CN220912501U - Temperature measuring assembly and cooking equipment - Google Patents

Abstract

The embodiment of the utility model provides a temperature measuring assembly and cooking equipment, wherein the temperature measuring assembly comprises: the bearing plate is provided with a bearing area on the first side; the heat conducting layer is arranged on the second side of the bearing plate and is attached to the bearing plate; the plurality of temperature sensing pieces are arranged on one side, far away from the bearing plate, of the heat conducting layer, one end of each Wen Ganjian abuts against the heat conducting layer, and one end of at least part of the temperature sensing pieces extends out of the bearing plate. According to the technical scheme, the heat conducting layer is utilized, so that heat on the bearing plate can be transferred to the temperature sensing piece, temperature detection is facilitated, and a plurality of temperature sensing pieces can be utilized to realize multipoint detection, so that the accuracy of temperature detection is improved.

Description

Temperature measuring assembly and cooking equipment

Technical Field

The utility model relates to the technical field of temperature measuring devices, in particular to a temperature measuring assembly and cooking equipment.

Background

At present, in the related art, when the temperature of the cooking device is measured, a single-point temperature measurement mode is generally adopted, and after the pot is locally heated, the detected position is not necessarily an actual heating area, namely the detected temperature is not accurate.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems existing in the prior art or related art.

In view of this, embodiments of the first aspect of the present utility model provide a temperature measuring assembly.

Embodiments of the second aspect of the present utility model provide a cooking apparatus.

To achieve the above object, an embodiment of a first aspect of the present utility model provides a temperature measuring assembly, including: the bearing plate is provided with a bearing area on the first side; the heat conducting layer is arranged on the second side of the bearing plate and is attached to the bearing plate; the plurality of temperature sensing pieces are arranged on one side, far away from the bearing plate, of the heat conducting layer, one end of each Wen Ganjian abuts against the heat conducting layer, and one end of at least part of the temperature sensing pieces extends out of the bearing plate.

According to the temperature measuring assembly provided by the utility model, the temperature measuring assembly mainly comprises the bearing plate, the heat conducting layer and the temperature sensing piece, the bearing plate is used for bearing the cooking utensil, the heat conducting layer is arranged on one side of the bearing plate, namely, one side far away from the cooking utensil is particularly used for bearing the cooking utensil, the heat conducting layer is arranged on one side of the inner surface of the bearing plate, heat can be transmitted to the temperature sensing piece through the heat conducting layer, and finally, wen Ganjian can be used for detecting the temperature of the heat conducting layer at different positions conveniently, and the temperature in a specific area of the first side on the bearing plate can be detected. Particularly, all the temperature sensing pieces are arranged at the lower side of the heat conducting layer, wherein one part of the temperature sensing pieces are in contact with the heat conducting layer, so that non-contact detection of the temperature on the bearing area is realized, and the other part Wen Ganjian is in contact with a pot on the bearing plate directly, so that contact temperature measurement is realized. It is emphasized that the heat conducting layer is utilized, so that heat on the bearing plate can be transferred to the temperature sensing part, the temperature can be conveniently detected, the heat conducting layer can be utilized to realize the adhesion with the bearing plate, and meanwhile, the accuracy of temperature detection can be greatly improved by adopting Wen Ganjian of two different detection objects.

Further, the loading board sets up in whole temperature measurement subassembly top, and first side is used for bearing cooking utensil, and when the operation, local dry combustion method probably takes place, and this moment is through the heat conduction layer that is located the loading board second side, with heat transfer to temperature sensing piece department, utilizes Wen Ganjian and the offset positional relationship of heat conduction layer, can detect the temperature of specific position to each position temperature in accurate measurement pot bottom, guarantee the culinary art experience, and then can play the effect of effective protection panel according to the operation of specific temperature variation control product.

It can be understood that the temperature of the specific area on the bearing plate can be accurately and rapidly measured by utilizing a plurality of temperature sensing pieces, so that the temperature in different temperature measuring areas can be conveniently detected by a subsequent control board, and further, the temperature control is realized.

For the carrying plate, the first side is formed with a carrying area, generally an upper surface, i.e. the cooking appliance can be placed on the designated carrying area only, so as to achieve a better cooking effect.

In the above technical solution, optionally, the heat-conducting layer is in a film-like structure or a powder-like structure, and the heat-conducting layer specifically includes at least one independent heat-conducting area; the heat conduction coefficient of the heat conduction layer is larger than that of the bearing plate.

In this technical scheme, the heat conduction layer can be in the form of film or the form setting of powder at the downside of loading board, no matter what kind of form is adopted, and the heat conduction ability of the material of heat conduction layer needs to be greater than the heat conduction ability of loading board self, and the coefficient of heat conduction layer is greater than the coefficient of heat conduction of loading board promptly to the heat can be through the quick transfer of heat conduction layer to the temperature sensing piece department that partly offsets with the heat conduction layer, improves temperature measurement efficiency, also improves the temperature measurement accuracy simultaneously.

The heat conducting layer may be copper, aluminum, iron, etc. and may be formed into film structure or sprayed onto the lower side of the bearing board directly.

In the above technical scheme, optionally, the quantity of heat conduction area is a plurality of, and a plurality of heat conduction area circumferences set up, are equipped with a detection position in every heat conduction area, wen Ganjian's one end offsets with the detection position.

In this technical scheme, including a plurality of heat conduction regions to the heat conduction layer, a plurality of heat conduction regions are the circumference and encircle the setting, are provided with one in every heat conduction region and examine the position to Wen Ganjian with examine the laminating of position, thereby detect the temperature of this heat conduction region.

In the above technical solution, optionally, the number of the heat conducting areas is one, a first opening is formed in the heat conducting area, a second opening corresponding to the first opening is formed on the carrying plate, and the portion Wen Ganjian passes through the first opening and the second opening.

In this technical scheme, in this scheme, only set up a heat conduction region, be formed with the first mouth that supplies the part temperature sensing piece to pass in the heat conduction region, still be equipped with the second mouth of being convenient for Wen Ganjian to wear out simultaneously on the loading board to make through the outside Wen Ganjian of stretching out of first mouth and second mouth can directly contact the temperature measurement to the pan of placing on the loading board.

In the above technical solution, optionally, the plurality of temperature sensing elements specifically include: one end of the first temperature sensing piece penetrates through the heat conducting layer and the bearing plate; the second Wen Ganjian is uniformly arranged around the first temperature sensing piece, and one end of the second temperature sensing piece is propped against the heat conducting layer.

In this technical solution, for the temperature sensing element, according to the different setting positions, the temperature sensing element may be divided into a first temperature sensing element and a second Wen Ganjian, where the first temperature sensing element is disposed in a circumferential center area, the first temperature sensing element is used as a main element for contact temperature measurement, the second Wen Ganjian is disposed around the circumference of the first temperature sensing element, the second Wen Ganjian is used as a main element for non-contact temperature measurement, a probe portion of the first temperature sensing element extends out of the carrier plate, and a probe portion of the second temperature sensing element abuts against the heat conducting layer.

In the above technical solution, optionally, the method further includes: the heat insulation piece is arranged on one side, far away from the bearing plate, of the heat conducting layer, an opening matched with Wen Ganjian is formed in the heat insulation piece, and at least part Wen Ganjian penetrates through the opening and abuts against the heat conducting layer.

In this technical scheme, through setting up the insulating part at the downside of heat conduction layer, can isolate temperature detection, reduce the influence of the heat that generates to the temperature sensing piece when the operation process of heating coil, guarantee temperature detection's accuracy nature. In addition, a plurality of open pores are arranged on the heat insulating piece, and for a part of temperature sensing pieces, the heat insulating piece can pass through the open pores and then is abutted on the heat conducting layer, and the open pores arranged on the heat insulating piece can be used for Wen Ganjian to pass through, so that temperature measurement is realized.

Wherein, the heat insulating part self shape is discoid to with Wen Ganjian's setting position looks adaptation of being convenient for.

In the above technical solution, optionally, the projection of the heat insulating element on the carrier plate covers the projection of the heat conducting layer on the carrier plate.

In this technical scheme, to insulating part and heat conduction layer, restrict its projection on the loading board respectively, the projection of insulating part is bigger, can cover the projection of heat conduction family to can improve thermal-insulated effect, the heat conduction layer is covered by the insulating part completely promptly, improves thermal-insulated effect, reduces Wen Ganjian and receives the temperature influence of other components and parts that generate heat, leads to the possibility that the temperature measurement accuracy takes place the deviation.

It will be appreciated that the shape of the insulating element is similar to the shape of the thermally conductive layer, i.e. it may be circular or square, as long as complete coverage is achieved.

In the above technical solution, optionally, the method further includes: the bottom shell is arranged on one side of the heat conduction layer far away from the bearing plate; the temperature sensing piece specifically includes: the elastic support is arranged on the bottom shell and is provided with a temperature sensing body.

In this technical scheme, through setting up the drain pan in the downside of heat conduction layer to the connection of temperature sensing spare of being convenient for, temperature sensing spare includes elastic support and temperature sensing body promptly, and the temperature sensing body mainly includes the probe and links to each other with the control panel connects, and the elastic support then is used for supporting the temperature sensing body, plays fixed effect, namely fixes the temperature sensing body on the drain pan.

Further, the elastic support can be made of silica gel or other elastic materials, and can shrink in the up-down direction, so that the heat conduction layer can be pressed and attached.

In the above technical solution, optionally, the method further includes: the wire coil support is arranged on one side of the heat conduction layer, which is far away from the bearing plate, and a heating coil is arranged on the wire coil support; the temperature sensing piece specifically includes: the elastic support is arranged on the wire coil support and is provided with a temperature sensing body.

In this technical scheme, through setting up the drum support in the downside of heat-conducting layer to the connection of temperature sensing spare of being convenient for, temperature sensing spare includes elastic support and temperature sensing body promptly, and the temperature sensing body mainly includes the probe and links to each other with the control panel connects, and the elastic support then is used for supporting the temperature sensing body, plays fixed effect, namely fixes the temperature sensing body on the drain pan.

Further, be provided with the heating coil on the drum support, the drum support can be fixed the position of heating coil in whole temperature measurement subassembly, and the drum support also provides the connection for Wen Ganjian's fixed simultaneously.

The bearing plate can be a high borosilicate glass plate, has low thermal expansion coefficient and stable performance, has high water resistance, alkali resistance, acid resistance and the like, but the high borosilicate glass plate has poor temperature resistance. The temperature measurement board can be selected as the insulation board to guarantee that temperature sensing piece can not take place the short circuit, in addition, the temperature measurement board still can be selected as the heat insulating board, thereby when placing the temperature measurement subassembly in equipment, the temperature that the heating element who is located the temperature measurement board opposite side in the equipment sent when operation probably leads to the fact the influence to Wen Ganjian's temperature measurement effect, guarantees the temperature measurement accuracy.

Embodiments of the second aspect of the present utility model provide a cooking apparatus comprising: a housing; any one of the temperature measuring assemblies in the first aspect is arranged in the shell; and the heating coil is arranged on one side of the heat conduction layer in the temperature measuring assembly, which is far away from the bearing plate.

The cooking equipment provided by the utility model comprises the shell, the temperature measuring component arranged in the shell and the heating coil arranged below the temperature measuring component, wherein the shell mainly has a protection effect on internal electronic elements and physical structures, and can have a heating effect on the cooking utensil on the bearing plate under the action of the heating coil.

The cooking device includes the temperature measuring component, so that the cooking device has the beneficial effects of any one of the embodiments of the first aspect, and will not be described herein.

Cooking devices include, but are not limited to, induction cookers, electroceramics, electric cookers, and the like, which require measurement of the temperature of the carrier plate.

In the above technical solution, optionally, the housing specifically includes: a bottom case; the upper cover is detachably connected with the bottom shell, the upper cover is connected with the bottom shell to form a containing cavity, and the heat insulation piece of the temperature measuring assembly is arranged in the containing cavity; wherein, the loading board of temperature measurement subassembly is laminated mutually with the upper cover.

In this technical scheme, the casing mainly includes drain pan and the upper cover of detachable connection, and two structures are connected, and inside can form and hold the chamber, can place structures such as thermal-insulated piece in holding the chamber, but the loading board then sets up the opposite side of upper cover to play the effect of bearing cooking utensil.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, or may be learned by practice of the utility model.

Drawings

FIG. 1 shows a schematic structural view of a temperature sensing assembly according to one embodiment of the present utility model;

FIG. 2 shows a schematic structural view of a temperature sensing assembly according to one embodiment of the present utility model;

FIG. 3 shows a schematic structural view of a temperature sensing assembly according to one embodiment of the present utility model;

FIG. 4 shows a schematic structural view of a temperature sensing assembly according to one embodiment of the present utility model;

Fig. 5 illustrates a schematic structural view of a cooking apparatus according to an embodiment of the present utility model.

The correspondence between the reference numerals and the component names in fig. 1 to 5 is:

100: a temperature measuring assembly; 102: a carrying plate; 1022: a carrying area; 1024: a second port; 104: a heat conducting layer; 1042: a thermally conductive region; 1044: a first port; 106: wen Ganjian; 1062: a first temperature sensing member; 1064: a second temperature sensing member; 1066: an elastic support; 1068: a temperature sensing body; 108: a heat insulating member; 1082: opening holes;

200: a cooking device; 202: a heating coil; 204: a housing; 2042: a bottom case; 2044: and (5) an upper cover.

Detailed Description

In order that the above-recited objects, features and advantages of embodiments of the present utility model can be more clearly understood, a further detailed description of embodiments of the present utility model will be rendered by reference to the appended drawings and detailed description thereof. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but embodiments of the utility model may be practiced otherwise than as described herein, and therefore the scope of the utility model is not limited to the specific embodiments disclosed below.

Some embodiments according to the present utility model are described below with reference to fig. 1 to 5.

As shown in fig. 1 and fig. 4, the temperature measuring assembly 100 provided in this embodiment mainly includes a carrying plate 102, a heat conducting layer 104 and a temperature sensing member 106, where the carrying plate 102 is used for carrying a cooking appliance, and the heat conducting layer 104 is disposed on one side of the carrying plate 102, specifically, the side far away from the cooking appliance, i.e. the outer surface of the carrying plate 102 is used for carrying the cooking appliance, and the heat conducting layer 104 is disposed on one side of the inner surface, so that heat can be transferred to the temperature sensing member 106 through the heat conducting layer 104, and finally, the Wen Ganjian is convenient for 106 to detect the temperatures of the heat conducting layer 104 at different positions, i.e. the temperature in the specific area on the first side of the carrying plate 102 can be detected. In particular, in the present application, the temperature sensing element 106 is disposed at the lower side of the heat conducting layer 104, wherein a part of the temperature sensing element 106 is abutted against the heat conducting layer 104, so as to realize non-contact detection of the temperature on the carrying area 1022, and the other part Wen Ganjian is directly contacted with the pot on the carrying plate, so as to realize contact temperature measurement. It should be emphasized that, according to the present application, the heat conducting layer 104 is utilized to transfer the heat on the carrier plate 102 to the temperature sensing element 106, so that the temperature detection is facilitated, and the heat conducting layer 104 can be utilized to attach to the carrier plate 102, and meanwhile, by adopting Wen Ganjian of two different detection objects, the accuracy of the temperature detection can be greatly improved.

In one embodiment, the thermally conductive layer 104 is optionally provided in the form of a film on the underside of the carrier plate 102.

In another embodiment, the thermally conductive layer 104 is optionally provided in the form of powder on the underside of the carrier plate 102.

However, whichever form is adopted, the heat conduction capability of the material of the heat conduction layer 104 needs to be greater than the heat conduction capability of the carrier plate 102 itself, that is, the heat conduction coefficient of the heat conduction layer 104 is greater than the heat conduction coefficient of the carrier plate 102, so that heat can be quickly transferred to the temperature sensing part 106 which is partially propped against the heat conduction layer 104 through the heat conduction layer 104, thereby improving the temperature measurement efficiency and simultaneously improving the temperature measurement accuracy.

The heat conducting layer 104 may be made of copper, aluminum, iron, etc., and may be formed into a film independent structure or directly sprayed on the lower side of the carrier plate 102 by a powder spraying process.

In one embodiment, as shown in fig. 1, optionally, the heat conducting layer 104 includes a plurality of heat conducting areas 1042, where the plurality of heat conducting areas 1042 are circumferentially disposed, and a detecting position is disposed in each heat conducting area 1042, so as to facilitate the adhesion between Wen Ganjian and the detecting position, so as to detect the temperature of the heat conducting area 1042.

In another embodiment, as shown in fig. 2, optionally, only one heat conducting area 1042 is provided, in which a first port 1044 is formed for passing a part of the temperature sensing element 106, and a second port 1024 is also provided on the carrier plate 102 for facilitating Wen Ganjian to pass through, so that Wen Ganjian extending outwards through the first port 1044 and the second port 1024 directly performs contact temperature measurement on the pot placed on the carrier plate 102.

Further, the bearing plate 102 is arranged at the uppermost part of the whole temperature measuring assembly 100, the first side is used for bearing a cooking utensil, when the cooking utensil is operated, local dry heating possibly occurs, at this time, heat is transferred to the temperature sensing piece 106 through the heat conducting layer 104 positioned at the second side of the bearing plate 102, and the temperature at a specific position can be detected by utilizing the offset position relation between Wen Ganjian and the heat conducting layer 104, so that the temperature of each part of the bottom of the pot is accurately measured, the cooking experience is ensured, and the operation of a product can be controlled according to specific temperature change, so that the effect of effectively protecting the panel is achieved.

It can be appreciated that by using a plurality of temperature sensing members 106, the temperature of a specific area on the carrier plate 102 can be accurately and rapidly measured, so that the temperature in different temperature measuring areas can be detected by the subsequent control panel, and thus the temperature control can be realized.

In this embodiment, the first side of the carrying plate 102 is formed with a carrying area 1022, generally an upper surface, that is, the cooking appliance can only be placed on the designated carrying area 1022, so as to achieve a better cooking effect.

Further, for Wen Ganjian to 106, the arrangement positions of the first temperature sensing element 1062 and the second temperature sensing element 1064 may be different, where the first temperature sensing element 1062 is disposed in the central area of the circumference, the first temperature sensing element is used as a main element for contact temperature measurement, the second temperature sensing element 1064 is disposed around the circumference of the first temperature sensing element 1062, the second Wen Ganjian is used as a main element for non-contact temperature measurement, the probe portion of the first temperature sensing element 1062 and the probe portion of the second temperature sensing element 1064, i.e. one end of the first temperature sensing element 1062 extends out of the carrier plate, and one end of the second temperature sensing element 1064 abuts against the heat conducting layer.

Further, as shown in fig. 2, the heat insulation member 108 is disposed at the lower side of the heat conducting layer 104, so as to isolate the temperature detection, reduce the influence of the generated heat on Wen Ganjian during the operation of the heating coil, and ensure the accuracy of the temperature detection. In addition, a plurality of openings 1082 are formed in the heat insulating member 108, and for a portion of the temperature sensing member 106, the heat insulating member is abutted against the heat conducting layer 104 after passing through the openings 1082, and the openings Wen Ganjian formed in the heat insulating member can pass through the heat insulating member, so as to measure the temperature.

In one particular embodiment, the insulator 108 itself is shaped as a disk to fit the location of Wen Ganjian to which it is to be placed.

For the heat insulating piece 108 and the heat conducting layer 104, the projection of the heat insulating piece 108 on the bearing plate 102 is limited, the projection of the heat insulating piece 108 is larger, and the projection of a heat conducting person can be covered, so that the heat insulating effect can be improved, namely, the heat conducting layer 104 is completely covered by the heat insulating piece 108, the heat insulating effect is improved, the influence of the temperature of other heating components on Wen Ganjian is reduced, and the possibility of deviation of temperature measurement accuracy is reduced.

It will be appreciated that the shape of the thermal shield 108 is similar to the shape of the thermally conductive layer 104, i.e., it may be circular or square, as long as complete coverage is achieved.

In a specific embodiment, a bottom shell is disposed on the lower side of the heat conducting layer 104 to facilitate connection of Wen Ganjian to 106, as shown in fig. 3, that is, the temperature sensing element 106 includes an elastic support 1066 and a temperature sensing body 1068, the temperature sensing body 1068 mainly includes a probe and a connector connected to a control board, and the elastic support 1066 is used for supporting the temperature sensing body 1068 to perform a fixing effect, that is, fixing the temperature sensing body 1068 on the bottom shell.

Further, the elastic support 1066 may be made of silica gel or other elastic materials, and may be shrunk in the vertical direction, so as to achieve the fitting effect on the heat conducting layer 104.

In another specific embodiment, a wire coil support is disposed on the lower side of the heat conducting layer 104, so that the connection of Wen Ganjian and 106 is facilitated, that is, the temperature sensing member 106 includes an elastic support 1066 and a temperature sensing body 1068, the temperature sensing body 1068 mainly includes a probe and a connector connected to a control board, and the elastic support 1066 is used for supporting the temperature sensing body 1068, so as to achieve a fixing effect, that is, fixing the temperature sensing body 1068 on the bottom shell.

Further, be provided with the heating coil on the drum support, the drum support can be fixed the position of heating coil in whole temperature measurement subassembly, and the drum support also provides the connection for Wen Ganjian's fixed simultaneously.

On the basis of any one of the above embodiments, a control board electrically connected to the plurality of temperature sensing elements 106 is provided, and temperature changes of different detection positions can be detected according to Wen Ganjian under the action of the control board, so that the operation of the product can be controlled according to specific temperature changes, and the function of effectively protecting the panel is achieved.

On the basis of any embodiment, an independent temperature measuring plate can be arranged, the temperature measuring plate is arranged on the lower side of the bearing plate 102, wen Ganjian can be arranged on the temperature measuring plate, and if a circuit fault occurs, the temperature measuring plate can be directly and independently replaced.

It should be emphasized that by arranging the temperature sensing plate and the carrier plate 102 opposite to each other, and simultaneously arranging Wen Ganjian 106,106 on the temperature sensing plate, the temperature in a specific area on the carrier plate 102 can be sensed.

In a specific embodiment, the shapes of the temperature measuring plate and the carrying plate 102 are limited in an adapting manner, when Wen Ganjian in the form of a resistive film is arranged on the temperature measuring plate, the shape of the resistive film arranged on the temperature measuring plate is more attached to the temperature measuring plate, and the effective temperature measuring effect can be achieved no matter the carrying plate 102 is a plane or a curved surface. For example, if the carrier plate 102 is a flat plate, the temperature measuring plate is a flat plate, and if the carrier plate 102 is a curved plate, the temperature measuring plate is a curved plate with the same radian.

Further, for the heat conducting layer 104, a plurality of heat conducting areas are circumferentially arranged, and each heat conducting area is provided with a detection position, so that Wen Ganjian is attached to the detection position, and the temperature of the heat conducting area is detected.

Based on any of the above embodiments, the carrier plate 102 may be a borosilicate glass plate, which has a low thermal expansion coefficient and stable performance, and has high water resistance, alkali resistance, acid resistance, and the like.

On the basis of any embodiment, the insulating plate is selected, so that the temperature sensing piece 106 can be ensured to normally operate to realize temperature measurement, and the possibility of short circuit is reduced.

On the basis of any of the above embodiments, the heat insulation board may be selected, so that when the temperature measuring assembly 100 is placed in the device, the temperature of the heat generating device located on the other side in the device may affect the temperature measuring effect of Wen Ganjian to ensure the accuracy of temperature measurement.

On the basis of any embodiment, the insulating board is selected, and the two advantages can be achieved.

As shown in fig. 5, the present embodiment provides a cooking apparatus 200, which includes a housing 204, a temperature measuring assembly 100, and a heating coil 202 disposed below the temperature measuring assembly 100, and can perform a heating effect on a cooking appliance on a carrier plate 102 under the action of the heating coil 202.

Since the cooking apparatus 200 includes the temperature measuring assembly 100, the above-mentioned embodiment of the first aspect has the beneficial effects of any one of the temperature measuring assemblies 100, and will not be described herein.

Cooking device 200 includes, but is not limited to, induction cookers, electroceramics, electric cookers, and the like that require measurement of the temperature of carrier plate 102.

Further, as shown in fig. 4, the housing 204 mainly includes a bottom shell 2042 and an upper cover 2044 which are detachably connected, and the two structures are connected to form a receiving cavity therein, and a heat insulating member and other structures can be placed in the receiving cavity, but a bearing plate is disposed on the other side of the upper cover to perform the function of bearing the cooking utensil.

In a specific embodiment, there is provided an induction cooker comprising: the kitchen panel (i.e. the loading board), the loading board of this embodiment can select the low high boron silicon material kitchen panel of cost, in addition, installs 6 temperature measurement components to kitchen panel downside, and at kitchen panel back accessible paste or hot compress processing assembly heat conduction layer, when the pan on the high boron silicon panel takes place dry combustion method and produces high temperature, the heat can be guided the position of high temperature probe (Wen Ganjian promptly) by the heat conduction membrane fast to make the temperature probe visit temperature more accurate. The heat-conducting films are not necessarily only heat-conducting silica gel, but also film sheets such as aluminum films or copper films and the like which can conduct heat rapidly. The heat conduction material is not necessarily in a membrane mode, and metal powder such as iron powder can be sprayed on the high-boron silicon plate, so that the heat conduction uniformity of the panel is accelerated, and the effect of accelerating the reaction speed of the thermistor can be achieved.

According to the temperature measuring assembly and the cooking equipment provided by the utility model, the heat on the bearing plate can be transmitted to the temperature sensing part by utilizing the heat conducting layer, so that the temperature can be conveniently detected, and the multipoint detection can be realized by utilizing a plurality of temperature sensing parts, so that the accuracy of the temperature detection is improved.

In the present utility model, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more, unless expressly defined otherwise. The terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; "coupled" may be directly coupled or indirectly coupled through intermediaries. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "rear", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or units referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model.

In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (11)

1. A temperature measurement assembly, comprising:

the bearing plate is provided with a bearing area on the first side;

The heat conducting layer is arranged on the second side of the bearing plate and is attached to the bearing plate;

The temperature sensing pieces are arranged on one side, far away from the bearing plate, of the heat conducting layer, at least part of one ends of the Wen Ganjian are abutted against the heat conducting layer, and at least part of one ends of the Wen Ganjian extend out of the bearing plate.

2. The temperature measurement assembly of claim 1, wherein the thermally conductive layer is in a film-like or powder-like structure, and specifically comprises at least one independent thermally conductive region;

The heat conduction coefficient of the heat conduction layer is larger than that of the bearing plate.

3. The temperature measurement assembly of claim 2, wherein the number of the heat conducting areas is plural, the plural heat conducting areas are circumferentially arranged, each heat conducting area is provided with a detection position, and one end of Wen Ganjian is abutted against the detection position.

4. The temperature measurement assembly of claim 2, wherein the number of the heat conducting areas is one, a first port is formed in the heat conducting areas, a second port is formed in the bearing plate, the second port is arranged corresponding to the first port, and part of Wen Ganjian passes through the first port and the second port.

5. The temperature measurement assembly of claim 1, wherein a plurality of said Wen Ganjian specifically comprises:

One end of the first temperature sensing piece passes through the heat conducting layer and the bearing plate;

the second Wen Ganjian is uniformly arranged around the first temperature sensing piece, and one end of the second temperature sensing piece is propped against the heat conducting layer.

6. The temperature measurement assembly of claim 1, further comprising:

The heat insulation piece is arranged on one side, far away from the bearing plate, of the heat conducting layer, an opening matched with Wen Ganjian is formed in the heat insulation piece, and at least part of Wen Ganjian penetrates through the opening and abuts against the heat conducting layer.

7. The temperature measurement assembly of claim 6 wherein a projection of the thermal shield onto the carrier plate covers a projection of the thermally conductive layer onto the carrier plate.

8. The temperature measurement assembly of claim 1, further comprising:

The bottom shell is arranged on one side of the heat conduction layer away from the bearing plate;

The Wen Ganjian specifically includes:

the elastic support is arranged on the bottom shell and is provided with a temperature sensing body.

9. The temperature measurement assembly of claim 1, further comprising:

The wire coil support is arranged on one side of the heat conduction layer away from the bearing plate, and a heating coil is arranged on the wire coil support;

The Wen Ganjian specifically includes:

The elastic support is arranged on the wire coil support, and a temperature sensing body is arranged on the elastic support.

10. A cooking apparatus, comprising:

A housing;

the temperature measurement assembly of any one of claims 1 to 9;

and the heating coil is arranged on one side of the heat conduction layer in the temperature measuring assembly, which is far away from the bearing plate.

11. Cooking apparatus according to claim 10, characterized in that said housing comprises in particular:

A bottom case;

The upper cover is detachably connected with the bottom shell, the upper cover is connected with the bottom shell to form a containing cavity, and the heat insulation piece of the temperature measuring assembly is arranged in the containing cavity;

wherein, the loading board of temperature measurement subassembly with the upper cover laminating mutually.