 is detected to deviate from the preset temperature, the driving voltage is output according to the difference value, and the power amplification circuit 41 is driven to heat the heat dissipation module 2.
In summary, the present embodiment provides a temperature control system, which directly heats a heat dissipation module through a heating module, so that the heat dissipation module and a heat dissipation device waiting for a current detection resistor can be continuously stabilized in a certain interval near a set temperature, and even under a high current condition, the temperature of the current detection resistor will not generate significant fluctuation, thereby effectively avoiding the temperature drift effect of the current detection resistor when testing a high current, and improving the measurement accuracy. When the preset temperature is set to 60 ℃, the temperature of the current detection resistor can be kept at about 60+/-2 ℃, and the current detection precision is controlled within 0.1%. In addition, the temperature control system provided by the utility model has the advantages of simple structure and low cost, and other interference sources are not introduced, so that the detection precision is further improved.
It should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is for clarity only, and that the skilled artisan should recognize that the embodiments may be combined as appropriate to form other embodiments that will be understood by those skilled in the art.
The above list of detailed descriptions is only specific to practical embodiments of the present utility model, and is not intended to limit the scope of the present utility model, and all equivalent embodiments or modifications that do not depart from the spirit of the present utility model should be included in the scope of the present utility model.
Claims (10)
1. A temperature control system for controlling the temperature of a device to be heat-dissipated, comprising:
a heat radiation module, a temperature sensing module and a heating module,
The heat dissipation module is configured to conduct heat dissipation and cooling on the device to be heat-dissipated, and the heat dissipation and cooling speed of the heat dissipation module is larger than the heating speed of the heat dissipation module caused by heating of the device to be heat-dissipated;
the temperature sensing module is configured to detect a temperature of the heat dissipation module;
The heating module is configured to heat the heat dissipation module according to the detection result of the temperature sensing module.
2. The temperature control system of claim 1, further comprising a target temperature generation module comprising a reference voltage generation circuit and a voltage division follower circuit coupled thereto, the reference voltage generation circuit configured to generate a corresponding reference voltage value based on a preset temperature.
3. The temperature control system of claim 2, wherein the temperature sensing module comprises a temperature sensing circuit configured to detect a temperature of the heat sink module and output a corresponding voltage, and a feedback control circuit configured to adjust and amplify a difference between the voltage output by the temperature sensing circuit and the reference voltage value.
4. A temperature control system according to claim 3, wherein the temperature sensing module further comprises a follower circuit coupled to the temperature sensing circuit.
5. The temperature control system of claim 2, wherein the reference voltage generation circuit is configured to generate the corresponding reference voltage value based on 60 ℃.
6. The temperature control system of claim 1, wherein the heating module comprises a power amplification circuit configured to receive a drive voltage output by the temperature sensing module to heat the power amplifier and to heat the heat sink module.
7. The temperature control system of claim 6, wherein the heating module further comprises a current limiting protection circuit coupled to the power amplifying circuit.
8. The temperature control system of claim 6, wherein the power amplifier is a power MOSFET.
9. The temperature control system of claim 6, wherein the heat dissipating module is a metal heat sink.
10. The temperature control system of claim 9, wherein the device to be heat-dissipated is attached to the surface of the metal heat sink and the power amplifier is attached to the surface of the metal heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322304548.2U CN220933409U (en) | 2023-08-25 | 2023-08-25 | Temperature control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322304548.2U CN220933409U (en) | 2023-08-25 | 2023-08-25 | Temperature control system |
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| Publication Number | Publication Date |
|---|---|
| CN220933409U true CN220933409U (en) | 2024-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202322304548.2U Active CN220933409U (en) | 2023-08-25 | 2023-08-25 | Temperature control system |
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|---|---|
| CN (1) | CN220933409U (en) |
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2023
- 2023-08-25 CN CN202322304548.2U patent/CN220933409U/en active Active
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