CN220821523U - Wafer adsorption device - Google Patents

Abstract

The utility model provides a wafer adsorption device, which comprises a wafer bearing plate, wherein an adsorption groove is formed in one side of the wafer bearing plate, which bears a wafer, and comprises an outer ring, an inner ring and a communication groove, wherein the outer ring and the inner ring are communicated through the communication groove; the wafer bearing plate is provided with a hollowed-out part, and the hollowed-out part extends from one side edge of the wafer bearing plate to the inner side of the inner ring; an internal air channel is arranged in the wafer bearing plate, the adsorption groove is communicated with the internal air channel, and the adsorption groove is communicated to an air channel outside the wafer bearing plate through the internal air channel; the wafer adsorption device is convenient to fix the wafer through the amorphous wafer adsorption area of the fixed wafer bearing plate, so that the upper side and the lower side of the wafer borne by the wafer bearing plate can accommodate corresponding detection equipment, and the wafer adsorption device can be suitable for more types of detection equipment.

Description

Wafer adsorption device

Technical Field

The utility model belongs to the field of semiconductor equipment, and particularly relates to a wafer adsorption device.

Background

Wafers are the basic unit of semiconductor material processing and are the key components in the fabrication of integrated circuits, wherein wafer suction devices play a key role in both holding and positioning. The wafer adsorption device realizes firm adsorption and stable positioning of the wafer by applying negative pressure on the surface of the wafer so as to ensure that the position of the wafer is kept unchanged in the process.

In the partial wafer inspection process, it is necessary to inspect the wafer in a specific environment, for example, in a magnetic field environment to inspect the performance of the wafer. The existing wafer adsorption device mostly has larger thickness due to the existence of the air channel, and parts in the detection equipment are difficult to approach the bottom of the wafer, so that corresponding detection environments cannot be realized, for example, the wafer cannot be in a stronger vertical magnetic field, and further cannot be used in partial wafer detection.

The above information disclosed in the background section is only for enhancement of understanding of the background of the utility model and therefore may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.

Disclosure of utility model

The utility model provides a wafer adsorption device, which aims at solving the technical problem that the existing wafer adsorption device cannot be used for detecting partial wafers, and comprises a wafer bearing plate, wherein one side of the wafer bearing plate bearing the wafers is provided with an adsorption groove, the adsorption groove comprises an outer ring, an inner ring and a communication groove, and the outer ring and the inner ring are communicated through the communication groove; the wafer bearing plate is provided with a hollowed-out part, and the hollowed-out part extends from one side edge of the wafer bearing plate to the inner side of the inner ring; the inside of wafer loading board is provided with inside gas circuit, the adsorption tank with inside gas circuit intercommunication, the adsorption tank is through inside gas circuit intercommunication to the outside gas circuit of wafer loading board.

Preferably, the inner gas path communicates with the outer ring.

Further preferably, the inner gas path communicates with the outer ring from both sides of the outer ring.

Preferably, the outer ring, the inner ring and the hollowed-out part are symmetrically arranged along the same plane respectively.

Preferably, a space is arranged between the adsorption groove and the hollowed-out part.

Preferably, the internal gas path comprises a first path and a second path, the first path is communicated with a gas path outside the wafer bearing plate, and two extension ends of the first path extend to two sides of the hollowed-out part respectively; the two second passages extend from the extending ends of the first passages to the outer ring respectively and are communicated with the adsorption groove; the second passage communicates with the first passage.

Further preferably, the first via is disposed along a first plane, the second via is disposed along a second plane, the first plane and the second plane are respectively parallel to a plane of the wafer carrying plate carrying the wafer, and a space is disposed between the first plane and the second plane.

Further preferably, the diameter of the first passageway is greater than the diameter of the second passageway.

The utility model has at least the following beneficial effects: the outer ring and the inner ring form a more uniform low-pressure area, so that the stress of the wafer is more uniform, and the wafer is prevented from being damaged; the hollowed-out part is arranged to reduce the volume of the wafer bearing plate, so that the wafer bearing plate is light and the detection equipment is closer to the wafer; the wafer adsorption device is convenient to fix the wafer through the amorphous wafer adsorption area of the fixed wafer bearing plate, so that the upper side and the lower side of the wafer borne by the wafer bearing plate can accommodate corresponding detection equipment, and the wafer adsorption device can be suitable for more types of detection equipment.

Drawings

Fig. 1 is a schematic overall structure of one possible embodiment of the present utility model.

Fig. 2 is another view of the embodiment of fig. 1.

Fig. 3 is a cross-sectional view of a first plane of one possible embodiment of the utility model.

Fig. 4 is a cross-sectional view of a second plane of one possible embodiment of the utility model.

Detailed Description

In order to make the objects and features of the present utility model more comprehensible, embodiments accompanied with figures are described in detail below. It should be noted that the drawings are in a very simplified form and use non-precise ratios for convenience and clarity in assisting in the description of embodiments of the utility model.

The present utility model provides a wafer adsorption device, which comprises a wafer carrier plate 100, fig. 1 shows a specific form of the wafer carrier plate 100, in addition, the wafer carrier plate 100 may also be in the form of a wafer carrier, a sample stage, or other shapes, and generally, a relatively flat carrier surface is required to be provided at a position where a wafer is carried. The wafer carrying plate 100 is provided with an adsorption groove 110 on one side carrying the wafer, the adsorption groove 110 is open on one side close to the wafer, and the opening can be shielded by the wafer carried by the wafer carrying plate 100, so that gas entering the adsorption groove 110 through a gap between the wafer and the wafer carrying plate 100 is approximately isolated. The inside of the wafer carrier plate 100 is provided with an internal air channel 130, the adsorption groove 110 is communicated with the internal air channel 130, and the adsorption groove 110 is communicated to the air channel outside the wafer carrier plate 100 through the internal air channel 130, so that the adsorption groove 110 is pumped through the internal air channel 130 to reduce the air pressure of the adsorption groove 110 during use, and then a pressure difference is formed between two surfaces of a wafer, so that the wafer is pressed on the wafer carrier plate 100 by the air pressure, and the wafer is fixed. The adsorption tank 110 includes an outer ring 111, an inner ring 112, and a communication tank 113, and the outer ring 111 and the inner ring 112 are communicated with each other through the communication tank 113. The outer ring 111 and the inner ring 112 form a more uniform low-pressure area, so that the stress of the wafer is more uniform, and the wafer is prevented from being damaged. The wafer carrier 100 is further provided with a hollowed-out portion 120, and the hollowed-out portion 120 extends from one side edge of the wafer carrier 100 to the inner side of the inner ring 112, so that on one hand, the volume of the wafer carrier 100 can be reduced, and further, the wafer carrier is light, on the other hand, in some cases, the lower part of the wafer is exposed or the thickness of the carrier assembly is reduced, so that the detection device is closer to the wafer, a corresponding detection environment is conveniently created at the position of the wafer to be detected, for example, a pole head generating a vertical magnetic field can be made to be close to the upper side and the lower side of the wafer; through the form of wafer loading board 100, be convenient for through the fixed wafer loading board 100 the fixed wafer of non-wafer adsorption area realization to the upside, the downside of the wafer that make wafer loading board 100 bear can both hold corresponding check out test set, thereby make this wafer adsorption equipment can be applicable to more types of check out test set, and realize better detection effect. The gas flow and pressure in the internal gas path 130 and the adsorption tank 110 are controlled by external equipment, so that whether the wafer is fixed and the fixed strength are conveniently adjusted, and the operation is convenient.

For the communication manner of the internal gas path 130 with the adsorption tank 110, according to one implementation shown in fig. 1 to 4, the internal gas path 130 communicates with the outer ring 111. More specifically, to make the pressure in the adsorption tank 110 more uniform, the inner gas path 130 communicates with the outer ring 111 from both sides of the outer ring 111. In addition, the arrangement mode enables two mutually independent communication structures to be arranged between the internal gas circuit 130 and the adsorption groove 110, so that the condition that the internal gas circuit 130 cannot be communicated with the adsorption groove 110 due to gas circuit blockage can be reduced, and the stability and reliability of corresponding equipment in the use process are improved. When the gas channel on one side is blocked, the other side can still provide gas supply, so that the normal operation of the system is ensured.

Referring to fig. 1 and fig. 2, as an alternative embodiment, the outer ring 111, the inner ring 112, and the hollow portion 120 may be symmetrically disposed along the same plane, so as to form a more regular structure of the wafer carrier 100.

Referring to fig. 1 and 2, in order to ensure stable pressure in the adsorption tank 110 and reduce the amount of gas entering the adsorption tank 110 when adsorbing wafers, the adsorption tank 110 and the wafer to be adsorbed can form a substantially closed space, and more specifically, a space can be provided between the adsorption tank 110 and the hollowed-out portion 120, so as to avoid the communication of a partial area of the adsorption tank 110 to the outside of the wafer carrier 100 caused by the hollowed-out portion 120.

Referring to fig. 2 to fig. 4, the internal air channel 130 includes a first channel 131 and a second channel 132, the first channel 131 is communicated with an air channel outside the wafer carrier 100, and for a specific communication mode, an air valve 140 may be disposed at a junction between the first channel 131 and the wafer carrier 100, so as to control a communication condition between the external air channel and the internal air channel 130, and further adjust an adsorption state of the adsorption tank 110. The two extending ends of the first passage 131 extend to two sides of the hollowed-out portion 120 respectively, so as to ensure that the first passage 131 is positioned inside the wafer carrying plate 100 and ensure that the wafer carrying plate 100 has enough strength; two second passages 132 extend from the extending ends of the first passages 131 toward the outer ring 111, respectively, and communicate with the adsorption tank 110; the second passage 132 communicates with the first passage 131.

Referring to fig. 3 and 4, the first via 131 may be disposed along a first plane, and fig. 4 illustrates a cross-sectional view of the wafer carrier 100 along the first plane, wherein a particular form of the first via 131 is illustrated; the second passages 132 are disposed along a second plane, and fig. 3 illustrates a cross-sectional view of the wafer carrier plate 100 along the second plane, wherein a particular form of the second passages 132 is shown. In order to facilitate processing and ensure that the wafer carrier 100 has sufficient strength, the first plane and the second plane are respectively parallel to the wafer carrying plane of the wafer carrier, and a space is provided between the first plane and the second plane. In this case, the first passage 131 and the second passage 132 may be communicated through a connection hole provided between the first plane and the second plane.

The diameter of the first passage 131 is larger than the diameter 132 of the second passage, on the basis, because the first passage 131 has a larger sectional area than the second passage 132, a larger passage can be provided for a larger amount of gas circulation, and when the first passage 131 is communicated with an external gas passage and is used for exhausting by means of external air exhausting equipment, the gas in the pipeline can be more effectively sucked away, and a higher air exhausting effect can be realized; the second passage 132 has a smaller cross-sectional area, thereby increasing the gas passing speed and decreasing the pressure, and can enhance the suction force of the suction groove 110, so that it can more effectively suck and fix the wafer.

The foregoing has outlined and described the basic principles, features, and advantages of the present utility model in order that the present utility model may be practiced in other embodiments that depart from these specific details. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, but rather that the foregoing embodiments and description illustrate only the principles of the utility model, and that the utility model is susceptible to various equivalent changes and modifications without departing from the spirit and scope of the utility model, all of which are intended to be within the scope of the utility model as hereinafter claimed.

Claims (8)

1. The utility model provides a wafer adsorption equipment which characterized in that: the wafer suction device comprises a wafer bearing plate, wherein an adsorption groove is formed in one side of the wafer bearing plate, which bears a wafer, the adsorption groove comprises an outer ring, an inner ring and a communication groove, and the outer ring and the inner ring are communicated through the communication groove; the wafer bearing plate is provided with a hollowed-out part, and the hollowed-out part extends from one side edge of the wafer bearing plate to the inner side of the inner ring; the inside of wafer loading board is provided with inside gas circuit, the adsorption tank with inside gas circuit intercommunication, the adsorption tank is through inside gas circuit intercommunication to the outside gas circuit of wafer loading board.

2. A wafer chucking apparatus as recited in claim 1, wherein: the inner air passage is in communication with the outer ring.

3. A wafer chucking apparatus as recited in claim 2, wherein: the inner air passage is communicated with the outer ring from two sides of the outer ring.

4. A wafer chucking apparatus as recited in claim 1, wherein: the outer ring, the inner ring and the hollowed-out part are symmetrically arranged along the same plane respectively.

5. A wafer chucking apparatus as recited in claim 1, wherein: and a space is arranged between the adsorption groove and the hollowed-out part.

6. A wafer chucking apparatus as recited in claim 1, wherein: the internal gas circuit comprises a first passage and a second passage, the first passage is communicated with a gas circuit outside the wafer bearing plate, and two extending ends of the first passage extend towards two sides of the hollowed-out part respectively; the two second passages extend from the extending ends of the first passages to the outer ring respectively and are communicated with the adsorption groove; the second passage communicates with the first passage.

7. The wafer chucking apparatus of claim 6, wherein: the first via is arranged along a first plane, the second via is arranged along a second plane, the first plane and the second plane are respectively parallel to the plane of the wafer bearing plate bearing the wafer, and a space is arranged between the first plane and the second plane.

8. The wafer chucking apparatus of claim 6, wherein: the diameter of the first passageway is greater than the diameter of the second passageway.