CN220795079U - Semiconductor appearance defect detection equipment - Google Patents
Semiconductor appearance defect detection equipment Download PDFInfo
- Publication number
- CN220795079U CN220795079U CN202322234141.7U CN202322234141U CN220795079U CN 220795079 U CN220795079 U CN 220795079U CN 202322234141 U CN202322234141 U CN 202322234141U CN 220795079 U CN220795079 U CN 220795079U
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- China
- Prior art keywords
- fixedly connected
- appearance defect
- semiconductor
- plate
- sliding
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 238000001514 detection method Methods 0.000 title claims abstract description 29
- 230000007547 defect Effects 0.000 title claims abstract description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 7
- 239000010959 steel Substances 0.000 claims description 7
- 239000011111 cardboard Substances 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000005457 optimization Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000105 evaporative light scattering detection Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a semiconductor appearance defect detection device which comprises a shell, wherein the inner wall of the shell is fixedly connected with a fixed plate, the left side surface of the fixed plate is fixedly connected with a cam, the inside of the shell is rotationally connected with a rotating shaft and a rotating disc, and the left end of the rotating shaft is fixedly connected with the rotating disc.
Description
Technical Field
The utility model relates to the technical field of semiconductor detection equipment, in particular to semiconductor appearance defect detection equipment.
Background
Semiconductor chips are etched and wired on semiconductor sheets to produce semiconductor devices capable of performing a certain function, and semiconductor materials such as gallium arsenide and germanium are not only silicon chips but also common semiconductor chips.
Through retrieving, the Chinese patent with publication number CN213212116U discloses a semiconductor silicon wafer rack appearance translation detection device, which is technically characterized in that: the utility model discloses a semiconductor silicon wafer frame appearance translation detection device which comprises a device base, a guide rail, a sliding table, a handle, a semiconductor silicon wafer frame carrying groove, a support and a microscope, wherein the guide rail is arranged on the device base, the sliding table is arranged on the guide rail, the handle is positioned at the side edge of the sliding table, the semiconductor silicon wafer frame carrying groove is positioned in the middle of the sliding table, the support is arranged on the device base, the microscope is arranged on the support, the semiconductor silicon wafer frame can be rapidly detected by moving the sliding table, and the situation that the semiconductor silicon wafer frame is manually taken under the microscope to carry out appearance detection is avoided, so that the detection efficiency is remarkably improved.
The technical scheme is that the appearance of the existing semiconductor silicon wafer frame needs to be inspected when the existing semiconductor silicon wafer frame is produced, inspection staff is required to manually take the semiconductor silicon wafer frame to be placed under a microscope for appearance detection, the manual taking detection efficiency is low, and the requirement of mass detection cannot be met.
There is therefore a need to propose a new solution to this problem.
Disclosure of utility model
The utility model aims to provide a semiconductor appearance defect detection device, which solves the problems that in the prior art, a sliding table is in sliding connection with a guide rail, so that the sliding table is difficult to turn over a semiconductor during detection, and a plurality of angles of the semiconductor are difficult to detect during detection of the device.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor appearance defect check out test set, includes the casing, the inner wall fixedly connected with fixed plate of casing, the left surface fixedly connected with cam of fixed plate, the inside of casing rotates and is connected with pivot and carousel, and the left end and the carousel fixed connection of pivot, the right-hand member of pivot is connected with the handle, the inside sliding connection of carousel has two push rods, every the equal fixedly connected with connecting rod of surface of push rod, every the steel ball is all installed to the inside of connecting rod, and the equal and cam contact of every steel ball.
In order to facilitate the movement of the sliding rod and the installation of the fixing head, the semiconductor appearance defect detection device is preferably provided with sliding grooves in the connecting rods, and the sliding rod is slidably connected in each sliding groove.
In order to facilitate the installation of the fixing heads, the semiconductor appearance defect detection device is preferably provided with the fixing heads fixedly connected with the left ends of the sliding rods, and the left ends of the fixing heads are fixedly connected with the turntables.
In order to facilitate resetting the position of the fixing heads, the semiconductor appearance defect detection device is preferably provided with springs fixedly connected to the right side surfaces of the fixing heads, and the left ends of the springs are fixedly connected with corresponding connecting rods.
In order to facilitate placement of a semiconductor chip, the semiconductor appearance defect detection device is preferably characterized in that a connecting plate is fixedly connected to the left side face of the turntable, a clamping plate is fixedly connected to the left side face of the connecting plate, and a clamping groove is formed in the clamping plate.
In order to facilitate placement of the semiconductor chip on the card board and prevent the semiconductor chip from falling off, it is preferable that a push plate is fixedly connected to the left side surface of each push rod, and each push plate is in sliding contact with the card board.
In order to facilitate the fixing of the housing and the detection of the semiconductor chip, as a semiconductor appearance defect detection device of the present utility model, preferably, the bottom surface of the housing is fixedly connected with a fixing base, and the upper surface of the fixing base is fixedly provided with a detection device.
Compared with the prior art, the utility model has the following beneficial effects:
1. According to the device, the fixed plate, the cam, the rotating shaft, the rotating disc and other parts are arranged, when the device is used, the handle is manually rotated, the rotating shaft is driven to rotate when the handle rotates, the rotating shaft drives the rotating disc and the two push rods to rotate, the connecting rod is driven to rotate when the push rods rotate, when the connecting rod rotates, the upper position and the lower position of the two push plates are exchanged, meanwhile, the connecting plate moves according to the radian of the cam, so that the position of the push plate rotating to the lower part moves to the lower part of the clamping plate, the push plate rotating to the upper part resets through the elasticity of the spring, and the effect that the device can enable the positions of the two push plates to be exchanged according to requirements is achieved.
2. According to the utility model, the handle, the rotating shaft, the turntable, the clamping plate and other parts are arranged, when the device is used, the rotating shaft is rotated by rotating the handle, the turntable is driven to rotate when the rotating shaft rotates, the clamping plate is driven to rotate when the turntable rotates, and the semiconductor chip in the clamping groove is driven to rotate when the clamping plate rotates, so that the effect that the device can drive the semiconductor chip to overturn according to requirements is achieved.
Drawings
FIG. 1 is a schematic view of the overall three-dimensional structure of the present utility model;
FIG. 2 is a schematic elevational view of the present utility model;
FIG. 3 is a schematic view of the structure of the housing of the present utility model;
FIG. 4 is a schematic cross-sectional view of a housing according to the present utility model;
in the figure: 1. a housing; 2. a fixing plate; 3. a cam; 4. a rotating shaft; 5. a turntable; 6. a push rod; 7. a connecting rod; 8. steel balls; 9. a sliding groove; 10. a slide bar; 11. a fixed head; 12. a detection device; 13. a spring; 14. a handle; 15. a connecting plate; 16. a clamping plate; 17. a clamping groove; 18. a push plate; 19. and (5) fixing the base.
Detailed Description
Referring to fig. 1 to 4, a semiconductor appearance defect detecting device includes a housing 1, an inner wall of the housing 1 is fixedly connected with a fixing plate 2, a left side surface of the fixing plate 2 is fixedly connected with a cam 3, a rotating shaft 4 and a rotating disc 5 are rotatably connected in the housing 1, a left end of the rotating shaft 4 is fixedly connected with the rotating disc 5, a handle 14 is connected with a right end of the rotating shaft 4, two push rods 6 are slidably connected in the rotating disc 5, a connecting rod 7 is fixedly connected to an outer surface of each push rod 6, steel balls 8 are mounted in each connecting rod 7, and each steel ball 8 is in contact with the cam 3.
In this embodiment: when using this device, through manual rotation handle 14, drive pivot 4 and rotate when handle 14 rotates, pivot 4 can drive carousel 5 and two push rods 6 and rotate, can drive connecting rod 7 and rotate when push rod 6 rotates, when connecting rod 7 rotates, the upper and lower position of two push plates 18 can exchange, simultaneously connecting rod 7 can remove according to the radian of cam 3, make the push plate 18 position that rotates the below remove to the below of cardboard 16, the slide bar 10 that rotates the top can drive push plate 18 through the 13 elasticity of spring and reset, reach the device and can make two push plates 18 carry out the effect of position exchange according to the demand.
As a technical optimization scheme of the utility model, the inside of each connecting rod 7 is provided with a sliding groove 9, and the inside of each sliding groove 9 is connected with a sliding rod 10 in a sliding way.
In this embodiment: the sliding rod 10 is fixed through the sliding groove 9, and the fixed head 11 can be driven to move through the sliding rod 10.
As a technical optimization scheme of the utility model, the left end of each sliding rod 10 is fixedly connected with a fixed head 11, and the left end of each fixed head 11 is fixedly connected with the turntable 5.
In this embodiment: the sliding rod 10 can be conveniently installed through the fixed head 11, and the sliding rod 10 can conveniently slide through the sliding rod 10 and the sliding groove 9.
As a technical optimization scheme of the utility model, the right side surface of each fixed head 11 is fixedly connected with a spring 13, and the left end of each spring 13 is fixedly connected with the corresponding connecting rod 7.
In this embodiment: when the sliding rod 10 moves to the upper side, the sliding rod 10 drives the push plate 18 to reset through the reaction force of the spring 13 through the arranged spring 13, and the spring 13 is fixed with the connecting rod 7.
As a technical optimization scheme of the utility model, a connecting plate 15 is fixedly connected to the left side surface of the turntable 5, a clamping plate 16 is fixedly connected to the left side surface of the connecting plate 15, and a clamping groove 17 is formed in the clamping plate 16.
In this embodiment: the clamping plate 16 is fixed through the connecting plate 15, and the semiconductor chip can be conveniently placed through the clamping groove 17.
As a technical optimization scheme of the utility model, the left side surface of each push rod 6 is fixedly connected with a push plate 18, and each push plate 18 is in sliding contact with a clamping plate 16.
In this embodiment: the pushing plate 18 is moved to the lower part of the clamping plate 16, so that the semiconductor chip is supported, and the gap between the pushing plate 18 and the clamping plate 16 is reduced through the sliding contact between the pushing plate 18 and the clamping plate 16, so that the semiconductor chip is prevented from sliding off.
As a technical optimization scheme of the utility model, the bottom surface of the shell 1 is fixedly connected with a fixed base 19, and the upper surface of the fixed base 19 is fixedly provided with a detection device 12.
In this embodiment: the shell 1 and the detection device 12 are fixed through the fixed base 19, and the appearance of the semiconductor chip can be conveniently detected through the detection device 12.
Working principle: when the device is used, the semiconductor chip is placed in the clamping groove 17, the lower push plate 18 supports the semiconductor chip, the front of the semiconductor chip is detected through the detection device 12, when the back of the semiconductor needs to be detected, the rotary shaft 4 is driven to rotate through the manual rotation handle 14, the rotary disc 5 and the push rod 6 are driven to rotate when the rotary shaft 4 rotates, the connecting plate 15 and the clamping plate 16 are driven to rotate when the rotary disc 5 rotates, meanwhile, the connecting rod 7 also rotates, the upper connecting rod 7 moves leftwards according to the cambered surface of the cam 3 when the connecting rod 7 rotates, the push plate 18 slides along the clamping plate 16 when the upper connecting rod 7 moves to the lower side of the clamping plate 16, the semiconductor chip is supported through the lower side of the clamping plate 16, the connecting rod 7 moves to the upper side through the elastic force of the spring 13, the connecting rod 7 drives the push plate 18 to reset, and the back of the semiconductor chip can be detected through the detection device 12.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (7)
1. Semiconductor appearance defect detection equipment, including casing (1), its characterized in that: the inner wall fixedly connected with fixed plate (2) of casing (1), the left surface fixedly connected with cam (3) of fixed plate (2), the inside rotation of casing (1) is connected with pivot (4) and carousel (5), and the left end and the carousel (5) fixed connection of pivot (4), the right-hand member of pivot (4) is connected with handle (14), the inside sliding connection of carousel (5) has two push rods (6), every the equal fixedly connected with connecting rod (7) of the surface of push rod (6), every steel ball (8) are all installed to the inside of connecting rod (7), and the all with cam (3) of every steel ball (8) contact.
2. The semiconductor appearance defect detecting apparatus according to claim 1, wherein: the inside of every connecting rod (7) has all seted up sliding tray (9), and the inside of every sliding tray (9) all sliding connection has slide bar (10).
3. A semiconductor appearance defect detecting apparatus according to claim 2, wherein: the left end of each sliding rod (10) is fixedly connected with a fixed head (11), and the left end of each fixed head (11) is fixedly connected with the rotary table (5).
4. A semiconductor appearance defect detecting apparatus according to claim 3, wherein: the right side face of each fixed head (11) is fixedly connected with a spring (13), and the left end of each spring (13) is fixedly connected with a corresponding connecting rod (7).
5. The semiconductor appearance defect detecting apparatus according to claim 1, wherein: the left side fixedly connected with connecting plate (15) of carousel (5), the left side fixedly connected with cardboard (16) of connecting plate (15), draw-in groove (17) have been seted up to the inside of cardboard (16).
6. The semiconductor appearance defect detecting apparatus according to claim 1, wherein: the left side face of each push rod (6) is fixedly connected with a push plate (18), and each push plate (18) is in sliding contact with the clamping plate (16).
7. The semiconductor appearance defect detecting apparatus according to claim 1, wherein: the bottom surface of casing (1) fixedly connected with unable adjustment base (19), the upper surface fixed mounting of unable adjustment base (19) has detection device (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322234141.7U CN220795079U (en) | 2023-08-19 | 2023-08-19 | Semiconductor appearance defect detection equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322234141.7U CN220795079U (en) | 2023-08-19 | 2023-08-19 | Semiconductor appearance defect detection equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220795079U true CN220795079U (en) | 2024-04-16 |
Family
ID=90633964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322234141.7U Active CN220795079U (en) | 2023-08-19 | 2023-08-19 | Semiconductor appearance defect detection equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220795079U (en) |
-
2023
- 2023-08-19 CN CN202322234141.7U patent/CN220795079U/en active Active
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