CN220814354U - Connecting node structure of sandwich heat-insulating wallboard and parapet - Google Patents
Connecting node structure of sandwich heat-insulating wallboard and parapet Download PDFInfo
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- CN220814354U CN220814354U CN202322208937.5U CN202322208937U CN220814354U CN 220814354 U CN220814354 U CN 220814354U CN 202322208937 U CN202322208937 U CN 202322208937U CN 220814354 U CN220814354 U CN 220814354U
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- parapet
- top surface
- board
- outer leaf
- wallboard
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- 238000004321 preservation Methods 0.000 claims abstract description 35
- 239000000565 sealant Substances 0.000 claims abstract description 16
- 239000004570 mortar (masonry) Substances 0.000 claims abstract description 13
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 12
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000009413 insulation Methods 0.000 claims description 30
- 239000003513 alkali Substances 0.000 claims description 6
- 239000004744 fabric Substances 0.000 claims description 6
- 239000003365 glass fiber Substances 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
- 238000005336 cracking Methods 0.000 abstract description 12
- 239000011324 bead Substances 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004026 adhesive bonding Methods 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- 238000011065 in-situ storage Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010009 beating Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
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- Building Environments (AREA)
Abstract
The utility model discloses a sandwich heat-insulating wallboard and parapet connecting node structure, which comprises: the sandwich heat-insulating wallboard comprises an outer leaf plate, an inner wallboard and a heat-insulating plate clamped between the outer leaf plate and the inner wallboard; parapet, parapet side is perpendicular to be equipped with the board of encorbelmenting, and the board of encorbelmenting is located heated board top surface and outer leaf top surface, is connected through first sealant between board bottom surface and the outer leaf top surface of encorbelmenting, and board top surface of encorbelmenting is equipped with the heat preservation with parapet side laminating, forms the filling space between heat preservation bottom surface, outer leaf top surface and the board side of encorbelmenting, the intussuseption of filling is filled with hydrophobic expanded bead heat preservation mortar. According to the sandwich heat-insulating wallboard and parapet wall connection node structure, glue is applied between hard materials, so that cracking and water seepage caused by the cracking are effectively avoided, and hydrophobic expanded bead heat-insulating mortar is arranged at the joints of the cantilever plates and the outer leaf plates, so that cold bridge phenomenon can be avoided.
Description
Technical Field
The utility model relates to the technical field of building structures, in particular to a connecting node structure of a sandwich heat-insulating wallboard and a parapet wall.
Background
The sandwich heat-insulating external wall board structure system generally requires that the external leaf boards are closed, and the effect of cracking prevention and leakage prevention can be effectively achieved, so that the peripheral wall body is basically realized by combining sandwich heat-insulating external wall boards with PCF boards, when the parapet is arranged on the building roof layer, the parapet is also designed into a prefabricated sandwich parapet, the prefabricated sandwich parapet and the prefabricated sandwich heat-insulating wall boards on the lower layer are sealed by gluing the external leaf boards and the external leaf boards, the effect of cracking prevention and leakage prevention is achieved, but the cost of the prefabricated sandwich parapet is higher, and the cast-in-situ parapet is mostly adopted in the project.
At present, the connecting node between the prefabricated sandwich heat-insulating external wall board and the cast-in-situ parapet wall is prepared by two methods: one is that the insulation board of the parapet of cast-in-place adds plastering and outer leaf of sandwich insulation external wall panel to beat the glue in the joint, the problem that this kind of connected node is because plastering is thinner, beat the glue between the soft and hard materials, the time is long and will break, and then cause the leakage of the outer wall, leak in many project roof layer rooms at present is because the connected node designs improperly and causes; the other way is that the concrete connection between the outer blade plate and the inner wall plate blocks the water seepage path above the elevation of the roof, and the way has the problems that on one hand, the outer blade plate belongs to a non-stressed member and is not directly connected with the stressed member, so that the influence on the outer blade plate caused by the deformation of the inner wall plate is avoided, and on the other hand, the concrete connection position is free of a heat insulation plate, and a cold bridge phenomenon occurs.
Disclosure of utility model
In order to overcome the defects in the prior art, a sandwich heat-insulating wallboard and parapet wall connection node structure is provided, and the sandwich heat-insulating wallboard and parapet wall connection node structure can play a role in preventing cracking and leakage.
In order to achieve the technical effects, the utility model provides a sandwich heat-insulating wallboard and parapet wall connection node structure, which comprises:
The sandwich heat-insulating wallboard comprises an outer leaf plate, an inner wallboard and a heat-insulating plate clamped between the outer leaf plate and the inner wallboard;
Parapet, parapet side is perpendicular to be equipped with the board of encorbelmenting, the board of encorbelmenting is located the heated board top surface with outer leaf top surface, the board bottom surface of encorbelmenting with connect through first sealant between the outer leaf top surface, the board top surface of encorbelmenting be equipped with the heat preservation of parapet side laminating, the heat preservation bottom surface outer leaf top surface and the board side of encorbelmenting between form the filling space, the intussuseption of filling is filled with hydrophobic expanded pearl heat preservation mortar.
Preferably, the heat preservation is higher than the outer leaf plate, a joint is formed between the bottom surface of the cantilever plate and the top surface of the outer leaf plate, and the joint is filled with first sealant.
Preferably, PE rods are further filled between the bottom surface of the cantilever plate and the top surface of the outer leaf plate.
Preferably, the side surface of the heat preservation layer far away from the parapet is paved with alkali-resistant glass fiber mesh cloth.
Preferably, the parapet top surface is provided with cornices, the heat preservation top surface is flush with the cornices bottom surface, and the heat preservation top surface and the cornices bottom surface are filled with second sealant.
Preferably, the cornice is provided with water drops, and the water drops are arranged on the cornice bottom surface, which is far away from the side surface of the parapet, of the heat preservation layer.
The sandwich heat-insulating wallboard and parapet connecting node structure has the beneficial effects that the cantilever board is arranged on the side face of the parapet, the cantilever board is arranged on the top faces of the outer leaf boards of the sandwich heat-insulating wallboard and the heat-insulating board, the first sealant is filled between the top faces of the outer leaf boards and the bottom faces of the cantilever board, and the water seepage caused by cracking and splitting can be effectively avoided by gluing the hard materials. And the hydrophobic expanded bead thermal insulation mortar is filled in the space formed by the bottom surface of the thermal insulation layer, the top surface of the outer blade plate and the side surface of the cantilever plate, so that the cold bridge phenomenon can be avoided. The sandwich heat-insulating wallboard and parapet wall connecting node structure can play a role in preventing cracking and leakage and avoid cold bridge phenomenon.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural view of a sandwich insulation wallboard and parapet connection node structure of the present utility model.
FIG. 2 is a schematic cross-sectional view of a sandwich insulation wall panel and parapet connection node structure of the present utility model.
The label correspondence is as follows:
1-sandwich heat-insulating wallboard; 101-outer blades; 102-an insulation board; 103-inner wallboard; 2-parapet wall; 3-cantilever plates; 4-hydrophobic expanded bead thermal insulation mortar; 5-an insulating layer; 6-a first sealant; 7-PE rod; 8-alkali-resistant glass fiber mesh cloth; 9-grooves; 10-dripping water; 11-roof; 12-roof boarding; 13-post-cast ring beam.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 2, an embodiment of the present utility model provides a connecting node structure for a sandwich heat insulation wallboard and parapet, which comprises a sandwich heat insulation wallboard 1 and parapet 2. Wherein:
the sandwich insulation wall 1 comprises an outer leaf 101 and an inner wall plate 103 and an insulation plate 102 sandwiched between the outer leaf 101 and the inner wall plate 103.
Parapet 2 waters the top surface of locating roof 11, be equipped with perpendicularly in parapet 2's side and encorbelment board 3, it locates the top surface of heated board 102 and the top surface of outer leaf 101 to encorbelment board 3, be connected through first sealant 6 between the top surface of encorbelment board 3 bottom surface and the top surface of outer leaf 101, the top surface of encorbelment board 3 is equipped with the heat preservation 5 of laminating with parapet 2 side, be formed with the filling space between heat preservation 5 bottom surfaces, outer leaf 101 top surface and the board 3 side of encorbelment, fill hydrophobic expanded bead heat preservation mortar 4 in the filling space, can make hydrophobic expanded bead heat preservation mortar 4 pack in the junction of board 3 side and encorbelment board 3 and outer leaf 101 of encorbelmenting. The parapet wall 2 and the sandwich heat-insulating wall 1 are connected by gluing between the cantilever plate 3 and the outer leaf plate 101, and leakage caused by cracking and cracking can be effectively reduced by gluing between hard materials. The hydrophobic expanded bead thermal insulation mortar 4 has good thermal insulation and waterproof performance, and the hydrophobic expanded bead thermal insulation mortar 4 is stuffed on the side surface of the cantilever plate 3 and the joint of the cantilever plate 3 and the outer leaf plate 101 can avoid cold bridge phenomenon of the connecting node.
As a preferred embodiment, the heat insulation layer 5 is higher than the outer leaf 101, a seam is formed between the bottom surface of the cantilever plate 3 and the top surface of the outer leaf 101, and the seam is filled with the first sealant 6.
As a preferred embodiment, PE bars 7 are also filled between the bottom surface of the cantilever plate 3 and the top surface of the outer leaf 101.
As a preferred implementation mode, the side surface of the heat preservation layer 5 far away from the parapet wall 2 is paved with the alkali-resistant glass fiber mesh fabric 8, so that the strength of the heat preservation layer 5 can be enhanced, the heat preservation layer 5 has high impact strength, the deformation of the heat preservation layer 5 is reduced, and the heat preservation layer 5 is prevented from cracking.
As a preferred implementation mode, the parapet 2 top surface is equipped with cornices, cornices bottom surface and heat preservation 5 top surface laminating, and heat preservation 5 top surface and cornices bottom surface annotate and be equipped with the second sealant. The heat preservation 5 is laminated with cornice and is kept away from parapet 2's bight position and reserves recess 9, pours into the second sealant into in recess 9, prevents that water from permeating into in the heat preservation 5, plays waterproof effect.
As a preferred embodiment, cornice is provided with water drops, and the water drops are arranged on the cornice bottom surface of the heat insulation layer 5, which is far away from the side surface of the parapet 2, so that the water can play a role in draining, and water is prevented from being gathered on the heat insulation layer 5 and flowing into the joint between the sandwich heat insulation wallboard 1 and the parapet 2, so that leakage of the joint is caused.
According to the sandwich heat-insulating wallboard and parapet wall connection node structure, the cantilever board 3 is vertically arranged on the side face of the parapet wall 2, the cantilever board 3 is arranged on the top faces of the outer leaf board 101 and the heat-insulating board 102 of the sandwich heat-insulating wallboard 1, and the bottom face of the cantilever board 3 is connected with the top face of the outer leaf board 101 through the first sealant 6 and the PE rod 7. The top surface of the cantilever plate 3 is provided with an insulating layer 5 attached to the side surface of the parapet 2, a filling space is formed by the bottom surface of the insulating layer 5, the top surface of the outer blade plate 101 and the side surface of the cantilever plate 3 far away from the parapet 2, and hydrophobic expanded bead insulating mortar 4 is filled in the filling space. The side of the heat preservation layer 5 far away from the parapet 2 is paved with the alkali-resistant glass fiber mesh fabric 8, so that the strength of the heat preservation layer 5 can be enhanced, and the crack of the heat preservation layer 5 is reduced. And a second sealant is injected into a groove 9 which is attached to the heat preservation layer 5 and is far away from the corner position of the parapet wall 2, so that the heat preservation layer 5 is waterproof. And the cornice is provided with the water drip 10, which can play a role in draining water.
The sandwich heat-insulating wallboard and parapet wall connecting node structure is adopted, the cantilever board of the parapet wall and the outer leaf board of the sandwich heat-insulating wallboard are connected through the first sealant, and the filling space formed by the bottom surface of the heat-insulating layer, the top surface of the outer leaf board and the side surface of the cantilever board, which is far away from the parapet wall, is surrounded by the hydrophobic expanded bead heat-insulating mortar. The glue-beating connection between the hard materials can effectively avoid water seepage caused by cracking and the cracking, and the hydrophobic expanded bead thermal insulation mortar is filled on one side, far away from the parapet, of the cantilever plate and the junction of the cantilever plate and the outer blade plate, so that the phenomenon of cold bridge can be avoided. And the heat-insulating layer is paved with alkali-resistant glass fiber mesh cloth, so that cracks generated in the heat-insulating layer are reduced. The waterproof sealing glue of the second sealing glue between the heat preservation and the cornice is used for realizing the waterproof of the heat preservation and is provided with water drops at cornice, so that the water draining effect can be achieved, the waterproof connecting node with a plurality of defense lines is constructed by waterproof materials, and the leakage of the joint between the sandwich heat preservation wallboard and the parapet wall can be effectively avoided.
None of the utility models are related to the same or are capable of being practiced in the prior art. Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A sandwich insulation wallboard and parapet connected node structure, characterized by comprising:
The sandwich heat-insulating wallboard comprises an outer leaf plate, an inner wallboard and a heat-insulating plate clamped between the outer leaf plate and the inner wallboard;
Parapet, parapet side is perpendicular to be equipped with the board of encorbelmenting, the board of encorbelmenting is located the heated board top surface with outer leaf top surface, the board bottom surface of encorbelmenting with connect through first sealant between the outer leaf top surface, the board top surface of encorbelmenting be equipped with the heat preservation of parapet side laminating, the heat preservation bottom surface outer leaf top surface and the board side of encorbelmenting between form the filling space, the intussuseption of filling is filled with hydrophobic expanded pearl heat preservation mortar.
2. The sandwich insulation wall panel and parapet wall connection node construction of claim 1, wherein the insulation layer is higher than the outer leaf, a seam is formed between the bottom surface of the overhanging board and the top surface of the outer leaf, and a first sealant is filled in the seam.
3. The sandwich insulation wall panel and parapet wall connection node construction of claim 2, wherein PE bars are also filled between the bottom surface of the cantilever panel and the top surface of the outer leaf panel.
4. The sandwich insulation wallboard and parapet wall connection node structure of claim 1, wherein the side of the insulation layer away from the parapet wall is paved with alkali-resistant glass fiber mesh cloth.
5. The sandwich insulation wallboard and parapet connection node structure of claim 1, wherein the parapet top surface is provided with a cornice, the cornice bottom surface is attached to the insulation layer top surface, and a second sealant is injected between the insulation layer top surface and the cornice bottom surface.
6. The sandwich insulating wall panel and parapet wall joint structure of claim 5, wherein the cornice is provided with a drip, and the drip is arranged on the cornice bottom surface of the insulating layer outside the side surface far away from the parapet wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322208937.5U CN220814354U (en) | 2023-08-16 | 2023-08-16 | Connecting node structure of sandwich heat-insulating wallboard and parapet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322208937.5U CN220814354U (en) | 2023-08-16 | 2023-08-16 | Connecting node structure of sandwich heat-insulating wallboard and parapet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220814354U true CN220814354U (en) | 2024-04-19 |
Family
ID=90704084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322208937.5U Active CN220814354U (en) | 2023-08-16 | 2023-08-16 | Connecting node structure of sandwich heat-insulating wallboard and parapet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220814354U (en) |
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2023
- 2023-08-16 CN CN202322208937.5U patent/CN220814354U/en active Active
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