CN220784473U - Crystal bar wire cutting equipment for semiconductor integrated circuit chip - Google Patents

Abstract

The utility model discloses crystal bar wire cutting equipment for a semiconductor integrated circuit chip, which comprises an operation table, wherein a wire cutting machine is arranged at the top of the operation table, a holding ring is arranged, a rope hanging rubber plate is firstly taken down from the outer side of a hook, then a worker holds a pull ring to drive a plug rod to be pulled out from the inner sides of a pull plate and a guide groove, and simultaneously holds the holding ring to drive the pull plate to move towards the back, so that the pull plate moves under the limiting effect of a circular plate along the guide groove through a guide rod, and the top scraps of the pull plate slide into a designated container along with an inclined angle after being pulled out of the inner side of a square box by the pull plate, and simultaneously, when the square box or the pull plate is required to be cleaned, the square box and the pull plate are taken down from the inner side of the device together by holding the support ring through a bent rod, so that the device can conveniently collect and clean the scraps.

Description

Crystal bar wire cutting equipment for semiconductor integrated circuit chip

Technical Field

The utility model relates to the technical field of wire cutting equipment, in particular to crystal bar wire cutting equipment for a semiconductor integrated circuit chip.

Background

A wire-cutting apparatus is a device for cutting a semiconductor integrated circuit chip-use ingot by running at a high speed, which is generally required to be cut into a proper size for subsequent use before use, and which can cut the semiconductor integrated circuit chip-use ingot by using a fine diamond wire after clamping the semiconductor integrated circuit chip-use ingot by a jig in the apparatus under the operation of a worker, and in view of this, the conventional apparatus is not perfect enough to have a facility for collecting and cleaning scraps, and a semiconductor integrated circuit chip-use ingot wire-cutting apparatus can provide a solution to the above-mentioned problems;

patent document: CN217916174U discloses a crystal bar wire cutting device for a semiconductor integrated circuit chip, "comprising a base and two vertical rails, and further comprising a conveying mechanism, a cutting mechanism and a tightening mechanism, wherein the conveying mechanism comprises a driving component and a plurality of tapered conveying rollers, the cutting mechanism comprises a sliding plate, a cutting line, a traction component and a lifting component, the tightening mechanism comprises a baffle and an adjusting component, the adjusting component is arranged at the top of the base, the baffle is arranged on the adjusting component in a sliding manner, and the driving component, the traction component and the lifting component are electrically connected with a controller. The above publication mainly discloses that when each time the silicon rod is conveyed to the cutting line, the driving component directly drives the tapered conveying rollers to rotate, so that the silicon rod is driven to be conveyed forward horizontally, manual auxiliary feeding is not needed, time and labor are saved, and the processing efficiency is improved;

the existing wire cutting equipment generally makes the sweeps splash at will when cutting the crystal bar for the semiconductor integrated circuit chip, and the staff is required to wipe and clean the sweeps later by using rags, so that the device is inconvenient to store and clean the sweeps, and the cleanliness is reduced.

Disclosure of utility model

The utility model aims to provide crystal bar wire cutting equipment for a semiconductor integrated circuit chip, which can solve the technical problems of inconvenient collection and cleaning of scraps and low cleanliness in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the crystal bar wire cutting equipment for the semiconductor integrated circuit chip comprises an operation table, wherein a wire cutting machine is arranged at the top of the operation table;

The wire cutting machine is characterized in that a square box is placed on the inner side of the wire cutting machine, guide grooves are formed in the two sides of the square box in a penetrating mode, guide rods are placed on the inner side of the guide grooves, circular plates are sleeved on the outer sides of the guide rods, the circular plates are placed on the two sides of the square box in a fitting mode, a drawing plate is installed between the guide rods and located on the inner side of the square box, inserting rods are placed on the inner side of the drawing plate in a penetrating mode, pull rings are installed at the right ends of the inserting rods, bent rods are installed on the back faces of the square box in a penetrating mode, supporting rings are installed in the inner portions of the bent rods in a penetrating mode, hooks are installed on the two sides of the bent rods, rubber plates are installed on the back faces of the square box, hanging ropes are installed on the two sides of the rubber plates, and holding rings are installed on the back faces of the drawing plate through connecting parts.

Preferably, two wire cutting heads are installed on the right side of the wire cutting machine, and the wire cutting heads are located at the top of the drawing plate.

Preferably, a concave plate is arranged on the back surface of the operation table, and a box body is embedded in the inner side of the concave plate.

Preferably, a plurality of placing grooves are formed in the top of the box body, and the notch width of each placing groove is different.

Preferably, through grooves are formed in the inner walls of the two sides of the placing groove.

Preferably, square plates are placed on the inner sides of the through grooves, a blocking sleeve is arranged between every two square plates, and the size of each blocking sleeve is adapted to the notch of the placing groove.

Preferably, the two sides of the box body are provided with handles, and the top of the retaining sleeve is provided with a pull handle.

Compared with the prior art, the utility model has the following beneficial effects:

1. According to the utility model, when the device is used for cutting the crystal bar for the semiconductor integrated circuit chip, scraps are scattered on the top of the pulling plate, after a period of time, a worker firstly takes down the rope hanging rubber plate from the outer side of the hook, so that the rubber plate does not provide a resisting effect on the pulling plate and the pulling plate, then the worker holds the pull ring, the pull ring drives the inserting rod to pull out from the inner sides of the pulling plate and the guide groove, and meanwhile, the worker uses one hand to hold the supporting ring, the other hand holds the holding ring, the holding ring drives the pulling plate to move towards the back by utilizing the connecting part under the reaction force of the supporting ring driving the pulling box through the bent rod, the pulling plate moves along the guide groove under the limit effect of the circular plate through the guide rod, and the top scraps of the pulling plate slide into the appointed container along with the inclination angle after being pulled out of the inner side of the pulling plate, and meanwhile, when the pulling plate or the pulling plate is required to be cleaned, the pulling ring and the pulling box are driven by the bent rod to be taken down from the inner side of the device together, the pulling ring is cleaned, so that the device can be convenient to clean the scraps, and the cleanliness is improved.

2. According to the utility model, after the concave plate is arranged, a worker starts the device to cut the crystal bar for the semiconductor integrated circuit chip, the crystal bar for the semiconductor integrated circuit chip is cut into crystal bars with different sizes, at the moment, the worker can select a proper-size placing groove to place and store the crystal bar for the semiconductor integrated circuit chip according to actual conditions, then holds the pull handle to drive the baffle sleeve to move along the through groove to be close to the crystal bar for the semiconductor integrated circuit chip through the square plate, so that the baffle sleeve resists and limits the crystal bar, after a period of time, when the placing groove is placed with the crystal bar fully, the worker holds the handle to drive the box body to be taken down from the inner side of the concave plate to move to a proper position, and the cut crystal bar is poured into a designated container for storage for subsequent use, so that the cut crystal bar for the semiconductor integrated circuit chip can be stored conveniently.

Drawings

FIG. 1 is a perspective view of the present utility model;

FIG. 2 is a schematic perspective view of a square box according to the present utility model;

FIG. 3 is a schematic perspective view of a drawer plate according to the present utility model;

FIG. 4 is a schematic perspective view of a recess plate according to the present utility model;

fig. 5 is a schematic perspective view of a retaining sleeve according to the present utility model.

In the figure: 1. an operation table; 2. a wire cutting machine; 3. a square box; 4. a guide groove; 5. a guide rod; 6. a circular plate; 7. a drawing plate; 8. a rod; 9. a pull ring; 10. a wire cutting head; 11. bending a rod; 12. a support ring; 13. a hook; 14. a rubber plate; 15. hanging ropes; 16. a grip ring; 17. a concave plate; 18. a case body; 19. a grip; 20. a placement groove; 21. a through groove; 22. a square plate; 23. a blocking sleeve; 24. a pull handle.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only one embodiment of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. It will be apparent to those skilled in the art that the specific meaning of the terms described above in the present utility model may be practiced in specific cases.

Referring to fig. 1, a die wire cutting apparatus for a semiconductor integrated circuit chip;

Including operation panel 1, wire saw 2 is installed at the top of operation panel 1, two wire saw heads 10 are installed on the right side of wire saw 2, and wire saw head 10 is located the top of pull board 7, operation panel 1 can provide operation support for wire saw 2, wire saw 2 can provide operation power for wire saw head 10, wire saw head 10 can utilize the high-speed operation of diamond wire to cut with the crystal bar of semiconductor integrated circuit chip, the staff can place to suitable position department through utilizing operation panel 1 with the device, then make wire saw 2 start operation, make wire saw 2 drive wire saw head 10 utilize the diamond wire to cut with the crystal bar of semiconductor integrated circuit chip according to actual conditions's needs, in order to use later.

Referring to fig. 1,2 and 3, a die wire cutting apparatus for a semiconductor integrated circuit chip;

the wire cutting machine comprises a square box 3, the square box 3 is placed on the inner side of the wire cutting machine 2, guide grooves 4 are penetratingly formed in the two sides of the square box 3, guide rods 5 are placed on the inner side of the guide grooves 4, circular plates 6 are sleeved on the outer sides of the guide rods 5, the circular plates 6 are placed on the two sides of the square box 3, a pull plate 7 is installed between the two guide rods 5, the pull plate 7 is located on the inner side of the square box 3, an inserting rod 8 is placed on the inner side of the guide grooves 4, a pull ring 9 is installed at the right end of the inserting rod 8, a bent rod 11 is installed on the back side of the square box 3, a supporting ring 12 is installed on the inner side of the bent rod 11 in a penetrating mode, hooks 13 are installed on the two sides of the bent rod 11, rubber plates 14 are installed on the back side of the square box 3, hanging ropes 15 are installed on the two sides of the rubber plates 14, holding rings 16 are installed on the back side of the pull plate 7 through connecting parts, the square box 3 can provide a space for the guide grooves 4, the guide rods 4 can provide a moving space, the pull plate 7 can provide a placing space for waste chips, the circular plates 6 can provide a stop limiting effect for the guide plates 5, when a chip is placed on the inner side of the guide plates 7, a chip is placed on the guide plates 7, a chip is pulled down from the inner side of the guide plates 7 through the guide rings 7, a driver to the guide rings 7, a worker is driven by driving the opposite to pull the guide rings 7 to move through the hanging rings 7, and then through the hanging rings 13, and the hanging rings 4, a certain distance is driven by driving the hanging ropes 13 from the hanging rings 4, and the hanging rings are driven by the hanging rings 4 through the hanging rings and the hanging rings 4, and the hanging rings are driven by the hanging down through the hanging rings and the hanging rings 4. When the square box 3 or the drawing plate 7 is required to be cleaned, the square box 3 and the drawing plate 7 can be taken down together from the inner side of the device by holding the supporting ring 12 through the bent rod 11 to clean, so that the device can conveniently collect and clean the scraps, and the cleanliness is improved.

Referring to fig. 1, 4 and 5, a die-cutting apparatus for semiconductor integrated circuit chips;

Comprises a concave plate 17, a concave plate 17 is arranged on the back surface of an operation table 1, a box body 18 is embedded and placed on the inner side of the concave plate 17, a plurality of placing grooves 20 are formed at the top of the box body 18, the width of the notch of each placing groove 20 is different, through grooves 21 are formed on the inner walls of two sides of each placing groove 20, square plates 22 are placed on the inner side of each through groove 21, a baffle sleeve 23 is arranged between every two square plates 22, the size of each baffle sleeve 23 is adapted to the notch of each placing groove 20, grips 19 are arranged on two sides of the box body 18, pull handles 24 are arranged at the top of the baffle sleeves 23, after a worker starts the device to cut crystal bars for semiconductor integrated circuit chips, the crystal bars for the semiconductor integrated circuit chips are cut into crystal bars with different sizes, at this moment, the staff can select the appropriate size of the standing groove 20 to place and store the crystal bar for the semiconductor integrated circuit chip according to actual conditions, then hold the pull handle 24 to drive the blocking sleeve 23 to move along the through groove 21 to the crystal bar for the semiconductor integrated circuit chip through the square plate 22, so that the blocking sleeve 23 can block and limit the crystal bar, after a period of time, when the standing groove 20 is fully placed with the crystal bar, the staff holds the handle 19 again to drive the box 18 to take down from the inner side of the concave plate 17 and move to a proper position, so that the cut crystal bar is poured into a designated container for storage for later use, and the cut crystal bar for the semiconductor integrated circuit chip can be conveniently stored.

Working principle: before the device is used, whether the device has the problem of influencing the use or not is checked, when a worker needs to use the device, the device is moved to a proper position through the operation table 1 to be placed, then the crystal bar for the semiconductor integrated circuit chip is clamped and fixed by using the clamp of the device, and then the wire cutting machine 2 is started to operate, so that the wire cutting machine 2 drives the wire cutting head 10 to cut the crystal bar for the semiconductor integrated circuit chip.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (7)

1. Crystal bar wire cutting equipment for semiconductor integrated circuit chips comprises an operation table (1), and is characterized in that: a wire cutting machine (2) is arranged at the top of the operating platform (1);

Square box (3) have been placed to the inboard of wire-electrode cutting machine (2), guide slot (4) have been seted up in the both sides of square box (3) run through, guide arm (5) have been placed to the inboard of guide slot (4), circular plate (6) have been installed in the outside of guide arm (5), and circular plate (6) laminating square box (3) both sides place, two install pull board (7) between guide arm (5), and pull board (7) are located the inboard of square box (3), insert rod (8) have been placed to the inboard of guide slot (4) run through the inboard of pull board (7), pull ring (9) are installed to the right-hand member of insert rod (8), bent rod (11) are installed to the back of square box (3), branch ring (12) are installed in the inside run through of bent rod (11), couple (13) are installed to the both sides of bent rod (11), rubber slab (14) are installed to the back of square box (3), pull string (15) are installed to the both sides of rubber slab (14), and back through connecting part (16) are installed to the back through holding ring (7).

2. The ingot wire cutting apparatus for a semiconductor integrated circuit chip according to claim 1, wherein: two wire cutting heads (10) are arranged on the right side of the wire cutting machine (2), and the wire cutting heads (10) are positioned at the top of the drawing plate (7).

3. The ingot wire cutting apparatus for a semiconductor integrated circuit chip according to claim 1, wherein: the back of the operating platform (1) is provided with a concave plate (17), and a box body (18) is embedded in the inner side of the concave plate (17).

4. A boule wire-saw apparatus for a semiconductor integrated circuit chip according to claim 3, wherein: a plurality of placing grooves (20) are formed in the top of the box body (18), and the notch width of each placing groove (20) is different.

5. The ingot wire cutting apparatus for a semiconductor integrated circuit chip as set forth in claim 4, wherein: through grooves (21) are formed in the inner walls of the two sides of the placing groove (20).

6. The ingot wire cutting apparatus for a semiconductor integrated circuit chip as set forth in claim 5, wherein: square plates (22) are placed on the inner sides of the through grooves (21), a blocking sleeve (23) is arranged between every two square plates (22), and the size of each blocking sleeve (23) is adapted to the notch of the placing groove (20).

7. The ingot wire cutting apparatus for a semiconductor integrated circuit chip as set forth in claim 6, wherein: the two sides of the box body (18) are provided with handles (19), and the top of the retaining sleeve (23) is provided with a pull handle (24).