CN220874820U - Solder paste coating device for processing LED lamp strip - Google Patents
Solder paste coating device for processing LED lamp strip Download PDFInfo
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- CN220874820U CN220874820U CN202322493012.XU CN202322493012U CN220874820U CN 220874820 U CN220874820 U CN 220874820U CN 202322493012 U CN202322493012 U CN 202322493012U CN 220874820 U CN220874820 U CN 220874820U
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- solder paste
- scraping
- strip
- coating device
- workbench
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 71
- 239000011248 coating agent Substances 0.000 title claims abstract description 25
- 238000000576 coating method Methods 0.000 title claims abstract description 25
- 238000007790 scraping Methods 0.000 claims abstract description 61
- 230000001680 brushing effect Effects 0.000 claims abstract description 18
- 238000003860 storage Methods 0.000 claims abstract description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 25
- 239000010959 steel Substances 0.000 claims description 25
- 238000005452 bending Methods 0.000 claims description 12
- 230000000694 effects Effects 0.000 description 5
- 239000011324 bead Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 206010063659 Aversion Diseases 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of LED lamp processing, in particular to a solder paste coating device for processing an LED lamp strip, which comprises a workbench, wherein a placing plate is arranged above the workbench, a movable rack is arranged at the rear side of the workbench, a paste brushing component which moves left and right through a driving screw and a guiding polish rod is arranged at the front side of the movable rack, solder paste scraping storage parts matched with the paste brushing component are arranged at two sides of the workbench, the paste brushing component comprises a connecting seat movably connected with the movable rack, a screw rod which is adjusted up and down is arranged at the front side of the connecting seat, a scraper blade which is arranged horizontally is connected below the screw rod, side baffles which are used for gathering solder paste overflowing from two ends of the scraper blade are arranged at two ends of the scraper blade, the side baffles are vertically arranged with the scraper blade, each side baffle comprises a fixing part which is fixed with two ends of the scraper blade, and soft inclined surfaces are arranged at two sides of the fixing part. The problem that the existing solder paste coating device cannot collect solder paste overflowed from two ends of a scraping plate and cannot clean residual solder paste after coating is completed is solved.
Description
Technical Field
The utility model relates to the technical field of LED lamp processing, in particular to a solder paste coating device for LED lamp strip processing.
Background
The LED lamp strip is characterized in that LEDs are assembled on a strip-shaped flexible circuit board or a PCB hard board, the LED lamp strip is named as a strip, because the LED lamp strip has long service life, is very energy-saving and environment-friendly, and gradually reaches the brand-new angle in various decoration industries, in the production process of the LED lamp strip, the solder paste is generally coated onto the circuit board through a steel mesh with holes, then lamp beads are mounted on the corresponding positions of the circuit board coated with the solder paste, the circuit board is heated to harden the solder paste, and the welding of the lamp beads is realized, so that the solder paste coating flow is very important.
Disclosure of utility model
(One) solving the technical problems
Aiming at the defects of the prior art, the utility model provides a solder paste coating device for processing an LED lamp strip, which solves the problems that the existing solder paste coating device can not collect solder paste overflowed from two ends of a scraper and can not clean residual solder paste after coating is finished.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions: the solder paste coating device for processing the LED lamp strip comprises a workbench, wherein a placing plate is arranged above the workbench, a movable rack is arranged at the rear side of the workbench, a paste brushing assembly capable of moving left and right through a driving screw rod and a guiding polished rod is arranged at the front side of the movable rack, and solder paste scraping storage parts matched with the paste brushing assembly are arranged at two sides of the workbench;
The paste brushing assembly comprises a connecting seat movably connected with the movable frame, a screw rod which is adjusted up and down is arranged at the front side of the connecting seat, a scraper which is horizontally arranged is connected below the screw rod, and side baffles which are used for gathering solder paste overflowed from two ends of the scraper are arranged at two ends of the scraper;
The side baffle is perpendicular to the scraping plate, the side baffle comprises fixing parts fixed with two ends of the scraping plate, soft inclined planes are arranged on two sides of the fixing parts, and an included angle between each soft inclined plane and the side wall of the scraping plate is larger than 90 degrees.
Preferably, the solder paste scraping and storing part comprises a receiving groove symmetrically fixed at the left side and the right side of the workbench, an opening is formed at the top of the receiving groove, and a bending scraping strip for scraping residual solder paste on the surface of the scraping plate is arranged above the side wall positioned at the outer side of the receiving groove.
Preferably, the bending scraping strip comprises a connecting strip which is vertically arranged, the top of the connecting strip is provided with a horizontal scraping strip which is vertical to the connecting strip and extends towards the direction of the scraping plate, the end part of the horizontal scraping strip is positioned above the opening of the receiving groove, and the length of the bending scraping strip is larger than that of the scraping plate so as to scrape residual solder paste on the scraping plate and the side baffle plate.
Preferably, the movable frame comprises an upright post vertically arranged at the rear side of the workbench, a fixed plate is arranged at the front side of the upright post, and the paste brushing component is movably connected to the front side of the fixed plate.
Preferably, the left end and the right end of the placing plate are fixedly connected with the side wall of the solder paste scraping storage part, and the top surface of the placing plate and the width of the placing plate are smaller than the width of the steel mesh so that the two side walls of the steel mesh extend to the upper part of the opening of the receiving groove.
Preferably, the outside of placing the board is equipped with the activity fixed part that is used for fixed steel mesh, and activity fixed part is a plurality of, evenly distributed and is fixed in the lateral wall around placing the board, is equipped with movable bolt on the activity fixed part, and the movable bolt bottom is equipped with the circular preforming that contacts with the steel mesh.
(III) beneficial effects
Compared with the prior art, the utility model provides a solder paste coating device for processing an LED lamp strip, which has the following beneficial effects:
When the side baffles are arranged at the two ends of the scraping plate to scrape the solder paste in the left-right direction of the scraping plate, the solder paste can move towards the two ends of the scraping plate, and the side baffles collect the solder paste to be overflowed towards the direction of the scraping plate, so that the situation that the solder paste on the surface of the steel mesh is less and less to cause coating leakage is avoided.
Meanwhile, after the coating of the solder paste is finished, the solder paste brushing component is adjusted to horizontally move to the solder paste scraping storage part, the soft inclined surface is extruded and opened to two sides, and the soft inclined surface is attached to the side face of the horizontal scraping strip, so that the solder paste bonded on the scraping plate and the soft inclined surface is scraped into the receiving groove through the bending scraping strip, and the cleaning and the collection of the solder paste are realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic diagram of the whole structure of a solder paste coating device according to the utility model;
FIG. 2 is a schematic view of a brush paste assembly according to the present utility model;
FIG. 3 is a schematic view of the side dam structure of the present utility model mated with a squeegee;
Fig. 4 is a schematic diagram of a structure of a solder paste scraping and storing part and a structure of a placing plate according to the utility model.
Reference numerals illustrate:
1. A work table;
2. Placing a plate; 21. a movable fixing part; 211. a movable bolt; 212. round tabletting;
3. a movable frame; 31. a column; 32. a fixing plate;
4. A brushing paste component; 41. a connecting seat; 42. a scraper; 43. side baffles; 431. a fixing part; 432. a soft inclined plane;
5. A solder paste scraping and storing part; 51. a receiving groove; 52. bending the scraping strip; 521. horizontal scraping strips.
Detailed Description
The following detailed description of embodiments of the present application will be given with reference to the accompanying drawings and examples, by which the implementation process of how the present application can be applied to solve the technical problems and achieve the technical effects can be fully understood and implemented.
Fig. 1-4 show an embodiment of the utility model, a solder paste coating device for processing an LED lamp strip, comprising a workbench 1, a placing plate 2 for placing a steel mesh is arranged above the workbench 1, a movable frame 3 is arranged at the rear side of the workbench 1, a paste brushing component 4 which can move left and right through a driving screw and a guiding polished rod is arranged at the front side of the movable frame 3, solder paste scraping storage parts 5 matched with the paste brushing component 4 are arranged at two sides of the workbench 1, in actual work, a circuit board is placed on the placing plate 2, the steel mesh is pressed above the circuit board and is attached to the circuit board, the solder paste is placed on the steel mesh, the solder paste is coated on the surface of the steel mesh through the paste brushing component 4, and the solder paste falls on the circuit board through holes on the steel mesh;
The paste brushing assembly 4 comprises a connecting seat 41 movably connected with the movable frame 3, a screw rod which is adjusted up and down is arranged at the front side of the connecting seat 41, a scraper 42 which is horizontally arranged is connected below the screw rod, two ends of the scraper 42 are provided with side baffles 43 which are used for gathering the solder paste overflowed from two ends of the scraper 42, in actual work, the scraper 42 is lowered by the screw rod to enable the scraper 42 to be in contact with the surface of a steel mesh, the front side of the movable frame 3 is provided with a driving screw rod and a guiding polished rod to realize left and right movement of the whole paste brushing assembly 4, the effect that the scraper 42 scrapes the solder paste on the surface of the steel mesh is achieved, and when the solder paste is scraped in the left and right directions of the scraper 42, the side baffles 43 can collect the solder paste which overflows to the direction of the scraper 42 at the moment;
the side baffle 43 is perpendicular to the scraper 42, the side baffle 43 comprises a fixing part 431 fixed at two ends of the scraper 42, soft inclined planes 432 are arranged at two sides of the fixing part 431, the included angle between each soft inclined plane 432 and the side wall of the scraper 42 is larger than 90 degrees, when the solder paste at two ends of the scraper 42 is collected, the soft inclined planes 432 push the solder paste towards the scraper 42, the soft inclined planes 432 are symmetrically arranged, and when the left side and the right side of the scraper 42 move, the solder paste is scraped.
The solder paste scraping and storing part 5 comprises a receiving groove 51 symmetrically fixed on the left side and the right side of the workbench 1, an opening is formed in the top of the receiving groove 51, a bending scraping strip 52 used for scraping residual solder paste on the surface of the scraper 42 is arranged above the side wall located on the outer side of the receiving groove 51, the bending scraping strip 52 comprises a connecting strip which is vertically arranged, a horizontal scraping strip 521 which is perpendicular to the connecting strip and extends towards the scraper 42 is arranged on the top of the connecting strip, the end part of the horizontal scraping strip 521 is located above the opening of the receiving groove 51, the length of the bending scraping strip 52 is larger than that of the scraper 42 so as to realize the scraping and the storing of the solder paste remained on the scraper 42 and the side baffle 43, after the solder paste coating is finished, the brush paste component 4 is adjusted to horizontally move to the solder paste scraping and storing part 5, the scraper 42 is close to the bending scraping strip 52, at the moment, the soft inclined surface 432 is opened towards the two ends and the side face 432 is attached to the side face of the horizontal scraping strip 521, and then the scraper 42 is adjusted upwards so that the solder paste adhered on the soft inclined surface 432 is scraped into the receiving groove 51, and the solder paste is cleaned and collected.
The movable frame 3 comprises an upright post 31 vertically arranged at the rear side of the workbench 1, a fixed plate 32 is arranged at the front side of the upright post 31, and the brush paste component 4 is movably connected at the front side of the fixed plate 32, so that the stability of the brush paste component 4 during working is ensured.
The left end and the right end of the placing plate 2 are fixedly connected with the side wall of the solder paste scraping storage part 5, the top surface of the placing plate 2 and the width of the placing plate 2 are smaller than the width of the steel mesh, so that the two side walls of the steel mesh extend to the upper side of the opening of the receiving groove 51, after the solder paste coating is finished, when the scraping plate 42 horizontally moves to the two ends of the steel mesh, redundant solder paste on the steel mesh can be pushed into the receiving groove 51 by the scraping plate 42.
The outside of placing the board 2 is equipped with the movable fixing part 21 that is used for fixed steel mesh, and movable fixing part 21 is a plurality of, evenly distributed and be fixed in the lateral wall around placing the board 2, is equipped with movable bolt 211 on the movable fixing part 21, and the movable bolt 211 bottom is equipped with the circular preforming 212 that contacts with the steel mesh, adjusts movable fixing part 21 through the staff, is fixed in placing the board 2 top with the steel mesh to sticis the circuit board between steel mesh and placing the board 2, avoid the circuit board to take place the aversion condition when the coating work goes on.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A solder paste coating device for LED lamp area processing, includes workstation (1), and workstation (1) top is equipped with places board (2), its characterized in that: the rear side of the workbench (1) is provided with a movable rack (3), the front side of the movable rack (3) is provided with a paste brushing component (4) which moves left and right through a driving screw and a guiding polished rod, and two sides of the workbench (1) are provided with a solder paste scraping storage part (5) matched with the paste brushing component (4);
The paste brushing assembly (4) comprises a connecting seat (41) movably connected with the movable frame (3), a screw rod which is adjusted up and down is arranged at the front side of the connecting seat (41), a scraper (42) which is horizontally arranged is connected below the screw rod, and side baffles (43) which are used for gathering solder paste overflowed from two ends of the scraper (42) are arranged at two ends of the scraper (42);
the side baffle (43) is perpendicular to the scraping plate (42), the side baffle (43) comprises fixing parts (431) fixed to two ends of the scraping plate (42), soft inclined planes (432) are arranged on two sides of the fixing parts (431), and an included angle between each soft inclined plane (432) and the side wall of the scraping plate (42) is larger than 90 degrees.
2. The solder paste coating device for processing an LED strip of claim 1, wherein: the solder paste scraping and storing part (5) comprises a receiving groove (51) symmetrically fixed on the left side and the right side of the workbench (1), the top of the receiving groove (51) is provided with an opening, and a bending scraping strip (52) for scraping residual solder paste on the surface of the scraping plate (42) is arranged above the side wall outside the receiving groove (51).
3. The solder paste coating device for processing an LED strip of claim 2, wherein: the bending scraping strip (52) comprises a connecting strip which is vertically arranged, a horizontal scraping strip (521) which is perpendicular to the connecting strip and extends towards the direction of the scraping plate (42) is arranged at the top of the connecting strip, the end part of the horizontal scraping strip (521) is located above the opening of the bearing groove (51), and the length of the bending scraping strip (52) is larger than that of the scraping plate (42) so as to scrape residual solder paste on the scraping plate (42) and the side baffle (43).
4. The solder paste coating device for processing an LED strip of claim 1, wherein: the movable frame (3) comprises an upright post (31) vertically arranged on the rear side of the workbench (1), a fixed plate (32) is arranged on the front side of the upright post (31), and the paste brushing assembly (4) is movably connected to the front side of the fixed plate (32).
5. The solder paste coating device for processing an LED strip of claim 1, wherein: the left end and the right end of the placing plate (2) are fixedly connected with the side wall of the solder paste scraping storage part (5), the width of the top surface of the placing plate (2) and the width of the placing plate (2) are smaller than the width of the steel mesh, and the two side walls of the steel mesh extend to the upper part of the opening of the receiving groove (51).
6. The solder paste coating device for processing an LED strip of claim 1, wherein: the outside of placing board (2) is equipped with movable fixed part (21) that are used for fixed steel mesh, and movable fixed part (21) are a plurality of, evenly distributed and are fixed in the lateral wall around placing board (2), are equipped with movable bolt (211) on movable fixed part (21), and movable bolt (211) bottom is equipped with circular preforming (212) that contact with the steel mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322493012.XU CN220874820U (en) | 2023-09-14 | 2023-09-14 | Solder paste coating device for processing LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322493012.XU CN220874820U (en) | 2023-09-14 | 2023-09-14 | Solder paste coating device for processing LED lamp strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220874820U true CN220874820U (en) | 2024-04-30 |
Family
ID=90810793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322493012.XU Active CN220874820U (en) | 2023-09-14 | 2023-09-14 | Solder paste coating device for processing LED lamp strip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220874820U (en) |
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2023
- 2023-09-14 CN CN202322493012.XU patent/CN220874820U/en active Active
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