CN220926271U - Preparation facilities of processing nanopore chip array - Google Patents
Preparation facilities of processing nanopore chip array Download PDFInfo
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- CN220926271U CN220926271U CN202322026939.2U CN202322026939U CN220926271U CN 220926271 U CN220926271 U CN 220926271U CN 202322026939 U CN202322026939 U CN 202322026939U CN 220926271 U CN220926271 U CN 220926271U
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- 238000002347 injection Methods 0.000 claims description 12
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- 108091028043 Nucleic acid sequence Proteins 0.000 description 1
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Abstract
The utility model discloses a preparation device for processing a nanopore chip array, which comprises two liquid pools capable of being mutually butted, wherein the chip array is detachably arranged at the joint of the two liquid pools, a plurality of solution channels are arranged in the two liquid pools, when the two liquid pools are butted and folded, electrolyte and an access electrode are introduced into the two liquid pools, and dielectric is formed in the solution channels to process the nanopore of the chip array; according to the utility model, a plurality of chips can be processed at the same time by only once clamping, so that the aperture consistency of the nano holes is ensured, and the processing efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of processing nano-pore chip array preparation, in particular to a preparation device for processing nano-pore chip array.
Background
Genes are the basic units of inheritance, and are specific nucleotide sequences necessary for the production of a polypeptide chain or functional RNA; the gene supports the basic structure and performance of life, stores all information of the processes of race, blood type, inoculation, growth, apoptosis and the like of the life, and is an internal factor for determining the health of the life; thus, gene sequencing technology is listed as an important topic of bioscience; the first generation and second generation gene sequencing technology realizes high-precision sequencing of genes, but still takes longer time and high cost; therefore, the gene sequencing with high accuracy, long reading time, low cost, high flux and high efficiency is of great significance to life science research.
The nanopore sensing technology is used as a third generation sequencing technology, and has the advantages of high flux, long reading length, low cost and the like, so that the nanopore sensing technology is a biological sensing technology which is widely researched and applied. Meanwhile, the preparation of the solid-state nano-pore sensor with small pore diameter and strong robustness has very necessity; in the aspect of solid nano hole preparation, the current dielectric breakdown punching method can generate sub-nano holes on the film, has the advantages of low equipment cost, simple operation and the like, and is widely applied at present; however, the liquid pool device used in the traditional dielectric breakdown method for preparing the solid-state nano-holes can only clamp and process a single thin film chip at a time; when a dielectric breakdown technology is used, a large number of solid nano hole chips with the same target aperture are processed successively, the apertures of different nano hole chips have obvious differences due to different manufacturing conditions and processing time, and the requirements of stable quality and mass production are difficult to meet.
The existing fluid pool can be used for simultaneously clamping and manufacturing four solid nano-pore devices with consistent pore diameters, but four chips are required to be respectively arranged in different pool channels, so that the operation is time-consuming and complicated, and the volume of the pool is larger; and can not be used for clamping and processing chip arrays, and is difficult to realize the requirements of miniaturized, integrated and batch processing production.
Disclosure of utility model
The utility model aims to provide a preparation device for processing a nanopore chip array, which can process a plurality of chips simultaneously, ensure the consistency of the aperture of the nanopore and improve the processing efficiency.
The aim of the utility model is achieved by the following technical scheme:
The utility model provides a preparation facilities of processing nanopore chip array, includes two liquid pools that can dock each other, and chip array detachably installs the butt joint department at two liquid pools, is provided with many solution channel in two liquid pools, and when two liquid pools dock and close, lets in electrolyte and access electrode to two liquid pools inside, forms the dielectric in the solution channel and carries out the nanopore processing to chip array.
Based on the technical scheme, the utility model can be improved as follows:
further, the solution channels are arranged in one-to-one correspondence with the chips on the chip array.
Further, the two liquid pools are provided with electrode grooves on the outer side surfaces, wherein the electrode grooves are connected with power supply.
Further, one of the liquid tanks is provided with a first connecting position, the other liquid tank is provided with a second connecting position, and when the two liquid tanks are in butt joint and close, the first connecting position and the second connecting position can be matched with each other.
Further, the first connection part is a boss integrally formed on the inner side surface of the first liquid pool, the second connection part is a concave table integrally formed on the inner side surface of the second liquid pool, and when the two liquid pools are in butt joint and closure, the boss on the first liquid pool and the concave table on the second liquid pool can be matched with each other in a concave-convex mode.
Further, the first connection part is a boss detachably connected to the inner side surface of the first liquid pool, the second connection part is a concave table detachably connected to the inner side surface of the second liquid pool, and when the two liquid pools are in butt joint and closure, the boss on the first liquid pool and the concave table on the second liquid pool can be in concave-convex fit with each other.
Further, the chip array mounting groove is arranged on the matching surface of the boss and the concave table, a plurality of solution channels are arranged inside the first connecting part and the second connecting part, one end of each solution channel is communicated with the chip array mounting groove, and the other end of each solution channel is provided with an injection notch communicated with the electrode groove.
Further, sealing elements are arranged in the chip array mounting grooves of the two liquid pools, and a plurality of through holes which are communicated with the solution channels in a one-to-one correspondence manner are formed in the sealing elements; when the two liquid pools are in butt joint and close, the sealing elements are closely attached to the two sides of the chip array.
Further, the solution channel comprises a horizontal section and an inclined section, the horizontal section of the solution channel is communicated with the chip array mounting groove, the inclined section is communicated with the injection notch, and an included angle is formed between the inclined section and the horizontal section.
Further, an included angle formed between the inclined section and the horizontal section of the solution channel is 100-160 degrees.
Compared with the prior art, the technology of the utility model has the following advantages:
(1) According to the utility model, the plurality of solution channels are arranged in one-to-one correspondence with the chips on the chip array, so that the plurality of chips can be processed at the same time by only one clamping, the consistency of the aperture of the nano holes is ensured, and the processing efficiency is improved;
(2) The solution channel adopts a sectional structure, and consists of a horizontal section and an inclined section, wherein electrolyte closely flows against the inner wall of one side of the inclined section of the solution channel under the action of self gravity in the process of introducing, and releases air in the flowing process and is discharged along the inclined section of the solution channel so as to avoid the interference of bubbles to the nano-pore processing of the chip array;
(3) According to the utility model, the joint of the two liquid pools adopts a detachable connection structure, and the butt joint and the sealing piece with the corresponding number of solution channels can be selected according to the number of chips on the chip array to be processed, so that the chip array processing requirements of chips with different numbers can be met, and the applicability is further improved.
Drawings
The utility model will be described in further detail with reference to the accompanying drawings and specific embodiments
FIG. 1 is an assembly view of a manufacturing apparatus according to an embodiment;
FIG. 2 is a cross-sectional view of a manufacturing apparatus according to an embodiment;
FIG. 3 is a disassembled view of a manufacturing apparatus according to an embodiment;
FIG. 4 is a schematic diagram of a chip array;
FIG. 5 is a schematic view of a first liquid pool;
FIG. 6 is a schematic diagram of a second fluid reservoir;
FIG. 7 is a sectional view of a production apparatus of the second embodiment;
FIG. 8 is a sectional view of a third production apparatus of the embodiment;
FIG. 9 is a sectional view of a solution channel manufacturing apparatus using a sectional structure according to a third embodiment.
The marks on the accompanying drawings: 1-first liquid pool, 2-first liquid pool, 3-solution channel, 4-chip array, 4 a-outer frame, 4 b-inner rod, 5-chip array mounting groove, 6-electrode groove, 7-injection notch, 8-sealing piece, 9-first connection place, 10-second connection place, 11-fastening bolt, 12-lug.
Detailed Description
The following description of specific embodiments of the utility model is provided to aid in understanding the utility model and is not to be construed as limiting the utility model, as illustrated in the accompanying drawings. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
Example 1
Referring to fig. 1 to 6, the utility model relates to a preparation device of a multi-channel dielectric breakdown solid nano-pore chip array 4, which comprises two liquid pools capable of being butted with each other, and a solution channel 3 which is arranged in the two liquid pools and can be correspondingly communicated with each other, wherein the chip array 4 is detachably arranged at the butted position of the two liquid pools; when the two liquid pools are in butt joint and close, electrolyte is introduced into the two liquid pools, flows to two sides of the chip array 4 along the solution channel 3, and nano-pore processing is carried out on the chip array 4 by connecting electrodes into the two liquid pools.
The chip array 4 for the nano-pore processing in the embodiment comprises a chip fixing frame and a plurality of chips which are fixedly arranged on the fixing frame and distributed in an array manner; the chip fixing frame comprises a rectangular outer frame 4a, the outer frame is formed by connecting four outer rods end to end, a plurality of inner rods 4b are arranged in the outer frame 4a, and the inner rods are arranged in a crisscross manner so as to longitudinally and transversely divide the inner space of the outer frame into a plurality of chip stations for installing chips.
In this embodiment, the solution channels 3 are provided with a plurality of chips, and the solution channels 3 are arranged in a one-to-one correspondence with the chips on the chip array 4, so that in the nano-pore processing process, the influence of the mutual interference caused by the flowing of the electrolyte between the chips on the nano-pore processing of the chips is avoided, and the plurality of chips can be processed simultaneously only by one clamping, thereby ensuring the aperture consistency of the nano-pores and improving the processing efficiency.
Specifically, the inner side surfaces of the two liquid tanks are butt joint surfaces, chip array mounting grooves 5 used for fixing the chip arrays 4 during butt joint and folding are formed in the inner side surfaces, and electrode grooves 6 for connecting electrodes are formed in the outer side surfaces of the two liquid tanks; the solution channel 3 is a tube cavity which is transversely arranged, one end of the solution channel is communicated with the chip array mounting groove 5, and the other end of the solution channel is provided with an injection notch 7 communicated with the electrode groove 6.
In the specific implementation, the two liquid pools are in butt joint and closed, electrolyte is introduced from the injection notch 7, flows to two sides of the chip array 4 along the solution channel 3, and an electrode connected with an external power supply is connected into the electrode groove 6, and dielectric is formed in the solution channel 3 after the external power supply is electrified so as to process the nano holes of the chip array 4.
The two liquid pools are provided with sealing elements 8 in the chip array mounting grooves 5, and the sealing elements 8 are provided with a plurality of through holes which are communicated with the solution channels 3 in a one-to-one correspondence manner; when the two liquid pools are in butt joint and close, the sealing pieces 8 are tightly attached to the two sides of the chip array 4 to seal gaps between the solution channels 3 and the chip array 4, so that electrolyte flowing out of each solution channel 3 is in one-to-one corresponding contact with chips on the chip array 4, leakage of the electrolyte is prevented, and mutual interference caused by flowing of the electrolyte between the chips through the gaps is avoided.
The thickness of the sealing member 8 should be greater than the groove depth of the chip array mounting groove 5, and the sealing member 8 is made of an elastic material; when the two liquid pools are in butt joint and closure, the sealing piece 8 is compressed and deformed along the thickness direction, and clamping force is formed on two sides of the chip array 4 so as to keep close fit with the chip array 4, and meanwhile, stamping resultant force generated when the two liquid pools are in butt joint and closure can be buffered, so that the chip array 4 is prevented from being cracked due to overlarge stress.
Preferably, the sealing member 8 in this embodiment is a rubber pad, and is pre-pressed in the chip array mounting groove 5, and according to practical situations, the sealing member 8 may be a silica gel pad.
In this embodiment, a first connection point 9 is disposed on one of the liquid tanks, and a second connection point 10 is disposed on the other liquid tank, and when the two liquid tanks are in butt joint and close, the first connection point 9 and the second connection point 10 can be matched with each other; the solution channel 3, the chip array mounting groove 5 and the injection notch 7 are arranged at a first connecting position 9 and a second connecting position 10; for convenience of description, the two liquid tanks are named as a first liquid tank 1 and a second liquid tank 2, respectively, a first connection 9 is provided on the first liquid tank 1, and a second connection 10 is provided on the second liquid tank 2.
Specifically, the first connection part 9 is a boss integrally formed on the inner side surface of the first liquid pool 1, and the second connection part 10 is a concave table integrally formed on the inner side surface of the second liquid pool 2; when the two liquid tanks are in butt joint and close, the convex platform on the first liquid tank 1 and the concave and convex on the second liquid tank 2 can be matched with each other in a concave-convex way, and the chip array mounting groove 5 is arranged on the matching surface of the convex platform and the concave platform; the fitting surface of boss and concave station sets up chip array mounting groove 5, and solution channel 3 transversely runs through and sets up inside first junction 9 and second junction 10, and the one end intercommunication chip array mounting groove 5 of solution channel 3, the injection notch 7 of the other end formation intercommunication electrode groove 6 for the solution channel 3 of two liquid pools inside arranges with the chip one-to-one on the chip array 4, is convenient for two liquid pools of quick location equipment simultaneously.
In this embodiment, the two tanks are rectangular tanks and are made of transparent materials, such as organic glass, so that a processing person can observe the flow of electrolyte in the tanks and the processing condition of the chip array 4, find problems in time and perform corresponding operations.
After the two liquid pools are in butt joint and closure, fastening by a fastener to avoid mutual separation of the two liquid pools in the nano-pore processing process of the chip array 4; four fasteners are arranged in the embodiment and are respectively positioned at right angles of the liquid pool; the fastening piece is a fastening bolt 11, and the fastening bolt 11 comprises a nut and a screw; a countersunk stepped through hole is formed in the first liquid pool 1, and a threaded through hole is formed in the second liquid pool 2; after the two liquid pools are in butt joint and closure, a screw rod of the fastening bolt 11 penetrates through a countersunk stepped hole in the first liquid pool 1 to be in threaded connection with a threaded through hole in the first liquid pool 1, a nut of the fastening bolt 11 is embedded into a stepped groove of the countersunk stepped through hole, so that the surface of the liquid pools is kept flat, and meanwhile, the butt joint gap between the two liquid pools can be changed by screwing the fastening bolt 11, so that the chip arrays 4 with different thicknesses can be processed adaptively, and the applicability is improved.
Example two
Referring to fig. 7, the difference between the second embodiment and the first embodiment is that the solution channel 3 is of a sectional structure, and is composed of a horizontal section and an inclined section, the horizontal section of the solution channel 3 is communicated with the chip array mounting groove 5, the inclined section is communicated with the injection notch 7, and an included angle is formed between the inclined section and the horizontal section, and the included angle is 100-160 °; in the process of introducing the electrolyte, the electrolyte closely abuts against the inner wall of one side of the inclined section of the solution channel 3 under the action of self gravity, and air is released in the flowing process and is discharged along the inclined section of the solution channel 3, so that the phenomenon that bubbles are generated to interfere with the nano-pore processing of the chip array 4 is avoided.
Preferably, the angle between the inclined section and the horizontal section of the solution channel 3 is 135 °.
Example III
Referring to fig. 8, in comparison with the first embodiment, the difference between the third embodiment and the first embodiment is that the first connection portion 9 is a boss detachably connected to the inner side surface of the first liquid pool 1, and the second connection portion 10 is a recess detachably connected to the inner side surface of the second liquid pool 2; when the two liquid tanks are in butt joint and close, a boss on the first liquid tank 1 and a concave table on the second liquid tank 2 are in concave-convex fit with each other, and a chip array 4 mounting groove is formed in a matching surface of the boss and the concave table; the mating surface of boss and concave station sets up chip array mounting groove 5, and a plurality of solution passageway 3 set up inside first junction 9 and the inside second junction 10, and the one end intercommunication chip array mounting groove 5 of solution passageway 3, the injection notch 7 of the other end formation intercommunication electrode groove 6.
In specific implementation, according to the number of chips on the chip array 4 to be processed, the boss and the concave table with the corresponding number of solution channels 3 are selected, the boss and the concave table are respectively arranged on the two liquid pools, meanwhile, the sealing piece 8 with the corresponding number of through holes is selected and pre-pressed in the chip array mounting groove 5 on the boss and the concave table, so that the processing requirements of the chip array 4 with different numbers of chips can be met, and the applicability is further improved.
Specifically, be provided with lug 12 on the outer peripheral face of boss and concave station, set up the fixed slot 13 with electrode tank 6 intercommunication on the medial surface of two ponds to and the draw-in groove that sets up along the mounting groove profile, in the fixed slot of two ponds of boss and concave station fixed mounting respectively, and lug 12 and draw-in groove mutually support, so that quick assembly disassembly changes boss and concave station, improves machining efficiency, and the degree of depth of fixed slot is greater than the degree of depth of draw-in groove.
Referring to fig. 9, the solution channel in this embodiment may also be a sectional structure of the solution channel in the second embodiment, that is, the solution channel is composed of a horizontal section and an inclined section, the horizontal section of the solution channel 3 is communicated with the chip array mounting slot 5, the inclined section is communicated with the injection slot 7, and an included angle is formed between the inclined section and the horizontal section.
The above-mentioned embodiments of the present utility model are not intended to limit the scope of the present utility model, and the embodiments of the present utility model are not limited thereto, and all kinds of modifications, substitutions or alterations made to the above-mentioned structures of the present utility model according to the above-mentioned general knowledge and conventional means of the art without departing from the basic technical ideas of the present utility model shall fall within the scope of the present utility model.
Claims (10)
1. The preparation device for processing the nanopore chip array is characterized by comprising two liquid pools which can be mutually butted, wherein the chip array is detachably arranged at the joint of the two liquid pools, a plurality of solution channels are arranged in the two liquid pools, when the two liquid pools are butted and folded, electrolyte and an access electrode are introduced into the two liquid pools, and dielectric is formed in the solution channels to process the nanopore of the chip array.
2. The apparatus of claim 1, wherein the solution channels are arranged in a one-to-one correspondence with the chips on the array of chips.
3. The apparatus for fabricating a nanopore chip array according to claim 2, wherein two of the reservoirs are provided with electrode grooves on the outer sides for electrode access.
4. A device for fabricating a nanopore chip array according to claim 3, wherein one of the reservoirs is provided with a first junction and the other reservoir is provided with a second junction, the first junction and the second junction being adapted to mate with each other when the reservoirs are mated together.
5. The device of claim 4, wherein the first connection is a boss integrally formed on an inner side of the first liquid pool, and the second connection is a recess integrally formed on an inner side of the second liquid pool, and the boss on the first liquid pool and the recess on the second liquid pool are capable of being matched with each other in a concave-convex manner when the two liquid pools are in butt joint.
6. The device of claim 4, wherein the first connection is a boss detachably connected to the inner side of the first liquid pool, and the second connection is a recess detachably connected to the inner side of the second liquid pool, and the boss on the first liquid pool and the recess on the second liquid pool are capable of being matched with each other in a concave-convex manner when the two liquid pools are in butt joint.
7. The apparatus according to claim 5 or 6, wherein a chip array mounting groove is provided on the mating surface of the boss and the recess, a plurality of solution channels are provided inside the first connection and inside the second connection, one end of each solution channel communicates with the chip array mounting groove, and the other end forms an injection slot communicating with the electrode slot.
8. The device for manufacturing the nanopore chip array according to claim 7, wherein the two liquid pools are provided with sealing members in the chip array mounting groove, and the sealing members are provided with a plurality of through holes which are communicated with the solution channels in a one-to-one correspondence manner; when the two liquid pools are in butt joint and close, the sealing elements are closely attached to the two sides of the chip array.
9. The apparatus of claim 7, wherein the solution channel comprises a horizontal section and an inclined section, the horizontal section of the solution channel is in communication with the chip array mounting slot, the inclined section is in communication with the injection slot, and an included angle is formed between the inclined section and the horizontal section.
10. The apparatus of claim 7, wherein the solution channel has an included angle between the inclined section and the horizontal section of 100 ° to 160 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322026939.2U CN220926271U (en) | 2023-07-31 | 2023-07-31 | Preparation facilities of processing nanopore chip array |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322026939.2U CN220926271U (en) | 2023-07-31 | 2023-07-31 | Preparation facilities of processing nanopore chip array |
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| CN220926271U true CN220926271U (en) | 2024-05-10 |
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| CN202322026939.2U Active CN220926271U (en) | 2023-07-31 | 2023-07-31 | Preparation facilities of processing nanopore chip array |
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