CN220783703U - Production device capable of rapidly clamping semiconductor probe - Google Patents
Production device capable of rapidly clamping semiconductor probe Download PDFInfo
- Publication number
- CN220783703U CN220783703U CN202322667446.7U CN202322667446U CN220783703U CN 220783703 U CN220783703 U CN 220783703U CN 202322667446 U CN202322667446 U CN 202322667446U CN 220783703 U CN220783703 U CN 220783703U
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- clamping
- wall
- fixedly connected
- device body
- groove
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- 239000000523 sample Substances 0.000 title claims abstract description 36
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000009434 installation Methods 0.000 claims abstract description 8
- 230000002457 bidirectional effect Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
Abstract
The utility model relates to the technical field of semiconductor probe production, and discloses a production device capable of rapidly clamping a semiconductor probe, which comprises a device body, supporting legs fixedly connected to the bottom end of the device body, and a disassembly and assembly clamping mechanism arranged inside and outside the device body, wherein the disassembly and assembly clamping mechanism comprises a disassembly and assembly positioning mechanism arranged outside the device body, one side of the disassembly and assembly positioning mechanism is provided with a movable clamping mechanism, a pulling handle is pulled to drive a pull rod to move upwards, the pull rod is pulled to act on a spring in a stretching way through the upward movement of the pulling handle, a clamping lug is driven to move upwards through the upward movement of the pull rod, so that the clamping plate is separated from the clamping connection with a clamping groove, the clamping plate is pushed to the inside of a groove formed in the outer wall of a mounting box during installation, the clamping lug is driven to move upwards when an arc-shaped top groove is contacted and the clamping lug is extruded, and the spring is rebounded until the clamping groove moves to the lower part of the clamping lug, so that the clamping lug is pushed to be inserted into the clamping groove, and the installation is completed.
Description
Technical Field
The utility model relates to the technical field of semiconductor probe production, in particular to a production device capable of rapidly clamping a semiconductor probe.
Background
The test probe is also called a semiconductor probe, and consists of a needle tube, a spring and a needle head, and the semiconductor probe needs to be clamped in the production process of the semiconductor probe.
However, when the existing production device clamps the probes in the use process, the use limitation exists, namely most clamping jaws are fixedly connected to the device, and when different probes are clamped, clamping jaws with different sizes need to be replaced, so that most devices can only clamp specific probes, and the limitation is larger.
Disclosure of utility model
The utility model aims to provide a production device capable of rapidly clamping a semiconductor probe, which solves the problems that most of clamping jaws are fixedly connected to the device when the existing production device clamps the probe in the use process, and the clamping jaws with different sizes are required to be replaced when clamping different probes, so that most of devices only clamp specific probes, and the limitation is larger.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a production device capable of rapidly clamping a semiconductor probe comprises a device body;
the support legs are fixedly connected to the bottom end of the device body;
And the disassembly and assembly clamping mechanism comprises a disassembly and assembly positioning mechanism which is arranged inside and outside the device body, and one side of the disassembly and assembly positioning mechanism is provided with a movable clamping mechanism.
Preferably, the dismouting positioning mechanism is including installing the installation box at electric telescopic handle outer wall, the installation box outer wall is fluted, the mounting box top is seted up the slide hole, and this slide hole inner wall sliding connection has the pull rod, pull rod top fixedly connected with pulling handle, pulling handle bottom fixedly connected with spring, pulling handle one end fixedly connected with is kept away from to the spring is at the installation box top, pulling handle one end fixedly connected with card lug is kept away from to the pull rod, card lug outer wall block is connected with the cardboard, the draw-in groove has been seted up on the cardboard top, card lug outer wall block is connected at the draw-in groove inner wall, arc roof groove has been seted up to cardboard one end, arc roof groove one end fixedly connected with clamping jaw is kept away from to the cardboard, through pulling handle in the dismouting positioning mechanism, alright drive pull rod upward movement, can carry out the stretching action to the spring through pulling handle upward movement will drive card lug upward to break away from the block connection with the draw-in groove, accomplish the dismantlement, with the cardboard to the inside recess that the installation box outer wall was seted up, when the draw-in groove contact and to card lug extrusion, alright drive card lug upward movement, can accomplish the rebound in the draw-in the lug direction, and the rebound can accomplish the lug when card lug upward movement.
Preferably, the movable clamping mechanism comprises a fixed plate fixedly connected to the outer wall of the device body, a motor is fixedly connected to the top end of the fixed plate, a bidirectional threaded rod is fixedly connected to the output end of the motor, a threaded block is connected to the outer wall of the bidirectional threaded rod in a threaded manner, the threaded block is fixedly connected to the outer wall of the electric telescopic rod, the motor in the movable clamping mechanism is started to drive the bidirectional threaded rod to rotate, the threaded block can be driven to move when the bidirectional threaded rod rotates, the electric telescopic rod can be driven to move when the threaded block moves, so that the clamping jaw at the bottom end can be driven to move towards the middle, and the probe can be clamped.
Preferably, the number of the mounting boxes is two, and the mounting boxes are symmetrically distributed outside the device body.
Preferably, the number of the electric telescopic rods is two, and the electric telescopic rods are symmetrically distributed outside the device body.
Preferably, the inner wall of the sliding hole formed at the top end of the mounting box is matched with the outer wall of the pull rod, and the inner wall of the clamping groove is matched with the outer wall of the clamping projection.
Preferably, the device body outer wall is provided with a limiting chute, and the inner wall of the limiting chute is matched with the outer wall of the thread block.
The utility model provides a production device capable of rapidly clamping a semiconductor probe. The production device capable of rapidly clamping the semiconductor probe has the following beneficial effects:
(1) The production device capable of rapidly clamping the semiconductor probe can drive the pull rod to move upwards by pulling the pulling handle in the dismounting and positioning mechanism, and can stretch the spring by pulling the handle to move upwards, and the clamping convex block can be driven to move upwards by pulling the pull rod, so that the clamping convex block is separated from the clamping connection with the clamping groove, the dismounting is completed, the clamping plate is pushed towards the inside of the groove formed in the outer wall of the mounting box during the mounting, when the arc-shaped top groove contacts and extrudes the clamping convex block, the clamping convex block can be driven to move upwards until the clamping groove moves to the lower part of the clamping convex block, the spring can rebound and reset, and the clamping convex block can be pushed to be inserted into the clamping groove, so that the mounting is completed;
(2) This but quick clamp get semiconductor probe's apparatus for producing through starting the motor in the removal fixture, alright drive two-way threaded rod and rotate, alright drive the screw thread piece and remove when rotating through two-way threaded rod, alright drive electric telescopic handle and remove when removing through the screw thread piece to this alright drive the clamping jaw of bottom to the centre removes, thereby alright clamp the probe and get work.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic cross-sectional view of the mounting box of the present utility model;
FIG. 3 is a schematic view of a positioning mechanism for disassembly and assembly according to the present utility model;
fig. 4 is a schematic structural view of the movable clamping mechanism of the present utility model.
In the figure: 1. a device body; 2. support legs; 3. disassembling and assembling the clamping mechanism; 31. disassembling and assembling the positioning mechanism; 311. a mounting box; 312. a pull rod; 313. pulling the handle; 314. a spring; 315. a card bump; 316. a clamping plate; 317. a clamping groove; 318. an arc-shaped top groove; 319. a clamping jaw; 32. moving the clamping mechanism; 321. a fixing plate; 322. a motor; 323. a two-way threaded rod; 324. a screw block; 325. an electric telescopic rod.
Detailed Description
Example 1
As shown in fig. 1-4, the present utility model provides a technical solution: the production device capable of rapidly clamping the semiconductor probe comprises a device body 1, supporting legs 2 fixedly connected to the bottom end of the device body 1, and a dismounting and clamping mechanism 3 arranged inside and outside the device body 1, wherein the dismounting and clamping mechanism 3 comprises a dismounting and positioning mechanism 31 arranged outside the device body 1, one side of the dismounting and positioning mechanism 31 is provided with a movable clamping mechanism 32, the dismounting and positioning mechanism 31 comprises mounting boxes 311 arranged on the outer wall of an electric telescopic rod 325, the number of the mounting boxes 311 is two, the mounting boxes 311 are symmetrically distributed outside the device body 1, the inner wall of a sliding hole formed at the top end of the mounting box 311 is matched with the outer wall of a pull rod 312, the inner wall of a clamping groove 317 is matched with the outer wall of a clamping convex block 315, the outer wall of the mounting box 311 is provided with a groove, the top end of the mounting box 311 is provided with a sliding hole, the inner wall of the sliding hole is slidingly connected with a pull rod 312, the top end of the pull rod 312 is fixedly connected with a pulling handle 313, the bottom end of the pulling handle 313 is fixedly connected with a spring 314, one end of the spring 314, which is far away from the pulling handle 313, is fixedly connected with a clamping projection 315, the outer wall of the clamping projection 315 is connected with a clamping plate 316 in a clamping manner, a clamping groove 317 is arranged at the top end of the clamping plate 316, the outer wall of the clamping projection 315 is connected with the inner wall of the clamping groove 317 in a clamping manner, one end of the clamping plate 316 is provided with an arc-shaped top groove 318, one end of the clamping plate 316, which is far away from the arc-shaped top groove 318, is fixedly connected with a clamping jaw 319, when the clamping jaw 319 needs to be replaced, the pulling handle 313 can be pulled, the pulling handle 313 can drive the pull rod 312 with the bottom end fixedly connected to move upwards, when the pulling handle 313 moves upwards, the spring 314 can be driven to stretch, when the pulling handle 312 moves upwards, the clamping projection 315, which can drive the bottom end of the pulling rod fixedly connected with the clamping projection to move upwards, when the card lug 315 moves upwards, the clamping connection with the clamping groove 317 formed in the top end of the clamping plate 316 is separated, at this time, the clamping jaw 319 can be detached, clamping jaws 319 with different specifications are inserted into grooves formed in the outer wall of the mounting box 311, when an arc-shaped top groove 318 formed in one end of the clamping plate 316 contacts the card lug 315, the clamping lug 315 is continuously moved, the extruded card lug 315 is extruded to move upwards, when the clamping groove 317 moves below the card lug 315, the spring 314 is rebounded to reset, and the clamping lug 315 is pushed to move downwards, so that the clamping lug is inserted into the clamping groove 317 to finish mounting work.
In this embodiment, the pull rod 312 is driven to move upwards by pulling the pull handle 313 in the dismounting positioning mechanism 31, the spring 314 is pulled by pulling the pull handle 313 to move upwards, the clamping projection 315 is driven to move upwards by the upward movement of the pull rod 312, so that the clamping projection 315 is separated from the clamping connection with the clamping groove 317, the dismounting is completed, the clamping plate 316 is pushed towards the inside of the groove formed in the outer wall of the mounting box 311 during the mounting, when the arc-shaped top groove 318 contacts and extrudes the clamping projection 315, the clamping projection 315 is driven to move upwards until the clamping groove 317 moves to the lower side of the clamping projection 315, the spring 314 is reset in a rebound manner, and the clamping projection 315 is pushed to be inserted into the clamping groove 317, so that the mounting is completed.
Example 2
On the basis of embodiment 1, the preferred embodiment of the apparatus for manufacturing a semiconductor probe capable of being rapidly clamped according to the present utility model is as follows: the movable clamping mechanism 32 comprises a fixed plate 321 fixedly connected to the outer wall of the device body 1, a motor 322 is fixedly connected to the top end of the fixed plate 321, a bidirectional threaded rod 323 is fixedly connected to the output end of the motor 322, a threaded block 324 is connected to the outer wall of the bidirectional threaded rod 323 in a threaded mode, a limiting sliding groove is formed in the outer wall of the device body 1, the inner wall of the limiting sliding groove is matched with the outer wall of the threaded block 324, the threaded block 324 is fixedly connected with the outer wall of the electric telescopic rod 325, the number of the electric telescopic rods 325 is two, the electric telescopic rods 325 are symmetrically distributed outside the device body 1, the motor 322 is started, the output end of the electric telescopic rod 325 drives the bidirectional threaded rod 323 to rotate, when the bidirectional threaded rod 323 rotates, the threaded block 324 can drive the threaded block 324 which is in the outer wall of the bidirectional threaded rod 323 to move towards the middle, when the threaded block 324 moves towards the middle, the electric telescopic rod 325 fixedly connected to the outer wall of the electric telescopic rod 325 can drive the clamping jaw 319 at the bottom end to move towards the middle, and accordingly the probe can clamp the probe.
In this embodiment, the motor 322 in the moving clamping mechanism 32 is started to drive the bidirectional threaded rod 323 to rotate, the threaded block 324 is driven to move when the bidirectional threaded rod 323 rotates, the electric telescopic rod 325 is driven to move when the threaded block 324 moves, so that the clamping jaw 319 at the bottom end can be driven to move towards the middle, and the probe can be clamped.
Claims (7)
1. A production device capable of rapidly clamping a semiconductor probe comprises a device body (1);
support legs (2) fixedly connected to the bottom end of the device body (1);
And including setting up inside and outside dismouting fixture (3) at device body (1), its characterized in that: the dismounting and clamping mechanism (3) comprises a dismounting and positioning mechanism (31) arranged outside the device body (1), and a movable clamping mechanism (32) is arranged on one side of the dismounting and positioning mechanism (31).
2. The apparatus for manufacturing a semiconductor probe capable of being rapidly clamped according to claim 1, wherein: the utility model provides a dismouting positioning mechanism (31) is including installing mounting box (311) at electric telescopic handle (325) outer wall, mounting box (311) outer wall is fluted, mounting box (311) top is seted up and is slided hole, and this sliding connection is downthehole to draw-bar (312), draw-bar (312) top fixedly connected with pulling handle (313), pulling handle (313) bottom fixedly connected with spring (314), pulling handle (313) one end fixedly connected with is kept away from to spring (314) top at mounting box (311) top, pulling handle (313) one end fixedly connected with card lug (315) are kept away from to draw-bar (312), card lug (315) outer wall block is connected with cardboard (316), draw-in groove (317) are seted up on cardboard (316) top, card lug (315) outer wall block is connected at draw-in groove (317) inner wall, arc roof groove (318) are seted up to cardboard (316) one end, arc roof groove (318) one end fixedly connected with clamping jaw (319) are kept away from to cardboard (316).
3. The apparatus for manufacturing a semiconductor probe capable of being rapidly clamped according to claim 1, wherein: the movable clamping mechanism (32) comprises a fixed plate (321) fixedly connected to the outer wall of the device body (1), a motor (322) is fixedly connected to the top end of the fixed plate (321), a bidirectional threaded rod (323) is fixedly connected to the output end of the motor (322), a threaded block (324) is connected to the outer wall of the bidirectional threaded rod (323) in a threaded mode, and the threaded block (324) is fixedly connected with the outer wall of the electric telescopic rod (325).
4. The apparatus for manufacturing a semiconductor probe capable of being rapidly clamped according to claim 2, wherein: the number of the installation boxes (311) is two, and the installation boxes (311) are symmetrically distributed outside the device body (1).
5. A device for rapidly gripping a semiconductor probe according to claim 3, wherein: the number of the electric telescopic rods (325) is two, and the electric telescopic rods (325) are symmetrically distributed outside the device body (1).
6. The apparatus for manufacturing a semiconductor probe capable of being rapidly clamped according to claim 2, wherein: the inner wall of the sliding hole formed in the top end of the mounting box (311) is matched with the outer wall of the pull rod (312), and the inner wall of the clamping groove (317) is matched with the outer wall of the clamping convex block (315).
7. A device for rapidly gripping a semiconductor probe according to claim 3, wherein: the device is characterized in that a limiting chute is formed in the outer wall of the device body (1), and the inner wall of the limiting chute is matched with the outer wall of the thread block (324).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322667446.7U CN220783703U (en) | 2023-10-07 | 2023-10-07 | Production device capable of rapidly clamping semiconductor probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322667446.7U CN220783703U (en) | 2023-10-07 | 2023-10-07 | Production device capable of rapidly clamping semiconductor probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220783703U true CN220783703U (en) | 2024-04-16 |
Family
ID=90631257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322667446.7U Active CN220783703U (en) | 2023-10-07 | 2023-10-07 | Production device capable of rapidly clamping semiconductor probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220783703U (en) |
-
2023
- 2023-10-07 CN CN202322667446.7U patent/CN220783703U/en active Active
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