CN220854927U - Test burning seat for packaged chip - Google Patents
Test burning seat for packaged chip Download PDFInfo
- Publication number
- CN220854927U CN220854927U CN202322115264.9U CN202322115264U CN220854927U CN 220854927 U CN220854927 U CN 220854927U CN 202322115264 U CN202322115264 U CN 202322115264U CN 220854927 U CN220854927 U CN 220854927U
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- test
- upper cover
- cover plate
- base
- sliding
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- 238000012360 testing method Methods 0.000 title claims abstract description 108
- 238000010438 heat treatment Methods 0.000 claims abstract description 29
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 6
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013522 software testing Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a test burning seat for a packaged chip, which comprises a test main board, wherein a test base is arranged on the outer wall of the top of the test main board, a clamping side plate is respectively arranged on one side wall of the test base, a movable clamping shaft is connected to the clamping side plate in a sliding way, the test chip is placed in a chip test interface on the test base, then an upper cover plate is turned over, then the upper cover plate is pressed downwards, when the upper cover plate passes over a sliding press block, the sliding press block ejects the upper cover plate to limit the upper cover plate, meanwhile, a heating mechanism can press the test chip, and then a pressing screw is screwed down, so that the sliding press block can drive the upper cover plate to move downwards, the pressing force of the heating mechanism on the upper cover plate on the chip is regulated, the test lower effect of chips with different thicknesses is guaranteed, and after the test is finished, an auxiliary pull rod is pulled, the sliding press block does not limit the upper cover plate, so that the upper cover plate can be separated from the test base conveniently and rapidly, and the use convenience of the device is improved.
Description
Technical Field
The utility model particularly relates to a test burning seat for a packaged chip, and belongs to the technical field of chip testing.
Background
Electronic devices, such as tablet computers, servers, indoor telecommunications, outdoor telecommunications, industrial computers, high performance computing data centers, copiers, digital cameras, smart phones, control systems, automated teller machines, etc., typically employ electronic components packaged with chips to increase functionality and component density, and when performing data retention capability measurements on packaged chips, it is often necessary to obtain failure rate data at multiple temperatures, to obtain failure data at multiple temperatures, it is often necessary to move the chip into an oven for heating, and when writing data on the chip, it is necessary to write on a tester, such that the chip needs to be moved back and forth between the oven and the test station, which is very inconvenient.
The retrieved China patent CN216412143U discloses a test burning seat for a packaged chip, which comprises the following components: the base is provided with a chip interface matched with the target test chip; an upper flip cover hinged with the base; the heating device is arranged between the base and the upper flip cover, and one of two surfaces of the heating device, which are oppositely arranged, is matched with the back surface of the target test chip, and the other surface is matched with the upper flip cover. The test burning seat for the packaged chip provided by the utility model can realize in-situ heating and testing of the packaged chip, and improves the testing efficiency and the testing automation degree.
However, the above-mentioned prior art can realize the normal position heating and the test of encapsulation chip when using, improves efficiency of software testing and test degree of automation, but it can not adjust heating device to the clamp force of test chip, therefore can produce certain difference to the heating test effect of different thickness chips, and above-mentioned prior art also can not convenient and fast with base and flip looks joint and break away from.
Disclosure of utility model
The utility model aims to overcome the defects of the prior art, and provides a test burning seat for a packaged chip, which can realize in-situ heating and testing of the tested chip through a heating device, can adjust the pressing force on the tested chip, ensures that the chip test data with different thicknesses cannot have overlarge difference, and can conveniently and rapidly clamp and separate an upper cover from a base.
The utility model realizes the purpose through the following technical scheme that the test burning seat for the packaged chip comprises a test main board, wherein a test base is arranged on the top outer wall of the test main board, clamping side plates are respectively arranged on one side wall of the test base, movable clamping shafts are in sliding clamping connection on the clamping side plates, connecting rods are arranged on the side walls of the movable clamping shafts, an upper cover plate is arranged on one side wall of the connecting rods, a clamping base is arranged on the top outer wall of the test base, clamping grooves are formed in the clamping base, a sliding pressing block and a sliding I-shaped block are respectively and movably clamped on the clamping grooves, a first supporting spring is arranged on one side wall of the sliding pressing block, limiting plates are respectively arranged on two side walls of the sliding I-shaped block, a connecting top plate is arranged on the top outer wall of the connecting rods, a pressing screw is arranged on the connecting top plate, and a third supporting spring is arranged on the bottom inner wall of the clamping base.
Furthermore, in order to keep parallel with the test base when the upper cover plate is pressed down, a positioning block is arranged on the outer wall of the top of the test main board, and a positioning groove is formed in the upper cover plate.
Further, in order to heat the test chip, the use convenience of the base is improved, a heating mechanism is arranged on the upper cover plate, and four supporting springs are respectively arranged on the heating mechanism.
Further, in order to provide an upward supporting force for the upper cover plate, the balance type upper cover plate pressing down is improved, and the second supporting springs are respectively arranged on the outer wall of the top of the test base.
Furthermore, in order to guide the second supporting spring, the second supporting spring is prevented from bending when being compressed, and the spring guide rods are movably clamped on the test base respectively.
Further, in order to be in the in-process of upper cover plate pushing down, can further prevent the upper cover plate with produce the slope between the test base, install spacing respectively on the both sides wall of test base, spacing curb plate is installed respectively to the both sides wall of upper cover plate.
Further, in order to facilitate manual pulling of the sliding press block by a worker, the upper cover plate is conveniently separated from the test base, and an auxiliary pull rod is arranged on one side wall of the sliding press block.
Further, in order to facilitate the pressing down process of the upper cover plate, the sliding pressing block can smoothly pass through the upper cover plate, and a guide angle is formed in the sliding pressing block.
The utility model has the technical effects and advantages that: through placing the chip test interface on test base with test chip in, then overturn the upper cover plate, press down the upper cover plate then, when the upper cover plate passed over the slip briquetting, the slip briquetting pops out and carries out spacingly to the upper cover plate, simultaneously heating mechanism can press test chip, push down the screw through twisting down afterwards for the slip briquetting can drive the upper cover plate and move down, thereby adjust the hold-down force of heating mechanism on the upper cover plate to the chip, be favorable to guaranteeing the test of different thickness chips and effect down, after the test is accomplished, through pulling auxiliary pull rod, make the slip briquetting no longer carry out spacingly to the upper cover plate, thereby make the separation of upper cover plate and test base that can convenient and fast, be favorable to improving the device's convenience of use.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a spring guide bar according to the present utility model;
FIG. 3 is a schematic view of a clamping side plate according to the present utility model;
Fig. 4 is an enlarged schematic view of the structure of the present utility model at a.
In the figure: 1. testing a main board; 2. a test base; 3. clamping the side plates; 4. a movable clamping shaft; 5. a connecting rod; 6. an upper cover plate; 7. a heating mechanism; 8. the base is clamped; 9. a clamping groove; 10. a sliding pressing block; 11. sliding the I-shaped block; 12. a limiting plate; 13. a first supporting spring; 14. connecting a top plate; 15. pressing down the screw; 16. a second supporting spring; 17. a spring guide rod; 18. a positioning groove; 19. a positioning block; 20. a limit bar; 21. a limit side plate; 22. an auxiliary pull rod; 23. a third supporting spring; 24. a supporting spring IV; 25. guide angle.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, a test burning seat for packaged chips comprises a test main board 1, a test base 2 is arranged on the top outer wall of the test main board 1, a chip test interface is arranged on the test base 2, a clamping side plate 3 is respectively arranged on one side wall of the test base 2, a movable clamping shaft 4 is slidably clamped on the clamping side plate 3, a sliding groove is arranged on the clamping side plate 3, the movable clamping shaft 4 is slidably clamped with the clamping side plate 3 through the sliding groove, a connecting rod 5 is arranged on the side wall of the movable clamping shaft 4, an upper cover plate 6 is arranged on one side wall of the connecting rod 5, a clamping base 8 is arranged on the top outer wall of the test base 2, a clamping groove 9 is arranged on the clamping base 8, a sliding pressing block 10 and a sliding I-shaped block 11 are movably clamped on the clamping groove 9, a supporting spring 13 is arranged on one side wall of the sliding pressing block 10, limiting plates 12 are respectively arranged on two side walls of the sliding I-shaped block 11, a connecting top plate 14 is arranged on the top outer wall of the connecting rod 5, a pressing screw 15 is arranged on the connecting top plate 14, a supporting spring III 23 is arranged on the bottom inner wall of the clamping base 8, the limiting plates 12 are driven to upwards prop against the sliding press block 10 by the supporting springs III 23, a positioning block 19 is arranged on the top outer wall of the supporting spring III 23 test main board 1, a positioning groove 18 is arranged on the upper cover plate 6, a heating mechanism 7 is arranged on the upper cover plate 6, supporting springs IV 24 are respectively arranged on the heating mechanism 7, when the heating mechanism 7 presses a test chip, the heating mechanism 7 can be prevented from pressing the test chip through the supporting springs IV 24, the chip to be tested is firstly placed in a chip test interface on the test base 2, the upper cover plate 6 is parallel to the surface of the test base 2 by overturning the upper cover plate 6, through pushing down upper cover plate 6, can keep parallelism with test base 2 when guaranteeing upper cover plate 6 to push down with locating piece 19 joint, when upper cover plate 6 passes over slip briquetting 10, drive slip briquetting 10 through supporting spring one 13 and pop out and carry out spacingly to upper cover plate 6, thereby accomplish the quick joint of test base 2 and upper cover plate 6, simultaneously, heating mechanism 7 also can press test chip, through screwing down push screw 15, make it drive upper cover plate 6 downwardly moving through slip briquetting 10, can adjust the clamping force of heating mechanism 7 on upper cover plate 6 to the chip, thereby be favorable to guaranteeing the effect of the test of different thickness chips, finally, heat through heating mechanism 7, with test chip performance, after the test is accomplished, through pulling slip briquetting 10, make it no longer spacing to upper cover plate 6, make upper cover plate 6 and test base 2 can convenient separation, thereby the convenience of use of the device can be improved.
The second supporting springs 16 are respectively arranged on the outer walls of the top of the test base 2, and the second supporting springs 16 provide an upward supporting force for the upper cover plate 6, so that the balance type upper cover plate 6 is improved during pressing. The test base 2 is respectively movably clamped with a spring guide rod 17, and the second support spring 16 is guided by the spring guide rod 17 to prevent the second support spring 16 from bending when being compressed. The two side walls of the test base 2 are respectively provided with a limiting strip 20, the two side walls of the upper cover plate 6 are respectively provided with a limiting side plate 21, and the upper cover plate 6 is clamped with the limiting strips 20 through the limiting side plates 21 in the pressing process of the upper cover plate 6, so that the upper cover plate 6 is further prevented from tilting when being pressed down.
An auxiliary pull rod 22 is arranged on one side wall of the sliding press block 10, and the sliding press block 10 is manually pulled by a worker through the auxiliary pull rod 22, so that the upper cover plate 6 is conveniently separated from the test base 2. The guide angle 25 is formed on the sliding press block 10, and the guide angle 25 is beneficial to facilitating the pressing down of the upper cover plate 6, so that the sliding press block 10 can be smoothly passed through.
When the device is used, a test chip is placed in a chip test interface on the test base 2, then the upper cover plate 6 is turned over to enable the test chip to be parallel to the test base 2, then the upper cover plate 6 is pressed downwards to clamp the positioning groove 18 with the positioning block 19, meanwhile, when the upper cover plate 6 passes over the sliding press block 10, the first supporting spring 13 drives the sliding press block 10 to pop up to limit the upper cover plate 6, the quick clamping of the test base 2 and the upper cover plate 6 is completed, meanwhile, the heating mechanism 7 can press the test chip, then the sliding press block 10 can drive the upper cover plate 6 to move downwards through screwing the pressing screw 15, so that the pressing force of the heating mechanism 7 on the upper cover plate 6 on the chip is adjusted, the test lower effect of chips with different thicknesses is guaranteed, then the heating mechanism 7 is used for heating, the performance of the test chip is tested, and after the test is completed, the sliding press block 10 does not limit the upper cover plate 6 any more through pulling the auxiliary pull rod 22, so that the upper cover plate 6 and the test base 2 can be separated conveniently and rapidly, and the use convenience of the device is improved.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (8)
1. The utility model provides a encapsulation chip test burn-in seat, includes test mainboard (1), its characterized in that: the test main board (1) is characterized in that a test base (2) is arranged on the outer wall of the top of the test main board (1), a clamping side plate (3) is respectively arranged on one side wall of the test base (2), a movable clamping shaft (4) is connected to the clamping side plate (3) in a sliding mode, a connecting rod (5) is arranged on the side wall of the movable clamping shaft (4), an upper cover plate (6) is arranged on one side wall of the connecting rod (5), a clamping base (8) is arranged on the outer wall of the top of the test base (2), a clamping groove (9) is formed in the clamping base (8), a sliding pressing block (10) and a sliding I-shaped block (11) are respectively movably clamped on the clamping groove (9), a supporting spring I (13) is arranged on one side wall of the sliding pressing block (10), a limiting plate (12) is respectively arranged on two side walls of the sliding I-shaped block (11), a connecting top plate (14) is arranged on the outer wall of the top of the connecting rod (5), a pressing screw (15) is arranged on the connecting plate (14), and a top plate (23) is arranged on the bottom of the clamping base (8).
2. The packaged chip test burn-in socket of claim 1, wherein: the top outer wall of the test main board (1) is provided with a positioning block (19), and the upper cover board (6) is provided with a positioning groove (18).
3. The packaged chip test burn-in socket of claim 1, wherein: the upper cover plate (6) is provided with a heating mechanism (7), and the heating mechanism (7) is respectively provided with a support spring IV (24).
4. The packaged chip test burn-in socket of claim 1, wherein: and a second supporting spring (16) is respectively arranged on the outer wall of the top of the test base (2).
5. The packaged chip test burn-in socket of claim 1, wherein: the test base (2) is respectively movably clamped with a spring guide rod (17).
6. The packaged chip test burn-in socket of claim 1, wherein: limiting strips (20) are respectively arranged on two side walls of the test base (2), and limiting side plates (21) are respectively arranged on two side walls of the upper cover plate (6).
7. The packaged chip test burn-in socket of claim 1, wherein: an auxiliary pull rod (22) is arranged on one side wall of the sliding press block (10).
8. The packaged chip test burn-in socket of claim 1, wherein: the sliding press block (10) is provided with a guide angle (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322115264.9U CN220854927U (en) | 2023-08-08 | 2023-08-08 | Test burning seat for packaged chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322115264.9U CN220854927U (en) | 2023-08-08 | 2023-08-08 | Test burning seat for packaged chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220854927U true CN220854927U (en) | 2024-04-26 |
Family
ID=90774494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322115264.9U Active CN220854927U (en) | 2023-08-08 | 2023-08-08 | Test burning seat for packaged chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220854927U (en) |
-
2023
- 2023-08-08 CN CN202322115264.9U patent/CN220854927U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |