CN220904291U - Improved wallboard substrate structure - Google Patents
Improved wallboard substrate structure Download PDFInfo
- Publication number
- CN220904291U CN220904291U CN202321954108.5U CN202321954108U CN220904291U CN 220904291 U CN220904291 U CN 220904291U CN 202321954108 U CN202321954108 U CN 202321954108U CN 220904291 U CN220904291 U CN 220904291U
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- CN
- China
- Prior art keywords
- substrate layer
- utility
- model
- substrate
- honeycomb
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- 239000000758 substrate Substances 0.000 title claims abstract description 51
- 230000004927 fusion Effects 0.000 claims abstract description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 6
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000011090 solid board Substances 0.000 claims description 3
- 238000005187 foaming Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 11
- 239000004743 Polypropylene Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004566 building material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model relates to an improved wallboard substrate structure, which comprises a first substrate layer and a second substrate layer, wherein a honeycomb core plate is arranged between the first substrate layer and the second substrate layer, the honeycomb core plate consists of a plurality of honeycomb units, and the first substrate layer and the second substrate layer are in fusion connection with the honeycomb core plate. The beneficial effects of the utility model are as follows: thermal insulation, sound insulation, light weight and high strength.
Description
Technical Field
The utility model relates to the field of building board structures, in particular to an improved wallboard base material structure.
Background
The existing composite board is formed by a multi-layer structure, and a multi-layer bonding mode is adopted to form the building material. The Chinese patent No. 218876540U discloses a composite plate structure, which adopts 2 mixed layers for compounding, adopts a mixed layer of polypropylene and stone powder and a mixed layer of polypropylene and plant fiber, and the two mixed layers are compounded.
Disclosure of utility model
In order to overcome the defects in the prior art, the utility model provides an improved wallboard substrate structure which is used for paving house decoration wallboards, is used for sound insulation and heat insulation and reducing the weight of wallboards, and is realized by the following technical scheme.
The utility model provides an improved generation wallboard substrate structure, includes first substrate layer and second substrate layer, be provided with the honeycomb core between first substrate layer and the second substrate layer, the honeycomb core comprises a plurality of honeycomb unit, first substrate layer and second substrate layer are connected with the honeycomb core butt fusion.
Further, the first substrate layer is one of a solid board, a calcium carbonate powder board, a glass fiber board or a talcum powder board.
Further, the shape of the honeycomb unit structure is one of a circle, a square, a hexagon, and a diamond.
The beneficial effects of the utility model are as follows: thermal insulation, sound insulation, light weight and high strength.
Drawings
Fig. 1 is a schematic side view of a wallboard substrate construction in accordance with a first embodiment of the present utility model.
Fig. 2 is a schematic side view of a wallboard substrate construction in accordance with a second embodiment of the present utility model.
Fig. 3 is a schematic view of the wallboard substrate structure of the first embodiment of the present utility model.
Fig. 4 is a schematic view of a wallboard substrate structure according to a second embodiment of the present utility model.
Detailed Description
The utility model is further illustrated below with reference to examples, which are only examples of part of the utility model, which are intended to illustrate the utility model and do not limit the scope of the utility model in any way.
As shown in fig. 1 and 3, an improved wallboard substrate structure according to a first embodiment of the present utility model includes a first substrate layer 10 and a second substrate layer 30, between which a honeycomb core plate 20 is disposed, and the honeycomb core plate 20 is composed of a plurality of honeycomb units 21.
As shown in fig. 2 and 4, in a second embodiment of the present utility model, a film layer 40 is optionally coated on the surface of the first substrate layer, and the film layer is a PP film layer, so that the appearance is more attractive.
In embodiments of the utility model, the shape of the honeycomb unit also includes square, diamond, etc. quadrilateral structures.
As shown in fig. 3-4, which is one embodiment of the present utility model, the honeycomb core is made up of a plurality of honeycomb cells having a hexagonal honeycomb shape.
In other embodiments of the utility model, the ultrasonic welding device can be formed by ultrasonic welding of round pipes, and has the same function.
In a first embodiment of the utility model, the first substrate layer comprises a solid board, a calcium carbonate powder filled board, a glass fiber filled board, a talc filled board. And the calcium carbonate powder, the glass fiber or the talcum powder is filled in the middle of the base material, and then an extrusion process is adopted to form the calcium carbonate powder plate, the glass fiber plate or the talcum powder, so that the cost can be saved, the hardness of the first base material layer is improved, and the surface is flat.
In an embodiment of the utility model, the first substrate layer is a solid plate, produced by injection molding.
The second substrate layer is a foaming plate and is produced in an injection molding mode, so that the heat preservation, heat insulation and sound insulation effects are enhanced.
The honeycomb layer adopts honeycomb structure, reduces the materials and simultaneously guarantees intensity, and its material is plastic materials such as PP, PVC, PET.
The materials of the first substrate and the second substrate comprise: plastic materials such as PP, PVC, PET and the like are suitable for an ultrasonic fusion process.
In the embodiment of the utility model, the honeycomb layer is taken as a whole, and the upper surface and the lower surface are respectively welded with the first base material and the second base material by ultrasonic waves to form the wallboard base material.
As shown in fig. 3-4, in a first embodiment of the present utility model, the improved wallboard substrate structure is made by:
Step 1, prefabricating a honeycomb core board through other equipment, wherein the honeycomb core board is provided with an A surface and a B surface, and can be purchased;
Step 2, extruding the second substrate layer to the A surface of the honeycomb core plate, wherein the surface temperature of the second substrate layer is more than 200 ℃ during extrusion, and melting the A surface of the honeycomb core plate through heat transfer to achieve a bonding effect;
Step 3, extruding the first substrate layer to the B surface of the honeycomb core plate, and bonding the first substrate layer and the honeycomb layer in the same step 2;
And 4, when the temperature of the first substrate layer is reduced to 170-180 ℃, the PP film layer is attached to the surface of the first substrate layer, and the welding effect is achieved, so that the PP film layer is covered on the surface of the first substrate layer, and the attractive effect is achieved.
The process for processing the structure of the utility model is simple, only the die is needed to be fixed, and then the structure is finished by ultrasonic welding, thus the process is simple. When a plurality of honeycomb units are stacked, the honeycomb units can form a structure with stable structure, and the honeycomb layers reduce the solid structure, so that the whole honeycomb unit has light weight, high strength of a solid plate, extrusion resistance and sound insulation effect.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (3)
1. The utility model provides an improved generation wallboard substrate structure, includes first substrate layer and second substrate layer, its characterized in that is provided with the honeycomb core between first substrate layer and the second substrate layer, the honeycomb core comprises a plurality of honeycomb unit, first substrate layer and second substrate layer are connected with the honeycomb core butt fusion, first substrate layer is one of solid board, calcium carbonate powder board, glass fiber board or talcum powder board, the second substrate layer is the foaming board.
2. An improved wallboard substrate construction in accordance with claim 1 wherein said honeycomb is one of square, hexagonal, diamond or round in shape.
3. An improved wallboard substrate structure as in claim 1 wherein said first substrate layer is coated with a film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321954108.5U CN220904291U (en) | 2023-07-24 | 2023-07-24 | Improved wallboard substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321954108.5U CN220904291U (en) | 2023-07-24 | 2023-07-24 | Improved wallboard substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220904291U true CN220904291U (en) | 2024-05-07 |
Family
ID=90917624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321954108.5U Active CN220904291U (en) | 2023-07-24 | 2023-07-24 | Improved wallboard substrate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220904291U (en) |
-
2023
- 2023-07-24 CN CN202321954108.5U patent/CN220904291U/en active Active
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| GR01 | Patent grant |