CN220805117U - Tungsten steel riving knife forming die for semiconductor bonding - Google Patents
Tungsten steel riving knife forming die for semiconductor bonding Download PDFInfo
- Publication number
- CN220805117U CN220805117U CN202322428110.5U CN202322428110U CN220805117U CN 220805117 U CN220805117 U CN 220805117U CN 202322428110 U CN202322428110 U CN 202322428110U CN 220805117 U CN220805117 U CN 220805117U
- Authority
- CN
- China
- Prior art keywords
- die
- tungsten steel
- riving knife
- semiconductor bonding
- lower die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 25
- 239000010959 steel Substances 0.000 title claims abstract description 25
- 229910052721 tungsten Inorganic materials 0.000 title claims abstract description 25
- 239000010937 tungsten Substances 0.000 title claims abstract description 25
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000010030 laminating Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 12
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 3
- 238000005299 abrasion Methods 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007493 shaping process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003657 tungsten Chemical class 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses a tungsten steel riving knife forming die for semiconductor bonding, and relates to the technical field of tungsten steel riving knife forming dies. The tungsten steel riving knife forming die for semiconductor bonding comprises a base, a lower die fixedly connected to the upper surface of the base and an upper die attached to the upper surface of the lower die, wherein a forming cavity is formed in the center of the upper surface of the lower die. According to the utility model, the ejector blocks, the abutting grooves, the hydraulic cylinders and the like are arranged, after the material in the molding cavity is molded, the hydraulic cylinders are started to drive the fixed blocks to slide upwards, the two ejector blocks can be driven to slide upwards through the sliding columns to eject the material, so that the demolding can be realized quickly, the high efficiency is enhanced, the friction force between the sliding columns and the ejector blocks can be reduced when the sliding columns slide in the abutting grooves through the installation rollers, the abrasion between the sliding columns and the ejector blocks is reduced, and the service lives of the sliding columns and the ejector blocks are prolonged.
Description
Technical Field
The utility model relates to the technical field of tungsten steel riving knife forming dies, in particular to a tungsten steel riving knife forming die for semiconductor bonding.
Background
The forming mold for tungsten steel chopper for semiconductor bonding is one special tool for producing metal wire for semiconductor bonding. In the manufacture of semiconductor devices, bonding is a critical step in the connection between a semiconductor chip and a package substrate, and it typically uses metal wires to connect leads of the chip to contact points on the package substrate. The tungsten steel riving knife forming die is used for manufacturing equipment for the tungsten steel riving knife;
in the existing tungsten steel riving knife forming die, friction force is generated between a punch and the surface of the die in the stamping process, when the friction force is too large, a stamping part is difficult to separate smoothly from the die, adhesion phenomenon can possibly occur between a stamping material and the surface of the die, and particularly for a material with viscosity, the stamping part is difficult to separate from the die, so that manual intervention is required or a demolding procedure is additionally added in the demolding process, and the production efficiency of the tungsten steel riving knife is greatly prolonged.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a tungsten steel riving knife forming die for semiconductor bonding, which solves the problems that a stamping part is difficult to separate from the die smoothly, and a procedure of manual intervention or additional demoulding is needed during demoulding, so that the production efficiency of the tungsten steel riving knife is greatly prolonged.
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a tungsten steel riving knife forming die for semiconductor bonding, includes base, fixed connection at the bed die of base upper surface and laminating connection at the last mould of bed die upper surface, the upper surface center department of bed die has seted up the shaping chamber, the inside sliding connection of bed die has the kicking block, the inside of kicking block runs through and has seted up the groove of supporting, the inside center department fixed mounting of bed die has the pneumatic cylinder, the output fixedly connected with fixed block of pneumatic cylinder, the inside center department fixedly connected with round pin pole of fixed block, the surface rotation of round pin pole is connected with two connecting plates, the spacing groove has been seted up to the inside of bed die, the one end rotation that the round pin pole was kept away from to the connecting plate is connected with the sliding column.
Preferably, the inside equidistance rotation of slip post is connected with the roller, the surface that extends to the slip post of roller and laminating at the inner wall of supporting the groove.
Preferably, the outer surface of the sliding column is movably connected to the inside of the supporting groove, and the supporting groove is trapezoid.
Preferably, one end of the pin rod far away from the fixed block is slidably connected in the limiting groove.
Preferably, the number of the sliding columns and the number of the connecting plates are two, and the fixed block is movably connected in the lower die.
Preferably, the sliding column is square, the outer surface of the sliding column is connected inside the lower die in a sliding mode, and the top end of the top block extends to the inside of the forming cavity.
Advantageous effects
The utility model provides a tungsten steel riving knife forming die for semiconductor bonding. Compared with the prior art, the method has the following beneficial effects:
1. This tungsten steel riving knife forming die for semiconductor bonding through setting up the kicking block, supporting groove and pneumatic cylinder etc. after the material shaping of die cavity inside, through starting the pneumatic cylinder, the pneumatic cylinder drives the fixed block and upwards slides, can drive two kicking blocks and upwards slide through the slip post, and it is ejecting with the material, can realize the drawing of patterns fast, has strengthened the high efficiency.
2. According to the tungsten steel riving knife forming die for the semiconductor bonding, through the installation roller, when the sliding column slides in the supporting groove, the friction force between the sliding column and the top block can be reduced, the abrasion between the sliding column and the top block is reduced, and the service lives of the sliding column and the top block are prolonged.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a cross-sectional view of a lower mold in accordance with the present utility model;
Fig. 3 is a cross-sectional view of a sliding column according to the present utility model.
In the figure: 1. a base; 2. a lower die; 3. an upper die; 4. a molding cavity; 5. a top block; 6. a groove is propped against; 7. a hydraulic cylinder; 8. a fixed block; 81. a pin rod; 9. a limit groove; 10. a connecting plate; 11. a sliding column; 111. and (3) a roller.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a tungsten steel riving knife forming die for semiconductor bonding, including base 1, fixed connection is at the bed die 2 of base 1 upper surface and laminating connection is at the last mould 3 of bed die 2 upper surface, forming die cavity 4 has been seted up to the upper surface center department of bed die 2, the inside sliding connection of bed die 2 has kicking block 5, the top of kicking block 5 extends to the inside of forming die cavity 4, the inside of kicking block 5 has run through and has been seted up support groove 6, fixed mounting has pneumatic cylinder 7 in the inside center department of bed die 2, the output fixedly connected with fixed block 8 of pneumatic cylinder 7, fixed block 8 swing joint is in the inside of bed die 2, the inside center department fixedly connected with round pin pole 81 of fixed block 8, the surface rotation of round pin pole 81 is connected with two connecting plates 10, the inside of bed die 2 has been seted up spacing groove 9, one end of the pin rod 81 far away from the fixed block 8 is slidably connected in the limiting groove 9, one end of the connecting plate 10 far away from the pin rod 81 is rotatably connected with the sliding columns 11, the number of the sliding columns 11 and the number of the connecting plate 10 are two, the sliding columns 11 are square, the outer surface of the sliding columns 11 is slidably connected in the lower die 2, the outer surface of the sliding columns 11 is movably connected in the abutting groove 6, the abutting groove 6 is trapezoid, the ejector block 5, the abutting groove 6, the hydraulic cylinder 7 and the like are arranged, after the material in the die cavity 4 is molded, the hydraulic cylinder 7 is started to drive the fixed block 8 to slide upwards, the two ejector blocks 5 can be driven to slide upwards through the sliding columns 11, the material is ejected out, the die stripping can be realized quickly, and the high efficiency is enhanced;
the inside equidistance rotation of slip post 11 is connected with roller 111, and the surface that extends to slip post 11 of roller 111 is laminated and is supporting the inner wall in groove 6, through installation roller 111, when slip post 11 is supporting the inside slip in groove 6, can reduce the frictional force between slip post 11 and the kicking block 5, has reduced wearing and tearing each other, has prolonged the life of slip post 11 and kicking block 5.
During operation, after the material shaping of die cavity 4 inside, through starting pneumatic cylinder 7, pneumatic cylinder 7 drives fixed block 8 and upwards slides, fixed block 8 drives pin 81 and upwards slides, two connecting plates 10 rotate this moment, and drive two slip posts 11 and upwards slide to the inside of supporting groove 6, roller 111 roll connection is at the inner wall of supporting groove 6 simultaneously, can drive two kicking blocks 5 and upwards slide through slip post 11, it is ejecting with the material, can realize the drawing of patterns fast, the high efficiency has been strengthened, after the drawing of patterns, start pneumatic cylinder 7 and drive fixed block 8 and reverse slide, when the material is placed to die cavity 4 inside and punching press is carried out, because pressure kicking block 5 can retract automatically to the inside of lower mould 2, can not influence the normal production of material.
And all that is not described in detail in this specification is well known to those skilled in the art.
Claims (6)
1. The utility model provides a tungsten steel riving knife forming die for semiconductor bonding, includes base (1), fixed connection at bed die (2) of base (1) upper surface and laminating connection at bed die (2) upper surface's last mould (3), its characterized in that: the forming die comprises a lower die (2), wherein a forming cavity (4) is formed in the center of the upper surface of the lower die (2), a jacking block (5) is connected to the lower die (2) in a sliding mode, a supporting groove (6) is formed in the jacking block (5) in a penetrating mode, a hydraulic cylinder (7) is fixedly installed in the center of the lower die (2), a fixing block (8) is fixedly connected to the output end of the hydraulic cylinder (7), a pin rod (81) is fixedly connected to the center of the inside of the fixing block (8), two connecting plates (10) are connected to the outer surface of the pin rod (81) in a rotating mode, and a limiting groove (9) is formed in the lower die (2), and one end, far away from the pin rod (81), of each connecting plate (10) is connected with a sliding column (11) in a rotating mode.
2. The tungsten steel riving knife forming die for semiconductor bonding according to claim 1, wherein: the inside equidistance rotation of slip post (11) is connected with roller (111), the surface that extends to slip post (11) of roller (111) is laminated at the inner wall of supporting groove (6).
3. The tungsten steel riving knife forming die for semiconductor bonding according to claim 1, wherein: the outer surface of the sliding column (11) is movably connected to the inside of the supporting groove (6), and the supporting groove (6) is trapezoid.
4. The tungsten steel riving knife forming die for semiconductor bonding according to claim 1, wherein: one end of the pin rod (81) far away from the fixed block (8) is slidably connected in the limiting groove (9).
5. The tungsten steel riving knife forming die for semiconductor bonding according to claim 1, wherein: the number of the sliding columns (11) and the number of the connecting plates (10) are two, and the fixed blocks (8) are movably connected in the lower die (2).
6. The tungsten steel riving knife forming die for semiconductor bonding according to claim 1, wherein: the sliding column (11) is square, the outer surface of the sliding column (11) is connected inside the lower die (2) in a sliding mode, and the top end of the top block (5) extends into the forming cavity (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322428110.5U CN220805117U (en) | 2023-09-07 | 2023-09-07 | Tungsten steel riving knife forming die for semiconductor bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322428110.5U CN220805117U (en) | 2023-09-07 | 2023-09-07 | Tungsten steel riving knife forming die for semiconductor bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220805117U true CN220805117U (en) | 2024-04-19 |
Family
ID=90701573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322428110.5U Active CN220805117U (en) | 2023-09-07 | 2023-09-07 | Tungsten steel riving knife forming die for semiconductor bonding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220805117U (en) |
-
2023
- 2023-09-07 CN CN202322428110.5U patent/CN220805117U/en active Active
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