CN220820173U - Chip detection device of semiconductor detector - Google Patents

Chip detection device of semiconductor detector Download PDF

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Publication number
CN220820173U
CN220820173U CN202322545924.7U CN202322545924U CN220820173U CN 220820173 U CN220820173 U CN 220820173U CN 202322545924 U CN202322545924 U CN 202322545924U CN 220820173 U CN220820173 U CN 220820173U
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China
Prior art keywords
chip
workbench
chips
semiconductor
box body
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CN202322545924.7U
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Chinese (zh)
Inventor
邹长广
蔡志宏
褚明辉
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Wuhan Wanying Semiconductor Technology Co ltd
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Wuhan Wanying Semiconductor Technology Co ltd
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Abstract

The utility model discloses a chip detection device of a semiconductor detector, which comprises a 匚 -type workbench, wherein a sampling disc for placing a semiconductor chip is rotatably arranged on the workbench, an adjusting mechanism for driving the sampling disc to rotate is arranged on the workbench, the adjusting mechanism comprises a supporting seat arranged on the workbench, a rotating rod is rotatably arranged on the supporting seat, the top of the rotating rod is connected with a chassis, and the sampling disc is arranged on the chassis; the inner annular array of the sampling disc is provided with a plurality of chips to be detected, the sampling disc is driven to rotate by the adjusting mechanism, the air cylinder drives the detection camera to transversely move, the chips at the central position can be detected firstly, then, the peripheral chips are detected sequentially, and finally, the outermost chips are detected sequentially, so that the chips can be detected sequentially, the detection results of the chips are recorded, and the speed and the accuracy of chip detection are improved.

Description

Chip detection device of semiconductor detector
Technical Field
The utility model relates to the technical field of semiconductor detectors, in particular to a chip detection device of a semiconductor detector.
Background
A semiconductor detector is a detector fabricated using semiconductor materials for detecting and measuring electromagnetic radiation, particles, or other physical quantities. The semiconductor material can realize signal conversion and amplification by utilizing special properties of the semiconductor material, such as energy structure, carrier movement and the like. The basic principle of a semiconductor detector is that charged particles generate electron-hole pairs in the sensitive volume of the semiconductor detector, which drift under the influence of an external electric field to output a signal.
Through searching, the patent with the application number 201821337195.9 discloses a semiconductor chip detection device, which comprises a shell and a detection device, wherein the detection device is arranged in the shell and comprises a base and a lifting column, the lifting column is arranged at the center of the base, a movable seat, a probe fixing plate and a probe are arranged on the lifting column, the movable seat and the probe fixing plate are detachably arranged at the top end of the lifting column, the probe is arranged at the bottom of the probe fixing plate, an annular groove is arranged on the surface of the base, a carrying plate is arranged in the groove in a clamping manner, the carrying plate is in an annular shape, and the bottom of the carrying plate is connected with a plurality of springs which are fixedly connected with the base; the detection device provided by the utility model has the advantages of simple structure and convenience in use, and can effectively reduce the damage rate of the chip during detection, improve the detection efficiency and reduce the detection cost.
In the prior art, when detecting (semiconductor detector) chips, most of the chips can be detected only one at a time, frequent chip picking and placing are needed, and the detection efficiency of the semiconductor chips is greatly reduced, so that a chip detection device of the semiconductor detector is needed.
Disclosure of utility model
The utility model aims to provide a chip detection device of a semiconductor detector, wherein a plurality of chips to be detected are arranged in an annular array in a sampling disc, a sampling disc is driven to rotate by an adjusting mechanism, a detection camera is driven to transversely move by a cylinder, the chips at the central position can be detected firstly, then a circle of chips at the periphery are detected sequentially, finally, the chips at the outermost periphery are detected sequentially, the detection of the plurality of chips can be realized sequentially, the detection results of the chips are recorded, and the speed and the accuracy of chip detection are improved, so that the problems in the background technology are solved.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the chip detection device of the semiconductor detector comprises a 匚 -type workbench, wherein a sampling disc for placing a semiconductor chip is rotatably arranged on the workbench, an adjusting mechanism for driving the sampling disc to rotate is arranged on the workbench, the adjusting mechanism comprises a supporting seat arranged on the workbench, a rotating rod is rotatably arranged on the supporting seat, the top of the rotating rod is connected with a chassis, and the sampling disc is arranged on the chassis;
The top of workstation has seted up the through-hole, the inside slidable mounting of through-hole has the box body, the inside of box body is equipped with the detection camera that is used for detecting chip surface defect, the detection camera is located the top of sampling plate.
Preferably, the adjusting mechanism further comprises an annular seat fixed on the workbench, and a motor for driving the rotating rod to rotate is arranged on the side part of the annular seat.
Preferably, one end of an output shaft of the motor is connected with a rotating shaft, a first bevel gear is sleeved on the outer wall of one end of the rotating shaft, a second bevel gear is sleeved on the outer wall of the rotating rod, and the first bevel gear is meshed with the second bevel gear.
Preferably, the top of annular seat inlays the ball that is equipped with a plurality of roll settings, the recess has been seted up to the bottom of chassis, the ball rolls the inside of installing at the recess.
Preferably, an air cylinder is arranged on the inner side wall of the workbench, and one end of a piston rod of the air cylinder is connected to one side of the box body.
Preferably, the top of box body rotates and installs the lid, install the compact heap that is used for contradicting at detecting the camera top on the lid, the compact heap is established to the silastic piece.
Preferably, the slider is installed to the lateral part upper end of box body, the spout has been seted up to the inner wall of through-hole, slider slidable mounting is in the inside of spout.
Compared with the prior art, the utility model has the beneficial effects that:
The inner annular array of the sampling disc is provided with a plurality of chips to be detected, the sampling disc is driven to rotate by the adjusting mechanism, the air cylinder drives the detection camera to transversely move, the chips at the central position can be detected firstly, then, the peripheral chips are detected sequentially, and finally, the outermost chips are detected sequentially, so that the chips can be detected sequentially, the detection results of the chips are recorded, and the speed and the accuracy of chip detection are improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the structure of the cartridge, the inspection camera and the cylinder of the present utility model;
FIG. 3 is a schematic view of the structure of the adjusting mechanism of the present utility model;
fig. 4 is a schematic view of the structure of the chassis and the groove of the present utility model.
In the figure: 1. a work table; 2. an adjusting mechanism; 21. an annular seat; 22. a motor; 23. a rotating shaft; 24. a first bevel gear; 25. a support base; 26. a rotating rod; 27. a second bevel gear; 28. a chassis; 281. a groove; 29. a ball; 3. a sampling plate; 4. a through hole; 5. a case body; 51. a box cover; 52. a compaction block; 6. detecting a camera; 7. a display screen; 8. and (3) a cylinder.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the chip detection device of the semiconductor detector comprises a 匚 -type workbench 1, a sampling disc 3 for placing semiconductor chips is rotatably arranged on the workbench 1, particularly, a containing groove (not shown in the figure) is formed in the inner bottom of the sampling disc 3, the semiconductor chips are placed in the containing groove, a plurality of groups of semiconductor chips are arranged on the semiconductor chips, each group of semiconductor chips are arranged in an annular array, an adjusting mechanism 2 for driving the sampling disc 3 to rotate is arranged on the workbench 1, the adjusting mechanism 2 comprises a supporting seat 25 arranged on the workbench 1, a rotating rod 26 is rotatably arranged on the supporting seat 25, the supporting seat 25 can ensure the stability of the rotating process of the rotating rod 26, a chassis 28 is connected to the top of the rotating rod 26, and the sampling disc 3 is arranged on the chassis 28; the surface of the chassis 28 is provided with an embedded groove, the inner diameter of the embedded groove is equal to the outer diameter of the sampling disc 3, the sampling disc 3 is clamped in the embedded groove, the stability of the sampling disc 3 is ensured, and the sampling disc 3 is prevented from flying out due to centrifugal action in the rotation process.
The through-hole 4 of bar has been seted up at the top of workstation 1, and the inside slidable mounting of through-hole 4 has box body 5, and the inside of box body 5 is equipped with the detection camera 6 that is used for detecting chip surface defect, and detection camera 6 is located the top of sampling dish 3.
One side of the workbench 1 is provided with a display screen 7, the detection camera 6 is in signal connection with the display screen 7, and data detected by the detection camera 6 can be displayed on the display screen 7, so that a inspector can intuitively acquire the data.
After the detection is finished, processing and analyzing the data by using professional analysis software or algorithm according to the data measured by the instrument, and explaining the defect degree of the chip according to the result of data analysis.
Semiconductor detectors generally include any one of several detectors:
Silicon photodiode: silicon photodiodes are a common type of photodetector that can operate in the visible and near infrared spectral ranges. The method has high sensitivity and quick response time, and is suitable for detecting optical signals in 850nm wave bands.
Selenium-cadmium-sulfur photoresistor: a photoresistor is a photosensitive material that can sense optical signals in the near infrared spectral range. The device has higher sensitivity and wider wavelength response range, and is suitable for detecting optical signals in 850nm wave bands.
Silicon photomultiplier: the silicon photomultiplier is a high-gain and high-sensitivity photoelectric detector and is suitable for detecting low light intensity. The device can work in visible light and near infrared spectrum ranges, and is suitable for detecting optical signals in 850nm wave bands.
Infrared focal plane array (IRFPA): an infrared focal plane array is an array of a plurality of infrared detectors that can detect optical signals at a plurality of points simultaneously. The method is suitable for image detection in the near infrared spectrum range, and can realize comprehensive scanning and analysis of chip samples.
The adjusting mechanism 2 further comprises an annular seat 21 fixed on the workbench 1, a motor 22 for driving a rotating rod 26 to rotate is arranged on the side part of the annular seat 21, and the motor 22 is a stepping motor.
One end of an output shaft of the motor 22 is connected with a rotating shaft 23, a first bevel gear 24 is sleeved on the outer wall of one end of the rotating shaft 23, a second bevel gear 27 is sleeved on the outer wall of the rotating rod 26, and the first bevel gear 24 is meshed with the second bevel gear 27.
The motor 22 drives the rotating shaft 23 to rotate, the rotating shaft 23 drives the rotating rod 26 to rotate through the first bevel gear 24 and the second bevel gear 27, the rotating rod 26 drives the chassis 28 to rotate, and then the chassis 28 drives the sampling disc 3 to rotate, and under the coordination of the transverse movement of the detection camera 6 and the rotation of the sampling disc 3, the omnibearing detection of chips to be detected can be realized, and a plurality of chips are detected one by one.
The top of annular seat 21 inlays the ball 29 that is equipped with a plurality of roll settings, and recess 281 has been seted up to the bottom of chassis 28, and ball 29 roll installs in the inside of recess 281, guarantees the stability when chassis 28 is rotatory.
An air cylinder 8 is arranged on the inner side wall of the workbench 1, one end of a piston rod of the air cylinder 8 is connected to one side of the box body 5, and the air cylinder 8 pushes the box body 5 to move.
The top of box body 5 rotates and installs lid 51, installs the compact heap 52 that is used for contradicting at the detection camera 6 top on the lid 51, and compact heap 52 is established to the silastic piece, and compact heap 52 has spacing effect to detection camera 6, makes it keep stable in the inside of box body 5.
The slider is installed to the lateral part upper end of box body 5, and the spout has been seted up to the inner wall of through-hole 4, and slider slidable mounting is in the inside of spout.
When the chip to be detected is placed in the sampling disc 3, the sampling disc 3 is placed in the chassis 28, then the cylinder 8 drives the box body 5 to drive the detection camera 6 to move to the position above the center of the chassis 28, meanwhile, the detection camera 6 is continuously driven to transversely move and the sampling disc 3 is driven to rotate, specifically, the motor 22 drives the rotating shaft 23 to rotate, the rotating shaft 23 drives the rotating rod 26 to rotate through the first bevel gear 24 and the second bevel gear 27, the rotating rod 26 drives the chassis 28 to rotate, the chassis 28 drives the sampling disc 3 to rotate, the omnibearing detection of the chip to be detected can be realized under the cooperation of the transverse movement of the detection camera 6 and the rotation of the sampling disc 3, a plurality of chips can be detected one by one according to the circumferential sequence, data detected each time are displayed on the display screen 7 and recorded, and the detected data are analyzed and calculated, and the defect degree of the chip is judged, namely, the chip is judged to be a good product. Incomplete products are also waste products.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The chip detection device of a kind of semiconductor detector, including the work level (1) of 匚 type, its characteristic lies in: the semiconductor chip sampling device is characterized in that a sampling disc (3) for placing a semiconductor chip is rotatably arranged on the workbench (1), an adjusting mechanism (2) for driving the sampling disc (3) to rotate is arranged on the workbench (1), the adjusting mechanism (2) comprises a supporting seat (25) arranged on the workbench (1), a rotating rod (26) is rotatably arranged on the supporting seat (25), the top of the rotating rod (26) is connected with a chassis (28), and the sampling disc (3) is arranged on the chassis (28);
through-hole (4) have been seted up at the top of workstation (1), the inside slidable mounting of through-hole (4) has box body (5), the inside of box body (5) is equipped with and is used for detecting chip surface defect's detection camera (6), detection camera (6) are located the top of sampling dish (3).
2. The device for chip inspection of a semiconductor probe of claim 1, wherein: the adjusting mechanism (2) further comprises an annular seat (21) fixed on the workbench (1), and a motor (22) for driving the rotating rod (26) to rotate is arranged on the side part of the annular seat (21).
3. The device for chip inspection of a semiconductor probe of claim 2, wherein: one end of an output shaft of the motor (22) is connected with a rotating shaft (23), a first bevel gear (24) is sleeved on the outer wall of one end of the rotating shaft (23), a second bevel gear (27) is sleeved on the outer wall of the rotating rod (26), and the first bevel gear (24) is meshed with the second bevel gear (27).
4. A chip inspection apparatus of a semiconductor probe according to claim 3, wherein: the top of annular seat (21) is inlayed and is equipped with a plurality of balls (29) of rolling setting, recess (281) have been seted up to the bottom of chassis (28), ball (29) rolling installation is in the inside of recess (281).
5. The device for chip inspection of a semiconductor probe of claim 1, wherein: an air cylinder (8) is arranged on the inner side wall of the workbench (1), and one end of a piston rod of the air cylinder (8) is connected to one side of the box body (5).
6. The device for chip inspection of a semiconductor probe of claim 1, wherein: the top of box body (5) rotates installs lid (51), install compact heap (52) that are used for contradicting at detecting camera (6) top lid (51), compact heap (52) are established to the silastic piece.
7. The device for chip inspection of a semiconductor probe of claim 1, wherein: the sliding block is installed at the upper end of the side part of the box body (5), the sliding groove is formed in the inner wall of the through hole (4), and the sliding block is slidably installed in the sliding groove.
CN202322545924.7U 2023-09-19 2023-09-19 Chip detection device of semiconductor detector Active CN220820173U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322545924.7U CN220820173U (en) 2023-09-19 2023-09-19 Chip detection device of semiconductor detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322545924.7U CN220820173U (en) 2023-09-19 2023-09-19 Chip detection device of semiconductor detector

Publications (1)

Publication Number Publication Date
CN220820173U true CN220820173U (en) 2024-04-19

Family

ID=90705670

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322545924.7U Active CN220820173U (en) 2023-09-19 2023-09-19 Chip detection device of semiconductor detector

Country Status (1)

Country Link
CN (1) CN220820173U (en)

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