CN220871168U - Semiconductor refrigeration knapsack suitable for plant material collects - Google Patents
Semiconductor refrigeration knapsack suitable for plant material collects Download PDFInfo
- Publication number
- CN220871168U CN220871168U CN202322721657.4U CN202322721657U CN220871168U CN 220871168 U CN220871168 U CN 220871168U CN 202322721657 U CN202322721657 U CN 202322721657U CN 220871168 U CN220871168 U CN 220871168U
- Authority
- CN
- China
- Prior art keywords
- semiconductor refrigeration
- temperature
- plant material
- inclusion
- heat dissipation
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 61
- 238000005057 refrigeration Methods 0.000 title claims abstract description 60
- 239000000463 material Substances 0.000 title claims abstract description 24
- 238000004321 preservation Methods 0.000 claims abstract description 8
- 239000011229 interlayer Substances 0.000 claims description 13
- 238000009413 insulation Methods 0.000 claims description 11
- 239000010410 layer Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 210000002268 wool Anatomy 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 21
- 241000886569 Cyprogenia stegaria Species 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 229920000642 polymer Polymers 0.000 description 3
- 229920000742 Cotton Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 229920004933 Terylene® Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
Abstract
The utility model discloses a semiconductor refrigeration knapsack suitable for collecting plant materials, and relates to the technical field of plant material preservation. The utility model mainly aims to solve the problems that the existing plant material collecting device cannot conveniently keep the plant fresh and leads to desiccation and rot of the plant due to water loss, and provides the following technical scheme: the semiconductor refrigeration assembly comprises a heat dissipation base, a semiconductor refrigeration sheet, heat dissipation fins, a temperature control heat dissipation fan and a heat dissipation fan shell, a temperature and humidity sensor is arranged in the enclosure, the semiconductor refrigeration assembly is connected with an inner cavity of the enclosure, a display control board is further arranged on the outer surface of the enclosure, and the display control board is respectively in communication connection with the semiconductor refrigeration assembly and the temperature and humidity sensor. The utility model automatically cools when the temperature in the bag is sensed to be higher, displays the temperature in the bag in real time, utilizes the semiconductor for refrigeration, is light, energy-saving and convenient to carry, and ensures the freshness of plant materials to the greatest extent.
Description
Technical Field
The utility model relates to the technical field of plant material preservation, in particular to a semiconductor refrigeration knapsack suitable for plant material collection.
Background
The collection of the rural plant material in the field is an important link of the introduction research of the rural plant, and can provide rich physical materials for the research of the geographical distribution, ecological adaptability and the like of the rural plant. The plant material collection time is mostly in late spring or early autumn, and the weather is relatively hot at this moment, gathers plant material and carries about, easily appears losing water and dry up or rotting scene, leads to the unable research work that is used for of plant, consequently this patent is to plant material's fresh-keeping, has provided a semiconductor refrigeration knapsack suitable for plant material collects.
Disclosure of utility model
The utility model aims to provide a semiconductor refrigeration knapsack suitable for collecting plant materials, which solves the problems that the existing plant material collecting device cannot conveniently keep the plant fresh, and the plant is dehydrated and dried up and rotten.
The technical scheme for solving the technical problems is as follows:
The utility model provides a semiconductor refrigeration knapsack suitable for plant material collects, it includes the inclusion, set up a plurality of semiconductor refrigeration subassemblies at the inclusion side, be used for keeping the heat preservation interlayer of inclusion temperature, semiconductor refrigeration subassembly includes the heat dissipation base, control by temperature change heat dissipation fan and semiconductor refrigeration piece, the heat dissipation base is connected with the inclusion, semiconductor refrigeration piece is connected with the heat dissipation base, the control by temperature change heat dissipation fan is connected with semiconductor refrigeration piece, be equipped with temperature and humidity inductor in the inclusion, semiconductor refrigeration subassembly is connected with the inner chamber of inclusion, the inclusion surface still is equipped with the display control board, the display control board respectively with semiconductor refrigeration subassembly and temperature and humidity inductor communication connection.
The beneficial effects of adopting above-mentioned technical scheme are: according to the utility model, the semiconductor refrigeration assembly arranged on the backpack body can cool the backpack when the temperature in the backpack is high, the control board arranged on the backpack and the temperature and humidity sensor in the backpack can automatically control and cool the backpack when the temperature in the backpack is high is sensed, the temperature in the backpack is displayed in real time, and the heat preservation interlayer arranged in the backpack can keep the temperature in the backpack at a low temperature, so that the aim of plant preservation is fulfilled.
Further, the semiconductor refrigeration assembly further comprises a heat dissipation fan shell and heat dissipation fins, wherein the heat dissipation fins are arranged between the temperature control heat dissipation fan and the semiconductor refrigeration fins, and the heat dissipation fan shell is buckled outside the heat dissipation base.
Further, the heat insulation interlayer comprises a pearl cotton heat insulation layer and an aluminum film reflecting layer.
Further, the semiconductor refrigeration assembly is powered using a mobile power source.
Further, the number of semiconductor refrigeration modules is 4.
The utility model has the following beneficial effects:
According to the utility model, the semiconductor refrigeration assembly arranged on the backpack body can cool the backpack when the temperature in the backpack is high, the control board arranged on the backpack and the temperature and humidity sensor in the backpack can automatically control and cool the backpack when the temperature in the backpack is high is sensed, the temperature in the backpack is displayed in real time, and the heat preservation interlayer arranged in the backpack can keep the temperature in the backpack at a low temperature, so that the aim of plant preservation is fulfilled. The utility model adopts knapsack type design, utilizes semiconductor refrigeration, is light, saves energy and is convenient to carry. The temperature of the semiconductor refrigeration knapsack can be set to be 4-10 ℃, so that the freshness of plant materials is ensured to the greatest extent.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a cross-sectional view of the present utility model;
Fig. 3 is a structural exploded view of the semiconductor refrigeration assembly.
The reference numerals shown in fig. 1 to 3 are respectively expressed as: 1-a bag body; 2-semiconductor refrigeration assembly; 3-insulating interlayer; 4-a heat dissipation base; 5-semiconductor refrigerating sheets; 6-radiating fins; 7-a temperature-control radiating fan; 8-a heat dissipation fan housing; 9, a temperature and humidity sensor; 10-display control panel; 11-mobile power supply placing bag.
Detailed Description
The following description of the embodiments of the present utility model will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present utility model, based on the embodiments of the present utility model.
Referring to fig. 1-2, the utility model provides a semiconductor refrigeration knapsack suitable for collecting plant materials, which comprises a knapsack body 1, a semiconductor refrigeration assembly 2 and a heat insulation interlayer 3, wherein the semiconductor refrigeration assembly 2 is arranged on the side surface of the knapsack body 1, the semiconductor refrigeration assembly 2 is used for refrigerating and cooling the inside of the knapsack body, the heat insulation interlayer 3 is arranged in the interlayer of the knapsack body 1, and the heat insulation interlayer 3 is used for keeping the temperature of the knapsack body 1.
Referring to fig. 3, the semiconductor refrigeration assembly 2 includes a heat dissipation base 4, a semiconductor refrigeration sheet 5, heat dissipation fins 6, a temperature control heat dissipation fan 7 and a heat dissipation fan housing 8, a temperature and humidity sensor 9 is disposed in the enclosure 1, a display control board 10 is further disposed on the outer surface of the enclosure 1, the temperature and humidity sensor 9 is used for sensing the temperature and humidity inside the enclosure 1, and transmitting sensed data to the display control board 10 for display, the semiconductor refrigeration assembly 2 is connected with the inner cavity of the enclosure 1, and is used for conveying cold air generated by the semiconductor refrigeration assembly 2 into the enclosure 1, the display control board 10 is respectively in communication connection with the semiconductor refrigeration assembly 2 and the temperature and humidity sensor 9, and the communication connection mode includes WiFi, bluetooth, 4G or 5G connection.
The shell fabric of the bag body 1 comprises a heat insulation interlayer 3, a PU terylene shell fabric, a high polymer propylene p plate and non-woven fabrics, wherein the heat insulation interlayer 3 comprises a pearl cotton heat insulation layer and a reflecting layer aluminum film. The heat insulation interlayer 3 is used for keeping the internal temperature of the bag body 1 in a lower range and preventing cold air from running outside.
The semiconductor refrigeration assembly 2 can be powered by a mobile power supply, and is embedded on a high polymer acrylic p guard plate, and the total number of the semiconductor refrigeration assembly is four.
The bag body 1 further comprises a mobile power supply placing bag 11 arranged on the side face of the bag body 1, the mobile power supply placing bag 11 is used for placing a mobile power supply, and a charging port of the semiconductor refrigeration assembly 2 is embedded in a high polymer propylene p guard plate, so that power supply to the semiconductor refrigeration assembly 2 is facilitated.
The implementation steps of the utility model are as follows:
After the port of the semiconductor refrigeration assembly 2 is plugged into the charging port of the mobile power supply, a switch of the integrated display panel controller is turned on, the temperature required by the setting interface is set, the semiconductor refrigeration assembly operates to cool the inside of the bag body 1, and the temperature and the humidity in the current bag are automatically displayed after the display panel exits from the setting interface.
The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.
Claims (5)
1. A semiconductor refrigeration backpack suitable for collection of plant material, comprising: inclusion (1), set up a plurality of semiconductor refrigeration subassembly (2) of inclusion (1) side, be used for keeping inclusion (1) temperature's heat preservation interlayer (3), semiconductor refrigeration subassembly (2) are including radiating base (4), semiconductor refrigeration piece (5) and control by temperature change radiator fan (7), radiating base (4) with inclusion (1) are connected, semiconductor refrigeration piece (5) with radiating base (4) are connected, control by temperature change radiator fan (7) with semiconductor refrigeration piece (5) are connected, be equipped with temperature and humidity inductor (9) in inclusion (1), semiconductor refrigeration subassembly (2) with the inner chamber of inclusion (1) is connected, inclusion (1) surface still is equipped with display control board (10), display control board (10) respectively with semiconductor refrigeration subassembly (2) with temperature and humidity inductor (9) communication connection.
2. The semiconductor refrigeration backpack suitable for plant material collection according to claim 1, wherein the semiconductor refrigeration assembly (2) further comprises a heat dissipating fan housing (8) and heat dissipating fins (6), the heat dissipating fins (6) are arranged between the temperature-controlled heat dissipating fan (7) and the semiconductor refrigeration fins (5), and the heat dissipating fan housing (8) is fastened to the outside of the heat dissipating base (4).
3. The semiconductor refrigeration backpack suitable for plant material collection according to claim 1, wherein the insulation layer (3) comprises a pearl wool insulation layer and an aluminum film reflective layer.
4. The semiconductor refrigeration backpack suitable for plant material collection according to claim 1, wherein the semiconductor refrigeration assembly (2) is powered using a mobile power source.
5. The semiconductor refrigeration backpack suitable for plant material collection according to claim 4, wherein the number of semiconductor refrigeration components (2) is 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322721657.4U CN220871168U (en) | 2023-10-08 | 2023-10-08 | Semiconductor refrigeration knapsack suitable for plant material collects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322721657.4U CN220871168U (en) | 2023-10-08 | 2023-10-08 | Semiconductor refrigeration knapsack suitable for plant material collects |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220871168U true CN220871168U (en) | 2024-04-30 |
Family
ID=90817809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322721657.4U Active CN220871168U (en) | 2023-10-08 | 2023-10-08 | Semiconductor refrigeration knapsack suitable for plant material collects |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220871168U (en) |
-
2023
- 2023-10-08 CN CN202322721657.4U patent/CN220871168U/en active Active
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| GR01 | Patent grant |