CN220914225U - Package assembly and electronic device - Google Patents

Abstract

The application discloses a packaging assembly and electronic equipment. The package assembly includes: the shielding shell comprises a containing cavity and an opening, and the opening is positioned on one side of the shielding shell and is communicated with the containing cavity; an insulating layer covering at least a portion of an inner wall of the shield case; and a radiator in contact with an outer wall of the shield case. The electronic device includes: the package assembly; an electronic device positioned in the accommodating cavity, wherein a connector of the electronic device extends out of the opening; and the main board is contacted with one side of the heat radiation body away from the shielding shell.

Description

Package assembly and electronic device

Technical Field

The embodiment of the application relates to the technical field of electronic equipment, in particular to a packaging assembly and electronic equipment.

Background

The Solid state disk (Solid STATE DRIVES, SSD) is a storage device formed by Solid electronic storage chips, has the advantages of high read-write speed, low power consumption, high stability and the like, and is widely applied to electronic equipment such as notebook computers and the like. With the improvement of the SSD read-write speed, the problem of exceeding radiation can appear after the SSD is applied to electronic equipment.

Therefore, how to reduce radiation without affecting SSD performance is one of the technical problems that those skilled in the art need to solve.

Disclosure of utility model

The packaging assembly and the electronic device provided by the embodiment of the application can solve or partially solve the defects in the prior art or other defects in the prior art.

According to a first aspect of the present application, there is provided a package assembly comprising:

The shielding shell comprises a containing cavity and an opening, and the opening is positioned on one side of the shielding shell and is communicated with the containing cavity;

an insulating layer covering at least a portion of an inner wall of the shield case; and

And the radiator is contacted with the outer wall of the shielding shell.

An electronic device provided according to a second aspect of the present application includes:

A package assembly, comprising:

The shielding shell comprises a containing cavity and an opening, and the opening is positioned on one side of the shielding shell and is communicated with the containing cavity; and an insulating layer covering at least a part of an inner wall of the shield case;

The radiator is contacted with the outer wall of the shielding shell;

An electronic device positioned in the accommodating cavity, wherein a connector of the electronic device extends out of the opening; and

And the main board is contacted with one side of the heat radiation body away from the shielding shell.

According to the packaging assembly provided by the embodiment of the application, the shielding shell is adopted, the insulating layer is covered on all or most of the inner walls of the shielding shell, and meanwhile, the heat radiation body is arranged on the outer wall of the shielding shell, so that electromagnetic shielding can be realized on the premise of ensuring electric isolation of electronic devices, radiation can be obviously reduced, and heat generated by the electronic devices can be rapidly conducted to the outside by virtue of the shielding shell and the heat radiation body. In addition, as the name implies that the shielding shell is of a thin-wall structure, the space occupied by the accommodating cavity formed by surrounding the thin wall of the shielding shell is originally used for accommodating electronic devices, and the space occupied by the thin wall of the shielding shell is very small, so that a large amount of space can be saved by the packaging assembly of the embodiment of the application.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the application or to delineate the scope of the application. Other features of the present application will become apparent from the description that follows.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings. The drawings are included to provide a better understanding of the present application and are not to be construed as limiting the application. In the drawings:

FIG. 1 is a schematic structural view of a package assembly according to an embodiment of the present application;

FIG. 2 is an isometric schematic of an electronic device according to an embodiment of the application;

FIG. 3 is a schematic front view of an electronic device according to an embodiment of the application;

FIG. 4 is a partial installation schematic diagram of an electronic device according to an embodiment of the application; and

Fig. 5 is a schematic top view of an electronic device according to an embodiment of the application.

Reference numerals:

100. a shield case; 101. an opening; 102. a receiving chamber; 103. a first through hole;

200. An insulating layer; 300. a heat sink; 400. an electric conductor; 500. an electronic device;

501. A connector; 502. a second through hole; 503. a first conductive structure; 600. a main board;

601. a second conductive structure; 700. and (5) a screw.

Detailed Description

For a better understanding of the application, various aspects of the application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the application and is not intended to limit the scope of the application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, the expressions first, second, third, etc. are used only to separate one feature from another feature region, and do not denote any limitation of features, particularly do not denote any order of precedence.

In the description of the present application, unless otherwise indicated, the terms "upper," "lower," "left," "right," "front," "rear," and the like refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, rather than to indicate or imply that the apparatus or element in question must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application.

The term "coupled" is to be interpreted broadly, and may be used, for example, as a fixed connection, as a removable connection, or as an integral connection, unless clearly indicated and limited otherwise; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

In the drawings, the thickness, size, and shape of the components have been slightly adjusted for convenience of description. The figures are merely examples and are not drawn to scale. As used herein, the terms "about," "approximately," and the like are used as terms of a table approximation, not as terms of a table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by one of ordinary skill in the art.

It will be further understood that terms such as "comprises," "comprising," "includes," "including," "having," "containing," "includes" and/or "including" are open-ended, rather than closed-ended, terms that specify the presence of the stated features, elements, and/or components, but do not preclude the presence or addition of one or more other features, elements, components, and/or groups thereof. Furthermore, when a statement such as "at least one of the following" appears after a list of features listed, it modifies the entire list of features rather than just modifying the individual elements in the list. Furthermore, when describing embodiments of the application, use of "may" means "one or more embodiments of the application. Also, the term "exemplary" is intended to refer to an example or illustration.

Unless defined otherwise, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. In addition, unless explicitly defined or contradicted by context, the particular steps included in the methods described herein need not be limited to the order described, but may be performed in any order or in parallel. The application will be described in detail below with reference to the drawings in connection with embodiments.

The Solid state disk (Solid STATE DRIVES, SSD) generally includes a control chip, a cache chip and a flash memory chip, wherein the control chip is used for reasonably allocating the load of data on each flash memory chip and transferring all data, the cache chip is used for assisting the control chip in data processing, and the flash memory chip is used for storing data. Among them, the cache chip generally adopts a dynamic random access chip (Dynamic Random Access Memory, DRAM), and the flash memory chip generally adopts a NAND chip. With the improvement of the read-write speed of the DRAM chip and the NAND chip, the problem of exceeding electromagnetic radiation can occur after the SSD is assembled in electronic equipment such as a notebook computer.

Currently, in order to reduce electromagnetic radiation of an SSD, a wave absorbing material is generally wrapped on an outer side of the SSD before the SSD is mounted, and then the SSD wrapped with the wave absorbing material is mounted in an electronic device. Although the wave absorbing material can absorb electromagnetic waves to reduce electromagnetic radiation of the SSD, the wave absorbing material occupies an internal space of the electronic device, which affects heat dissipation of the SSD and installation of the heat dissipating material. In addition, the internal structure of the electronic equipment is complex, the wave absorbing material is difficult to be tightly attached to other heat conducting components in the electronic equipment, an air gap exists between most of the surface of the wave absorbing material and the front of the other heat conducting components of the electronic device, and only heat can be transferred through natural convection heat exchange with air, so that heat generated by SSD is difficult to be quickly transferred to the outside.

Based on this, in order to solve at least some of the problems described above, embodiments of the present application provide a package assembly. Fig. 1 shows a schematic structural diagram of a package assembly according to one embodiment of the present application. As shown in fig. 1, the package assembly includes a shield case 100, an insulating layer 200, and a heat sink 300, the shield case 100 includes a receiving cavity 102 and an opening 101, the opening 101 of the shield case 100 is located at one side of the shield case 100, the opening 101 of the shield case 100 communicates with the receiving cavity 102 of the shield case 100, the insulating layer 200 covers at least a portion of an inner wall of the shield case 100, and the heat sink 300 contacts an outer wall of the shield case 100. Wherein "the insulating layer 200 covers at least part of the inner wall of the shield shell 100" generally means that the entire inner wall of the shield shell 100 is covered with the insulating layer 200 or that most of the inner wall of the shield shell 100 is covered with the insulating layer 200. The coverage area of the insulating layer 200 is sufficient to ensure that no leakage is induced after the electronic device 500 is mounted in the shield case 100.

In use, as shown in connection with fig. 1 and 5, the electronic device 500 may be loaded into the receiving cavity 102 through the opening 101 of the shield case 100. Since all or most of the inner wall of the shielding shell 100 is covered with the insulating layer 200, the insulating layer 200 can electrically isolate the electronic device 500, so as to avoid leakage caused by direct contact between the electronic device 500 and the shielding shell 100, and electromagnetic waves generated during operation of the electronic device 500 are shielded in the shielding shell 100. In addition, since the shield case 100 generally has good heat conductivity, and the outer wall of the shield case 100 is further provided with the heat radiator 300, heat generated from the electronic device 500 can be rapidly conducted to the heat radiator 300 through the shield case 100 and finally released to the outside.

It can be seen that, the package assembly according to the embodiment of the present application, by adopting the shielding shell 100, and covering the insulating layer 200 on all or most of the inner wall of the shielding shell 100, and simultaneously disposing the heat radiator 300 on the outer wall of the shielding shell 100, not only can electromagnetic shielding be achieved and radiation be significantly reduced on the premise of ensuring electrical isolation of the electronic device 500, but also heat generated by the electronic device 500 can be rapidly conducted to the outside by means of the shielding shell 100 and the heat radiator 300. In addition, as the name implies, the shielding shell 100 is of a thin-wall structure, the space occupied by the accommodating cavity 102 formed by surrounding the thin wall of the shielding shell 100 is originally used for accommodating the electronic device 500, and the space occupied by the thin wall of the shielding shell 100 is very small, so that a large amount of space can be saved by the packaging assembly in the embodiment of the application.

It should be noted that, the shielding shell 100 may include a conductive material, and the conductive material may be a metal material such as copper, silver, gold, or a composite material having shielding and conductive properties. For example, the shield case 100 may be prepared from a metal plate, a metal mesh, and/or a metal film. The shield case 100 may be designed in any shape according to the shape of the electronic device 500, which is not limited in the present application. In addition, the insulating material may be plastic, rubber, insulating paint, etc., and the heat sink 300 may be heat conductive silicone grease, heat dissipation fins, or other heat dissipation structures with larger heat conductivity.

In addition, in order to save space as much as possible, the shape of the shield case 100 is adapted to the shape of the electronic device 500, in other words, the shield case 100 is similar to the cross-sectional shape of the electronic device 500 in the same direction, and the size of the shield case 100 may be slightly larger than the size of the electronic device 500, so that the insulating layer 200 covering the inner wall of the shield case 100 is closely attached to the surface of the electronic device 500 after the electronic device 500 is inserted into the shield case 100. In addition, assuming that the electronic device 500 is inserted into the accommodating chamber 102 through the opening 101 of the shield case 100 in the first direction, in order to enhance the shielding effect, projections of the opening 101 of the shield case 100 and the electronic device 500 overlap on a plane perpendicular to the first direction, in other words, after the electronic device 500 is inserted into the accommodating chamber 102 through the opening 101 of the shield case 100, edges of the opening 101 are closely adhered to the surface of the electronic device 500, and there is almost no gap between the surface of the electronic device 500 and the opening 101. As an example, as shown in fig. 1, the electronic device 500 is a solid state disk, which is generally a rectangular plate-like structure. In order to save space, the shielding shell 100 may be a cuboid structure made of metal plates, the shielding shell 100 includes an upper side wall and a lower side wall which are disposed opposite to each other from top to bottom, and a left side wall, a front side wall, a right side wall and a rear side wall which are connected end to end in sequence, where the left side wall, the front side wall, the right side wall and the rear side wall enclose together to form a rectangular space, the upper side wall and the lower side wall are respectively covered on the upper side and the lower side of the rectangular space to enclose to form a containing cavity 102, and the right side wall is provided with an opening 101 for inserting a rectangle of the solid state disk. Of course, the opening 101 may be an opening provided at the right side of the shield case 100, in other words, the shield case 100 may have no right side wall. The size and shape of the opening 101 may be determined according to the cross-sectional shape and size of the solid state disk. In use, the solid state disk is inserted into the accommodating cavity 102 through the opening 101 of the shielding shell 100, and the connector 501 of the solid state disk extends out of the accommodating cavity 102 through the opening 101 to be electrically connected with other components such as the motherboard 600. The upper, lower, front, rear and left side walls of the shield case 100 are respectively adhered to the corresponding surfaces of the solid state disk through the insulating layers 200 covering thereon, and at the same time, the edges of the opening 101 are also adhered to the corresponding surfaces of the electronic device 500. Thereby, other parts of the electronic device 500 except the connector 501 are enclosed in the shielding case 100, and energy of electromagnetic waves generated during operation of the electronic device 500 is absorbed by free electrons on the shielding case 100 and converted into kinetic energy of the free electrons, so that the energy of electromagnetic waves is gradually attenuated until becoming zero, whereby shielding of electromagnetic waves can be achieved. Meanwhile, heat generated in the operation process of the electronic device 500 can be directly and sequentially transferred to the insulating layer 200 and the shielding shell 100 in a heat conduction manner, and then released to the outside through the heat sink 300 by the shielding shell 100.

In addition, in order to enable the electronic device 500 to be grounded through the shield case 100, most of the inner wall of the shield case 100 may cover the insulating layer 200, and the remaining small portion of the inner wall may not cover the insulating layer 200. For example, the inner wall of the shield case 100 includes a first region covered with the insulating layer 200 and a second region not covered with the insulating layer 200. It will be appreciated by those skilled in the art that the insulating layer 200 serves to electrically isolate the electronic device 500 from the shield can 100, and that the insulating layer 200 covers a first region, such that the first region generally refers to a majority of the inner wall of the shield can 100, and the second region is a remaining minority of the region, in other words, the first region is substantially larger than the second region. If a through hole is formed at an edge of the electronic device 500 and a ground point is provided in a circumferential direction of the through hole, the shield case 100 may further include a first through hole 103 penetrating the shield case 100, and the second region is adjacent to the first through hole 103 and extends in a circumferential direction of the first through hole 103. The first through hole 103 may be a semicircular through hole located at an edge of the shield case 100. Those skilled in the art will appreciate that the first through hole 103 may be a through hole of other shapes, which is not limited in the present application.

Thus, after the electronic device 500 is inserted into the accommodating chamber 102 through the opening 101 of the shield case 100, the first through hole 103 of the shield case 100 is coaxial with the through hole of the electronic device 500, and the second region, which is the region of the shield case 100 not covered with the insulating layer 200, is disposed opposite to the ground point of the electronic device 500. A fastener such as the screw 700 is sequentially screwed into the first through hole 103 of the shield case 100 and the through hole of the electronic device 500, and the head of the screw 700 presses the upper sidewall of the shield case 100 to be finally closely attached to the ground point of the electronic device 500 during the screwing of the screw 700. Thereby, the ground point of the electronic device 500, the second region of the shield case 100, and the screw 700 are electrically connected in order. After the screw 700 is tightened, a portion of the stud of the screw 700 protrudes out of the lower sidewall of the shield case 100 through the first through hole 103, and grounding of the electronic device 500 can be achieved by means of the screw 700.

In some embodiments, the package assembly further includes an electrical conductor 400 in contact with the outer wall of the shield 100. When the insulating layer 200 covers most of the inner wall of the shield case 100, a portion of the shield case 100 not covered with the insulating layer 200 may be in contact with the conductive structure of the electronic device 500, and the outer wall of the shield case 100 is connected with the conductive body 400, so that the conductive structure of the electronic device 500 may be electrically connected with the conductive body 400 through the shield case 100, and thus, the ground may be achieved by means of the conductive body 400. The conductor 400 may be located on the same side as the radiator 300 or on a different side from the shield case 100. The electrical conductor 400 may be, but is not limited to, a metal block or silver paste, etc.

As shown in fig. 2 to 5, the embodiment of the present application further provides an electronic device, which includes the electronic device 500, the motherboard 600, and the above-mentioned package assembly. The electronic device 500 is positioned in the receiving cavity 102 of the shield case 100, the connector 501 of the electronic device 500 protrudes out of the opening 101 of the shield case 100, and the motherboard 600 contacts a side of the heat sink 300 remote from the shield case 100. The electronic device 500 may be, but not limited to, a solid state disk, i.e., an SSD.

In order to further improve the shielding effect, the outside of the electronic device 500 may be further coated with a wave-absorbing layer, which is in contact with the inner wall of the shielding case 100. The size of the shielding case 100 may be slightly larger than the size of the electronic device 500 coated with the wave-absorbing layer, in other words, after the electronic device 500 coated with the wave-absorbing layer is mounted in the shielding case 100, the wave-absorbing layer is pressed between the shielding case 100 and the electronic device 500, one side surface of the wave-absorbing layer is almost entirely closely attached to the electronic device 500, the other side surface of the wave-absorbing layer is almost entirely closely attached to the inner wall of the shielding case 100, and the outer wall of the shielding case 100 is connected to the main board 600 through the heat sink 300. Thus, a part of electromagnetic waves generated during the operation of the electronic device 500 is absorbed by the wave-absorbing layer, and the remaining electromagnetic waves not absorbed by the wave-absorbing layer are shielded by the shielding case 100. Meanwhile, since the two sides of the wave-absorbing layer are tightly attached to the electronic device 500 and the shielding shell 100, heat generated in the operation process of the electronic device 500 can be directly and rapidly transferred to the wave-absorbing layer by a heat conduction mode, the wave-absorbing layer can rapidly transfer heat to the shielding shell 100 by a heat conduction mode, the outer wall of the shielding shell 100 is in contact with the heat radiation body 300, the heat radiation body 300 is in contact with the main board 600, and therefore, heat can be finally released to the outside through the main board 600.

In some embodiments, the side of the motherboard 600 facing the shielding shell 100 is provided with a second conductive structure 601, and the package assembly further includes a conductive body 400, wherein the conductive body 400 is located between the shielding shell 100 and the second conductive structure 601, and one side of the conductive body 400 is in contact with the shielding shell 100 and the other side is in contact with the second conductive structure 601. When the insulating layer 200 covers most of the inner wall of the shield case 100, a portion of the shield case 100 not covered with the insulating layer 200 may be in contact with the conductive structure of the electronic device 500, and the outer wall of the shield case 100 is connected to the second conductive structure 601 of the main board 600 through the conductive body 400, so that the electronic device 500 may be grounded through the shield case 100 and the conductive body 400 by means of the main board 600.

The conductor 400 may be in contact with the device case of the electronic device in addition to the main board 600. For example, the device housing of the electronic device 500 may include a first housing and a second housing disposed opposite to each other, the first housing and the second housing collectively enclosing a space for accommodating the above-described components. The main board 600 is fixed in the first shell, the shielding shell 100 with the electronic device 500 inserted therein is located at one side of the main board 600 far away from the first shell, the radiator 300 is connected between the shielding shell 100 and the main board 600, the second shell is located at one side of the shielding shell 100 far away from the main board 600, and the conductor 400 is connected between the shielding shell 100 and the second shell. In this case, the conductor 400 and the radiator 300 are located at opposite sides of the shield case 100, respectively. Of course, one side of the conductive body 400 is in contact with the device housing, and the other side of the conductive body 400 may be in contact with other sidewalls of the shield case 100, such as a front sidewall, a rear sidewall, or a left sidewall. When the insulating layer 200 covers most of the inner wall of the shield case 100, a portion of the shield case 100 not covered with the insulating layer 200 may be in contact with the conductive structure of the electronic device 500, and the outer wall of the shield case 100 is connected to the device case through the conductive body 400, so that the electronic device 500 may be grounded through the shield case 100 and the conductive body 400 by means of the device case.

In some embodiments, as shown in fig. 1 and 5, the electronic device 500 includes a second through hole 502 penetrating the electronic device 500 and first conductive structures 503 distributed along a circumferential direction of the second through hole 502, the shield case 100 includes the first through hole 103 penetrating the shield case 100 and corresponding to the second through hole 502, and an inner wall of the shield case 100 includes a first region covered with the insulating layer 200 and a second region in contact with the first conductive structures 503. The second through hole 502 may be a semicircular through hole located at an edge of the electronic device 500. Further, the main plate 600 includes a threaded hole for being engaged with the screw 700, and the screw 700 is disposed in the threaded hole after passing through the first and second through holes 103 and 502.

The following electronic device 500 is a solid state disk, and an electronic apparatus in an embodiment of the present application will be described below:

As shown in fig. 3, the electronic device includes a main board 600 and a shielding case 100 which are disposed opposite to each other at a distance, a conductive body 400 and a heat sink 300 are disposed between the main board 600 and the shielding case 100, one side of the conductive body 400 is in contact with the shielding case 100, the other side is in contact with a second conductive structure 601 of the main board 600, such as a ground point, and both sides of the heat sink 300 are respectively in contact with the shielding case 100 and the main board 600. As shown in fig. 1, the shield shell 100 includes a housing chamber 102 and an opening 101, the opening 101 of the shield shell 100 communicates with the housing chamber 102, a first through hole 103 penetrating the shield shell 100 is provided at an end of the shield shell 100 away from the opening 101, the first through hole 103 is semicircular, and the remaining area (first area) of the inner wall of the shield shell 100 is covered with an insulating layer 200 except for an arc-shaped area (second area) extending in a circumferential direction of the first through hole 103. When assembled, the solid state disk, i.e., the electronic device 500, can be inserted into the accommodating cavity 102 of the shield case 100 through the opening 101 of the shield case 100. As shown in fig. 5, the solid state disk is in a rectangular plate structure, one end of the solid state disk is provided with a connector 501, the edge of the other end is provided with a second through hole 502 penetrating through the solid state disk, the second through hole 502 is semicircular, and the solid state disk is further provided with first conductive structures 503 distributed along the circumferential direction of the second through hole 502. Thus, after the solid state disk is inserted into the accommodating cavity 102 of the shielding shell 100 through the opening 101 of the shielding shell 100, the connector 501 of the solid state disk extends out of the shielding shell 100 through the opening 101 of the shielding shell 100, the second through hole 502 of the solid state disk is coaxial with the first through hole 103 of the shielding shell 100, and the first conductive structure 503 of the solid state disk is opposite to the second area of the shielding shell 100, in other words, the projection of the second area on the solid state disk at least partially overlaps with the first conductive structure 503. Next, as shown in fig. 3 and 4, the screw 700 is screwed into the first through hole 103 from the side of the shield case 100 away from the main board 600, so that the screw 700 passes through the upper side wall of the shield case 100, the second through hole 502 of the solid state disk, and the lower side wall of the shield case 100 in order and finally is screwed into the screw hole of the main board 600. In this process, the head of the screw 700 is located at the outer side of the shield shell 100, and the head of the screw 700 applies downward pressure to the upper side wall of the shield shell 100, so that the upper side wall of the shield shell 100 is continuously close to the solid state disk. After the stud of the screw 700 is screwed into the motherboard 600 through the lower side wall of the shield shell 100, the head of the screw 700 is tightly attached to the upper side wall of the shield shell 100, and the second area of the shield shell 100 is tightly attached to the first conductive structure 503 of the solid state disk under the extrusion of the head of the screw 700. As can be seen from the above, the shielding shell 100 is electrically contacted with the first conductive structure 503 of the solid state disk through the second area. Thus, the shield case 100 may be connected to the main board 600 not only by the screw 700 but also by the conductor 400 and the main board 600, thereby realizing multi-point grounding. In addition, the connector 501 of the solid state disk has a ground wire, and the solid state disk can be grounded after being connected with the motherboard 600 or other devices.

In addition, after electromagnetic radiation and heat dissipation tests are carried out on the existing notebook computer and the notebook computer in the embodiment of the application, the notebook computer in the embodiment of the application has smaller radiation and better heat dissipation performance. The solid state disk of the existing notebook computer is coated with the wave absorbing material, and the encapsulation assembly is arranged in the notebook computer in the embodiment of the application, and the solid state disk is inserted into the shielding shell 100 of the encapsulation assembly. As shown in Table 1, the electromagnetic radiation generated by the notebook computer in the embodiment of the application is obviously smaller than that generated by the existing notebook computer, and the internal temperature of the notebook computer in the embodiment of the application is obviously smaller than that of the existing notebook computer, so that the heat dissipation effect is better.

Table 1 radiation and heat dissipation test results for notebook computer

It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. As an example, the steps described in the present disclosure may be performed in parallel or sequentially or in a different order, provided that the desired results of the technical solution of the present disclosure can be achieved, and are not limited herein.

The above embodiments do not limit the scope of the present application. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, as well as others, on average, depending on the design requirements. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of the present application.

Claims (15)

1. A package assembly, comprising:

The shielding shell comprises a containing cavity and an opening, and the opening is positioned on one side of the shielding shell and is communicated with the containing cavity;

an insulating layer covering at least a portion of an inner wall of the shield case; and

And the radiator is contacted with the outer wall of the shielding shell.

2. The package assembly of claim 1, wherein the material of the shield shell comprises a conductive material.

3. The package assembly of claim 2, wherein the shield shell further comprises a first through hole extending therethrough, the inner wall of the shield shell comprises a first region and a second region, the insulating layer covers the first region, and the second region is adjacent to and extends circumferentially of the first through hole.

4. The package assembly of claim 3, wherein the first through hole is a semicircular through hole located at an edge of the shield case.

5. The package assembly of claim 2, further comprising an electrical conductor in contact with an outer wall of the shield shell.

6. The package assembly of claim 5, wherein the heat sink and the electrical conductor are located on a same side of the shield.

7. The package assembly of claim 2, wherein the conductive material comprises at least one of a metal plate, a metal mesh, and a metal film.

8. An electronic device, comprising:

A package assembly, comprising:

The shielding shell comprises a containing cavity and an opening, and the opening is positioned on one side of the shielding shell and is communicated with the containing cavity; and

An insulating layer covering at least a portion of an inner wall of the shield case;

The radiator is contacted with the outer wall of the shielding shell;

An electronic device positioned in the accommodating cavity, wherein a connector of the electronic device extends out of the opening; and

And the main board is contacted with one side of the heat radiation body away from the shielding shell.

9. The electronic device of claim 8, wherein the material of the shield shell comprises a conductive material.

10. The electronic device of claim 9, wherein the electronic component includes a second through hole penetrating the electronic component and first conductive structures distributed along a circumferential direction of the second through hole, the shield case includes a first through hole penetrating the shield case and corresponding to the second through hole, and an inner wall of the shield case includes a first region covered with the insulating layer and a second region in contact with the first conductive structures.

11. The electronic device of claim 10, wherein the motherboard includes a threaded hole for mating with a screw disposed in the threaded hole after passing through the first and second through holes.

12. The electronic device of claim 10, wherein the second through hole is a semicircular through hole located at an edge of the electronic component.

13. The electronic device of claim 9, wherein a side of the motherboard facing the shielding shell is provided with a second conductive structure, the package assembly further comprising an electrical conductor located between the shielding shell and the second conductive structure.

14. The electronic device of any one of claims 8 to 13, wherein the electronic device further comprises:

and the wave absorbing layer is coated on the outer side of the electronic device and is contacted with the inner wall of the shielding shell.

15. The electronic device of any one of claims 8 to 13, wherein the electronic component comprises a solid state disk.