CN220858775U - Radiator with double-deck water-cooling structure - Google Patents
Radiator with double-deck water-cooling structure Download PDFInfo
- Publication number
- CN220858775U CN220858775U CN202322466813.7U CN202322466813U CN220858775U CN 220858775 U CN220858775 U CN 220858775U CN 202322466813 U CN202322466813 U CN 202322466813U CN 220858775 U CN220858775 U CN 220858775U
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- China
- Prior art keywords
- water
- cooling
- double
- cooling box
- utility
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 88
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 32
- 238000003466 welding Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 101100272964 Arabidopsis thaliana CYP71B15 gene Proteins 0.000 description 3
- 101150030164 PADI3 gene Proteins 0.000 description 3
- 102100035734 Protein-arginine deiminase type-3 Human genes 0.000 description 3
- 230000004907 flux Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010273 cold forging Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a radiator with a double-layer water-cooling structure, which comprises a water-cooling plate, wherein a spring screw is arranged at the top of the water-cooling plate, a PAD is arranged at the bottom of the water-cooling plate, a chip is arranged at the bottom of the PAD, the inside of the water-cooling plate is provided with the double-layer water-cooling structure, the double-layer water-cooling structure is composed of a first water-cooling box, a second water-cooling box, a water inlet pipe, a water outlet pipe and a connecting pipe, the first water-cooling box is connected with the second water-cooling box through the connecting pipe, the water outlet pipe is welded at the top of the first water-cooling box, and the water inlet pipe is welded at one end of the second water-cooling box. According to the utility model, the microchannel flow passage is made into a double-layer structure, so that the water-cooling heat exchange flow passage is lengthened in a space with a fixed size, the heat exchange area of the water-cooling plate is increased, and the overall heat dissipation efficiency is improved.
Description
Technical Field
The utility model relates to the field of heat dissipation of electronic products, in particular to a radiator with a double-layer water cooling structure.
Background
Along with the rapid development of the electronic product market, in order to meet the rapid calculation requirement of the market, the heating power of the chip is increased while the calculation capability is improved, the heat density of the chip is too high, the conventional air cooling heat dissipation can not meet the heat dissipation requirement of the high-power chip, and a water cooling system with better heat dissipation efficiency is adopted to meet the requirement. When the heat flux density of the chip is overlarge, the conventional copper pipe runner, the machining runner, the die casting runner, the cold forging runner and the relieved tooth micro-runner cannot meet the heat dissipation requirement, and the optimized lifting is needed on the basis of the relieved tooth micro-runner with good performance so as to meet the heat dissipation requirement of the chip with high heat flux density.
Disclosure of utility model
The present utility model is directed to solving the problems of the prior art by providing a heat sink with a double-layer water-cooling structure.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a radiator with double-deck water-cooling structure, includes the water-cooling board, spring screw is installed at the top of water-cooling board, PAD is installed to the bottom of water-cooling board, the chip is installed to the bottom of PAD, the inside of water-cooling board is equipped with double-deck water-cooling structure.
As a preferable technical scheme of the utility model, the double-layer water cooling structure consists of a first water cooling box, a second water cooling box, a water inlet pipe, a water outlet pipe and a connecting pipe.
As a preferable technical scheme of the utility model, the first water-cooling box and the second water-cooling box are connected through a connecting pipe.
As a preferable technical scheme of the utility model, the top of the first water cooling box is welded with a water outlet pipe, and one end of the second water cooling box is welded with a water inlet pipe.
The beneficial effects of the utility model are as follows: according to the utility model, the microchannel flow passage is made into a double-layer structure, so that the water-cooling heat exchange flow passage is lengthened in a space with a fixed size, the heat exchange area of the water-cooling plate is increased, and the overall heat dissipation efficiency is improved.
Drawings
FIG. 1 is a schematic view of a disassembled structure of the present utility model;
FIG. 2 is a schematic diagram of a double-layer water-cooling structure inside a water-cooling plate according to the present utility model.
In the figure: spring screw 1, water-cooling board 2, PAD3, chip 4, first water-cooling box 21, second water-cooling box 22, inlet tube 23, outlet pipe 24, connecting pipe 25.
Detailed Description
The preferred embodiments of the present utility model will be described in detail below with reference to the attached drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model.
Examples: referring to fig. 1-2, the present utility model provides a technical solution: the utility model provides a radiator with double-deck water-cooling structure, includes water-cooling board 2, and spring screw 1 is installed at the top of water-cooling board 2, and PAD3 is installed to the bottom of water-cooling board 2, and chip 4 is installed to the bottom of PAD3, and the inside of water-cooling board 2 is equipped with double-deck water-cooling structure.
The double-layer water cooling structure is composed of a first water cooling box 21, a second water cooling box 22, a water inlet pipe 23, a water outlet pipe 24 and a connecting pipe 25.
The first water-cooling box 21 and the second water-cooling box 22 are connected through a connecting pipe 25.
The top of the first water cooling box 21 is welded with a water outlet pipe 24, and one end of the second water cooling box 22 is welded with a water inlet pipe 23.
Working principle: the utility model provides a radiator with double-deck water-cooling structure, including water-cooling board 2, the inside first water-cooling box 21 of adoption of water-cooling board 2 and second water-cooling box 22 constitute, link to each other through connecting pipe 25 between first water-cooling box 21 and the second water-cooling box 22, cold water enters into water-cooling board 2 through inlet tube 23, cool down through the cooling runner in the water-cooling board 2, then enter into the second water-cooling box 22 through connecting pipe 25, cool down through the runner in the second water-cooling box 22, adopt first water-cooling box 21 and second water-cooling box 22 to increase the length of water-cooling heat transfer runner, thereby promote water-cooling board heat transfer area, promote whole radiating efficiency.
According to the utility model, the microchannel flow passage is made into a double-layer structure, so that the water-cooling heat exchange flow passage is lengthened in a space with a fixed size, the heat exchange area of the water-cooling plate is increased, and the overall heat dissipation efficiency is improved.
The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.
Claims (4)
1. The utility model provides a radiator with double-deck water-cooling structure, includes water-cooling board (2), its characterized in that: the top of water-cooling board (2) is installed spring screw (1), PAD (3) are installed to the bottom of water-cooling board (2), chip (4) are installed to the bottom of PAD (3), the inside of water-cooling board (2) is equipped with double-deck water-cooling structure.
2. A radiator having a double-layer water-cooling structure according to claim 1, wherein: the double-layer water cooling structure is composed of a first water cooling box (21), a second water cooling box (22), a water inlet pipe (23), a water outlet pipe (24) and a connecting pipe (25).
3. A radiator having a double-layer water-cooling structure according to claim 2, wherein: the first water cooling box (21) and the second water cooling box (22) are connected through a connecting pipe (25).
4. A radiator having a double-layer water-cooling structure according to claim 2, wherein: the top of first water-cooling box (21) is welded with outlet pipe (24), the one end welding of second water-cooling box (22) has inlet tube (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322466813.7U CN220858775U (en) | 2023-09-12 | 2023-09-12 | Radiator with double-deck water-cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322466813.7U CN220858775U (en) | 2023-09-12 | 2023-09-12 | Radiator with double-deck water-cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220858775U true CN220858775U (en) | 2024-04-26 |
Family
ID=90783940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322466813.7U Active CN220858775U (en) | 2023-09-12 | 2023-09-12 | Radiator with double-deck water-cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220858775U (en) |
-
2023
- 2023-09-12 CN CN202322466813.7U patent/CN220858775U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |